ES2137850B1 - ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS. - Google Patents
ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS.Info
- Publication number
- ES2137850B1 ES2137850B1 ES9701295A ES9701295A ES2137850B1 ES 2137850 B1 ES2137850 B1 ES 2137850B1 ES 9701295 A ES9701295 A ES 9701295A ES 9701295 A ES9701295 A ES 9701295A ES 2137850 B1 ES2137850 B1 ES 2137850B1
- Authority
- ES
- Spain
- Prior art keywords
- chip
- microsensors
- silicone
- humid environments
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title abstract 5
- 238000005538 encapsulation Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002775 capsule Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Técnica de encapsulación para microsensores de presión entre ambientes húmedos. La técnica consiste en insertar todo el chip en una silicona. De este modo se evita cualquier unión rígida entre el elemento sensor y la cápsula rígida exterior, con lo que el chip está mecánicamente desacoplado dando lugar a estados de bajo esfuerzo mecánico. La inmersión del chip completo en la silicona proporciona además la encapsulación hermética en el material protector e inerte que aísla los conductores eléctricos, los circuitos, microsoldaduras e hilos de conexión. La utilización de una resina de silicona fotocurable en combinación con procesos fotolitográficos para proteger la parte superior de la superficie del sensor permite además una protección parcial y controlada. Esto hace que el proceso sea especialmente adecuado para la encapsulación de microsensores de silicio ya que permite dejar al descubierto las áreas activas o, sensibles de la parte superior del chip, evitando así cualquier influencia delmaterial de recubrimiento sobre la membrana sensible.Encapsulation technique for pressure microsensors between humid environments. The technique consists of inserting the entire chip in a silicone. In this way any rigid connection between the sensor element and the rigid outer capsule is avoided, whereby the chip is mechanically decoupled giving rise to states of low mechanical stress. The immersion of the complete chip in the silicone also provides hermetic encapsulation in the protective and inert material that isolates the electrical conductors, circuits, micro-solders and connection wires. The use of a photocurable silicone resin in combination with photolithographic processes to protect the upper part of the sensor surface also allows partial and controlled protection. This makes the process especially suitable for encapsulating silicon microsensors as it allows the active or sensitive areas of the upper part of the chip to be exposed, thus avoiding any influence of the coating material on the sensitive membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES9701295A ES2137850B1 (en) | 1997-06-13 | 1997-06-13 | ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES9701295A ES2137850B1 (en) | 1997-06-13 | 1997-06-13 | ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES2137850A1 ES2137850A1 (en) | 1999-12-16 |
| ES2137850B1 true ES2137850B1 (en) | 2000-08-16 |
Family
ID=8299679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES9701295A Expired - Fee Related ES2137850B1 (en) | 1997-06-13 | 1997-06-13 | ENCAPSULATION TECHNIQUE FOR PRESSURE MICROSENSORS BETWEEN HUMID ENVIRONMENTS. |
Country Status (1)
| Country | Link |
|---|---|
| ES (1) | ES2137850B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2903624B1 (en) * | 2006-07-17 | 2008-11-28 | Oberthur Card Syst Sa | METHOD OF MANUFACTURING BY MOLDING A PORTABLE ELECTRONIC ENTITY, AND ENTITY THUS OBTAINED |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4823605A (en) * | 1987-03-18 | 1989-04-25 | Siemens Aktiengesellschaft | Semiconductor pressure sensor with casing and method for its manufacture |
| US4888226A (en) * | 1988-08-08 | 1989-12-19 | American Telephone And Telegraph Company | Silicone gel electronic device encapsulant |
| JPH04258176A (en) * | 1991-02-12 | 1992-09-14 | Mitsubishi Electric Corp | semiconductor pressure sensor |
| DE19524001A1 (en) * | 1995-06-30 | 1997-03-06 | Siemens Ag | Process for packaging a pressure-sensitive electronic circuit with a protective casing sealing on all sides |
-
1997
- 1997-06-13 ES ES9701295A patent/ES2137850B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| ES2137850A1 (en) | 1999-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EC2A | Search report published |
Date of ref document: 19991216 Kind code of ref document: A1 Effective date: 19991216 |
|
| FD2A | Announcement of lapse in spain |
Effective date: 20180807 |