[go: up one dir, main page]

ES2123781T3 - Procedimiento y dispositivo para recubrir circuitos impresos. - Google Patents

Procedimiento y dispositivo para recubrir circuitos impresos.

Info

Publication number
ES2123781T3
ES2123781T3 ES94913199T ES94913199T ES2123781T3 ES 2123781 T3 ES2123781 T3 ES 2123781T3 ES 94913199 T ES94913199 T ES 94913199T ES 94913199 T ES94913199 T ES 94913199T ES 2123781 T3 ES2123781 T3 ES 2123781T3
Authority
ES
Spain
Prior art keywords
coating
printed circuit
procedure
temperature
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94913199T
Other languages
English (en)
Inventor
Hans-Jurgen Schafer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
BASF Schweiz AG
Original Assignee
Ciba Geigy AG
Ciba Spezialitaetenchemie Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG, Ciba Spezialitaetenchemie Holding AG filed Critical Ciba Geigy AG
Application granted granted Critical
Publication of ES2123781T3 publication Critical patent/ES2123781T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1366—Spraying coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)

Abstract

LA INVENCION SE REFIERE A UN PROCESO PARA RECUBRIMIENTO DE PLACAS DE CIRCUITO IMPRESO POR MEDIO DE RODILLOS DE RECUBRIMIENTO CON REVESTIMIENTO QUE PUEDE SER RETICULADO MEDIANTE RADIACION ELECTROMAGNETICA, CON PREFERENCIA RADIACION UV, CARACTERIZANDOSE POR MEDIO DE LAS SIGUIENTES ETAPAS: SE FUNDE UN RECUBRIMIENTO DE BAJO PESO MOLECULAR, FUNDIBLE, FOTOPOLIMERIZABLE, QUE ES DESDE ALTAMENTE VISCOSO A SOLIDO A TEMPERATURA AMBIENTE Y TIENE UN PESO MOLECULAR MEDIO CON PREFERENCIA DESDE 500 HASTA 1.500 Y SE SUMINISTRA AL RODILLO (1) APLICADOR DE UNA INSTALACION DE RECUBRIMIENTO A RODILLO; EL RECUBRIMIENTO SE APLICA SOBRE LA SUPERFICIE O SUPERFICIES DE CIRCUITO IMPRESO A UNA TEMPERATURA DESDE 60 0.000 MPAS DE VISCOSIDAD Y 10-200 MICRAS DE ESPESOR; LA SUPERFICIE A SER RECUBIERTA DE LA PLACA (L) DE CIRCUITO IMPRESO SE CALIENTA (8) PREVIAMENTE ANTES DE RECUBRIMIENTO HASTA UNA TEMPERATURA DESDE 10 CUAL SE APLICA EL RECUBRIMIENTO. SE DESCRIBE TAMBIEN UN DISPOSITIVO (10) PARA LA REALIZACION DEL PROCEDIMIENTO.
ES94913199T 1993-05-12 1994-05-10 Procedimiento y dispositivo para recubrir circuitos impresos. Expired - Lifetime ES2123781T3 (es)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE4315774 1993-05-12
DE4324585 1993-07-22
DE4329730 1993-09-03
DE4329731 1993-09-03
DE4337907 1993-11-08
DE4401778 1994-01-24

Publications (1)

Publication Number Publication Date
ES2123781T3 true ES2123781T3 (es) 1999-01-16

Family

ID=27544671

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94913199T Expired - Lifetime ES2123781T3 (es) 1993-05-12 1994-05-10 Procedimiento y dispositivo para recubrir circuitos impresos.

Country Status (10)

Country Link
US (1) US5863620A (es)
EP (2) EP0698233B1 (es)
JP (2) JPH08510164A (es)
AT (1) ATE172550T1 (es)
AU (2) AU6544494A (es)
CA (2) CA2162712A1 (es)
DE (2) DE59407140D1 (es)
ES (1) ES2123781T3 (es)
HK (2) HK1010756A1 (es)
WO (2) WO1994027190A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162511A (en) * 1996-05-20 2000-12-19 Ballina Pty. Ltd. Method of coating and compositions for use therein
WO2000042830A1 (de) * 1999-01-14 2000-07-20 Schaefer Hans Juergen Verfahren und vorrichtung zur herstellung von kupferfolie, die beidseitig mit polymeren beschichtet ist und die auf leiterplatten laminiert wird
FR2814688B1 (fr) * 2000-09-29 2003-06-27 Usinor Procede et dispositif de revetement en continu d'au moins une face d'une bande metalique par un film fluide monocouche ou multicouches en polymeres reticulable
US6623825B2 (en) * 2001-03-14 2003-09-23 3M Innovative Properties Company Method of detackifying an edge face of a roll of tape
US7060352B2 (en) 2001-03-14 2006-06-13 3M Innovative Properties Company Method of detackifying an edge face of a roll of tape using a radiation curable composition
US7669547B2 (en) * 2001-03-14 2010-03-02 3M Innovative Properties Company Coating apparatus
TWI290016B (en) * 2002-10-14 2007-11-11 Atotech Deutschland Gmbh A process and an apparatus for coating printed circuit boards with laser-structurable, thermally curable solder stop lacquers and electroresists
US7364769B2 (en) * 2003-05-13 2008-04-29 Ricoh Company, Ltd. Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof
US20050058771A1 (en) * 2003-09-16 2005-03-17 International Business Machines Corporation Rolling contact screening method and apparatus
DE102007039949B3 (de) * 2007-08-23 2008-12-04 Flooring Technologies Ltd. Vorrichtung zum Auftragen einer Suspension auf eine Trägerplatte
US8506709B2 (en) 2010-04-02 2013-08-13 Advenira Enterprises, Inc. Roll coater having a recirculation loop for treating excess fluid
FR2974745B1 (fr) * 2011-05-06 2013-04-26 Commissariat Energie Atomique Dispositif et procede de depot par enduction a la racle d'encre a base de cuivre et d'indium
JP5246353B2 (ja) * 2012-01-12 2013-07-24 新日鐵住金株式会社 被膜形成方法
EP2812463B1 (en) * 2012-02-10 2016-04-13 The Diller Corporation Machine and method to chemically engrave a plate of stainless steel
DE102013010540A1 (de) 2012-08-02 2014-02-06 Hans-Jürgen Schäfer Elektroenergiespeicher mit 400 Wh/kg aus Elektrodispersionskraftstoff mit Microballs und aus Akkusolarskinfolie in liquid bed Magnetfeld Flüssigpolymer Technologie, gefüllt mit Li-Si Nanotubes für betankbare u. Wechselkassettenakkus, Kondensatoren, Solarfolien sowie Verfahren.
CN102773203B (zh) * 2012-08-03 2015-06-24 广东紫泉包装有限公司 一种用于瓶盖切口涂布的装置
CN104941863B (zh) * 2015-06-03 2017-11-17 喜健环球科技有限公司 一种全自动水平灌涂式pcb板双面涂布机
CN106696475B (zh) * 2015-11-13 2019-06-18 富泰华工业（深圳）有限公司 打印机及利用打印机打印电路板的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949667A (en) * 1988-04-20 1990-08-21 Dainippon Screen Mfg. Co., Ltd. Roll coating apparatus for forming a film of a high viscosity coating liquid on a surface
DE3833650A1 (de) * 1988-10-04 1990-04-05 Basf Ag Kontinuierliches verfahren zur herstellung eines lichtempfindlichen aufzeichnungselements
CA2026794A1 (en) * 1990-02-13 1991-08-14 Peter E. Kukanskis Method for applying liquid photoresist to planar substrate surfaces
SE469320B (sv) * 1990-11-02 1993-06-21 Thams Johan Petter B Foerfarande foer belaeggning av moensterkort med en lackbelaeggning, speciellt en loedmask
DE9201546U1 (de) * 1992-02-08 1992-05-21 Schäfer, Hans-Jürgen, Dipl.-Ing., 4060 Viersen Vorrichtung zur Beschichtung von Leiterplatten mit lösungsmittelfreien Lackschichten

Also Published As

Publication number Publication date
AU6544494A (en) 1994-12-12
CA2162712A1 (en) 1994-11-24
WO1994027190A1 (de) 1994-11-24
HK1011098A1 (en) 1999-07-02
DE59407101D1 (de) 1998-11-19
EP0698233B1 (de) 1998-10-21
JPH08510164A (ja) 1996-10-29
CA2162714A1 (en) 1994-11-24
EP0698233A1 (de) 1996-02-28
AU6544394A (en) 1994-12-12
EP0698232B1 (de) 1998-10-14
HK1010756A1 (en) 1999-06-25
ATE172550T1 (de) 1998-11-15
EP0698232A1 (de) 1996-02-28
DE59407140D1 (de) 1998-11-26
JPH08510163A (ja) 1996-10-29
US5863620A (en) 1999-01-26
WO1994027189A1 (de) 1994-11-24

Similar Documents

Publication Publication Date Title
ES2123781T3 (es) Procedimiento y dispositivo para recubrir circuitos impresos.
ATE177997T1 (de) Heissprägen von glas, keramik und anderen substraten
BR9813230A (pt) Formação de padrão
BR9914944A (pt) Revestimentos superabsorventes resistentes à água para artigos reforçados por fibras
ATE226709T1 (de) Kaltlicht-uv-bestrahlungsvorrichtung
ES2084350T3 (es) Material para impresion e instalacion de impresion que emplea dicho material.
BR9710223A (pt) Dispositivo de atomização auxiliado por gás.
US3535157A (en) Method of coating printed circuit board having through-holes
BR0114282A (pt) Processo e dispositivo de revestimento de modo contìnuo de pelo menos uma face de uma tira metálica com um filme fluido de camada única ou de camadas múltiplas feito de polìmero reticulável.
BR0202852A (pt) Composto polimérico, processo para a preparação de um composto polimérico, e, substrato inorgânico com a superfìcie tratada
BR9714756A (pt) Processo para secar um substrato revestido, aparelho para empregar o mesmo, e, processo para secar um revestimento sobre um substrato
AR042487A1 (es) Un sustrato polimerico impreso y un metodo para mejorar la adhesion de una composicion de tinta a dicho sustrato
ES2193529T3 (es) Procedimiento de fabricacion de una bobina para un transpondedor.
BR8505245A (pt) Processo para fazer aderir um material de revestimento a uma folha composita densificada com fibra caotica e folha revestida
DE60331398D1 (de) Verfahren zur herstellung von beschichtetem papier oder beschichtetem karton
BR0214979A (pt) Sistema para melhorar e modificar superfìcie
ES2073745T3 (es) Revestimientos reticulables para superficies y metodos para producirlos.
BR0011331A (pt) Dispositivo e um método para o depósito parcial de um revestimento superficial e uma lâmina ativa para respiração com um revestimento superficial parcial
MX9201779A (es) Substrato que tiene un revestimiento resistente al ataque del medio ambiente, composicion de revestimiento para el mismo, proceso para fabricar la composicion de revestimiento y proceso para revestir el substrato con la composicion.
ATE555251T1 (de) Vorhang-auftragsvorrichtung
ES2127480T3 (es) Procedimiento para proporcionar maximo brillo a peliculas de revestimiento.
MX9207140A (es) Aparato de revestimiento cortina.
MX9300331A (es) Composicion de recubrimiento de autodeposicion.
BR9712094A (pt) Folha de transferência adesiva e método paratransferência de chapa metálica para umsubstrato
BR9707498A (pt) Processo para formação de um revestimento de conversão em uma superfície de substrato de metal composição de concentrado líquido aquoso e processo para produção da mesma

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 698233

Country of ref document: ES