ES213245A1 - Improvements in the construction of printed electric circuits - Google Patents
Improvements in the construction of printed electric circuitsInfo
- Publication number
- ES213245A1 ES213245A1 ES0213245A ES213245A ES213245A1 ES 213245 A1 ES213245 A1 ES 213245A1 ES 0213245 A ES0213245 A ES 0213245A ES 213245 A ES213245 A ES 213245A ES 213245 A1 ES213245 A1 ES 213245A1
- Authority
- ES
- Spain
- Prior art keywords
- layer
- construction
- metal
- electric circuits
- printed electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010276 construction Methods 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 3
- 230000001464 adherent effect Effects 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Improvements introduced in the manufacture of printed circuits that include a capacitor that comprises a sheet or layer of metal that forms one of the electrodes attached to the support for the printed circuit a dielectric layer that is a compound of metal formed as an adherent layer on the exposed face of the metal sheet or layer and an outer electrode which is a conductive layer deposited on the dielectric with one or both of the electrodes being electrically connected to an element or elements of the circuit. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB483653A GB726083A (en) | 1953-02-20 | 1953-02-20 | Improvements in the construction of printed electric circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
ES213245A1 true ES213245A1 (en) | 1954-03-01 |
Family
ID=9784701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES0213245A Expired ES213245A1 (en) | 1953-02-20 | 1954-01-21 | Improvements in the construction of printed electric circuits |
Country Status (2)
Country | Link |
---|---|
ES (1) | ES213245A1 (en) |
GB (1) | GB726083A (en) |
-
1953
- 1953-02-20 GB GB483653A patent/GB726083A/en not_active Expired
-
1954
- 1954-01-21 ES ES0213245A patent/ES213245A1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB726083A (en) | 1955-03-16 |
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