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EP3887093A4 - Polishing pads and systems and methods of making and using the same - Google Patents

Polishing pads and systems and methods of making and using the same Download PDF

Info

Publication number
EP3887093A4
EP3887093A4 EP19890633.1A EP19890633A EP3887093A4 EP 3887093 A4 EP3887093 A4 EP 3887093A4 EP 19890633 A EP19890633 A EP 19890633A EP 3887093 A4 EP3887093 A4 EP 3887093A4
Authority
EP
European Patent Office
Prior art keywords
systems
making
methods
same
polishing pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19890633.1A
Other languages
German (de)
French (fr)
Other versions
EP3887093A1 (en
Inventor
Duy K. LEHUU
Qin Lin
David J. MURADIAN
Samad JAVID
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP3887093A1 publication Critical patent/EP3887093A1/en
Publication of EP3887093A4 publication Critical patent/EP3887093A4/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP19890633.1A 2018-11-27 2019-11-22 Polishing pads and systems and methods of making and using the same Pending EP3887093A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862771738P 2018-11-27 2018-11-27
PCT/IB2019/060064 WO2020109947A1 (en) 2018-11-27 2019-11-22 Polishing pads and systems and methods of making and using the same

Publications (2)

Publication Number Publication Date
EP3887093A1 EP3887093A1 (en) 2021-10-06
EP3887093A4 true EP3887093A4 (en) 2022-08-17

Family

ID=70852829

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19890633.1A Pending EP3887093A4 (en) 2018-11-27 2019-11-22 Polishing pads and systems and methods of making and using the same

Country Status (5)

Country Link
US (1) US20220023991A1 (en)
EP (1) EP3887093A4 (en)
JP (1) JP7545968B2 (en)
KR (1) KR102777772B1 (en)
WO (1) WO2020109947A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7645624B2 (en) * 2020-09-30 2025-03-14 富士紡ホールディングス株式会社 Polishing Pad
US11911870B2 (en) 2021-09-10 2024-02-27 Applied Materials, Inc. Polishing pads for high temperature processing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050197050A1 (en) * 2003-06-17 2005-09-08 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
WO2015127077A1 (en) * 2014-02-20 2015-08-27 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US20150298286A1 (en) * 2012-12-06 2015-10-22 Toyo Tire & Rubber Co., Ltd. Polishing pad
US20150325451A1 (en) * 2014-05-07 2015-11-12 Cabot Microelectronics Corporation Multi-layer polishing pad for cmp

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2701191A (en) * 1949-02-02 1955-02-01 American Optical Corp Polishing pads
TW421620B (en) * 1997-12-03 2001-02-11 Siemens Ag Device and method to control an end-point during polish of components (especially semiconductor components)
US6908366B2 (en) * 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
TWI290504B (en) * 2003-07-17 2007-12-01 Jsr Corp Chemical mechanical polishing pad and chemical mechanical polishing method
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
TWI385050B (en) * 2005-02-18 2013-02-11 Nexplanar Corp Customized polishing pads for cmp and methods of fabrication and use thereof
JP2006245445A (en) 2005-03-07 2006-09-14 Nihon Micro Coating Co Ltd Abrasive pad
US20060286906A1 (en) * 2005-06-21 2006-12-21 Cabot Microelectronics Corporation Polishing pad comprising magnetically sensitive particles and method for the use thereof
US8062096B2 (en) * 2005-06-30 2011-11-22 Cabot Microelectronics Corporation Use of CMP for aluminum mirror and solar cell fabrication
US7520797B2 (en) 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
US8129278B2 (en) 2005-11-14 2012-03-06 United Microelectronics Corp. Chemical mechanical polishing process
EP2135707A4 (en) * 2007-03-20 2013-10-09 Kuraray Co CUSHION FOR POLISHING PAD AND POLISHING PAD USING THE CUSHION
TWI411495B (en) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp Polishing pad
EP2274136A4 (en) * 2008-04-11 2014-01-01 Innopad Inc Chemical mechanical planarization pad with void network
TWM367052U (en) * 2009-04-24 2009-10-21 Bestac Advanced Material Co Ltd Polishing pad and polishing device
RU2633127C2 (en) * 2013-02-26 2017-10-11 Квх Мирка Лтд Method for obtaining surface of abrasive product and abrasive products obtained by this method
US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad
JP6425973B2 (en) * 2014-10-31 2018-11-21 日東電工株式会社 Resin foam and foam member
US10593574B2 (en) * 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
WO2017164842A1 (en) * 2016-03-22 2017-09-28 Intel Corporation Improved optical metrology for chemical mechanical polish
JP2018029142A (en) 2016-08-18 2018-02-22 株式会社クラレ Polishing pad and polishing method using the same
KR101889081B1 (en) * 2017-03-16 2018-08-16 에스케이씨 주식회사 Polishing pad and preparation method thereof
JP6923342B2 (en) * 2017-04-11 2021-08-18 株式会社荏原製作所 Polishing equipment and polishing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050197050A1 (en) * 2003-06-17 2005-09-08 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US20150298286A1 (en) * 2012-12-06 2015-10-22 Toyo Tire & Rubber Co., Ltd. Polishing pad
WO2015127077A1 (en) * 2014-02-20 2015-08-27 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US20150325451A1 (en) * 2014-05-07 2015-11-12 Cabot Microelectronics Corporation Multi-layer polishing pad for cmp

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020109947A1 *

Also Published As

Publication number Publication date
KR20210094024A (en) 2021-07-28
US20220023991A1 (en) 2022-01-27
EP3887093A1 (en) 2021-10-06
JP2022511763A (en) 2022-02-01
TW202033310A (en) 2020-09-16
KR102777772B1 (en) 2025-03-06
JP7545968B2 (en) 2024-09-05
WO2020109947A1 (en) 2020-06-04

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A4 Supplementary search report drawn up and despatched

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RIC1 Information provided on ipc code assigned before grant

Ipc: B24B 37/24 20120101ALI20220712BHEP

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