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ES218906A1 - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
ES218906A1
ES218906A1 ES0218906A ES218906A ES218906A1 ES 218906 A1 ES218906 A1 ES 218906A1 ES 0218906 A ES0218906 A ES 0218906A ES 218906 A ES218906 A ES 218906A ES 218906 A1 ES218906 A1 ES 218906A1
Authority
ES
Spain
Prior art keywords
semi
semiconductor member
conductor device
conductors
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0218906A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES218906A1 publication Critical patent/ES218906A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Sistema de electrónicos que comprende por lo menos un miembro semiconductor más en particular un diodo a cristal o un transmisor alojado en una válvula impermeable a los gases en cuya pared están sellados conductores eléctricos caracterizado por el hecho de que el espacio en el interior de la envoltura posee por lo menos dos partes de las cuales aquella que rodea al miembro semiconductor tiene una resistencia específica inferior al flujo térmico que la parte que está contigua al sello de los de los conductores.Electronic system comprising at least one semiconductor member, more particularly a crystal diode or a transmitter housed in a gas-tight valve on whose wall electrical conductors are sealed, characterized by the fact that the space inside the envelope It has at least two parts of which the one that surrounds the semiconductor member has a lower specific resistance to thermal flux than the part that is adjacent to the seal of the conductors.

ES0218906A 1953-12-12 1954-12-09 Semi-conductor device Expired ES218906A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL183554 1953-12-12

Publications (1)

Publication Number Publication Date
ES218906A1 true ES218906A1 (en) 1955-12-16

Family

ID=19750636

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0218906A Expired ES218906A1 (en) 1953-12-12 1954-12-09 Semi-conductor device

Country Status (8)

Country Link
US (1) US2877392A (en)
BE (1) BE534031A (en)
CH (1) CH329187A (en)
DE (1) DE1033783B (en)
ES (1) ES218906A1 (en)
FR (1) FR1115837A (en)
GB (1) GB800574A (en)
NL (1) NL87748C (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL236678A (en) * 1958-03-04 1900-01-01
US2937110A (en) * 1958-07-17 1960-05-17 Westinghouse Electric Corp Protective treatment for semiconductor devices
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
DE1184017B (en) * 1961-03-10 1964-12-23 Intermetall Method for producing silicone resin coatings that protect the pn junctions in semiconductor arrangements
US3181229A (en) * 1962-01-08 1965-05-04 Mallory & Co Inc P R Hermetically sealed semiconductor device and method for producing it
BE635453A (en) * 1962-07-27 1900-01-01
US3284678A (en) * 1962-11-09 1966-11-08 Philco Corp Semiconductor encapsulating and reinforcing materials utilizing boron nitride
DE1244963B (en) * 1963-01-09 1967-07-20 Siemens Ag Semiconductor valve encapsulated or pressed with a plastic cover
US3243670A (en) * 1963-09-30 1966-03-29 Int Standard Electric Corp Mountings for semiconductor devices
US4042955A (en) * 1973-06-22 1977-08-16 Nippondenso Co., Ltd. Resin-sealed electrical device
US4214885A (en) * 1978-03-01 1980-07-29 Hideo Nishi Method for producing miniature lamps
DE8909244U1 (en) * 1989-07-31 1989-09-21 Siemens AG, 1000 Berlin und 8000 München Semiconductor component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE307647C (en) *
US756676A (en) * 1902-11-10 1904-04-05 Internat Wireless Telegraph Company Wave-responsive device.
US1782129A (en) * 1924-12-26 1930-11-18 Andre Henri Georges Unilateral conductor for rectifying alternating current
US2406405A (en) * 1941-05-19 1946-08-27 Sperry Gyroscope Co Inc Coaxial condenser crystal and method of making same
BE454977A (en) * 1943-04-05
US2697805A (en) * 1949-02-05 1954-12-21 Sylvania Electric Prod Point contact rectifier
US2699594A (en) * 1952-02-27 1955-01-18 Sylvania Electric Prod Method of assembling semiconductor units

Also Published As

Publication number Publication date
US2877392A (en) 1959-03-10
GB800574A (en) 1958-08-27
FR1115837A (en) 1956-04-30
DE1033783B (en) 1958-07-10
NL87748C (en)
BE534031A (en)
CH329187A (en) 1958-04-15

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