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ES176333Y - RIBBON CASE FOR INTEGRATED CIRCUITS. - Google Patents

RIBBON CASE FOR INTEGRATED CIRCUITS.

Info

Publication number
ES176333Y
ES176333Y ES1971176333U ES176333U ES176333Y ES 176333 Y ES176333 Y ES 176333Y ES 1971176333 U ES1971176333 U ES 1971176333U ES 176333 U ES176333 U ES 176333U ES 176333 Y ES176333 Y ES 176333Y
Authority
ES
Spain
Prior art keywords
integrated circuits
ribbon case
ribbon
case
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES1971176333U
Other languages
Spanish (es)
Other versions
ES176333U (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATES Componenti Elettronici SpA filed Critical ATES Componenti Elettronici SpA
Publication of ES176333U publication Critical patent/ES176333U/en
Application granted granted Critical
Publication of ES176333Y publication Critical patent/ES176333Y/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49568Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • H01L23/49555Cross section geometry characterised by bent parts the bent parts being the outer leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
ES1971176333U 1971-08-25 1971-12-28 RIBBON CASE FOR INTEGRATED CIRCUITS. Expired ES176333Y (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2255671 1971-08-25

Publications (2)

Publication Number Publication Date
ES176333U ES176333U (en) 1972-08-01
ES176333Y true ES176333Y (en) 1973-02-01

Family

ID=11197792

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1971176333U Expired ES176333Y (en) 1971-08-25 1971-12-28 RIBBON CASE FOR INTEGRATED CIRCUITS.

Country Status (4)

Country Link
JP (1) JPS5117802Y2 (en)
DE (1) DE7146448U (en)
ES (1) ES176333Y (en)
FR (1) FR2124753A7 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3430849A1 (en) * 1984-08-22 1986-03-06 Gerd 7742 St Georgen Kammerer Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier

Also Published As

Publication number Publication date
DE7146448U (en) 1972-08-17
ES176333U (en) 1972-08-01
JPS4835270U (en) 1973-04-27
JPS5117802Y2 (en) 1976-05-13
FR2124753A7 (en) 1972-09-22

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