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ES2111541T3 - Compuestos complejos con caracter de oligomero a polimero. - Google Patents

Compuestos complejos con caracter de oligomero a polimero.

Info

Publication number
ES2111541T3
ES2111541T3 ES90916236T ES90916236T ES2111541T3 ES 2111541 T3 ES2111541 T3 ES 2111541T3 ES 90916236 T ES90916236 T ES 90916236T ES 90916236 T ES90916236 T ES 90916236T ES 2111541 T3 ES2111541 T3 ES 2111541T3
Authority
ES
Spain
Prior art keywords
oligomer
character
polymer
complex compounds
organic ligand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90916236T
Other languages
English (en)
Inventor
Lutz Stamp
Elisabeth Zettelmeyer-Decker
Heinrich Meyer
Desmaison Gonzalo Urrutia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2111541T3 publication Critical patent/ES2111541T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G85/00—General processes for preparing compounds provided for in this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Chemically Coating (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

LA INVENCION DESCRIBE COMPLEJOS DE UN GRUPO METALICO DE 8 A 11 DE LA TABLA PERIODICA CON AL MENOS UN LIGANDO ORGANICO, CARACTERIZADOS POR EL HECHO DE QUE EL COMPLEJO ESTA EN FORMA DE MULTI NUCLEO OLIGOMERICO A POLIMERICO Y QUE EL LIGANDO ORGANICO CONTIENE UN ATOMO N, O, O P O UN ENLACE MULTIPLE, O MAS DE UNO DE ESTOS ELEMENTOS.
ES90916236T 1989-11-17 1990-11-06 Compuestos complejos con caracter de oligomero a polimero. Expired - Lifetime ES2111541T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3938710A DE3938710A1 (de) 1989-11-17 1989-11-17 Komplexverbindungen mit oligomerem bis polymerem charakter

Publications (1)

Publication Number Publication Date
ES2111541T3 true ES2111541T3 (es) 1998-03-16

Family

ID=6393981

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90916236T Expired - Lifetime ES2111541T3 (es) 1989-11-17 1990-11-06 Compuestos complejos con caracter de oligomero a polimero.

Country Status (8)

Country Link
EP (1) EP0500616B1 (es)
JP (1) JP3093259B2 (es)
KR (1) KR100212370B1 (es)
AT (1) ATE161899T1 (es)
CA (1) CA2068992C (es)
DE (2) DE3938710A1 (es)
ES (1) ES2111541T3 (es)
WO (1) WO1991007522A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4130135C2 (de) * 1991-09-07 1999-07-22 Atotech Deutschland Gmbh Verfahren zur Herstellung von Formkörpern für Mikroelektrodenarrays
EP1368813B1 (en) 2000-12-15 2014-12-03 The Arizona Board of Regents on behalf of the University of Arizona Method for patterning metal using nanoparticle containing precursors
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method
JP6159205B2 (ja) * 2013-09-04 2017-07-05 ローム・アンド・ハース電子材料株式会社 無電解めっき用触媒液

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3318891A (en) * 1963-08-30 1967-05-09 Engelhard Ind Inc Palladium diacetate and method for its preparation
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates
DE2116389C3 (de) * 1971-03-30 1980-04-03 Schering Ag, 1000 Berlin Und 4619 Bergkamen Lösung zur Aktivierung von Oberflächen für die Metallisierung
DE3025307A1 (de) * 1980-07-04 1982-01-28 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von oberflaechen fuer die stromlose metallisierung
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
US4533502A (en) * 1983-02-22 1985-08-06 Rochon Fernande D Platinum (II) compounds and their preparation
GB8725148D0 (en) * 1987-10-27 1987-12-02 Omi International Gb Ltd Catalyst
EP0367885A1 (de) * 1988-11-08 1990-05-16 Schering Aktiengesellschaft Konditionierungsmittel für gedruckte Schaltungen

Also Published As

Publication number Publication date
JPH05501572A (ja) 1993-03-25
DE3938710C2 (es) 1992-10-08
DE59010794D1 (de) 1998-02-12
EP0500616A1 (de) 1992-09-02
ATE161899T1 (de) 1998-01-15
WO1991007522A1 (de) 1991-05-30
JP3093259B2 (ja) 2000-10-03
CA2068992C (en) 1997-08-19
KR100212370B1 (ko) 1999-08-02
EP0500616B1 (de) 1998-01-07
DE3938710A1 (de) 1991-05-23
KR927003872A (ko) 1992-12-18

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