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ES176807U - Elemento de construccion semiconductor. - Google Patents

Elemento de construccion semiconductor.

Info

Publication number
ES176807U
ES176807U ES0176807U ES176807U ES176807U ES 176807 U ES176807 U ES 176807U ES 0176807 U ES0176807 U ES 0176807U ES 176807 U ES176807 U ES 176807U ES 176807 U ES176807 U ES 176807U
Authority
ES
Spain
Prior art keywords
translation
machine
legally binding
google translate
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES0176807U
Other languages
English (en)
Other versions
ES176807Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
A G Brown Boberi & Cie
Original Assignee
A G Brown Boberi & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A G Brown Boberi & Cie filed Critical A G Brown Boberi & Cie
Publication of ES176807U publication Critical patent/ES176807U/es
Application granted granted Critical
Publication of ES176807Y publication Critical patent/ES176807Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

Elemento de construcción semiconductor con un cuerpo semiconductor en forma de disco que presenta por lo menos un paso, que se sujeta entre dos cuerpos de contacto por presión intercalando electrodos dúctiles, caracterizado porque los cuerpo; do contacto por presión presentan en las caras frontales, dirigidas hacia el cuerpo semiconductor, caras de contacto que se hallan simétricas a una linea central, porque los electrodos dúctiles se desarrollan en forma de plato o de copa, porque el diámetro del fondo interior de los electrodos es aproximadamente igual que el diámetro de los cuerpos de contacto por presión y porque los bordes doblados hacia arriba de los electrodos se dirigen hacia los cuerpos de contacto por presión.
ES1971176807U 1970-08-11 1971-08-09 Elemento de construccion semiconductor. Expired ES176807Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2039806A DE2039806C3 (de) 1970-08-11 1970-08-11 Halbleiterbauelement mit Druckkontakten

Publications (2)

Publication Number Publication Date
ES176807U true ES176807U (es) 1972-08-16
ES176807Y ES176807Y (es) 1973-05-01

Family

ID=5779405

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1971176807U Expired ES176807Y (es) 1970-08-11 1971-08-09 Elemento de construccion semiconductor.

Country Status (7)

Country Link
JP (1) JPS5550389B1 (es)
CH (1) CH520403A (es)
DE (1) DE2039806C3 (es)
ES (1) ES176807Y (es)
FR (1) FR2102176B1 (es)
GB (1) GB1336790A (es)
NL (1) NL7110924A (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2821268C2 (de) * 1978-05-16 1986-10-16 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit Druckkontakt
DE2825682C2 (de) * 1978-06-12 1984-09-20 Brown, Boveri & Cie Ag, 6800 Mannheim Halbleiterbauelement mit Isoliergehäuse
DE2840400C2 (de) * 1978-09-16 1982-04-08 Brown, Boveri & Cie Ag, 6800 Mannheim Steuerbares Leistungs-Halbleiterbauelement
DE2902224A1 (de) * 1979-01-20 1980-07-24 Bbc Brown Boveri & Cie Kontaktsystem fuer leistungs-halbleiterbauelemente
SE420964B (sv) * 1980-03-27 1981-11-09 Asea Ab Kompositmaterial och sett for dess framstellning
DE3209174A1 (de) * 1982-03-13 1983-09-15 Brown, Boveri & Cie Ag, 6800 Mannheim Sandwich fuer druckkontaktierbare halbleiter-leistungsbauelemente und verfahren zu seiner herstellung
JPS59134876A (ja) * 1983-01-20 1984-08-02 Mitsubishi Electric Corp 半導体装置
CN105210186B (zh) * 2013-05-13 2018-01-12 Abb 技术有限公司 半导体开关器件的间隔器系统
WO2020078816A1 (en) 2018-10-19 2020-04-23 Abb Schweiz Ag Power semiconductor device with free-floating packaging concept

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1467544A (fr) * 1965-02-08 1967-01-27 Westinghouse Electric Corp Appareils semiconducteurs

Also Published As

Publication number Publication date
FR2102176B1 (es) 1976-05-28
CH520403A (de) 1972-03-15
FR2102176A1 (es) 1972-04-07
DE2039806C3 (de) 1975-05-07
GB1336790A (en) 1973-11-07
ES176807Y (es) 1973-05-01
DE2039806B2 (de) 1974-09-05
NL7110924A (es) 1972-02-15
JPS5550389B1 (es) 1980-12-17
DE2039806A1 (de) 1972-02-24

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