EP3526303A4 - Thermal interface materials including coloring agent - Google Patents

Thermal interface materials including coloring agent Download PDF

Info

Publication number: EP3526303A4
Authority: EP; European Patent Office
Prior art keywords: coloring agent; materials including; thermal interface; interface materials; including coloring
Prior art date: 2016-10-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP16918509.7A

Other languages

German (de)

French (fr)

Other versions

EP3526303A1 (en

Inventor

Liqiang Zhang

Yaqin Mao

Huifeng DUAN

Haigang KANG

Yaqun Liu

Ling Shen

Kai Zhang

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Honeywell International Inc

Original Assignee

Honeywell International Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-10-12

Filing date

2016-10-12

Publication date

2020-09-09

2016-10-12 Application filed by Honeywell International Inc filed Critical Honeywell International Inc

2016-10-12 Priority to PT202110730T priority Critical patent/PT3839005T/en

2016-10-12 Priority to EP20211073.0A priority patent/EP3839005B1/en

2019-08-21 Publication of EP3526303A1 publication Critical patent/EP3526303A1/en

2020-09-09 Publication of EP3526303A4 publication Critical patent/EP3526303A4/en

Status Withdrawn legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
- C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0041—Optical brightening agents, organic pigments
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/23—Azo-compounds
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Physics & Mathematics (AREA)
Medicinal Chemistry (AREA)
Health & Medical Sciences (AREA)
Polymers & Plastics (AREA)
Microelectronics & Electronic Packaging (AREA)
Computer Hardware Design (AREA)
General Physics & Mathematics (AREA)
Power Engineering (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Combustion & Propulsion (AREA)
Thermal Sciences (AREA)
Compositions Of Macromolecular Compounds (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Coloring (AREA)
Cosmetics (AREA)

EP16918509.7A 2016-10-12 2016-10-12 Thermal interface materials including coloring agent Withdrawn EP3526303A4 (en)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
PT202110730T PT3839005T (en)	2016-10-12	2016-10-12	Thermal interface materials including coloring agent
EP20211073.0A EP3839005B1 (en)	2016-10-12	2016-10-12	Thermal interface materials including coloring agent

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/CN2016/101874 WO2018068222A1 (en)	2016-10-12	2016-10-12	Thermal interface materials including coloring agent

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
EP20211073.0A Division EP3839005B1 (en)	2016-10-12	2016-10-12	Thermal interface materials including coloring agent

Publications (2)

Publication Number	Publication Date
EP3526303A1 EP3526303A1 (en)	2019-08-21
EP3526303A4 true EP3526303A4 (en)	2020-09-09

Family

ID=61905079

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
EP16918509.7A Withdrawn EP3526303A4 (en)	2016-10-12	2016-10-12	Thermal interface materials including coloring agent
EP20211073.0A Active EP3839005B1 (en)	2016-10-12	2016-10-12	Thermal interface materials including coloring agent

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
EP20211073.0A Active EP3839005B1 (en)	2016-10-12	2016-10-12	Thermal interface materials including coloring agent

Country Status (9)

Country	Link
EP (2)	EP3526303A4 (en)
JP (1)	JP2020500225A (en)
KR (1)	KR102666004B1 (en)
CN (1)	CN109844056B (en)
BR (1)	BR112019007197A2 (en)
MX (1)	MX2019004236A (en)
PL (1)	PL3839005T3 (en)
PT (1)	PT3839005T (en)
WO (1)	WO2018068222A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN106536609B (en)	2014-07-07	2022-04-29	霍尼韦尔国际公司	Thermal interface material with ion scavenger
KR102470083B1 (en)	2014-12-05	2022-11-23	허니웰 인터내셔널 인코포레이티드	High performance thermal interface materials with low thermal impedance
US10312177B2 (en) *	2015-11-17	2019-06-04	Honeywell International Inc.	Thermal interface materials including a coloring agent
WO2017152353A1 (en)	2016-03-08	2017-09-14	Honeywell International Inc.	Phase change material
US10501671B2 (en)	2016-07-26	2019-12-10	Honeywell International Inc.	Gel-type thermal interface material
US11041103B2 (en)	2017-09-08	2021-06-22	Honeywell International Inc.	Silicone-free thermal gel
US10428256B2 (en)	2017-10-23	2019-10-01	Honeywell International Inc.	Releasable thermal gel
US11072706B2 (en)	2018-02-15	2021-07-27	Honeywell International Inc.	Gel-type thermal interface material
US11373921B2 (en)	2019-04-23	2022-06-28	Honeywell International Inc.	Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
EP3792305B1 (en) *	2019-06-24	2024-03-27	Fuji Polymer Industries Co., Ltd.	Heat-tolerant thermally conductive composition and heat-tolerant thermally conductive sheet
KR20230126716A (en)	2020-12-24	2023-08-30	다우 글로벌 테크놀로지스 엘엘씨	thermal interface material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20150008361A1 (en) *	2012-03-02	2015-01-08	Fuji Polymer Industries Co., Ltd.	Putty-like heat transfer material and method for producing the same
WO2016111139A1 (en) *	2015-01-06	2016-07-14	富士高分子工業株式会社	Heat-storage, thermally conductive sheet

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2003509578A (en) *	1999-09-21	2003-03-11	サンーゴバンセラミックスアンドプラスティクス，インコーポレイティド	Thermally conductive materials in hydrophobic compounds for thermal management
CN104194733B (en) *	2009-03-02	2018-04-27	霍尼韦尔国际公司	Thermal interfacial material and manufacture and use its method
KR101725336B1 (en) *	2009-03-16	2017-04-10	다우 코닝 코포레이션	Thermally conductive grease and methods and devices in which said grease is used
US9260645B2 (en) *	2010-02-23	2016-02-16	Laird Technologies, Inc.	Thermal interface materials including thermally reversible gels
US8552101B2 (en) *	2011-02-25	2013-10-08	Sabic Innovative Plastics Ip B.V.	Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
US20140171567A1 (en) *	2012-12-14	2014-06-19	Sabic Innovative Plastics Ip B.V.	Thermally conductive flame retardant polymer compositions and uses thereof
US20150125646A1 (en) *	2013-11-05	2015-05-07	Espci Innov	Self-Healing Thermally Conductive Polymer Materials
US10068830B2 (en) *	2014-02-13	2018-09-04	Honeywell International Inc.	Compressible thermal interface materials
CN104497574A (en) *	2014-12-10	2015-04-08	深圳市博恩实业有限公司	Multifunctional organic silicon thermal interface material
CN105349113A (en) *	2015-10-14	2016-02-24	文雪烽	Heat-conductive interface material

2016
- 2016-10-12 PT PT202110730T patent/PT3839005T/en unknown
- 2016-10-12 EP EP16918509.7A patent/EP3526303A4/en not_active Withdrawn
- 2016-10-12 CN CN201680089978.7A patent/CN109844056B/en active Active
- 2016-10-12 PL PL20211073.0T patent/PL3839005T3/en unknown
- 2016-10-12 KR KR1020197010394A patent/KR102666004B1/en active Active
- 2016-10-12 WO PCT/CN2016/101874 patent/WO2018068222A1/en unknown
- 2016-10-12 JP JP2019519732A patent/JP2020500225A/en active Pending
- 2016-10-12 MX MX2019004236A patent/MX2019004236A/en unknown
- 2016-10-12 BR BR112019007197A patent/BR112019007197A2/en not_active Application Discontinuation
- 2016-10-12 EP EP20211073.0A patent/EP3839005B1/en active Active

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20150008361A1 (en) *	2012-03-02	2015-01-08	Fuji Polymer Industries Co., Ltd.	Putty-like heat transfer material and method for producing the same
WO2016111139A1 (en) *	2015-01-06	2016-07-14	富士高分子工業株式会社	Heat-storage, thermally conductive sheet

Also Published As

Publication number	Publication date
KR20190067176A (en)	2019-06-14
MX2019004236A (en)	2019-07-04
BR112019007197A2 (en)	2019-07-02
CN109844056B (en)	2021-11-09
PL3839005T3 (en)	2023-11-27
PT3839005T (en)	2023-09-07
KR102666004B1 (en)	2024-05-14
EP3839005A1 (en)	2021-06-23
WO2018068222A1 (en)	2018-04-19
JP2020500225A (en)	2020-01-09
EP3526303A1 (en)	2019-08-21
EP3839005B1 (en)	2023-07-19
CN109844056A (en)	2019-06-04

Publication	Publication Date	Title
EP3526303A4 (en)	2020-09-09	Thermal interface materials including coloring agent
EP3105300A4 (en)	2017-09-13	Compressible thermal interface materials
EP3223771A4 (en)	2018-07-25	Hair coloring appliance
EP3262022A4 (en)	2018-08-15	Phenylethynylnaphthalene dyes and methods for their use
GB2566188B (en)	2020-11-18	Thermal interface material structures
EP3281621A4 (en)	2018-02-14	Hair darkening dye composition
EP3491096A4 (en)	2020-03-25	Gel-type thermal interface material
EP3153154A4 (en)	2018-01-03	Hair-dye composition
EP3274516A4 (en)	2018-11-21	Thermal break for use in construction
EP3153153A4 (en)	2017-11-15	Hair-dye composition
EP3464466A4 (en)	2020-02-12	Hot melt composition
EP3153152A4 (en)	2018-01-10	Hair dye composition
EP3124551A4 (en)	2017-02-01	Rhodamine-based coloring composition
EP3218192A4 (en)	2018-08-01	First and second reservoirs for printable compositions
EP3436811A4 (en)	2019-11-27	Thermal modulator
EP3103853A4 (en)	2017-10-25	Thermochromic color-memory composition and thermochromic color-memory microcapsule pigment encapsulating the same
EP3199596A4 (en)	2018-05-16	Coloring metallic pigment
EP3272346A4 (en)	2018-08-01	Solid preparation containing colorant
EP3192845A4 (en)	2018-04-18	Thermochromic color-memory composition and thermochromic color-memory microcapsule pigment including same
EP3115420A4 (en)	2017-03-22	Cyanine coloring composition
EP3473238A4 (en)	2020-02-26	Powder hair dye composition
EP3446472A4 (en)	2019-12-04	Colorant calibration
EP3150393A4 (en)	2018-01-24	Thermal printer
EP3357977A4 (en)	2019-03-06	Gardenia pigment preparation
GB201719931D0 (en)	2018-01-17	Cream-typehair coloring agent

Legal Events

Date	Code	Title	Description
2018-04-20	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2019-07-19	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2019-07-19	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2019-08-21	17P	Request for examination filed	Effective date: 20190409
2019-08-21	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2019-08-21	AX	Request for extension of the european patent	Extension state: BA ME
2020-01-15	DAV	Request for validation of the european patent (deleted)
2020-01-15	DAX	Request for extension of the european patent (deleted)
2020-06-03	RIC1	Information provided on ipc code assigned before grant	Ipc: C08K 5/00 20060101ALI20200429BHEP Ipc: H01L 23/373 20060101ALI20200429BHEP Ipc: C09K 5/06 20060101AFI20200429BHEP Ipc: C08K 3/22 20060101ALI20200429BHEP Ipc: C08K 3/08 20060101ALI20200429BHEP
2020-09-09	A4	Supplementary search report drawn up and despatched	Effective date: 20200811
2020-09-09	RIC1	Information provided on ipc code assigned before grant	Ipc: H01L 23/373 20060101ALI20200805BHEP Ipc: C08K 3/08 20060101ALI20200805BHEP Ipc: C08K 3/22 20060101ALI20200805BHEP Ipc: C09K 5/06 20060101AFI20200805BHEP Ipc: C08K 5/00 20060101ALI20200805BHEP
2021-02-26	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN
2021-03-31	18W	Application withdrawn	Effective date: 20210223