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ES2110642T3 - PROCEDURE FOR THE MANUFACTURE OF STAGED MOLD INSERTS, STAGED MOLD INSERTS AND HIGH PRECISION STAGNED MICROSTRUCTURAL BODIES MOLDED WITH THEM. - Google Patents

PROCEDURE FOR THE MANUFACTURE OF STAGED MOLD INSERTS, STAGED MOLD INSERTS AND HIGH PRECISION STAGNED MICROSTRUCTURAL BODIES MOLDED WITH THEM.

Info

Publication number
ES2110642T3
ES2110642T3 ES94101765T ES94101765T ES2110642T3 ES 2110642 T3 ES2110642 T3 ES 2110642T3 ES 94101765 T ES94101765 T ES 94101765T ES 94101765 T ES94101765 T ES 94101765T ES 2110642 T3 ES2110642 T3 ES 2110642T3
Authority
ES
Spain
Prior art keywords
high precision
mold inserts
staged
masks
staged mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94101765T
Other languages
Spanish (es)
Inventor
Holger Dr Reinecke
Arnd Dr Rogner
Friedolin Franz Noker
Ulrich Dr Sieber
Gerd Dr Prufer
Helge Pannhoff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boehringer Ingelheim Microparts GmbH
Original Assignee
Microparts Gesellschaft fuer Mikrostrukturtechnik mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microparts Gesellschaft fuer Mikrostrukturtechnik mbH filed Critical Microparts Gesellschaft fuer Mikrostrukturtechnik mbH
Application granted granted Critical
Publication of ES2110642T3 publication Critical patent/ES2110642T3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

2.1 LAS APLICACIONES DE MOLDE ESCALONADAS SE ELABORACION BAJO UTILIZACION DE MASCARAS DE RADIACION ESTRUCTURADAS CON ABSORCION DIFERENTE POR ZONAS PARA RADIACION DE RAYOS X; PARA ELLO SON NECESARIOS CALCULOS EXTENSOS. ADEMAS PUEDEN SER UTILIZADAS MULTIPLES MASCARAS, UNAS DESPUES DE OTRAS Y PARA CADA ETAPA DE RADIACION MODIFICAR LA PROFUNDIDAD DE LA PENETRACION DE RAYOS X; DEBIENDO SER POSICIONADAS LAS MASCARAS CON ALTA PRECISION. CON EL NUEVO PROCEDIMIENTO SE ELABORAN DE FORMA SENCILLA APLICACIONES DE MOLDE ESCALONADAS. 2.2 SOBRE UNA PLACA PLANA SE GENERAN DE FORMA LITOGRAFICA ZONAS DE APLICACION LIBRE MEDIANTE DESARROLLO, SIENDO LLENADAS DE UNA CAPA DE RESISTENCIA ESTRUCTURADA CON METAL. LA CAPA SE DESMONTA MECANICAMENTE HASTA CONSEGUIR EL ESPESOR PREDETERMINADO. DESPUES DE LA ELIMINACION DEL RESTO DE MATERIAL SE REPITE EVENTUALMENTE DE FORMA MULTIPLE ESTE PROCESO. LAS ZONAS DE APLICACION LIBRE CON ESTA CAPA APLICADA EN ULTIMO LUGAR SE RELLENAN CON METAL Y SE CUBREN DE FORMA SEPARADA CON OTRA CAPA, CON LO CUAL SE OBTIENE LA APLICACION DE MOLDE METALICO MULTIESCALONADA. 2.3 ELABORACION DE CUERPOS DE MICROESTRUCTURA DE ALTA PRECISION CON ESTRUCTURA MULTIESCALONADA.2.1 THE STAGED MOLD APPLICATIONS ARE MADE UNDER THE USE OF STRUCTURED RADIATION MASKS WITH DIFFERENT ABSORPTION BY ZONES FOR X-RAY RADIATION; FOR THIS ARE EXTENSIVE CALCULATIONS NECESSARY. IN ADDITION, MULTIPLE MASKS MAY BE USED, ONE AFTER OTHERS AND FOR EACH STAGE OF RADIATION, MODIFY THE DEPTH OF X-RAY PENETRATION; THE HIGH PRECISION MASKS SHOULD BE POSITIONED. WITH THE NEW PROCEDURE, STAGED MOLD APPLICATIONS ARE SIMPLY PREPARED. 2.2 ON A FLAT PLATE LITHOGRAPHIC AREAS ARE GENERATED FREE APPLICATION THROUGH DEVELOPMENT, BEING FILLED WITH A METAL STRUCTURED RESISTANCE LAYER. THE COAT IS MECHANICALLY DISMANTLED UNTIL THE DEFAULT THICKNESS IS OBTAINED. AFTER THE REMOVAL OF THE REST OF MATERIAL THIS PROCESS IS EVENTUALLY REPEATED IN A MULTIPLE WAY. THE AREAS OF FREE APPLICATION WITH THIS LAYER APPLIED IN THE LAST PLACE ARE FILLED WITH METAL AND ARE COVERED SEPARATELY WITH ANOTHER LAYER, WHICH IS WHICH THE APPLICATION OF A MULTI-GRADED METALLIC MOLD IS OBTAINED. 2.3 ELABORATION OF HIGH PRECISION MICROSTRUCTURE BODIES WITH MULTI-GRADED STRUCTURE.

ES94101765T 1993-03-30 1994-02-05 PROCEDURE FOR THE MANUFACTURE OF STAGED MOLD INSERTS, STAGED MOLD INSERTS AND HIGH PRECISION STAGNED MICROSTRUCTURAL BODIES MOLDED WITH THEM. Expired - Lifetime ES2110642T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4310296A DE4310296A1 (en) 1993-03-30 1993-03-30 Process for producing stepped mold inserts, stepped mold inserts and molded stepped microstructure bodies with high precision

Publications (1)

Publication Number Publication Date
ES2110642T3 true ES2110642T3 (en) 1998-02-16

Family

ID=6484218

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94101765T Expired - Lifetime ES2110642T3 (en) 1993-03-30 1994-02-05 PROCEDURE FOR THE MANUFACTURE OF STAGED MOLD INSERTS, STAGED MOLD INSERTS AND HIGH PRECISION STAGNED MICROSTRUCTURAL BODIES MOLDED WITH THEM.

Country Status (5)

Country Link
EP (1) EP0618502B1 (en)
JP (1) JP3342945B2 (en)
KR (1) KR100321017B1 (en)
DE (2) DE4310296A1 (en)
ES (1) ES2110642T3 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19524099A1 (en) * 1995-07-01 1997-01-02 Karlsruhe Forschzent Process for the production of mold inserts
DE19607671B4 (en) * 1996-02-29 2004-08-26 INSTITUT FüR MIKROTECHNIK MAINZ GMBH Process for the production of optical components with coupled optical waveguides and components produced by this process
DE19612329A1 (en) * 1996-03-28 1997-10-02 Leybold Ag Metal master production for CD manufacture
DE29808852U1 (en) * 1998-05-18 1999-09-30 Applikations- und Technikzentrum für Energieverfahrens-, Umwelt- und Strömungstechnik, 92237 Sulzbach-Rosenberg Starter plate for selective laser sintering
WO2001036341A2 (en) * 1999-11-17 2001-05-25 Schott Glas Method for microstructuring the form-giving surface of a form-giving tool for producing microstructures in glass or synthetic material and form-giving tool appurtenant thereto
EP1225477A1 (en) * 2001-01-17 2002-07-24 Hubert Lorenz Process for fabricating and marking micromechanical components using photolithography and electrodeposition
JP2003028895A (en) * 2001-07-17 2003-01-29 Kyushu Hitachi Maxell Ltd Manufacturing method of contact probe with bump
KR20040051879A (en) * 2002-12-13 2004-06-19 강신일 Cemented carbide micromold insert and fabrication method of cemented carbide micromold insert for glass molding
JP3990307B2 (en) * 2003-03-24 2007-10-10 株式会社クラレ Manufacturing method of resin molded product, manufacturing method of metal structure, chip
EP1711961A4 (en) * 2003-12-31 2008-10-22 Microfabrica Inc Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
CN109338419A (en) * 2018-12-03 2019-02-15 台州市黄岩圣发模具有限公司 A kind of PDCPD nickel mould and its electroforming manufacturing process

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4124473A (en) * 1977-06-17 1978-11-07 Rca Corporation Fabrication of multi-level relief patterns in a substrate
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
US4530639A (en) * 1984-02-06 1985-07-23 A/S Kongsberg Vapenfabrikk Dual-entry centrifugal compressor
DE3623637A1 (en) * 1986-07-12 1988-01-21 Kernforschungsz Karlsruhe METHOD FOR PRODUCING MICROSTRUCTURES OF DIFFERENT STRUCTURAL HEIGHT BY MEANS OF X-RAY DEPTH LITHOGRAPHY
JPH0636472B2 (en) * 1990-05-28 1994-05-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン Method for manufacturing multilayer wiring board

Also Published As

Publication number Publication date
KR100321017B1 (en) 2002-07-08
KR940022190A (en) 1994-10-20
DE59404694D1 (en) 1998-01-15
JP3342945B2 (en) 2002-11-11
EP0618502A1 (en) 1994-10-05
EP0618502B1 (en) 1997-12-03
JPH0734287A (en) 1995-02-03
DE4310296A1 (en) 1994-10-06

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