[go: up one dir, main page]

ES2082470T3 - Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas. - Google Patents

Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas.

Info

Publication number
ES2082470T3
ES2082470T3 ES92909860T ES92909860T ES2082470T3 ES 2082470 T3 ES2082470 T3 ES 2082470T3 ES 92909860 T ES92909860 T ES 92909860T ES 92909860 T ES92909860 T ES 92909860T ES 2082470 T3 ES2082470 T3 ES 2082470T3
Authority
ES
Spain
Prior art keywords
zones
plastic material
manufacture
procedure
wall thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92909860T
Other languages
English (en)
Other versions
ES2082470T5 (es
Inventor
Renee-Lucia Barak
Yahya Haghiri-Tehrani
Helmut Baader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GAO Gesellschaft fuer Automation und Organisation mbH
Original Assignee
GAO Gesellschaft fuer Automation und Organisation mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25903497&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2082470(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from DE19914115208 external-priority patent/DE4115208C2/de
Priority claimed from DE19914142392 external-priority patent/DE4142392C2/de
Application filed by GAO Gesellschaft fuer Automation und Organisation mbH filed Critical GAO Gesellschaft fuer Automation und Organisation mbH
Publication of ES2082470T3 publication Critical patent/ES2082470T3/es
Application granted granted Critical
Publication of ES2082470T5 publication Critical patent/ES2082470T5/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
    • B29C45/14024—Intermittently feeding endless articles, e.g. transfer films, to the mould and punching or cutting a portion from the endless articles during mould closing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C2045/569—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding using a mould part for decreasing and a mould part for increasing the volume of the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

EL PROCESO DE ACUERDO CON LA INVENCION PARA LA FABRICACION DE TARJETAS DE PLASTICO LIGERAS Y PIEZAS EN BRUTO PARA TARJETAS DE PLASTICO CON ZONAS DE PARED DE ESPESOR NOTABLEMENTE REDUCIDO, PREVE INYECTAR EL MATERIAL DE PLASTICO PRIMERAMENTE EN UNA CAVIDAD DE MOLDEO INICIAL QUE NO TIENE ZONAS DE PARED DE ESPESOR REDUCIDO. A CONTINUACION SE REDUCE LA DISTANCIA ENTRE CIERTAS REGIONES DE PARED DE LA CAVIDAD DE MOLDEO INICIAL HASTA LA DIMENSION EXIGIDA CON DESPLAZAMIENTO DEL MATERIAL PLASTICO A LAS ZONAS VECINAS DE LA CAVIDAD DE MOLDEO.
ES92909860T 1991-05-10 1992-05-07 Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas. Expired - Lifetime ES2082470T5 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19914115208 DE4115208C2 (de) 1991-05-10 1991-05-10 Verfahren und Vorrichtung zum Herstellen von Kunststoff-Formstücken mit bereichsweise reduzierter Wandstärke
DE19914142392 DE4142392C2 (de) 1991-12-20 1991-12-20 Verfahren und Vorrichtung zum Herstellen von spritzgegossenen Chipkarten mit bereichsweise reduzierter Wandstärke

Publications (2)

Publication Number Publication Date
ES2082470T3 true ES2082470T3 (es) 1996-03-16
ES2082470T5 ES2082470T5 (es) 2003-12-16

Family

ID=25903497

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92909860T Expired - Lifetime ES2082470T5 (es) 1991-05-10 1992-05-07 Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas.

Country Status (10)

Country Link
US (1) US5681356A (es)
EP (1) EP0584143B2 (es)
JP (1) JP3290986B2 (es)
AT (1) ATE133105T1 (es)
DE (1) DE59205116D1 (es)
DK (1) DK0584143T3 (es)
ES (1) ES2082470T5 (es)
GR (1) GR3018955T3 (es)
HK (1) HK1007705A1 (es)
WO (1) WO1992020506A1 (es)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476629A (en) * 1992-12-25 1995-12-19 Citizen Watch Co. Ltd. Method for manufacturing IC card substrate
DE4401588C2 (de) * 1994-01-20 2003-02-20 Gemplus Gmbh Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul
ES2102317B1 (es) * 1994-09-19 1998-04-16 Nacional Moneda Timbre Tarjeta inteligente de uso en telefonia y similar.
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
US5975584A (en) * 1996-08-30 1999-11-02 Adaptech S.A. Carrier card with value chip
US6190942B1 (en) * 1996-10-09 2001-02-20 Pav Card Gmbh Method and connection arrangement for producing a smart card
US5823071A (en) * 1996-10-31 1998-10-20 Borg-Warner Automotive, Inc. Integrated transmission control system
DE19703122C1 (de) * 1997-01-29 1998-05-20 Orga Kartensysteme Gmbh Verfahren zur Herstellung von Datenträgern
DE19736082C1 (de) 1997-08-20 1999-01-14 Orga Kartensysteme Gmbh Verfahren und Herstellen einer Chipkarte und Vorrichtung zur Durchführung des Verfahrens
FR2778002B1 (fr) * 1998-04-22 2000-06-30 Gemplus Card Int Procede de fabrication d'une carte a circuit integre a contact et une carte obtenue selon ce procede
DK1076315T3 (da) * 1999-08-12 2005-05-23 Ovd Kinegram Ag Databærer
JP4606553B2 (ja) * 2000-08-11 2011-01-05 大日本印刷株式会社 カード状基材の製造用金型およびカード状基材の製造方法
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
US6588099B2 (en) * 2001-01-22 2003-07-08 Sankyo Kasei Kabushiki Kaisha Process for manufacturing molded circuit board
PL365289A1 (en) * 2001-02-22 2004-12-27 Tele-Cd Company A/S Method for production of an optical disc with a detachable module
EP1249330A1 (de) * 2001-04-12 2002-10-16 Dynamit Nobel Kunststoff GmbH Verfahren zur Herstellung eines Kunststoff-Bauteils und Bauteil
PT1456810E (pt) 2001-12-18 2011-07-25 L 1 Secure Credentialing Inc Características de segurança com imagens múltiplas para documentos de identificação e processo para as efectuar
FR2834103B1 (fr) * 2001-12-20 2004-04-02 Gemplus Card Int Carte a puce a module de surface etendue
WO2003056507A1 (en) 2001-12-24 2003-07-10 Digimarc Id Systems, Llc Systems, compositions, and methods for full color laser engraving of id documents
AU2002364036A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Laser etched security features for identification documents and methods of making same
WO2003056500A1 (en) 2001-12-24 2003-07-10 Digimarc Id Systems, Llc Covert variable information on id documents and methods of making same
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
CA2469956C (en) * 2001-12-24 2009-01-27 Digimarc Id Systems, Llc Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same
WO2003088144A2 (en) 2002-04-09 2003-10-23 Digimarc Id Systems, Llc Image processing techniques for printing identification cards and documents
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
WO2004049242A2 (en) 2002-11-26 2004-06-10 Digimarc Id Systems Systems and methods for managing and detecting fraud in image databases used with identification documents
WO2004095348A2 (en) 2003-04-16 2004-11-04 Digimarc Corporation Three dimensional data storage
US7744002B2 (en) 2004-03-11 2010-06-29 L-1 Secure Credentialing, Inc. Tamper evident adhesive and identification document including same
DE102007062459B4 (de) 2007-12-22 2022-10-27 Leuze Electronic Gmbh + Co. Kg Vorrichtung zum Verbinden zweier optischer und/oder elektronischer Bauteile
US20130221544A1 (en) * 2010-10-29 2013-08-29 Konica Minolta, Inc. Molding die, microchip manufactured by using molding die, and manufacturing apparatus for manufacturing microchip
NO348516B1 (no) * 2013-04-30 2025-02-24 Sinvent As En fremgangsmåte for fremstilling av et lab-på-brikke-system og et lab-på-brikke-system
GB2542711B (en) * 2015-09-25 2019-04-10 Gr8 Eng Ltd Injection moulding method
DE102015119235B4 (de) * 2015-11-09 2019-01-10 Selectrona GmbH Vorrichtung zum Spritzgießen und Umspritzen von Objekten
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
MX2019001144A (es) * 2016-07-27 2019-06-10 Composecure Llc Componentes electronicos sobremoldeados para tarjetas de transaccion y metodos para hacer los mismos.
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
KR102714896B1 (ko) 2017-09-07 2024-10-07 컴포시큐어 엘엘씨 임베딩된 전자 컴포넌트들을 갖는 트랜잭션 카드 및 제조를 위한 프로세스
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
DK4109337T3 (en) 2017-10-18 2024-12-02 Composecure Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and backlighting
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
DE102021210271A1 (de) * 2021-09-16 2023-03-16 Magna Exteriors Gmbh Verfahren zum Herstellen von Kunststoffbauteilen

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3030666A (en) * 1960-01-07 1962-04-24 Owens Illinois Glass Co Method for low pressure molding
DE1729368A1 (de) * 1967-10-13 1971-06-09 Per Thorkildsen Verfahren und Vorrichtung zur Herstellung von dekorierten,spritzgegossenen Plastgegenstaenden
US4184835A (en) * 1978-09-28 1980-01-22 General Electric Company Mold apparatus
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3153769C2 (de) * 1981-04-14 1995-10-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
JPS6058010B2 (ja) * 1981-04-14 1985-12-18 三井化学株式会社 射出圧縮成形方法
US4470786A (en) * 1981-07-28 1984-09-11 Omron Tateisi Electronics Co. Molding apparatus with retractable preform support pins
JPS5839425A (ja) * 1981-09-04 1983-03-08 Hashimoto Forming Co Ltd 低圧射出成形法
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
DD230476A3 (de) * 1983-03-25 1985-12-04 Schwarzenberg Waschgeraete Verfahren zur herstellung von spritzgussteilen mit aussparungen
JPS59185636A (ja) * 1983-04-08 1984-10-22 Ricoh Co Ltd 射出圧縮成形法
US4540534A (en) * 1983-10-11 1985-09-10 American Optical Corporation Apparatus and method for injection molding lenses
JPS60193347A (ja) * 1984-03-15 1985-10-01 Toshiba Corp 半導体製造装置
JPS6168209A (ja) * 1984-09-12 1986-04-08 Aisin Seiki Co Ltd ポリアミド成形品の成形加工法
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
JPS6213094A (ja) * 1985-07-10 1987-01-21 三井化学株式会社 配線用プリント基板の製法及びその装置
FR2599165A1 (fr) * 1986-05-21 1987-11-27 Michot Gerard Objet associe a un element electronique et procede d'obtention
US4980115A (en) * 1987-05-28 1990-12-25 Yoshida Industry Co. Ltd. Method for making an injection-molded product having a partly thin portion
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
US4954308A (en) * 1988-03-04 1990-09-04 Citizen Watch Co., Ltd. Resin encapsulating method
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
US4944908A (en) * 1988-10-28 1990-07-31 Eaton Corporation Method for forming a molded plastic article
US5417905A (en) * 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces

Also Published As

Publication number Publication date
US5681356A (en) 1997-10-28
ATE133105T1 (de) 1996-02-15
DE59205116D1 (de) 1996-02-29
GR3018955T3 (en) 1996-05-31
HK1007705A1 (en) 1999-04-23
JP3290986B2 (ja) 2002-06-10
ES2082470T5 (es) 2003-12-16
WO1992020506A1 (de) 1992-11-26
DK0584143T3 (da) 1996-02-12
JPH06507126A (ja) 1994-08-11
EP0584143B1 (de) 1996-01-17
EP0584143A1 (de) 1994-03-02
EP0584143B2 (de) 2003-04-16

Similar Documents

Publication Publication Date Title
ES2082470T3 (es) Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas.
ES477696A1 (es) Un procedimiento para formar articulos huecos partiendo de un material termoplastico.
AR246476A1 (es) Botella plegable de plastico, molde de soplado para producirla y metodo para reducir el volumen de dicha botella de plastico.
ES2084855T3 (es) Dispositivo para fabricar tubos de plastico.
MX167713B (es) Procedimiento para producir un cuerpo hueco de matrial termoplastico
ECSP920839A (es) Recipiente con base de sustentacion para el llenado en caliente
ES2039545T3 (es) Procedimiento y macho de moldeo para la fabricacion de objetos de plastico con entrantes socavados.
BR7608787A (pt) Recipiente tubular oco,processo de selar,processo de moldar e molde para um recipiente tubular
MX9205303A (es) Mejoras en un metodo para la elaboracion de molduras decorativas
BR9201515A (pt) Molde de injecao para moldar por injecao uma preforma,e,recipiente de plastico
ES2038392T3 (es) Pared deformable.
ES2140728T3 (es) Procedimiento y dispositivo para la realizacion de al menos una parte de un molde de neumatico que comprende al menos un elemento moldeante para un dibujo no desmoldeable.
ES431542A1 (es) Un metodo de conformar material termoplastico.
ES8406944A1 (es) Procedimiento para formar un articulo moldeado mediante moldeo por inyeccion con reaccion
IT8321723A0 (it) Stampo per stampaggio ad iniezione o per vulcanizzazione per laproduzione di calzature.
ES2105313T3 (es) Procedimiento de fabricacion de piezas de material plastico por moldeo-termoconformado controlado.
MX9303405A (es) Proceso para la produccion de una barra de lapiz, una barra producida mediante el proceso y un lapiz que tiene esta barra.
ES2115704T3 (es) Proceso de moldeo para confeccionar articulos toroidales manufacturados a partir de un material elastomerico expandido de celdas cerradas y baja densidad, y aparato asociado.
GB1310396A (en) Device for manufacturing a hollow article of plastic material
BR7305016D0 (pt) Ejector de produto acabado para uma maquina de moldagem de plastico por injecao atraves de sopro
ES279855A1 (es) Un metodo y un aparato para fabricar recipientes de plastico
ES2104061T3 (es) Proceso para la produccion de espuma flexible a base de mdi.
ES2087210T3 (es) Mezclas termicamente estables de eter de polifenileno y caucho con base de dieno.
DE60135006D1 (de) Maschine zur herstellung von glaswaren
BR0302535A (pt) Aparelho e procedimento de moldagem por injeção de artigos em matéria plástica

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 584143

Country of ref document: ES