ES2556981T3 - Composición de pre-ataque químico y proceso de ataque químico para sustratos de plástico - Google Patents
Composición de pre-ataque químico y proceso de ataque químico para sustratos de plástico Download PDFInfo
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- ES2556981T3 ES2556981T3 ES12165248.1T ES12165248T ES2556981T3 ES 2556981 T3 ES2556981 T3 ES 2556981T3 ES 12165248 T ES12165248 T ES 12165248T ES 2556981 T3 ES2556981 T3 ES 2556981T3
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- 239000003381 stabilizer Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- FZUJWWOKDIGOKH-UHFFFAOYSA-N sulfuric acid hydrochloride Chemical compound Cl.OS(O)(=O)=O FZUJWWOKDIGOKH-UHFFFAOYSA-N 0.000 description 1
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 1
- CRDAMVZIKSXKFV-UHFFFAOYSA-N trans-Farnesol Natural products CC(C)=CCCC(C)=CCCC(C)=CCO CRDAMVZIKSXKFV-UHFFFAOYSA-N 0.000 description 1
- BJIOGJUNALELMI-UHFFFAOYSA-N trans-isoeugenol Natural products COC1=CC(C=CC)=CC=C1O BJIOGJUNALELMI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003021 water soluble solvent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Una composición de pre-ataque químico acuosa para el tratamiento de sustratos no conductores en un proceso de recubrimiento para la deposición de una capa de metal sobre una superficie de sustrato, en donde la composición de pre-ataque químico contiene por lo menos un disolvente soluble en agua, en donde la composición contiene por lo menos un compuesto seleccionado de entre el grupo que consiste en terpenos, fenilpropanoides, isovainillina y vainillina caracterizada por que la composición contiene adicionalmente por lo menos un disolvente seleccionado de entre el grupo que consiste en éster dimetílico del ácido 2-metilpentanodioico, isopentil diol, 6,6-dimetil biciclo- (3,1,1)-2-hepteno-2-etanol y etilacetoacetato.
Description
en la que R1 = C3H5,C3H3O, o C3H5O, R2 = H, OCH3, OH, y R3 = H, OH, OCH3, COOCH3, en la que por lo menos R1 difiere con respecto a R2 o R3, o R2 y R3 como un agente de hinchamiento en un proceso de deposición de
5 metal sobre una superficie de sustrato de plástico, como por ejemplo la superficie de un sustrato que se fabrica a partir de ABS, PC, PEI, o una mezcla que comprende por lo menos uno de los plásticos que se han mencionado en lo que antecede.
En otra realización, la invención se refiere al uso de un compuesto del grupo que consiste en anetol, estragol,
10 eugenol, isoeugenol, vainillina, isovainillina, metil eugenol, cinamaldehído, ácido cinámico, alcohol coniferílico, safrol, apiol, dilapiol, citral, mirceno, geraniol, citronelal, citronelol, 1,8-cineol, carvona, felandreno, α-pineno, β-pineno, limoneno, canfeno, 3-careno, terpinoleno, acetato de bornilo, mentol, mentona, citronelol, nerol, linalool, farnesol, rodinol, sabineno, borneol, isoborneol, α-terpineol, β-terpineol, γ-terpineol, δ-terpineol, trans-verbenol, cis-verbenol, ácido isovalérico y ácido giberélico o una mezcla de estos como un agente de hinchamiento en un proceso de
15 deposición de metal sobre una superficie de sustrato de plástico.
En otra realización, la invención se refiere al uso de un terpeno y/o un fenilpropanoide como un agente de hinchamiento en un proceso de deposición de una capa de metal sobre una superficie de sustrato no conductor en combinación con un disolvente soluble en agua. Preferiblemente, el disolvente está seleccionado de entre el grupo 20 que consiste en glicoles y sus derivados, por ejemplo dipropilen glicol (DPG), dietilen glicol monobutil éter (DEG-MBE), dietilen glicol, etilen glicol, etilen glicol dimetil éter, trietilen glicol, dietilen glicol dimetil éter (diglima), trietilen glicol dimetil éter (triglima), tetraetilen glicol dimetil éter (tatraglima), dipropilen glicol dimetil éter (proglima), polietilen glicol dimetil éter (poliglima), también varios disolventes como alcoholes solubles, éteres, ésteres, por ejemplo isopentil diol (IPD), 3-metoxi-3-metilbutan-1-ol (MMB) o su acetato (MMB-Ac), butiro-1.4-lactona, 1.3
25 dioxaciclopentano, 4-metil-1.3-dioxaciclopentano o una mezcla de estos.
La invención se explica en lo siguiente en términos de ejemplos.
30 Tabla 1
- Ejemplo n.º
- Disolvente Terpeno / fenilpropanoide / vainillina Aditivo Ácido/Hidróxido
- 1
- DPG, 400 ml/l + DEG-MBE, 30 ml/l Citral, 10 ml/l éster dimetílico del ácido 2-metilpentanodioico, 20 ml/l
- 2
- DEG-MBE 300 ml/l Cineol, 10 ml/l éster dimetílico del ácido 2-metilpentanodioico, 20 ml/l
- 3
- DPG, 100 ml/l Eugenol, 5 ml/l éster dimetílico del ácido 2-metilpentanodioico, 20 ml/l
- 4
- DPG, 250 ml/l Limoneno, 20 ml/l
- 5
- DEG-MBE 300 ml/l Citronelol, 30 ml/l Etilacetoacetato, 80 ml/l
- 6
- DPG, 440 ml/l + DEG-MBE, 30 ml/l Carvona, 10 ml/l
- 7
- DPG, 430 ml/l + DEG-MBE, 30 ml/l + MMB-Ac, 5 ml/l + IPD, 30 ml/l Citral, 10 ml/l
- 8
- DPG, 20 ml/l Ácido isovalérico, 10 g/l éster dimetílico del ácido 2-metilpentanodioico, 20 ml/l
- 9
- IPD, 400 ml/l Eugenol, 10 ml/l
- 10
- DEG-MBE, 250 ml/l Cineol, 10 ml/l
- 11
- DPG, 460 ml/l Felandreno, 10 ml/l
- 12
- DPG, 250 ml/l Prenol, 10 ml/l
6
- Agente de ataque químico de permanganato alcalino
- Permanganato de potasio Hidróxido de sodio 15 g/l 40 g/l 65 10
- Neutralizador 1
- Ácido oxálico Ácido ascórbico 5 g/l 10 g/l 30 4
- Neutralizador 2 (Acondicionador)
- Trietanol amina 10 g/l 35 2
- Enjuagado
- Agua
- Activador UDIQUE PD plus
- Estabilizador UDIQUE DP-310 Activador UDIQUE DP-320 Ácido clorhídrico 100 ml/l 20 ml/l 275 ml/l 45 4
- Enjuagado
- Agua
- Conductor UDIQUE DP plus
- Conductor UDIQUE DP-410-A Conductor UDIQUE DP-420-B 100 ml/l 200 ml/l 55 4
- Enjuagado
- Agua
- Cuprostar 1560
- CuSO4 * H2O Ácido sulfúrico Ácido clorhídrico APORTE Cuprostar 1560 VEHÍCULO Cuprostar 1560 NIVELADOR Cuprostar 1560 AGENTE HUMECTANTE Cuprostar 1560 215 g/l 35 ml/l 0,25 ml/l 6 ml/l 0,5 ml/l 0,4 ml/l 0,5 ml/l 25 50
- Las composiciones UDIQUE y las composiciones Cuprostar tal como se menciona en la tabla 4 son facilitadas comercialmente por Enthone Inc., West Haven, Connecticut, EE. UU.
Tabla 5
- Agente de ataque químico
- Ácido crómico -sulfúrico Permanganato ácido Permanganato alcalino
- ABS
- 0,59 N/mm 0,57 N/mm 0,68 N/mm
- PC-ABS
- 0,70 N/mm 0,68 N/mm 0,70 N/mm
Los sustratos que se mencionan en la tabla 5 se trataron de acuerdo con el procedimiento global tal como se divulga en la tabla 4. Las pruebas de adherencia se realizaron de acuerdo con la norma DIN 53494 (1984).
8
Claims (1)
-
imagen1 imagen2
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12165248.1A EP2657367B1 (en) | 2012-04-24 | 2012-04-24 | Pre-etching composition and etching process for plastic substrates |
Publications (1)
Publication Number | Publication Date |
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ES2556981T3 true ES2556981T3 (es) | 2016-01-21 |
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Country Status (3)
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EP (1) | EP2657367B1 (es) |
ES (1) | ES2556981T3 (es) |
WO (1) | WO2013163316A2 (es) |
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KR101807100B1 (ko) * | 2013-10-22 | 2017-12-08 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 수지 재료의 에칭 처리용 조성물 |
KR102447849B1 (ko) | 2014-04-01 | 2022-09-26 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 비전도성 플라스틱 표면들을 금속화하기 위한 조성 및 프로세스 |
KR101970970B1 (ko) | 2014-07-10 | 2019-04-22 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 수지 도금 방법 |
ES2727075T5 (es) | 2015-02-23 | 2022-05-27 | Macdermid Enthone Inc | Composición inhibidora para bastidores cuando se utilizan mordientes exentos de cromo en un proceso de galvanizado sobre materiales plásticos |
CN110709535A (zh) * | 2017-06-01 | 2020-01-17 | 株式会社杰希优 | 树脂表面的多段蚀刻方法以及利用其向树脂镀覆的方法 |
EP4299790A1 (en) | 2022-06-30 | 2024-01-03 | Atotech Deutschland GmbH & Co. KG | Method for etching a plastic substrate including spraying and electrolytic regeneration |
Family Cites Families (13)
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CA999826A (en) * | 1973-12-03 | 1976-11-16 | Derek G.E. Kerfoot | Photodeposition of metals on a non-conductive substrate |
US5015329A (en) * | 1988-11-07 | 1991-05-14 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
CA2031422A1 (en) * | 1990-05-01 | 1991-11-02 | Richard C. Retallick | Method for improving metal adhesion to polyimide surfaces |
US5271773A (en) * | 1990-12-07 | 1993-12-21 | Golden Technologies Company, Inc. | Process for cleaning articles with an aqueous solution of terpene and recycle water after separation |
US5332465A (en) * | 1993-09-08 | 1994-07-26 | Macdermid, Incorporated | Process for preparing plastic surfaces to be plated |
DE19740431C1 (de) | 1997-09-11 | 1998-11-12 | Atotech Deutschland Gmbh | Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats |
FR2786664B1 (fr) * | 1998-12-03 | 2001-03-09 | Xeda Internat Sa | Procede de traitement de fruits et legumes utilisant l'eugenol et/ou l'isoeugenol et utilisation d'une composition a base d'eugenol et/ou d'isoeugenol |
DE10054544A1 (de) | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
DE10124631C1 (de) | 2001-05-18 | 2002-11-21 | Atotech Deutschland Gmbh | Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen |
US20050199587A1 (en) | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
DE102005051632B4 (de) | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
ATE445667T1 (de) | 2007-08-10 | 2009-10-15 | Enthone | Chromfreie beize für kunststoffoberflächen |
PL2576747T3 (pl) * | 2010-05-31 | 2014-09-30 | Unilever Nv | Kompozycja do traktowania twardych powierzchni |
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EP2657367B1 (en) | 2015-11-25 |
WO2013163316A2 (en) | 2013-10-31 |
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