EP3652776A1

EP3652776A1 - Drying device and method for drying a substrate

Info

Publication number: EP3652776A1
Application number: EP18793166.2A
Authority: EP
Inventors: Markus Uihlein; Stefan Hansen; Tobias ROSSHART
Original assignee: RENA Technologies GmbH
Current assignee: RENA Technologies GmbH
Priority date: 2017-07-14
Filing date: 2018-07-12
Publication date: 2020-05-20
Also published as: JP7273788B2; TWI788382B; CN110892518A; KR20200022501A; TW201908680A; US20230314072A1; WO2019011382A1; JP2020527689A; US20200208913A1; CN110892518B; US20230304735A1

Abstract

The invention relates to a drying device (1) comprising at least one upper drying head (2a) and at least one lower (3a) drying head, wherein the at least one upper drying head (2a) is arranged above a transport plane (8), in which objects to be dried can be transported in a transport direction (9) through the drying device (1), and wherein the at least one lower drying head (3a) is arranged below said transport plane (8), the at least one upper drying head (2a) and the at least one lower drying head (3a) comprising in each case at least one air outlet slot (4a, 5a) and the longitudinal directions of said air outlet slots (4a, 5a) essentially extending parallel to the transport plane (8) and transversely to the transport direction (9), and in which slot planes (11), in which said air outlet slots extend, intersect the transport plane (8) at angles (a) which are greater than 0° and less than 90°; and method for drying a planar substrate (7) in a continuous system.

Description

Drying apparatus and method for drying a substrate

The invention relates to a drying device according to the preamble of claim 1 and a method for drying a flat substrate in a continuous flow according to the preamble of the independent method claim.

Flat substrates are often treated with liquids, in the course of which it is necessary to subsequently dry the flat substrates. For example, wet-chemically processed in Ferti ^¬ supply of solar cell semiconductor substrates, which represent sub-surface ^¬ strate and are often referred to as a wafer. In this context, it is usually ^¬ excessively required, the semiconductor substrates to dry, optionally after a preceding rinsing in water.

Area substrates are treated on an industrial scale or processed, for example in the industrial Ferti ^¬ supply of solar cells made of semiconductor substrates, this is done regularly with a continuous process and continuous flow systems, through which are transported through the planar substrates. It is known, for the purpose of drying the Halbleitersub ^¬ strate in such continuous flow of air through perforated sheets o- the like on the upper and lower sides of the Halbleitersub- strate to direct and by means of the inflowing air on the

Displace surface liquid. However, it has been found that at higher Transportgeschwindigkei ^¬ th of flat substrates by appropriate Durchlaufanla ^¬ gen can be achieved and remain liquid droplets or moist areas through no satisfactory drying results. This is the case even if the surface gen substrates are ge ^¬ dried twice in a row in the manner described.

Against this background, the present invention has for its object to provide an apparatus, by means of which sheet-like substrates in continuous operation can be dried reli ^¬ permeable.

This object is achieved by a drying device having the features of claim 1.

Furthermore, the invention has for its object to provide a drive Ver ^¬ to provide, by means of which sub-area ^¬ strate in a Durchlaufanläge at elevated transport speeds of the planar substrates speeds by the Durchlaufan ^¬ location therethrough can be reliably dried.

This object is achieved by a method with the Merkma ^¬ len of the independent method claim.

Advantageous developments are each subject Dependent ^¬ dependent claims.

The drying device according to the invention has at least one upper drying head and at least one lower one

Drying head on. Here, the at least one upper voltage Trock ^¬ head above a transport plane on which to trock ^¬ designating objects are transported through the drying apparatus ^¬ therethrough in a transport direction is disposed. The at least one lower drying head is arranged below the genann ^¬ th transport plane. The at least one upper one

Drying head and the at least one lower drying head each have at least one air outlet slot. The mentioned air outlet slots are shaped and attached in such a way orders that longitudinal directions of said air outlet ^¬ slots extend substantially parallel to the transport plane and transversely to the transport direction. Further, they are formed and arranged such that slot planes in WEL chen extend the air exit said slots intersecting Trans ^¬ port plane at angles which are larger than 0 ° and smaller than 90 °.

The term of the air outlet slot is present not to be understood so that mandatory air for drying is ^¬ sets must be. Instead, ande also re ^¬ gases or gas mixtures can in principle be used as the drying medium ^¬ to. As far as present air is concerned, this term always includes other gases or gas mixtures, which can be used for drying.

It has been found that with the described Trocknungsvor ^¬ direction area substrates in continuous operation can be reliably dried, even at elevated transport speeds of the planar substrates through the drying apparatus ^¬ therethrough.

In principle, the angles mentioned can be different for all slot ^segments . In a preferred variant, however, the angles mentioned are selected uniformly for those slot ^{planes in} which the at least one air outlet slot of the at least one upper drying head extends, and they assume a first dimension. Further, in this variant, the said angular slot for those planes in which the at least one air exit slot of Wenig ^¬ least extends a lower drying head uniformly ge selects ^¬ and they take on a second measure. Especially before ^¬ the angles mentioned are Trains t for all slot levels equal large, that is, the first measure and the second measure are identical.

By means of said air discharge slots may be formed in an advantageous manner, continuous air jet fronts ^¬ the. For this purpose, air outlet slots with a length of 180 mm have proven themselves in connection with silicon semiconductor substrates. It has, in particular in connection with the drying of semiconductor substrates made of silicon, proven to be advantageous for the drying result, when the slot planes run in the wel ^¬ chen the air exit said slots intersecting Trans ^¬ port plane at angles less than greater than 60 ° and than 80 ° are. Preferably, these angles are greater than 65 ° and less than 75 °, and more preferably 70 °.

The air outlet slots preferably have a uniform slot depth which is between 1 mm and 5 mm.

Preferably, the slot depth is between 2 mm and 4 mm and more preferably between 2.5 mm and 3.5 mm. These slot depths have proven particularly useful in practice. The air outlet slots preferably have a slot ^¬ width that is greater than or equal to 0.3 mm and less than or equal to 0.7 mm. Particularly preferably, the slit width ^¬ 0.5 mm. In this way, an efficient drying can be effected.

It has been shown that a constant slot cross-section has a considerable influence on the drying result. In order to stabilize the shape and thus the cross sections of the air outlet slots, therefore, in an advantageous further education Stiffening webs are provided, which are adapted to stabilize the shapes of the air outlet slots over the slot length away. This is particularly advantageous when larger slot lengths are chosen, which extends over an entire width of the material to be dried flat substrate he ^¬ stretch.

In a preferred embodiment variant of the drying ^¬ device has at least one drying head, a base plate, into which a bag for air guidance is turned processing ^¬ tet. Further, a connectable to the base plate De ^¬ ckel is provided by means of which the bag is closed to form a cavity. This cavity serves so ^¬ then mentioned air duct in the drying head to the air outlet slots out. This allows a aufwandsgüns ^¬ term production of the at least one drying head. Preference ^¬ way all drying heads are designed in the manner described. The term of the air duct in this case includes the leadership of another gaseous drying medium. Several lids of different drying heads can be connected to each other via a flow-through pipe. Before ^¬ preferably two lids are connected directly to each other via such pipes. This allows a uniform air distribution.

A further development of the drying apparatus provides a ^¬ angle sheet which is capable of at least one voltage Trock ^¬ head for stiffening and contemplated. Such an angle sheet may be inserted into the pocket machined into the base plate or secured externally to the base plate. Preferably, all drying heads are provided with an angle plate.

Advantageously, the longitudinal direction of at least one air outlet slot extends transversely to the transport direction. tion, that said longitudinal direction deviates by an angle of 87 ° or less from the transport direction. In this way it can be avoided that referred to by the we ^¬ nigstens an air outlet slot outgoing air jet impinges pa- rallel to a trailing edge of the area to be dried sub ^¬ strats. As a result of avoiding this parallel impact liquid located at the trailing edge can be pushed by the relative to the trailing edge obliquely extending air ^¬ beam when passing through the drying device from one end of the trailing edge to the opposite end of the rear ^¬ edge. This is particularly ^advantageous if the liquid tends to adhere to edges. Preferably, said angle is more than 75 ° and is less than or equal to 87 °. In this way, the were restricted space conditions in continuous installations bill ge will carry ^¬, especially when it comes to multi-track investments where transported to be dried flat substrates in multiple tracks side by side through the drying apparatus. In practice, an angle of 87 ° has proven particularly useful.

In some applications, it may be advantageous if the longitudinal directions of all the air outlet slots in the manner described above extend transversely to the transport direction. This can be the case, for example, if the liquid adheres very strongly to edges. Moreover, stabilization can be effected in this way if the sheet substrates show a tendency to vibrate. Such vibrations may be due to deflecting effects of air jets in the drying apparatus. Especially in the case of thin, flat substrates, such vibrations can lead to the rupture of the planar substrate. A further development of the invention provides that the longitudinal direction ^¬ an air outlet slot extends at least in ^¬ We sentlichen perpendicular to the transport direction. This may be advantageous when space is limited in the direction of transport, especially if beschrie below ^¬ bene stabilizing slots are additionally provided. In the case of particularly limited space conditions in the transport direction, it may be advantageous if the longitudinal directions of all the air outlet slots extend perpendicular to the transport direction. The drying heads can then be built very compact.

In an advantageous embodiment variant of the drying ^¬ device, an upper drying head and a lower drying head are a drying head pair arranged to form such überei ^¬ Nander that the slot planes run in which the air outlet slots of the upper drying head of the Trock ^¬ voltage head pair, with the transport plane sectional Gera ^¬ form the, which coincide with intersection lines which DIE jenigen slot planes in which the air outlet slots of the lower head drying of the drying head pair duri ^¬ fen, make with the plane of transport. In this way, the flat substrate can be virtually closed by a closed air jet ring. This allows a particularly efficient drying.

Alternatively or in a further drying head pair may be provided in an advantageous manner that an upper voltage Trock ^¬ head and a lower head drying a drying head pair are arranged one above the other making that the

Slit planes, in which the air outlet slots of the upper drying head of the drying head pair extend, form with the transport plane first line of intersection, which run parallel to the second line of intersection, which those slots levels, in which the air outlet slots of the lower drying ^¬ tion head of the drying head pair run, form with the Trans ^¬ portebene. Furthermore, the arrangement is made such that the first line of intersection with respect to the second line of intersection in the transport direction by a value between 1 mm and 5 mm are offset from each other. Preferably these Ver ^¬ set between 1 mm and 3 mm and preferably 2 mm. In this variant, the air jets from the upper Trock ^¬ head voltage and the lower drying head does not impinge on opposite points of the upper or Untersei ^¬ te of the planar substrate to but against each other ver ^¬ sets. This may have a less efficient drying result, but on the other hand, the above ^¬ be signed and occurring in some applications inclination in this way be reduced to vibration and the associated risk of breakage or avoided. In practice especially be ^¬ lasts, an arrangement has such a way that are offset downstream the first cutting ^¬ straight opposite the second cut line in the transport direction ^¬.

In an advantageous variant, at least two Trock ^¬ voltage pairs of heads are provided, which are arranged in the transport direction nacheinan ^¬. These two drying head pairs can be configured identically. Basically, however, the two pairs of heads drying may also be different to the requirements of each application to meet the ^¬. For example ^¬ couple the drying heads may be arranged in a second drying mind that the ers ^¬ th and second cut lines are displaced in the manner described above against each other while being arranged in the first drying ^¬ head couple the drying heads such that the line of intersection as above coincide. A further development provides that an upper and a lower drying head a drying head pair are forming above the other ranked at ^¬. The upper and lower drying heads of the drying head pair each have at least one flow-through stabilizing slot. Said Stabili ^¬ sierungsschlitze are arranged in each case in the transport direction ver ^¬ sets next to an air outlet slot. Furthermore, the said stabilizing slots are formed and arranged such that their longitudinal directions extend substantially parallel to the transport plane and in an angle deviating from 90 ° ^¬ the angle transverse to the transport direction. Further, the at least one stabilizing slot of the upper drying head and the at least one stabilizing ^¬ slot of the lower drying head pairs net angeord- such that arranged in the drying in the upper head

Stabilizing slot of a pair of stabilizing slot ^¬ air flowing fronts intersect with port level from the arranged in the lower head Trock ^¬ voltage stabilization this slot Stabili ^¬ sierungsschlit zpaares outflowing air fronts in the transport. Or expressed in other words: The stabilizing slots of the stabilizing ^{slot pair are} oriented in opposite directions relative to the transport direction, so that the outflowing air fronts of the stabilizing slots of this pair of stabilizing slots intersect in the transport plane.

Using the stabilization slots the tendency already described above many flat substrates to Vib ^¬ rations and the associated risk of breaking going on re- duced can be. It is also possible to use stabilizing ^¬ slots instead of other measures to avoid vibration. The drying device can thus optimally to the particular application and its Rahmenbe ^¬ conditions, such as limited space, be matched. For example, a combination of stabilizing slots and air outlets extending substantially perpendicularly to the transport direction may prove to be very advantageous in the case of limited space and vibration tendency. Among other things, in this example, it may be advantageous if all the air outlet slots of the drying device, or at least the Trocknungskopf- pair, he stretched substantially perpendicular to the transport direction he ^¬ .

The inventive method for drying a flat substrate in a Durchlaufanläge envisages itself to flow through a top surface of the planar substrate from a slurry over an entire ^¬ te of the planar substrate extending across the upper air jet. Simultaneously, a bottom of the sur fa ^¬ speaking substrate is flown from a over an entire width of the planar substrate extending across the bottom air jet. The top and bottom of the sheet substrate are of the upper and lower air jet loading subjected to a transport plane in which the sheet-like sub ^¬ strat is transported flows against at angles which are larger than 0 ° and smaller than 90 °.

The term the upper side of the flat substrate is a first large-area side of the flat substrate, Be ^¬ reached the bottom of a second large-area side of the sur fa ^¬ speaking substrate. The top and bottom of the flat sub ^¬ strats are not necessarily flowing at equal angles, they can in principle surfaces from each other differ, especially if it is necessary in the particular application to be advantageous. Usually, however, they are flowed at equal angles. The inventive method makes it possible to dry-area sub strate ^¬ in continuous flow systems, even at elevated speeds Transportge ^¬ by the Durchlaufanläge therethrough insbeson ^¬ particular at transport speeds greater than 2.6 meters per te for minutes, reliable. By Flow over across the entire width of the flat substrate away erstre ^¬ ADORABLE air jets barely liquid, the air jets go to ^¬. The sheet substrate can be dried reliably over its entire width.

Preferably, the upper surface of the planar substrate from the top air jet and the bottom of the flat sub ^¬ strats receive flow from the lower air jet counter to a transport ^¬ direction in which the sheet-like substrate is transported in the transport plane. Under a flow onto ent ^¬ against the direction of transport is presently understood that a flow direction of the air jet has a Richtungskomponen ^¬ te, which is directed opposite the transport direction.

Advantageously, the upper surface of the flat sub ^¬ strats of the top air jet and the bottom of the sur fa ^¬ speaking substrate are blown onto the transport plane at angles obtained from the lower air jet, which are larger than 60 ° and smaller than 80 °. Preferably, these angles are RESIZE ^¬ SSER than 65 ° and smaller than 75 °. Has proven particularly useful in practice an angle of 70 °.

The upper and lower air jet are preferably aligned such that they impinge in opposite preparation ^¬ surfaces of the flat substrate, on the one hand lie on the upper side of the flat substrate, on the other hand on the underside of the planar substrate. In this way, an air jet composite can be formed, which is the planar Surrounds the substrate circumferentially. Liquid can at such ei ^¬ nem circulating air jet structure is very difficult past ge ^¬ long, so efficient drying can be effected.

A further development provides that the top air jet and the bottom air jet to be aligned such that it in the transport direction by a value between 1 mm and 5 mm against ^¬ staggered impinge on the planar substrate. Preference ^¬ wise, this value is between 1 mm and 3 mm and more preferably 2 mm. As explained in connection with the trock ^¬ voltage device, can-making cases in this way in appli ^¬ in which tilt the flat substrates for the formation of vibration, this vibration tendency entgegenge ^¬ acts and to reduce the risk of fracture associated or even avoided. In practice, it has proven useful to the obe ^¬ ren and align the lower air jet such that the upper air jet relative to the lower air jet in Trans ^¬ port direction displaced downstream incident on the planar substrate.

Advantageously, a trailing edge of the flat sub ^¬ strats of the upper and lower air jet in Anströmrich ^¬ lines flowed so obliquely that the trailing edge with the direction of flow of the upper air jet and also with the on ^¬ strömrichtung the lower air jet angle of 3 ° or more. Preferably, the angles are less than 15 ° and are greater than or equal to 3 °. Particularly preferably, the angles are 3 °. As already explained above, in this way, more efficient drying can be effected for liquids which tend to adhere to edges. As a result of the be ^{¬ written} , opposite the trailing edge obliquely to the flow direction, the liquid can be displaced from one end of the rear edge to the other end and largely or completely detached there. In addition, in appropriate: Use cases of the inclination of flat substrates for Ausbil ^¬ tion of vibrations are counteracted. The Anströmrich ^¬ obligations of the upper and lower air jet may vary respects ^¬ Lich the principle with the trailing edge respectively included angle, but preferably the same angular value is selected.

In an advantageous embodiment variant, the sur fa ^¬ CHIGE substrate by a plurality of upper and a plurality of lower air ^¬ radiation is flown, in each case an upper and a lower air jet forming an air jet couple and impinge the air jets of the various air jet pairs in the transport direction gegeneinan ^¬ of offset to the planar substrate. In this way, if necessary, the drying effect can be improved,

Is a need for a stabilization of the flat sub ^¬ strats, in particular to a avoid vibration and the resulting risk of breakage, so the upper surface of an upper stabilization air jet and the bottom are preferably flows against a lower stabilization air jet for the stabilization of the sheet substrate. The lower stabilization air jet preferably has a a flow direction of the upper stabilization air jet entge ^¬ gengesetzt directed flow direction. This measure can be performed alternatively or in addition to the other to avoid vibration of the planar substrate serving steps by ^¬. The flow directions of the stabilization ^¬ air jets are particularly preferably selected parallel to a WING ^¬ chennormalen the transport plane.

An advantageous development provides that in the upper stabilizing air jet, a beam profile is formed, which is in opposite directions to a beam profile of the lower stabilizing air ^¬ beam. Under an opposing beam pro fil is understood to mean the following: the beam profiles of the upper and lower stabilization air jet are so designed from ^¬ that in the case of Zuströmens the upper stabilizer ^¬ lisierungsluftStrahls with opposite flow direction on the lower stabilization air jet at a Pro ^¬ jection of the beam profiles in the flow direction in a Pro ^¬ projection image of the two beam profiles results in an intersection. Preferably, this point of intersection lies approximately in the middle of the projection image. Particularly preferably, the beam profiles are formed axially symmetrical to an axis passing through the point of intersection. In this way, a good stabilization effect can be obtained by inflow of air in a relatively small surface areas of the flat sub ^¬ strats. Preferably, the sheet-like substrates at a rate RESIZE ^¬ SSER than 2.6 m per minute through the Durchlaufanläge be transported ^¬ advantage during the drying of the flat sub ^¬ strate. In this way, good and reliable trock ^¬ planning results can be realized at a comparatively high speed Durchsatzge-.

In addition, the invention is based on figures closer erläu ^¬ tert. Where appropriate, the same effect elemene ^¬ te herein are provided with the same reference numerals. The invention is not limited to the Ausführungsbeispie ^¬ le shown in the figures - not even in terms of functional features. The previous description as well as the following figures ^¬ description contain numerous features that are given in the dependent dependent ^¬ dependent part of several summarized. These features, as well as all other disclosed above and in the following description Watch ^¬ times the skilled artisan will also consider individually and together to form meaningful combinations. In particular, all the features mentioned are each individually and in arbitrary combination suitable combination with the drying device and / or the method of the independent claims. It zei ^¬ gen: 1 First embodiment of a Trocknungsvorrich ^¬ tung

FIG. 2 partial representation of the drying apparatus from FIG. 1 FIG. 3 partial representation of a drying head from FIG. 2

FIG. 4 partial representation of the drying device from FIG. 1 during the passage through a semiconductor substrate FIG. 5 (a) partial sectional view, (b) sectional view and (c) detail of a drying head from FIG

Figure 6 drying head of the drying apparatus of Figure 1 with the cover removed

7 shows perspective views of a second execution ^¬ example of the drying device 8 is partial view of the drying apparatus of Figure 7

Figure 9 Third embodiment of the drying device

FIG. 10 partial representation of a drying head from FIG. 9

Figure 11 first perspective view of a drying ^¬ head pair of Figure 9 Figure 12 is perspective view of the second head pair ^¬ drying of Figure 11,

FIG. 13 shows a schematic diagram of a first exemplary embodiment of the method

Figure 14 Schematic representation of a second embodiment of the method Figure 15 Third embodiment of the method Figure 16 Opposing beam profiles

FIG. 1 shows a first embodiment of the drying device. The drying device 1 shown therein has two upper drying heads 2a, 2b and two lower drying heads 3a, 3b. The upper drying head 2a and the lower drying head 3a on the one hand and the upper voltage Trock ^¬ head 2b and the lower drying head 3b are respectively connected to the drying head pairs. The drying device 1 will be explained in more detail below with reference to the figures 1 to 6. Thus, Figure 2 shows the two lower drying heads 3a, 3b in a perspective view. In this illustration, air outlet slots 5a, 5b can be seen, which are arranged in the lower drying heads 3a, 3b. The air outlet ^¬ slot 5a is also visible in the enlarged partial view of the lower drying head 3a in Figure 3 and in Figure 4. Figure 4 also shows a semiconductor substrate, which is transported straight through in a transport direction 9 through the drying device 1. An underside of the Halbleitersub ^¬ strats extends in a transport plane 8. The upper drying head 2a is in the representation of Figure 4, the BES seren clarity is ^¬ provided only to a small extent. However, this shows an upper air outlet ^¬ slot 4a. From FIGS. 1 and 4, it can thus be seen that the upper drying heads 2a, 2b are arranged above the transport plane 8, whereas the lower drying heads 3a, 3b are arranged below the transport plane 8. As can be seen from FIG. 2, the lower drying heads 3a, 3b have a plurality of air outlet slots 5a, 5b. The upper drying heads also have several air outlet slots.

Longitudinal directions of all air outlet slots extend, as shown in Figure 4, parallel to the transport ^¬ level 8 and transversely to the transport direction 9. Openings of the air outlet slots 4a, 4b, 5a, 5b extend in each associated slot planes and clamp them on. One to the

Air outlet slot 4a of the upper drying head 2a gehö ^¬ ing slot plane 11 is indicated schematically in Figure 4. This slot plane 11 intersects the transport plane 8 at ei ^¬ nem angle a. This angle a is greater than 0 ° and at the same time less than 90 °. Preferably, it is 70 °. As can be seen from ^¬ Fi gur 4, are to the lower air from ^¬ passage slot 5a corresponding slot plane the same angle ^¬ relationships in. FIG. 5a) shows a partial view of a bottom view of the upper drying head 2b. In Figure 5b) a Schnittdar ^¬ position through this upper drying head 2b along the Li ^¬ is never reproduced CC of Figure 5a). As can be seen therein, a lid 20 which can be seen in FIGS. 1 and 3 and is provided for all drying heads is not taken into account in the illustrations of FIG. FIG. 5 thus shows the upper drying head 2b with the cover 20 removed. The air outlet slits 4a, 4b, 5a, 5b have, at the Trock ^¬ drying apparatus 1 all have a uniform slot depth 13 (see FIG. 4), which is 3 mm. A ge in Figure 5c) ^¬ shows detailed view of a portion Z of Figure 5b) il- lustriert a slot width 14. This is a uniform

0.5 mm. It has been shown that a constant slit cross-section ^¬ significant impact on the drying result has. In order to stabilize the shape and thus the cross sections of the air outlet ^¬ slots 5a, 5b, 4a, 4b, therefore, stiffening webs 16 are provided in the drying device 1. These are arranged at a distance of about 5 cm from each other. In this way, the dimensional stability of the air outlet slots 4a, 4b, 5a, 5b can be increased. As can be seen in Figures 2 to 6, the longitudinal directions of the air exit slits extend 4a, 4b, 5a, 5b of the ^¬ art transversely to the transport direction 9, that said longitudinal ^¬ directions by an angle b deviate ^¬ surfaces of the transport direction, the 87 ° or less. In the case of the drying device 1, it is 87 °. As a result, the angle shown in Fi gur ^¬ 5a) is (90 ° -b) thus 3 °.

In the drying apparatus 1 is a trock ^¬ voltage device for a multi-track system, more specifically for a five-track system. The semiconductor substrates 7 can run side by side through the drying device in five Spu ^¬ ren. The air outlet slots 4a, 4b, 5a, 5b see pre ^¬ are for each track. Wherein a slot length 15 of the air outlet slots 4a, 4b, 5a, 5b each extend over the entire width of the semiconductor substrate (see FIG. In the case of Silizi ^¬ to semiconductor substrates, a slot length has proven 15 of 180 mm. The upper drying head 2a and the lower drying head 3a are arranged one above the other so that the slot plane 11 forms a cutting line with the transport plane 8, which coincides with a cutting line, which forms the slot plane associated with the lower air outlet slot 5a with the Trans ^¬ Portebene 8. This has the consequence that a is true from the obe ^¬ ren air outlet slit 4a air exiting beam over its entire length with an emerging from the lower air outlet ^¬ slot 5a air jet in the transport plane. 8 The same applies to the upper drying head 2b and the lower drying head 3b and arranged therein air ^{¬ exit} slits 4b, 5b.

All drying heads 2a, 2b, 3a, 3b have base plates 18a, 18b, 19a, 19b, in each of which a pocket 22 for air guide ^¬ incorporated. This is shown in FIG. 6 by way of example for the lower drying head 3a, which is shown there for this purpose with the cover 20 removed. The bag 22 forms when the lid 20 is a cavity 23, which serves to guide the air. In the interest of a ^¬ uniform drying result over the various tracks of the drying apparatus is away a uniform flow distribution in the drying heads 2a, 2b, 3a, 3b to make. For this purpose, in each case an angle plate 24 is inserted into the drying heads 2a, 2b, 3a, 3b, which has the gleichmä ^¬ lar air distribution serving holes 25. Dar ^{¬ Beyond} the angle plate 24 of the stiffening of the

Drying head 3a. In the case of the drying apparatus 1, the upper Trock ^¬ voltage heads 2a, 2b connected together by a common upper Rohrzulei ^¬ tung 26th Accordingly, the lower drying heads 3a, 3b connected by a common lower tube ^¬ supply 27th About these pipe feeders 26, 27 is an air used for drying, or another ^¬ res used gas mixture, the drying device 1 is supplied ^¬ . Figures 7 and 8 illustrate a further Ausführungsbei ^¬ play of the drying apparatus. So figure shows two 7-perspective by ^¬ representations of a drying device 40 from different angles. As in the case of the drying ^device 1, the drying device 40 has two upper drying heads 42a, 42b and two lower drying heads 43a, 43b, which form two drying head pairs 42a, 43a and 42b, 43b. Instead of the upper and lower pipe feed line 26, 27 in the drying device 1 40 separate hose feed 51a, 51b, 51c, 51d are provided for each drying head 42a, 42b, 43a, 43b in the Trocknungsvor ^¬ direction. These serve in a similar manner to the supply of air or other drying medium.

Each of the drying heads 42a, 42b, 43a, 43b similarly as in the case of the drying apparatus 1 comprises a base plate 48a, 48b, 49a, 49b, in which a bag is incorporated, which is closable with ^¬ means of the lid 20th However, an angle plate 54 serving for stiffening is not arranged in the pockets in the case of the drying ^device 40, but is fastened on the outside to the drying heads 42a, 42b, 43a, 43b. To this

Manner can be prevented from flowing move from the angle plates being ^¬ rising metallic impurities by means of through pockets air on the semiconductor substrates and contaminate.

In contrast to the drying device 1 40 continuous air outlet slots 45a, 45b are provided in the drying ^¬ device. As can be seen in FIG. 8, these extend substantially perpendicular to the transport direction 9. The drying device 40 can still be used in multi-lane systems. In the upper drying heads 42a, 42b appropriately designed air outlet slots are provided. However, they are offset relative to the air outlet slots 45a, 45b of the lower drying heads 43a, 43b. Considering slot planes in which the air outlet ^¬ slots 42a of the upper drying heads, 42b extend and the first line of intersection which this with the same way as in the case of the drying apparatus 1 extending transport plane 8 education to, this first cut line no longer coincide with the second line of intersection forming those Schlitzebe ^¬ NEN with the transport plane 8, in which the air from ^¬ passage slots 45a, 45b of the lower drying heads 43a, 43b extend. Rather, in each drying head pair 42a, 43a and 42b, 43b, the first cut line relative to the second

Cut straight offset in the transport direction. From the obe ^¬ ren drying heads 42a, 42b originating air jets hit thus in particular drying head pair of air jets from the air outlet slots 45a, 45b of the lower drying heads 43a, 43b explained with an offset in the transport direction on the semiconductor substrate 7. As Upper closer to this example, in certain applications reduces the formation of vibration of the semiconductor substrate during the Trocknungsvor ^¬ gear and related breakdown hazards.

Figures 9 to 12 illustrate a further Ausführungsbei ^¬ play of the drying apparatus. Again, the illustrated drying ^¬ device 70 has two upper drying heads 72a, 72b and two lower drying heads 73a, 73b. Similarly to the case of the drying apparatus 40 72b, 73a, 73b continuous or at least na ^¬ hezu continuous air exit slots 74a, 75a are in the Trock ^¬ voltage heads 72a, arranged whose longitudinal directions are substantially perpendicular to the

Transport direction 9 extend. Unlike drying Device 40 come in the drying device 70, the air outlet slots 74a, 75a upper 72a, 72b and lower drying heads 73a, 73b again superposed. Infol ^¬ gedessen arrives arranged from that in the upper drying head 72a air exit slot 74a outgoing air jet analogously as in the case of the drying apparatus 1 in the Trans ^¬ port plane 8 with an outgoing from the air exit slot 75a of the un ^¬ direct drying head 73a air jet together. However, the upper 72a and the lower drying head 73a of the drying head pair shown in Figs. 11 and 12 of air, or more specifically the drying medium, have flow through stabilizing slots 80a, 81a. These are arranged offset in transport ^¬ direction 9 adjacent to the air outlet slots 74a or 75a. Longitudinal directions of the stabilizing slots

80a, 81a extend parallel to the transport plane 8 and at an angle deviating from 90 ° transverse to the transport ^¬ direction 9. As a comparison of the partial views of Figures 11 and 12, the stabilizing slots 80a in the upper drying head 72a are opposite to the Stabilizing ^¬ slots 81 a arranged in the lower drying head 73 a. In the case of the drying apparatus 70 are the stabilizing ^¬ slots 80a, 81a are formed such that strikes them from ausströ ^¬ air flowing in a direction parallel to a surface normal of the transport plane 8 to the semiconductor substrate. The

Stabilizing slots 80a, 81a are also provided in the drying heads 72b, 73b in a corresponding manner. You can, as explained above, be additionally or alternatively used as co ^¬ tel to reduce or avoid vibration to be dried semiconductor substrates.

As shown in Figures 10 to 12, 72a have the drying ^¬ heads, 72b, 73a, 73b in a similar manner as in the overall therein Trock ^¬ drying devices 1 and 40 base plates 78a, 79a, formed pockets 82 and the lid 20. The Ausstei ^¬ tion serving angle plate 54 is mounted as in the case of drying ^¬ device 40 outside the pockets 82. Consequently, in the angle plate 54 no holes for distributing the air in the pockets 82 on the various tracks and associated air outlet slots 74 a, 75 a arranged ^¬ who. The uniform distribution of the air flow within the pockets 82a, which is significant for a uniform drying result on all tracks, must therefore take place in a different manner. For this purpose, in the drying heads 72a, 72b, 73a, 73b, free slots 84 are provided in webs 85 of the base plates 78a. 79a arranged. By means of these free cuts 84 in the webs 85, the uniform air distribution can be realized on the different tracks.

FIG. 13 illustrates a schematic representation of a first exemplary embodiment of the method. In this case, an upper side 28 of the semiconductor substrate 7 is ^flown over the entire width of the semiconductor substrate 7 away from an upper air jet 92. Simultaneously, a bottom side 29 of the semiconductor substrate 7 will be flowed through by a over the entire width of the semiconductor substrate 7 of time extending lower air jet ^¬ 93rd The top 28 as well as the bottom 29 are thereby against the transport direction 9 flows against said air jets 92, 93. The flow occurs at each ^¬ at the angle a, which preferably carries 70 ° ^¬ . The upper 92 and the lower air jet 93 are aligned such that they impinge in opposite Berei ^¬ chen the top 28 on the one hand and the bottom 29 on the other hand.

The first embodiment of the method can be performed in advantageous manner ^¬ with the drying apparatus 1 or the drying device 70th A further development of the process schematically illustrated in Figure 13 be discuss ^¬ tert hereinafter referring back to FIG. 4 In this development, a trailing edge 6 of the semiconductor substrate of the upper 92 and the lower air ^¬ jet 93 is flowed obliquely in flow directions that the trailing edge 6 with the direction of flow of the upper air jet ^¬ 92 and also with the direction of flow of the lower air ^¬ jet 93rd an angle c of 3 °. The angle c is directly linked to the angle b shown in FIG. For him, c = 90 ° -b.

Figure 14 illustrates a second embodiment of the Ver ^¬ driving. In this, the upper air jet 92 and the un- tere air jet 93 are aligned such that they are added in the transport direction by an offset ^¬ 94 impinge on the Halbleitersub ^¬ strat. 7 The offset 94 is preferably 2 mm. The upper air jet 92 impinges against the lower air ^¬ jet 93 downstream in the transport direction 9 on the semiconductor substrate 7. This has proven itself in practice.

The schematically illustrated in Figure 14 embodiment of the method can be realized by means of the drying device ^¬ 40th

A further embodiment of the process illustrated Figure 15. Here, the upper surface 28 of the Halbleitersub ^¬ strats be ^¬ flows from an upper stabilization air jet 96, the underside 29 is flown from a bottom stabilization air jet 97th As can be seen in FIG. 15, the flow directions of the upper stabilizing ^{air jet} 96 and of the lower stabilizing ^{air jet} 97 are aligned in opposite directions. In addition, the flow directions of both stabilizing air jets 96, 97 are parallel to one another Surface normals of the transport plane 8. The stabilizing ^{air ¬} rays 96, 97 can in turn be used in addition or alternatively to reduce or avoid vibration of the semiconductor ^¬ semiconductor substrate.

Figure 16 shows a schematic representation of a beam ^¬ profile 98 of the upper stabilization air jet 96 of Figure 15 and a beam profile 99 of the lower stabilization air ^¬ beam 97 of Figure 15. As shown in Figure 16 can be seen, these beam profiles 98, 99 are in opposite directions.

The embodiment of Figures 15 and 16 can be realized by means of the drying apparatus 70. While the invention in detail illustrated by preferred execution ^¬ examples and described in detail, the He ^¬ invention not a ^¬ set and other variants of the invention may be prepared by the disclosed embodiments be derived by the expert ^¬ man, without departing from the basic idea of the invention.

LIST OF REFERENCE NUMBERS

I drying device 2a, 2b upper drying head 3a, 3b lower drying head

4a, 4b air outlet slot

5a, 4b air outlet slot

6 trailing edge

7 semiconductor substrate 8 transport plane

9 transport direction

II slot level

13 slot depth

14 slot width

15 slot length

16 stiffening web

18a, 18b base plate

19a, 18b base plate

20 lids

22 bag

23 cavity

24 angle plate

25 holes

26 upper pipe inlet 27 lower pipe inlet

28 top

29 bottom

40 drying device

42a, 42b upper drying head

43a, 43b lower drying head

45a, 45b air outlet slot

48a, 48b base plate 49a, 49b base plate

51a, 51b hose supply line

51c, 51d hose supply line

54 angle sheet

70 drying device

72a, 72b upper drying head

73a, 73b lower drying head

74a air outlet slot

75a air outlet slot

78a base plate

79a base plate

80a stabilization slot

81a stabilization slot

82 bag

84 free-cutting

85 footbridge

92 upper air jet

93 lower air jet

94 offset

96 upper stabilizing air jet

97 lower stabilizing air jet

98 Beam profile upper stabilizing air jet 99 Beam profile lower stabilizing air jet

corner

c angle

C-C cutting line

Z subarea

Claims

Drying device (1) having

- at least one upper drying head (2a) and Wenig ^¬ least a bottom (3a) drying head;

- wherein the at least one upper drying head (2a)

above a transport plane (8) in which to trock ^¬ designating objects in a transport direction (9) through the drying apparatus (1) therethrough can be transported, positioned, and at least one lower Trock ^¬ drying head (3a) below said transport plane (8 ) is arranged;

d a d u r c h e c e n c i n e s that

- the at least one upper drying head (2a) and the at least one lower drying head (3a) in each case we ^¬ nigstens an air outlet slot (4a, 5a) having;

- Longitudinal directions of said air outlet slots (4a, 5a) extend substantially parallel to the transport plane (8) and transversely to the transport direction (9);

- Slit planes (11), in which the said Luftaus ^¬ exit slots run, the transport plane (8) at angles (a) intersect, which are greater than 0 ° and smaller than 90 °.

Drying device (1) according to claim 1,

characterized ,

the slit planes (11) in which the said air exit slits extend, under the transport plane (8)

Intersect angles (a) that are greater than 60 ° and less than 80 °, preferably greater than 65 ° and less than

75 °, and more preferably 70 °. Drying device (1) according to one of the preceding claims,

characterized ,

in that the air outlet slots (4a, 5a) have a substantially uniform slot depth (13) which has a value between 1 mm and 5 mm, preferably a value between 2 mm and 4 mm and particularly preferably a value between 2.5 mm and 3 , 5 mm.

Drying device (1) according to one of the preceding claims,

characterized ,

that the air outlet slots (4a, 5a) have a slot width (14) greater than or equal to 0.3 mm and less than or equal to 0.7 mm, wherein the slot width vorzugswei ^¬ se 0.5 mm.

Drying device (1) according to one of the preceding claims,

marked by

Stiffening webs (16) for stabilizing shapes of the air outlet slots (4a, 5a).

Drying device (1) according to one of the preceding claims,

characterized ,

in that at least one drying head (2a, 3a), preferably all drying heads (2a, 3a), have

- A base plate (18 a, 19 a), in which a pocket (22) is incorporated for air guidance,

- One with the base plate (18 a, 19 a) connectable lid (20), by means of which the bag (22) to form a cavity (23) is closable. Drying device (1) according to one of the preceding claims,

marked by

an angle plate (24) which is suitable and provided for stiffening at least one drying head (2a, 3a).

Drying device (1) according to one of the preceding claims,

characterized ,

that the longitudinal direction of at least one air outlet ^¬ slot (4a, 5a) to processing such transverse to the transport direction (9), that the longitudinal direction of said processing to ei ^¬ NEN angle (b) of 87 ° or less from the transport direction (9 ) deviates, preferably by an angle (b) of more than 75 ° and less than or equal to 87 ° and particularly preferably ^¬ by an angle (b) of 87 °.

Drying apparatus (40; 70) according to one of claims vorangegange ^¬ NEN,

characterized ,

in that the longitudinal direction of at least one air outlet ^slot (45a, 74a, 75a) extends substantially perpendicular to the transport direction (9).

A drying apparatus (1; 70) according to one of claims vorangegange ^¬ NEN,

characterized ,

in that an upper drying head (2a; 72a) and a lower drying head (3a; 73a) form a drying head pair in such a way that the slot planes (11) in which the air outlet slots (4a; 74a) of the upper drying head (2a; 72a) of the drying head pair, forming with the transport plane (8) cutting lines the, which coincide with intersecting lines which diejeni gene slot planes in which the air outlet slots (5a 75a) of the lower drying head (3a, 73a) of the drying head pair, with the transport plane (8) form.

11. Drying device (40) according to one of the preceding claims,

characterized ,

in that an upper drying head (42a) and a lower drying head (43a) are arranged so as to form a pair of drying heads over one another

- extending the slot planes in which the air outlet slots of the upper drying head (42a) of the Trocknungskopfpaa- res, with the transport plane (8) first cut ^¬ straight form extending parallel to the second line of intersection which those slot planes in which the air outlet slots (45a, 45b) of the lower drying head ^¬ (43a, 43b) of the drying head pair dur ^¬ fen, with the transport plane (8) form; and

- The first cut line relative to the second cut ^¬ straight in the transport direction (9) by a value zwi ^¬ 's 1 mm and 5 mm offset from each other, preferably before ^¬ to a value between 1 mm and 3 mm and be ^¬ particularly preferably by 2 mm.

12. Drying device (70) according to one of the preceding claims,

d a d u r c h e c e n c i n e s that

- An upper drying head (72 a) and a lower drying ^¬ tion head (73 a) a drying head pair forming superimposed ^¬ nander are arranged; - The upper (72 a) and the lower drying head (73 a) of the drying head pair each have at least one ^¬ flowable stabilizing slot (80 a, 81 a);

- The said stabilizing slots (80a, 81a) each offset in the transport direction (9) next to a Luftaus ^¬ passage slot (74a, 75a) are arranged;

- Longitudinal directions of the said stabilizing slots (80a, 81a) extend substantially parallel to the Trans ^¬ portebene (8) and at a deviating angle of 90 ° transverse to the transport direction (9);

The at least one stabilizing slot (80a) of the

upper drying head (72a) and the at least one stabilizing slot (81a) of the lower Trockikungskop ^¬ fes (73a) are arranged in pairs such that from the in the upper drying head (72a) arranged Stabili ^¬ sierungsschlitz (80a) of a stabilizing slot pair outgoing air fronts with the in the lower drying head (73a) arranged stabilizing slot (81a) of this stabilizing slot pair escaping air fronts intersect in the transport plane (8).

Drying device (1; 40; 70) according to one of claims 10 to 12,

characterized ,

in that at least two drying head pairs are provided, which are arranged one after the other in the transporting direction (9).

Drying device (40; 70) according to one of the preceding claims,

characterized ,

that the longitudinal directions of all the air outlet slots (45a; 74a, 75a) extend substantially perpendicular to the transport direction ^¬ (9). Process for drying a flat substrate (7) in a flow-through apparatus, in which

- an upper side (28) of the planar substrate (7) of ei ^¬ nem over an entire width of the planar Sub ^¬ strats (7) extending away upper air jet (92) is flown;

d a d u r c h e c e n c i n e s that

- At the same time a bottom (29) of the planar sub ^¬ strate (7) of a over an entire width of the planar substrate (7) extending away lower air jet (93) is flown;

- The top (28) and the bottom (29) of the planar substrate (7) of the upper (92) and the lower air ^¬ beam (93) relative to a transport plane (8), in wel ^¬ cher the sheet substrate is transported , are flown at angles (a) which are greater than 0 ° and less than 90 °.

16. The method according to claim 15,

characterized ,

that the upper side (28) and the underside (29) of the flächi ^¬ gen substrate (7) obtained from the upper (92) and the lower air ^¬ beam (93) on the transport plane (8) under Win ^¬ angles (a) flows against are, which are larger than 60 ° and klei ^¬ ner than 80 °, preferably greater than 65 ° and smaller than 75 °, and particularly preferably 70 °.

Method according to one of claims 15 to 16,

characterized ,

in that the upper air jet (92) and the lower jet of air are aligned (93) in such a way that they lie in mutually opposite areas on the one hand on the upper side (28) of the planar substrate (7), on the other hand on the Un ^¬ terseite (29) of the planar substrate (7) impinge.

18. The method according to any one of claims 15 to 16,

characterized ,

the upper air jet (92) and the lower air jet (93) are aligned in such a way that they impinge on the planar substrate (7) in the transport ^direction (9) offset by a value of between 1 mm and 5 mm, the said one Value is preferably between 1 mm and 3 mm, and more preferably 2 mm.

19. The method according to any one of claims 15 to 18,

characterized ,

that a trailing edge (6) of the flat substrate (7) of the upper (92) and lower air jet (93) is flown obliquely in Anströmrich ^¬ obligations, that the trailing edge with the inflow direction of the upper air jet (92) and also with the direction of flow the lower jet of air (93) includes an angle (c) of 3 ° or more, preferably an angle (c) of less than 15 ° and greater than or equal to 3 ° and most preferably an angle (c) of 3 °.

20. The method according to any one of claims 15 to 19,

characterized ,

that for the stabilization of the sheet substrate (7) the upper side (28) is flown from an upper stabilization air jet (96) and the underside (29) of a lower stabilization ^¬ approximately air jet (97), wherein the lower Sta ^¬ bilisierungsluftstrahl (97) is preferably a a flow ^¬ direction of the upper stabilizing air jet (96) oppositely directed flow direction. Method according to claim 20,

characterized ,

that a beam profile (99) of the lower stabilization air ^¬ beam (97) is formed counter-rotating beam profile (98) at the upper stabilization air jet (96).