[go: up one dir, main page]

EP3413065A4 - DEVICE HAVING FISSURE DETECTION CIRCUIT AND DETECTION SYSTEM - Google Patents

DEVICE HAVING FISSURE DETECTION CIRCUIT AND DETECTION SYSTEM Download PDF

Info

Publication number
EP3413065A4
EP3413065A4 EP16920069.8A EP16920069A EP3413065A4 EP 3413065 A4 EP3413065 A4 EP 3413065A4 EP 16920069 A EP16920069 A EP 16920069A EP 3413065 A4 EP3413065 A4 EP 3413065A4
Authority
EP
European Patent Office
Prior art keywords
fissure
detection
detection circuit
detection system
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16920069.8A
Other languages
German (de)
French (fr)
Other versions
EP3413065B1 (en
EP3413065A1 (en
Inventor
Hui SI
Haohui LONG
Jianping FANG
Runqing Ye
Weiqiang HONG
Yunfei Wang
Taixiang LIU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of EP3413065A1 publication Critical patent/EP3413065A1/en
Publication of EP3413065A4 publication Critical patent/EP3413065A4/en
Application granted granted Critical
Publication of EP3413065B1 publication Critical patent/EP3413065B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
EP16920069.8A 2016-10-28 2016-10-28 Device provided with crack detection circuit, and detection system Active EP3413065B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/103732 WO2018076272A1 (en) 2016-10-28 2016-10-28 Device provided with crack detection circuit, and detection system

Publications (3)

Publication Number Publication Date
EP3413065A1 EP3413065A1 (en) 2018-12-12
EP3413065A4 true EP3413065A4 (en) 2019-02-06
EP3413065B1 EP3413065B1 (en) 2023-08-30

Family

ID=62023310

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16920069.8A Active EP3413065B1 (en) 2016-10-28 2016-10-28 Device provided with crack detection circuit, and detection system

Country Status (6)

Country Link
US (1) US10996265B2 (en)
EP (1) EP3413065B1 (en)
JP (1) JP6892506B2 (en)
KR (1) KR102276266B1 (en)
CN (1) CN108496087B (en)
WO (1) WO2018076272A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10908210B2 (en) * 2018-09-28 2021-02-02 Sandisk Technologies Llc Die crack detection
KR20200124576A (en) * 2019-04-24 2020-11-03 에스케이하이닉스 주식회사 Die edge crack monitoring system
CN113467140B (en) * 2020-03-31 2022-06-07 荣耀终端有限公司 Display screen, electronic equipment and crack detection method
KR20220045684A (en) * 2020-10-06 2022-04-13 에스케이하이닉스 주식회사 Semiconductor Package Including a Wire Having a Zigzag Shape
CN113473826B (en) * 2021-06-09 2022-07-05 荣耀终端有限公司 Glass substrates, display panels, displays and electronic equipment
CN113552177B (en) * 2021-07-30 2023-05-12 武汉天马微电子有限公司 Display panel testing method, display panel and display device
CN114264700A (en) * 2021-12-23 2022-04-01 东华大学 A flexible wheel crack monitoring device and method
CN115561571B (en) * 2022-01-13 2023-12-08 深圳荣耀智能机器有限公司 Crack detection circuit, system, integrated circuit and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050212147A1 (en) * 2004-03-26 2005-09-29 Nec Electronics Corporation Semiconductor wafer, semiconductor chip, and semiconductor chip inspection method
US20070262370A1 (en) * 2006-05-10 2007-11-15 Nec Electronics Corporation Semiconductor device
CN105372857A (en) * 2015-12-16 2016-03-02 上海天马微电子有限公司 Glass substrate, liquid crystal display panel and liquid crystal display device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2526514B2 (en) * 1993-11-22 1996-08-21 日本電気株式会社 Hybrid integrated circuit board
US5969260A (en) * 1998-03-30 1999-10-19 Mcdonnell Douglas Corporation Remotely interrogatable apparatus and method for detecting defects in structural members
JP2001201477A (en) * 1999-11-09 2001-07-27 Horyo Sangyo Kk Structure maintenance support system
US7180302B2 (en) * 2004-07-16 2007-02-20 Simula, Inc Method and system for determining cracks and broken components in armor
JP2006041420A (en) 2004-07-30 2006-02-09 Seiko Epson Corp Evaluation device for electronic device and evaluation method for electronic device
JP2008021864A (en) 2006-07-13 2008-01-31 Nec Electronics Corp Semiconductor device
JP2008191995A (en) * 2007-02-06 2008-08-21 Toshiba Corp Ic card
CN101261246A (en) * 2007-03-09 2008-09-10 清华大学 Far-field eddy current detection method for pipeline cracks
US7701231B2 (en) 2007-03-20 2010-04-20 Cummins Filtration Ip, Inc Apparatus, system, and method for detecting cracking within an aftertreatment device
JP2009063532A (en) * 2007-09-10 2009-03-26 Ihi Corp Crack detector
CN101750556A (en) 2008-12-04 2010-06-23 鸿富锦精密工业（深圳）有限公司 Driver failure detection system and method
JP4748231B2 (en) 2009-02-24 2011-08-17 トヨタ自動車株式会社 Eddy current measuring sensor and inspection method therefor
US8253420B2 (en) * 2009-12-04 2012-08-28 Volterra Semiconductor Corporation Integrated electrical circuit and test to determine the integrity of a silicon die
US9057760B2 (en) 2011-01-20 2015-06-16 International Business Machines Corporation Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
JP2012220792A (en) * 2011-04-11 2012-11-12 Japan Display East Co Ltd Liquid crystal display device and method for manufacturing liquid crystal display device
CN102171579A (en) 2011-04-19 2011-08-31 华为终端有限公司 Integrated circuit device
WO2015065110A1 (en) 2013-10-31 2015-05-07 엘지전자(주) Method for transmitting discovery message in wireless communication system and apparatus for same
CN203587560U (en) * 2013-11-01 2014-05-07 绍兴文理学院元培学院 Metal crack detector
JP6267601B2 (en) * 2014-08-12 2018-01-24 東芝テック株式会社 Passive crack sensor
CN104914157B (en) * 2015-05-08 2017-11-07 上海海事大学 A kind of defect the cannot-harm-detection device in metal structure short space
CN205016497U (en) 2015-10-13 2016-02-03 中芯国际集成电路制造(北京)有限公司 Survey test structure of chip layering

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050212147A1 (en) * 2004-03-26 2005-09-29 Nec Electronics Corporation Semiconductor wafer, semiconductor chip, and semiconductor chip inspection method
US20070262370A1 (en) * 2006-05-10 2007-11-15 Nec Electronics Corporation Semiconductor device
CN105372857A (en) * 2015-12-16 2016-03-02 上海天马微电子有限公司 Glass substrate, liquid crystal display panel and liquid crystal display device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"TEST STRUCTURES FOR BUMPY INTEGRATED CIRCUITS", NTIS TECH NOTES, US DEPARTMENT OF COMMERCE. SPRINGFIELD, VA, US, 1 April 1990 (1990-04-01), XP000127996, ISSN: 0889-8464 *

Also Published As

Publication number Publication date
US20190324080A1 (en) 2019-10-24
JP6892506B2 (en) 2021-06-23
US10996265B2 (en) 2021-05-04
CN108496087A (en) 2018-09-04
WO2018076272A1 (en) 2018-05-03
KR102276266B1 (en) 2021-07-12
EP3413065B1 (en) 2023-08-30
CN108496087B (en) 2020-12-08
EP3413065A1 (en) 2018-12-12
KR20190076000A (en) 2019-07-01
JP2019533164A (en) 2019-11-14

Similar Documents

Publication Publication Date Title
EP3659868A4 (en) ABNORMALITY DETECTION DEVICE AND ABNORMALITY DETECTION METHOD
EP3413065A4 (en) DEVICE HAVING FISSURE DETECTION CIRCUIT AND DETECTION SYSTEM
EP3343433A4 (en) DEVICE AND SYSTEM FOR IDENTIFYING DIGITAL IMPRESSIONS
EP3489723A4 (en) DETECTION DEVICE AND ELECTRONIC APPARATUS
EP3323084A4 (en) MULTI-SENSOR EVENT DETECTION AND MARKING SYSTEM
EP3402128A4 (en) ANOMALY DETECTION METHOD, ANOMALY DETECTION DEVICE, AND ANOMALY DETECTION SYSTEM
FR3047909B1 (en) EXTRACTION AND FILTRATION-COMPRESSION DEVICE
EP3321671A4 (en) RAIL INSPECTION DEVICE AND RAIL INSPECTION SYSTEM
EP3816654A4 (en) RADAR DEVICE AND RADAR SYSTEM
EP3603692A4 (en) LIGHT INTRODUCTION DEVICE AND STERILIZATION SYSTEM
EP3367108A4 (en) PROBE CARD AND CONTACT INSPECTION DEVICE
EP3258214A4 (en) OBJECT DETECTION DEVICE
EP3319037A4 (en) OBJECT DETECTION DEVICE
EP3263875A4 (en) DIAGNOSTIC DEVICE AND DIAGNOSTIC SYSTEM
EP3410107A4 (en) ANALYSIS DEVICE AND SEPARATION DEVICE
EP3364178A4 (en) HUMIDITY DETECTION ELEMENT, GAS DETECTION DEVICE, AND HINE INSPECTION SYSTEM
EP3440993A4 (en) ELECTRONIC EQUIPMENT AND ESTIMATION SYSTEM
EP3585049A4 (en) IMAGING SYSTEM AND IMAGING DEVICE
EP3809808C0 (en) INTELLIGENT DETECTION SYSTEM DEVICE
EP3470773A4 (en) THREE DIMENSIONAL IMAGE SYSTEM AND ELECTRONIC DEVICE
EP3474508A4 (en) METHOD AND DEVICE FOR SIGNAL DETECTION
FR3047074B1 (en) SPRAY DEVICE AND LEAK DETECTION MODULE
EP3256987A4 (en) DIGITAL FOOTPRINT DETECTION CIRCUIT AND ELECTRONIC DEVICE
EP3314589A4 (en) METHOD, SYSTEM AND ALERT DEVICE
EP3404358A4 (en) CARD MAKING DEVICE AND CARD MAKING METHOD

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20180905

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

A4 Supplementary search report drawn up and despatched

Effective date: 20190108

RIC1 Information provided on ipc code assigned before grant

Ipc: G01R 31/08 20060101ALN20190102BHEP

Ipc: H01L 21/66 20060101AFI20190102BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20210625

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

REG Reference to a national code

Ref document number: 602016082422

Country of ref document: DE

Ref country code: DE

Ref legal event code: R079

Free format text: PREVIOUS MAIN CLASS: G01R0031080000

Ipc: H01L0021660000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: G01R 31/08 20060101ALN20230331BHEP

Ipc: H01L 21/66 20060101AFI20230331BHEP

INTG Intention to grant announced

Effective date: 20230425

RAP3 Party data changed (applicant data changed or rights of an application transferred)

Owner name: HUAWEI TECHNOLOGIES CO., LTD.

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602016082422

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20230830

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1606541

Country of ref document: AT

Kind code of ref document: T

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231130

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231230

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231201

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240102

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602016082422

Country of ref document: DE

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20231031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231028

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231028

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231030

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231031

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

26N No opposition filed

Effective date: 20240603

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231028

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20240906

Year of fee payment: 9

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231028

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240904

Year of fee payment: 9