ES2085387T3 - Procedimiento de fabricacion de transductores de presion del tipo diafragma equipados con extensimetros. - Google Patents
Procedimiento de fabricacion de transductores de presion del tipo diafragma equipados con extensimetros.Info
- Publication number
- ES2085387T3 ES2085387T3 ES91113969T ES91113969T ES2085387T3 ES 2085387 T3 ES2085387 T3 ES 2085387T3 ES 91113969 T ES91113969 T ES 91113969T ES 91113969 T ES91113969 T ES 91113969T ES 2085387 T3 ES2085387 T3 ES 2085387T3
- Authority
- ES
- Spain
- Prior art keywords
- pressure transducers
- matrix
- diaphragm
- extensimeters
- manufacturing procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000011159 matrix material Substances 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49103—Strain gauge making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
SE PRESENTA UN METODO PARA FABRICAR UNA PLURALIDAD DE TRANSDUCTORES DE PRESION SEPARADOS DEL TIPO DE LOS QUE COMPRENDEN UN CIRCUITO MEDIDOR DE DEFORMACION UNIDO AL DIAFRAGMA, EL METODO COMPRENDE LOS PASOS DE SUMINISTRAR UNA MATRIZ DE UNA PLURALIDAD DE CIRCUITOS MEDIDORES DE DEFORMACION FORMADOS SOBRE UNA HOJA LAMINADA Y UNA MATRIZ DE UNA PLURALIDAD DE DIAFRAGMAS QUE SE CORRESPONDE CON LA MATRIZ DE CIRCUITOS MEDIDORES DE DEFORMACION. LA MATRIZ DE CIRCUITOS MEDIDORES DE DEFORMACION SE ALINEA CON LA MATRIZ DE DIAFRAGMA. LA HOJA LAMINADA SE UNE A LA MATRIZ DE DIAFRAGMAS, CON CADA CIRCUITO MEDIDOR DE DEFORMACION ALINEADO CON UN DIAFRAGMA RESPECTIVO. FINALMENTE EL LAMINADO SE CORTA PARA FORMAR LOS TRANSDUCTORES DE PRESION SEPARADOS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/576,664 US5049232A (en) | 1990-08-31 | 1990-08-31 | Method of making diaphragm-type pressure transducers |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2085387T3 true ES2085387T3 (es) | 1996-06-01 |
Family
ID=24305426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES91113969T Expired - Lifetime ES2085387T3 (es) | 1990-08-31 | 1991-08-21 | Procedimiento de fabricacion de transductores de presion del tipo diafragma equipados con extensimetros. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5049232A (es) |
EP (1) | EP0496032B1 (es) |
JP (1) | JP3121389B2 (es) |
DE (1) | DE69118507T2 (es) |
ES (1) | ES2085387T3 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5328551A (en) * | 1992-10-28 | 1994-07-12 | Eaton Corporation | Method of making high output strain gage |
GB9321699D0 (en) * | 1993-10-21 | 1993-12-15 | Barnett John D | Improvements in or relating to sensors |
US5967030A (en) * | 1995-11-17 | 1999-10-19 | Micron Technology, Inc. | Global planarization method and apparatus |
US6642981B1 (en) | 1996-09-30 | 2003-11-04 | Fujitsu Display Technologies Corporation | Liquid crystal display device operating in a vertically aligned mode including at least one retardation film |
US6331488B1 (en) | 1997-05-23 | 2001-12-18 | Micron Technology, Inc. | Planarization process for semiconductor substrates |
US6316363B1 (en) | 1999-09-02 | 2001-11-13 | Micron Technology, Inc. | Deadhesion method and mechanism for wafer processing |
US6067016A (en) * | 1997-06-02 | 2000-05-23 | Avery Dennison Corporation | EAS marker and method of manufacturing same |
US6692672B1 (en) | 1997-06-02 | 2004-02-17 | Avery Dennison Corporation | EAS marker and method of manufacturing same |
US6218316B1 (en) | 1998-10-22 | 2001-04-17 | Micron Technology, Inc. | Planarization of non-planar surfaces in device fabrication |
US6230609B1 (en) * | 1999-06-03 | 2001-05-15 | Norton Performance Plastics Corporation | Fluoropolymer diaphragm with integral attachment device |
US6518172B1 (en) | 2000-08-29 | 2003-02-11 | Micron Technology, Inc. | Method for applying uniform pressurized film across wafer |
US20030211330A1 (en) * | 2002-05-09 | 2003-11-13 | Anderson Robert A. | Method of preparing a metal material for bonding |
ITTO20120504A1 (it) * | 2012-06-11 | 2013-12-12 | Alenia Aermacchi Spa | Metodo di realizzazione di una struttura aeronautica a profilo chiuso provvista di sensori di deformazione |
FR3023909B1 (fr) * | 2014-07-17 | 2020-11-20 | Centre Techn Ind Mecanique | Procede de realisation d'un capteur d'efforts et installation de mise en œuvre |
IL275618A (en) * | 2020-06-23 | 2022-01-01 | Vishay Advanced Tech Ltd | A method of manufacturing a polyimide-based flexible resistor or commutator |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB645331A (en) * | 1944-06-19 | 1950-11-01 | Douglas Crisp Gall | Improvements in strain gauges and methods of and means for the production thereof |
US4021766A (en) * | 1975-07-28 | 1977-05-03 | Aine Harry E | Solid state pressure transducer of the leaf spring type and batch method of making same |
US4133100A (en) * | 1976-12-27 | 1979-01-09 | Myhre Kjell E | Method of making diaphragm of optimized stress and strain distribution |
US4295116A (en) * | 1979-12-05 | 1981-10-13 | Bofors America, Inc. | Pressure transducer |
GB2174241A (en) * | 1985-04-25 | 1986-10-29 | Transamerica Delaval Inc | Transducer devices |
EP0229553A1 (fr) * | 1985-12-04 | 1987-07-22 | Seb S.A. | Procédé pour fabriquer et appliquer des jauges de contrainte, et jauges de contrainte obtenues notamment au cours de ce procédé |
JPH0810170B2 (ja) * | 1987-03-06 | 1996-01-31 | 株式会社日立製作所 | 半導体絶対圧力センサの製造方法 |
GB8917191D0 (en) * | 1989-07-27 | 1989-09-13 | Gec Avery Technology | Strain gauge encapsulation process |
-
1990
- 1990-08-31 US US07/576,664 patent/US5049232A/en not_active Expired - Lifetime
-
1991
- 1991-08-21 EP EP91113969A patent/EP0496032B1/en not_active Expired - Lifetime
- 1991-08-21 ES ES91113969T patent/ES2085387T3/es not_active Expired - Lifetime
- 1991-08-21 DE DE69118507T patent/DE69118507T2/de not_active Expired - Lifetime
- 1991-08-22 JP JP03233771A patent/JP3121389B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5049232A (en) | 1991-09-17 |
JP3121389B2 (ja) | 2000-12-25 |
EP0496032B1 (en) | 1996-04-03 |
JPH0593665A (ja) | 1993-04-16 |
DE69118507D1 (de) | 1996-05-09 |
EP0496032A3 (en) | 1993-01-20 |
DE69118507T2 (de) | 1996-11-28 |
EP0496032A2 (en) | 1992-07-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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