Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
  • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
  • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
  • B27N3/007—Manufacture of substantially flat articles, e.g. boards, from particles or fibres and at least partly composed of recycled material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
  • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
  • B27N1/00—Pretreatment of moulding material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
  • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
  • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
  • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles

Definitions

• the object of the invention is a chipboard consisting of organic particles, composite and synthetic resins, and its manufacturing process.
• Document CN107206734A discloses a composite board consisting at least partly of a non-woven composite, wherein the non-woven composite comprises: natural fibre and/or dispersed glass fibre, ductile optical fibre, and 0 to 50% by weight of thermal hardening agents.
• the invention relates also to chipboard (PB), medium density fibreboard (MDF) and high density fibreboard (MDF-HDF), oriented strand board (OSB), laminated veneer lumber (LVL), plywood (PLW), and related materials.
• PB chipboard
• MDF medium density fibreboard
• MDF-HDF high density fibreboard
• OSB oriented strand board
• LDL laminated veneer lumber
• PW plywood
• a chipboard consisting of organic particles of a composite of synthetic resins according to the invention is characterized in that it comprises from 10 to 60% by weight of the particulate composite, from 5 to 60% by weight of the synthetic resins and from 10 to 85% by weight of organic particles, in particular wood and vegetable particles or fibres or compositions of these components.
• the composite is grounded to a 1D form, wherein in this form, the dimensions of the mixture of particles are: length of 1-4 mm, thickness up to 1 mm.
• the composite is grounded to a 2D form, wherein in this form the dimensions of the particles of the composite are: length of 5-200 mm, width of 1-30 mm, and thickness of 0.2-2 mm.
• the composite constitutes from 10 to 40% by weight of the chipboard.
• the synthetic resins constitute from 5 to 20% by weight of the chipboard.
• an object of the invention is a method for manufacturing chipboard, characterised in that:
• a mat is formed such that an outer layer containing from 0 to 60% by weight of the grounded composite is formed, then a middle layer containing from 10 to 70% by weight of the grounded composite is formed and then an upper outer layer containing from 0 to 60% by weight of the grounded composite is formed, wherein the proportion of the middle layer is from 50% to 90% by weight of the manufactured board.
• the composite is grounded to a 1D form, wherein in this form, the dimensions of the mixture of particles are: length of 1-4 mm, thickness up to 1 mm.
• the composite is grounded to a 2D form, wherein in this form the dimensions of the particles of the composite are: length of 5-200 mm, width of 1-30 mm, and thickness of 0.2-2 mm.
• the composite constitutes from 10 to 40% by weight of the chipboard .
• the synthetic resins constitute from 5 to 20% by weight of the chipboard .
• the chipboard according to the invention is manufactured as follows:
• the grounded composite used may be a glass-epoxy composite, glass-polyester composite, carbon-epoxy composite, or carbon-polyester composite, while glass and carbon fibres can exist simultaneously in a milled composite bonded with synthetic resins.
• the grounded composite originates from the recycling of wind turbine or yachts and boats composite propellers or composite panels or other composite structures and articles or is a mixture of composites of said or other origin.
• a mat is formed such that an outer layer containing from 0 to 60% by weight of the grounded composite is formed, then a middle layer containing from 10 to 70% by weight of the grounded composite is formed and then an upper outer layer containing from 0 to 60% by weight of the grounded composite is formed, wherein the proportion of the middle layer is from 50% to 75%, even up to 90%, by weight of the manufactured board.
• the composite used to manufacture the board according to the invention may be ground to a 1D form, wherein in this form, the dimensions of the mixture of particles are: length of 1 mm, thickness up to 1 mm, or to a 2D form, wherein in this form the particle dimensions are: length of 5-200 mm, width of 5-30 mm and thickness of 0.2-2 mm.
• the grounded 2D and 1D composite is used to manufacture OSB - type chipboard , while the grounded 1D composite is used to make chipboard , fibre board, and MDF.
• the grounded composite does not absorb the binder and therefore its use leads to reduced binder (resin) consumption-the resin applied to the particles does not penetrate into their interior so that its amount is less than would be necessary to cover an equivalent amount of wood or plant particles. Therefore, as a result of the lack of absorbability, the amount of resin needed to bond the particles of the composite board is less than an equivalent amount of wood chips.
• the composite has uneven, rough/porous surfaces, which makes it easy to combine by entanglement with wood or plant chips.
• ground composite causes an increase in the hardness of the board, i.e. the more composite, the harder the board is.
• resin consumption can also be below 5% when using expensive resins.
• the pressing temperature of the boards is from 18 to 250°C, at a pressure of 0.2-5.0 MPa.
• the chipboard according to the invention has been tested to determine its physical and mechanical properties.
• the object of the test was to evaluate the physical and mechanical properties of chipboard having a thickness of 16 mm, containing additives of composites derived from ground fragments of turbine propeller.
• the sheets did not have regular shapes and had numerous cuts and holes resulting from other tests.
• the proportion of grounded fragments of turbine propeller was 10%, 20%, 30%, and 40%. The evaluation was performed together for all variants.
• test results for the tested boards are shown in table 1.
• the tested boards are characterized by an average static bending strength of 9.4 N/mm 2 and an average modulus of elasticity of 1910 N/mm 2 .
• the tensile strength perpendicular to the tested planes is 0.21 N/mm 2 .
• the tested boards deteriorates as a result of damage, delamination of the outer layer. By default, this type of board deteriorates in the middle layer, therefore an additional density profile of the delivered boards was realized.
• the maximum density is shifted closer to the centre of the boards, so the weaker layers are closer to the outer zones, causing the boards to deteriorate in the layer made of microparticles.
• the absorbability of chipboards not treated with additional hydrophobic agents is at the level of 27%-33%, and absorbability is from 60% to as much as 100%, therefore the swelling and absorbability values obtained for the boards tested should be considered satisfactory.
• the boards tested react better to fire. All evaluated properties for the evaluated boards are lower (better) than for the control board. Therefore, the evaluated board is a board who is less susceptible to fire than the control board
• the chipboards submitted for testing are characterised by good physical and mechanical properties.
• the values obtained indicate their high potential in the context of industrial production.
• the slightly lower values for static bending strength and tensile strength perpendicular to planes do not result from the additives used but from the way they are manufactured in the laboratory.
• the experience of the Department of Mechanical Wood Technology (pol. Katedra Mechanicznej Technologii Drewna) shows that the quality of a layer manufactured of microparticles under laboratory conditions, is usually much lower than the quality of this layer manufactured under industrial conditions. Since propeller fragments are added to the middle layer, it must be considered that a board so formed under industrial conditions will have even higher mechanical properties than a reference board manufactured entirely of wood chips.
• the use of a grounded composite increases the water resistance of the chipboard and the thermal insulation of the chipboard.
• the use of grounded composite increases the fire resistance of the board due to the non-combustible fibre content of the composite.
• the use of grounded GFK composite increases the electrical insulation of the chipboard.
• the use of grounded CFK composite provides the chipboard with an electrical conductivity.
• VOC organic substances
• ground composites reduces the need for chemicals that reduce emissions of volatile organic compounds in finished boards.
• the use of ground composites reduces the amount of water required to prepare wood chips. The ground composite does not emit volatile organic compounds.
• the addition of ground composites reduces the swelling of the board due to moisture by as much as the percentage of composite in the board.

Landscapes

• Life Sciences & Earth Sciences (AREA)
• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Wood Science & Technology (AREA)
• Forests & Forestry (AREA)
• Dry Formation Of Fiberboard And The Like (AREA)

Priority Applications (3)

Applications Claiming Priority (1)

Publications (1)

Family

ID=81850775

Family Applications (1)

Country Status (3)

Citations (4)

• 2022
  • 2022-04-01 EP EP22166241.4A patent/EP4252986A1/fr active Pending
• 2023
  • 2023-03-30 WO PCT/EP2023/058362 patent/WO2023187093A1/fr active Application Filing
  • 2023-03-30 CN CN202380032287.3A patent/CN119095704A/zh active Pending

Patent Citations (4)

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