[go: up one dir, main page]

ES2100398T3 - Recubrimiento protector para placas de circuitos impresos y procedimiento para su fabricacion. - Google Patents

Recubrimiento protector para placas de circuitos impresos y procedimiento para su fabricacion.

Info

Publication number
ES2100398T3
ES2100398T3 ES93110423T ES93110423T ES2100398T3 ES 2100398 T3 ES2100398 T3 ES 2100398T3 ES 93110423 T ES93110423 T ES 93110423T ES 93110423 T ES93110423 T ES 93110423T ES 2100398 T3 ES2100398 T3 ES 2100398T3
Authority
ES
Spain
Prior art keywords
printed circuit
circuit board
protective coating
film
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93110423T
Other languages
English (en)
Inventor
Arthur Hidber
Eduard Ryser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cerberus AG
Original Assignee
Cerberus AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4224633&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2100398(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cerberus AG filed Critical Cerberus AG
Application granted granted Critical
Publication of ES2100398T3 publication Critical patent/ES2100398T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/22—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using layers or sheathings having a shape adapted to the shape of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/08—Deep drawing or matched-mould forming, i.e. using mechanical means only
    • B29C51/082—Deep drawing or matched-mould forming, i.e. using mechanical means only by shaping between complementary mould parts
    • B29C51/085—Deep drawing or matched-mould forming, i.e. using mechanical means only by shaping between complementary mould parts with at least one of the shaping surfaces being made of resilien material, e.g. rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/10—Polymers of propylene
    • B29K2023/12—PP, i.e. polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2091/00—Use of waxes as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0088—Blends of polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

SE FABRICA UN RECUBRIMIENTO DE PROTECCION PARA GRUPOS CONSTRUCTIVOS ELECTRONICOS (13) SOBRE UNA PLACA DE CIRCUITOS IMPRESOS (9), PARA LO CUAL UNA HOJA DE PLASTICO (16) PREFABRICADA, LAMINADA A UN ESPESOR PREFIJADO EN FORMA DE BANDA SOPORTE (1), SE PONE EN UNA DE LAS SUPERFICIES A PROTEGER DEL MOLDE CORRESPONDIENTE, POR EJEMPLO, POR TROQUELADO O POR CORTE CON CHORRO DE AGUA DEL MOLDE, EN CASO NECESARIO DEJANDO LIBRE ABERTURAS (10) PARA COMPONENTES LIBRES (14). LA HOJA (16) SE COLOCA SOBRE LA PLACA DE CIRCUITOS IMPRESOS (9) Y DESPUES DEL ABLANDADO CON UN TAMPON DE SILICONA (17) SE PRESIONA EN LOS GRUPOS CONSTRUCTIVOS ELECTRONICOS (13), DE FORMA QUE SE ORIGINA UNA TOPOGRAFIA EN ESTRECHO CONTACTO. FINALMENTE SE FUNDE LA HOJA (16) SOBRE LOS GRUPOS CONSTRUCTIVOS ELECTRONICOS (13). COMO MATERIAL DE PARTIDA SIRVE UNA MEZCLA DE PLASTICOS TERMOPLASTICOS CON UNA CERA, CON UNA PROPORCION ELEVADA DE HIDROCARBUROS DE CADENA RAMIFICADA Y CICLOALIFATICOS.
ES93110423T 1992-06-30 1993-06-30 Recubrimiento protector para placas de circuitos impresos y procedimiento para su fabricacion. Expired - Lifetime ES2100398T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH2044/92A CH684479A5 (de) 1992-06-30 1992-06-30 Schutzüberzug für elektronische Baugruppen auf einer Leiterplatte, sowie Verfahren zu dessen Herstellung.

Publications (1)

Publication Number Publication Date
ES2100398T3 true ES2100398T3 (es) 1997-06-16

Family

ID=4224633

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93110423T Expired - Lifetime ES2100398T3 (es) 1992-06-30 1993-06-30 Recubrimiento protector para placas de circuitos impresos y procedimiento para su fabricacion.

Country Status (6)

Country Link
US (1) US5543008A (es)
EP (1) EP0577094B1 (es)
AT (1) ATE148820T1 (es)
CH (1) CH684479A5 (es)
DE (1) DE59305371D1 (es)
ES (1) ES2100398T3 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6127038A (en) * 1997-12-11 2000-10-03 American Meter Company Printed circuit board coating and method
US6404643B1 (en) 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
US6248199B1 (en) 1999-04-26 2001-06-19 Soundcraft, Inc. Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements
DE102004028603A1 (de) * 2004-06-07 2005-12-22 E.G.O. Control Systems Gmbh Verfahren zur Beschichtung einer Seite einer Leiterplatte, beschichtete Leiterplatte sowie Beschichtungs-Material
DE102004057493A1 (de) * 2004-11-29 2006-06-01 Siemens Ag Umhüllung von auf einem Substrat angeordneten Bauelementen
EP1770603A1 (en) * 2005-10-03 2007-04-04 Assa Abloy Identification Technology Group AB Encapsulated transponder and method for manufacturing the same
JP5555180B2 (ja) * 2008-01-16 2014-07-23 ライツ、 キャメラ、 アクション エルエルシイ 水中使用可能な高照度光源アセンブリー
WO2013106442A1 (en) * 2012-01-10 2013-07-18 Hzo, Inc. Masks for use in applying protective coatings to electronic assemblies, masked electronic assemblies and associated methods
KR20150020574A (ko) 2012-06-18 2015-02-26 에이치제트오 인코포레이티드 완전히 조립된 전자 디바이스의 내부 표면에 보호 코팅을 제공하는 시스템 및 방법
EP2780935A4 (en) 2013-01-08 2015-11-11 Hzo Inc REMOVAL OF SELECTED PARTS FROM SUBSTRATE PROTECTIVE COATINGS
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
US10306840B1 (en) * 2018-01-19 2019-06-04 Adam J. Mueller Reinforced agricultural silage covers
CN109093754A (zh) * 2018-09-30 2018-12-28 欣兴同泰科技（昆山）有限公司 带有自动收放料装置的高速成型装置
PL434034A1 (pl) * 2020-05-22 2021-11-29 Polskie Zakłady Lotnicze Spółka Z Ograniczoną Odpowiedzialnością Sposób wykonania stempla oraz stempel wykonany tym sposobem

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2772501A (en) * 1956-05-31 1956-12-04 Robert J Malcolm Method of manufacturing electrical circuit components
DE1182319B (de) * 1954-07-12 1964-11-26 Beck S Inc Verfahren zur Herstellung eines Leitungsmusters auf einer Kunststofftraegerplatte
US2938939A (en) * 1956-05-31 1960-05-31 Robert J Malcolm Printed circuit panel
US3713939A (en) * 1970-03-04 1973-01-30 Polymer Corp Method of processing articles of very thin plastic film material
US3996328A (en) * 1970-04-01 1976-12-07 Congoleum Corporation Method for finishing resinous surface coverings
GB1371334A (en) * 1970-10-30 1974-10-23 Agfa Gevaert Film stretching method and apparatus
JPS60209884A (ja) * 1984-04-02 1985-10-22 Toshiba Corp Ｉｃカ−ド
US4949610A (en) * 1985-04-15 1990-08-21 Flow System, Inc. Board-supporting assembly for fluid jet cutting system
US4687615A (en) * 1985-09-16 1987-08-18 Okura Industrial Co., Ltd. Method of producing biaxially oriented tubular polyetheretherketone films
US5114518A (en) * 1986-10-23 1992-05-19 International Business Machines Corporation Method of making multilayer circuit boards having conformal Insulating layers
US5017659A (en) * 1987-03-13 1991-05-21 Groep L A V D Polymer composition, a process for its manufacture, and a thermoplastic moulding composition
DE3714662A1 (de) * 1987-05-02 1988-11-17 Kronseder Maschf Krones Verfahren und vorrichtung zum schneiden von konturierten etiketten
US4822836A (en) * 1987-09-18 1989-04-18 General Electric Company Polyphenylene ether/polyamide blends having improved melt flow characteristics
JPH01186316A (ja) * 1988-01-20 1989-07-25 Showa Denko Kk 熱可塑性樹脂製容器の製造方法
JPH01210299A (ja) * 1988-02-17 1989-08-23 Fuji Photo Film Co Ltd ウェブ穿孔装置
JP2609545B2 (ja) * 1988-05-02 1997-05-14 プリントパック・イリノイ・インク 遮断性のすぐれたポリオレフィンフィルム
US5260130A (en) * 1989-09-29 1993-11-09 Shin-Etsu Chemical Co., Ltd. Adhesive composition and coverlay film therewith
US5018670A (en) * 1990-01-10 1991-05-28 Possis Corporation Cutting head for water jet cutting machine
US5102712A (en) * 1990-02-13 1992-04-07 Conductive Containers, Inc. Process for conformal coating of printed circuit boards
AT396085B (de) * 1990-07-13 1993-05-25 Gfm Fertigungstechnik Vorrichtung zum beschneiden raeumlicher formteile aus kunststoff od. dgl.
DE4026353C1 (es) * 1990-08-21 1991-12-12 Fa. Carl Freudenberg, 6940 Weinheim, De
US5158324A (en) * 1990-10-19 1992-10-27 Flesher Robert W Protective cover for vehicles
US5173239A (en) * 1991-08-29 1992-12-22 E. I. Du Pont De Nemours And Company Process for stretching a web of material
US5318855A (en) * 1992-08-25 1994-06-07 International Business Machines Corporation Electronic assembly with flexible film cover for providing electrical and environmental protection

Also Published As

Publication number Publication date
CH684479A5 (de) 1994-09-30
US5543008A (en) 1996-08-06
EP0577094A1 (de) 1994-01-05
DE59305371D1 (de) 1997-03-20
EP0577094B1 (de) 1997-02-05
ATE148820T1 (de) 1997-02-15

Similar Documents

Publication Publication Date Title
ES2100398T3 (es) Recubrimiento protector para placas de circuitos impresos y procedimiento para su fabricacion.
DE2967245D1 (en) Substrate for flexible printed circuits and method of fabricating the same, and film
DE3461058D1 (en) Heatshrinkable identification device
ES2029539T3 (es) Procedimiento y dispositivo para la fabricacion de pastillas.
GB2253112B (en) Electronic apparatus for the laser imprinting of screen-process printing stencils and the like
GB2244921A (en) Absorbent devices and precursors therefor
DE59201423D1 (de) Verfahren zur kontinuierlichen bildung einer gleichförmigen schicht von streugut und vorrichtung zur durchführung des verfahrens.
DE3176951D1 (en) Printed circuit board and method for fabricating the same
KR900014638A (ko) 기판위에 막패턴을 형성하는 방법 및 패널기판의 제조방법
GB2248970B (en) Method for masking through holes during the manufacture of printed circuit boards
ES2181233T3 (es) Ficha intermedia, procedimiento y dispositivo para la preparacion de un documento que lleva inscripciones variables.
ATE161675T1 (de) Verfahren zur herstellung eines substrates mit vorstehenden portionen
DE69109825D1 (de) Verfahren und Vorrichtung zur Inspektion der Linienbreiten einer gedruckten Schaltung.
DE69112646D1 (de) Verfahren und vorrichtung zur herstellung von etiketten.
ES267622Y (es) "un dispositivo de receptaculo de contacto formado de chapa metalica para montar un substrato sobre un panel de circuito impreso".
DE69320498D1 (de) Verfahren zur Herstellung von Dünnfilm-Leiterplatten
DE69032642D1 (de) Verfahren und Vorrichtung zur Herstellung einer synthetischen Schichtstoffplatte sowie Gegenstand daraus
JPS52142740A (en) Method of formation of shaped pattern using paper pattern having air-permeable formed layer
EP0332602A3 (en) Procedure for coating elements consisting in expanded plastic, and devices applied for it
ATE124653T1 (de) Verfahren und vorrichtung zur offsetlackierung.
JPS5394543A (en) Embossing plate
JPS5311931A (en) Method of laminating surface material in the production of corrugated board for interior
ES2040439T3 (es) Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto.
JPS53138056A (en) Method of coating resin layer on printed circuit board metal material substrate having through hole
KR960003428B1 (en) Synthetic resin composition, substrate material for printed circuit boards, and the method of manufacturing a synthetic resin composition

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 577094

Country of ref document: ES