[go: up one dir, main page]

ES2138909B1 - Material laminar compuesto para placas de circuito impreso. - Google Patents

Material laminar compuesto para placas de circuito impreso.

Info

Publication number
ES2138909B1
ES2138909B1 ES009701912A ES9701912A ES2138909B1 ES 2138909 B1 ES2138909 B1 ES 2138909B1 ES 009701912 A ES009701912 A ES 009701912A ES 9701912 A ES9701912 A ES 9701912A ES 2138909 B1 ES2138909 B1 ES 2138909B1
Authority
ES
Spain
Prior art keywords
fibreglass
sheets
composite
printed circuit
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES009701912A
Other languages
English (en)
Other versions
ES2138909A1 (es
Inventor
Coca Felip Balsells
Siurana Antonio Rodriguez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aismalibar SA
Original Assignee
Aismalibar SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aismalibar SA filed Critical Aismalibar SA
Priority to ES009701912A priority Critical patent/ES2138909B1/es
Priority to AT98500198T priority patent/ATE273608T1/de
Priority to DE69825534T priority patent/DE69825534T2/de
Priority to EP98500198A priority patent/EP0902608B1/en
Priority to KR10-1998-0037069A priority patent/KR100362304B1/ko
Priority to US09/150,791 priority patent/US6143414A/en
Publication of ES2138909A1 publication Critical patent/ES2138909A1/es
Application granted granted Critical
Publication of ES2138909B1 publication Critical patent/ES2138909B1/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B29C70/08—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers
    • B29C70/081—Combinations of fibres of continuous or substantial length and short fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • B29C70/885—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding with incorporated metallic wires, nets, films or plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3472—Woven fabric including an additional woven fabric layer
    • Y10T442/348—Mechanically needled or hydroentangled
    • Y10T442/3488—Four or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3472—Woven fabric including an additional woven fabric layer
    • Y10T442/3602—Three or more distinct layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

Material laminar compuesto, para placas de circuito impreso. Comprende dos hojas exteriores (1, 3) de tejido de vidrio de filamentos continuos y un núcleo (2) de vidrio no tejido, formado por hojas (4, 5) de papel de vidrio, estando todas las hojas impregnadas con resina epoxi, y que presenta por lo menos una lámina de material conductor (8), en una o ambas caras exteriores; se caracteriza por el hecho de que incorpora en el núcleo (2) de vidrio no tejido por lo menos una hoja intermedia (6, 7) de tejido de vidrio impregnado con resina. Permite fabricar circuitos impresos fiables incluso cuando se utilizan componentes de montaje superficial, y al mismo tiempo de coste relativamente reducido; es particularmente adecuado para el campo de la electrónica de consumo y semi-profesional.
ES009701912A 1997-09-10 1997-09-10 Material laminar compuesto para placas de circuito impreso. Expired - Fee Related ES2138909B1 (es)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ES009701912A ES2138909B1 (es) 1997-09-10 1997-09-10 Material laminar compuesto para placas de circuito impreso.
AT98500198T ATE273608T1 (de) 1997-09-10 1998-09-07 Verbundlaminat für gedruckte leiterplatten
DE69825534T DE69825534T2 (de) 1997-09-10 1998-09-07 Verbundlaminat für gedruckte Leiterplatten
EP98500198A EP0902608B1 (en) 1997-09-10 1998-09-07 Compound laminate for printed circuit boards
KR10-1998-0037069A KR100362304B1 (ko) 1997-09-10 1998-09-09 인쇄회로판용복합적층물
US09/150,791 US6143414A (en) 1997-09-10 1998-09-10 Compound laminate for printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES009701912A ES2138909B1 (es) 1997-09-10 1997-09-10 Material laminar compuesto para placas de circuito impreso.

Publications (2)

Publication Number Publication Date
ES2138909A1 ES2138909A1 (es) 2000-01-16
ES2138909B1 true ES2138909B1 (es) 2000-09-01

Family

ID=8300567

Family Applications (1)

Application Number Title Priority Date Filing Date
ES009701912A Expired - Fee Related ES2138909B1 (es) 1997-09-10 1997-09-10 Material laminar compuesto para placas de circuito impreso.

Country Status (6)

Country Link
US (1) US6143414A (es)
EP (1) EP0902608B1 (es)
KR (1) KR100362304B1 (es)
AT (1) ATE273608T1 (es)
DE (1) DE69825534T2 (es)
ES (1) ES2138909B1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004528466A (ja) * 2001-06-04 2004-09-16 ポリマー・グループ・インコーポレーテツド 回路板用の３次元不織基板
TW583235B (en) * 2001-09-25 2004-04-11 Sumitomo Bakelite Co Method of manufacturing composite laminated sheet
KR20090007006A (ko) * 2007-07-13 2009-01-16 삼성전자주식회사 액정 표시 장치 및 그의 제조 방법
US8574696B2 (en) * 2007-07-31 2013-11-05 Hewlett-Packard Development Company, L.P. Electronic device housing assembly
CN102189722B (zh) * 2011-01-30 2014-11-26 上海国纪电子有限公司 覆铜板及其加工方法
CN104908379A (zh) * 2015-06-17 2015-09-16 安徽旌德青山玻纤厂 一种耐高温玻璃纤维布
CN106915132A (zh) * 2015-12-25 2017-07-04 上海杰事杰新材料(集团)股份有限公司 一种夹芯板、制备方法及其用途

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3393117A (en) * 1964-02-13 1968-07-16 Cincinnati Milling Machine Co Copper-clad glass reinforced thermoset resin panel
US3617613A (en) * 1968-10-17 1971-11-02 Spaulding Fibre Co Punchable printed circuit board base
US4913955A (en) * 1987-06-05 1990-04-03 Shin-Kobe Electric Machinery Co., Ltd. Epoxy resin laminate
JPH02197190A (ja) * 1989-01-26 1990-08-03 Shin Kobe Electric Mach Co Ltd 多層印刷配線板
TW210422B (es) * 1991-06-04 1993-08-01 Akzo Nv

Also Published As

Publication number Publication date
KR100362304B1 (ko) 2003-03-04
EP0902608B1 (en) 2004-08-11
US6143414A (en) 2000-11-07
ES2138909A1 (es) 2000-01-16
KR19990029642A (ko) 1999-04-26
DE69825534T2 (de) 2005-11-17
EP0902608A1 (en) 1999-03-17
ATE273608T1 (de) 2004-08-15
DE69825534D1 (de) 2004-09-16

Similar Documents

Publication Publication Date Title
DE69735799D1 (de) Zwischenschichtklebefilm für mehrschichtige gedruckte Leiterplatte und mehrschichtige gedruckte Leiterplatte unter Verwendung desselben
DE69410188D1 (de) Leiterplatte mit Deckfilm
DE69812179D1 (de) Gedruckte schaltungsplatine mit integrierter schmelzsicherung
GB2316237B (en) Printed circuit board with electronic devices mounted thereon
DE69823591D1 (de) Geschichtete Aperturantenne und mehrschichtige Leiterplatte damit
GB2344463B (en) Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
AU2002224832A1 (en) Positive type photosensitive epoxy resin composition and printed circuit board using the same
SE9402854L (sv) Anordning för att fästa ett kyldon till en elektronisk förpackning
FR2703839B1 (fr) Connecteur intermédiaire entre carte de circuit imprimé et substrat à circuits électroniques.
IL109242A (en) Annular circuit components coupled with printed circuit board through- hole
DE69633690D1 (de) Harzfüllstoff und mehrschichtige Leiterplatte
DE3873896D1 (de) Laminiermaterial fuer gedruckte schaltungsplatte mit niedriger dielektrizitaetskonstanten.
ES2138909B1 (es) Material laminar compuesto para placas de circuito impreso.
DE69829908D1 (de) Mikroelektronische mehrschichtige Leiterplatte mit trimmbaren Kondensatoren
DE69406390D1 (de) Laminat und mehrschichtige leiterplatte
DE69610771D1 (de) Epoxidharzzusammensetzung für gedrückte leiterplatten und damit hergestellte schichtstoffplatten
EP0397177A3 (en) Asymmetric adhesive sheet
EP0864926A4 (en) PHOTOSENSITIVE RESIN COMPOSITION AND THIN COATING LAYER, RESIST INK, WELDING RESIST AND PRINTED CIRCUIT BOARD MADE THEREWITH
SG85102A1 (en) Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same
ITTO990288A1 (it) Insieme di scheda a circuito stampato con componenti di potenza e diradiatore per la scheda.
KR970067065A (ko) 전자음향 및 표시기능을 가진 스티커
McGrath Multilayer PCB Manufacture
IT1224236B (it) Circuito elettrico, per macchine elettroniche, stampato serigraficamente su pellicola in poliestere, avente struttura multistrato
FR2723500B1 (fr) Carte electronique de circuit imprime.
JPS53140391A (en) Laminate

Legal Events

Date Code Title Description
EC2A Search report published

Date of ref document: 20000116

Kind code of ref document: A1

Effective date: 20000116

FD1A Patent lapsed

Effective date: 20070911