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ES2184580B2 - PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION. - Google Patents

PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION.

Info

Publication number
ES2184580B2
ES2184580B2 ES200002735A ES200002735A ES2184580B2 ES 2184580 B2 ES2184580 B2 ES 2184580B2 ES 200002735 A ES200002735 A ES 200002735A ES 200002735 A ES200002735 A ES 200002735A ES 2184580 B2 ES2184580 B2 ES 2184580B2
Authority
ES
Spain
Prior art keywords
procedure
internal
analog circuits
circuits based
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES200002735A
Other languages
Spanish (es)
Other versions
ES2184580A1 (en
Inventor
Sanahujes Josep Altet
Cervera Xavier Aragones
Jimenez Jose Luis Gonzalez
Pena Diego Mateo
Echeto Francesc De B Moll
Sola Jose Antonio Rubio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universitat Politecnica de Catalunya UPC
Original Assignee
Universitat Politecnica de Catalunya UPC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universitat Politecnica de Catalunya UPC filed Critical Universitat Politecnica de Catalunya UPC
Priority to ES200002735A priority Critical patent/ES2184580B2/en
Publication of ES2184580A1 publication Critical patent/ES2184580A1/en
Application granted granted Critical
Publication of ES2184580B2 publication Critical patent/ES2184580B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Procedimiento de verificación estructural de circuitos integrados analógicos basado en la observación interna y concurrente de temperatura. Procedimiento para la detección de anomalías estructurales en circuitos analógicos (2) integrados, consistente en la medida dinámica (en el tiempo) de la temperatura en diferentes puntos (3,4) de la superficie del cristal semiconductor (1), llevada a cabo mediante circuitos sensores de temperatura (5) integrados en el mismo cristal (1) del circuito (2) que se verifica. La información procedente de estos sensores (6) es utilizada para discriminar los circuitos defectuosos y eventualmente su diagnosis y/o corrección.Structural verification procedure of analog integrated circuits based on internal and concurrent temperature observation. Procedure for the detection of structural anomalies in integrated analog circuits (2), consisting of the dynamic measurement (in time) of the temperature at different points (3,4) of the surface of the semiconductor crystal (1), carried out by temperature sensor circuits (5) integrated in the same crystal (1) of the circuit (2) that is verified. The information from these sensors (6) is used to discriminate the faulty circuits and eventually their diagnosis and / or correction.

ES200002735A 2000-11-03 2000-11-03 PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION. Expired - Fee Related ES2184580B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES200002735A ES2184580B2 (en) 2000-11-03 2000-11-03 PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200002735A ES2184580B2 (en) 2000-11-03 2000-11-03 PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION.

Publications (2)

Publication Number Publication Date
ES2184580A1 ES2184580A1 (en) 2003-04-01
ES2184580B2 true ES2184580B2 (en) 2004-03-16

Family

ID=8495641

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200002735A Expired - Fee Related ES2184580B2 (en) 2000-11-03 2000-11-03 PROCEDURE FOR STRUCTURAL VERIFICATION OF INTEGRATED ANALOG CIRCUITS BASED ON INTERNAL AND CONCURRENT TEMPERATURE OBSERVATION.

Country Status (1)

Country Link
ES (1) ES2184580B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013098128A3 (en) * 2011-12-29 2013-09-26 Continental Automotive Gmbh Circuit arrangement which is arranged on a substrate and which comprises a temperature monitoring system, and method for detecting an excess temperature

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436494A (en) * 1994-01-12 1995-07-25 Texas Instruments Incorporated Temperature sensor calibration wafer structure and method of fabrication
DE19534604C1 (en) * 1995-09-18 1996-10-24 Siemens Ag Field effect power semiconductor element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013098128A3 (en) * 2011-12-29 2013-09-26 Continental Automotive Gmbh Circuit arrangement which is arranged on a substrate and which comprises a temperature monitoring system, and method for detecting an excess temperature
CN104081665A (en) * 2011-12-29 2014-10-01 大陆汽车有限公司 Circuit arrangement which is arranged on a substrate and comprises a temperature monitoring system, and method for detecting an excess temperature

Also Published As

Publication number Publication date
ES2184580A1 (en) 2003-04-01

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