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EP3135083A1 - Method for protecting an electronic circuit carrier against environmental influences and circuit module - Google Patents

Method for protecting an electronic circuit carrier against environmental influences and circuit module

Info

Publication number
EP3135083A1
EP3135083A1 EP15713159.0A EP15713159A EP3135083A1 EP 3135083 A1 EP3135083 A1 EP 3135083A1 EP 15713159 A EP15713159 A EP 15713159A EP 3135083 A1 EP3135083 A1 EP 3135083A1
Authority
EP
European Patent Office
Prior art keywords
circuit carrier
electronic circuit
electronic
capsule material
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15713159.0A
Other languages
German (de)
French (fr)
Inventor
Hermann Josef Robin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Publication of EP3135083A1 publication Critical patent/EP3135083A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Definitions

  • the present invention relates to methods according to the features of patent claim 1 and an electronic circuit module according to the features of patent claim 5.
  • a housing To protect against environmental influences electronic circuit board are placed in a housing.
  • a housing element is e.g. made of aluminum, plastic or similar suitable material.
  • the housing is formed by means of a molding compound, wherein the circuit module is encapsulated in a molding process with the molding compound.
  • the electronic circuit in the housing From a housing for an electronic circuit u.a. required that it protects the electronic circuit from mechanical and climatic influences.
  • the electronic circuit in the housing to be protected from dust, foreign bodies and liquids.
  • the object of the invention is to provide a simple and inexpensive method with which an electronic circuit substrate can be protected at least in sections from environmental influences. Another object is to specify a corresponding electronic circuit module.
  • the invention is based on a method for protecting an electronic circuit substrate from environmental influences.
  • the electronic circuit carrier is in this case equipped with at least one electronic component, wherein the circuit carrier and the at least one electronic component are at least partially covered with a capsule material cohesively.
  • an association of electronic and in particular electronic components (for example diodes and transistors) to an arrangement on a printed circuit board will be understood by an electronic circuit carrier.
  • the encapsulation material may thus cover portions of the printed circuit board as well as portions of the electronic components disposed thereon. This ensures that no moisture gets from the outside to contact points of the circuit board or the electronic components.
  • the invention is characterized in that an electronic circuit carrier is provided in a first method step.
  • the capsule material is applied to the electronic circuit carrier by means of a 3D printing method.
  • the capsule material is conveniently a plastic, e.g. Epoxy resin, which is commonly used in a 3D printing process.
  • An advantage of this method is that a cost-effective envelope (encapsulation) of the electronic circuit substrate is possible. Furthermore, the method is flexible with respect to various arrangements of electronic components on electronic circuit carriers. The method is thus quickly and easily adaptable to the particular electronic circuit carrier to be processed.
  • the capsule material is in one embodiment of the invention.
  • the electronic circuit substrate is heated to the crosslinking temperature of the capsule matehal. Expediently, the heating takes place in one method step before the application of the capsule material to the circuit carrier.
  • the crosslinking temperatures of the different materials for a 3D printing process are known. In this case, the crosslinking temperature indicates the temperature at which the SD printing material, ie the capsule material, optimally bonds to the material, that is to say the electronic circuit carrier.
  • the electronic circuit substrate is cleaned by applying a washing process before applying the capsule material. This ensures that an optimal connection can be formed between capsule material and electronic circuit carrier.
  • the inventive method can be used in particular in the manufacture and processing of sensors and / or control devices for motor vehicles, in particular in the production of transmission control devices for motor vehicles.
  • Another aspect of the invention is based on an electronic circuit module having a housing, wherein the circuit module has an electronic circuit carrier, wherein the circuit carrier is equipped with at least one electronic component and wherein the circuit carrier and the at least one electronic component with a capsule material at least partially cohesively covered is, so that the capsule material forms the housing.
  • the invention is characterized in that the capsule material is a material which can be applied to the circuit carrier by means of a 3D printing method.
  • the capsule material covers the circuit carrier and the at least one electronic component on an upper and / or lower side of the circuit carrier in sections or completely, or the encapsulation material surrounds the circuit carrier completely the at least one electronic component.
  • the expansion of the capsule material over the Circuit carrier can thus be adjusted individually depending on the embodiment of the assembly of the circuit substrate.
  • the electronic circuit module may be a control device or a part of a control device in a motor vehicle, in particular a control device for a transmission control in a motor vehicle.
  • Fig. 2 shows the procedure according to the invention.
  • An electronic circuit carrier 1 of the circuit module 10 has an upper side 2 and a lower side 3.
  • the upper side 2 and the lower side 3 are equipped with electronic components 4.
  • a nozzle 5 of a 3D printer 6 is arranged.
  • This nozzle 5 is movable according to a known 3D printer 6 in all spatial direction (direction arrows).
  • the circuit carrier 1 it is also possible for the circuit carrier 1 to be arranged on a holding device 7 which can move the circuit carrier 1 in all spatial directions (directional arrows).
  • This holding device 7 can also be designed such that it serves as a heating plate for heating the circuit substrate 1 to the desired cross-linking temperature of the printing material of the 3D printer 6.
  • the printing material is located in a storage container 8 provided in the 3D printer
  • a layer of a capsule material 9 is exemplified.
  • This, applied to the circuit substrate 1 capsule material serves as a housing of the circuit substrate. 1
  • a further layer is applied, wherein the capsule material 9 from the nozzle 5 in the direction of the upper side 2 of the circuit substrate. 1 is applied. It is thus possible to apply the capsule material 9 locally and to adjust the height of the respective layer to the local conditions of the electronic circuit substrate 1, eg height of an electronic component 4 with respect to a surface of the circuit substrate 1.
  • a pretreatment or pre-tempering of the material to be printed 9 is then applied via the nozzle 5 droplets and / or layers on the circuit substrate 1 ,
  • a first step 100 an electronic circuit carrier is provided.
  • the circuit carrier is cleaned of dust, etc.
  • the cleaned circuit carrier is inserted into a 3D printer.
  • the temperature control of the circuit carrier to a desired temperature, advantageously to the crosslinking temperature of the pressure medium (capsule material).
  • the capsule material is prepared in the 3D printer, in particular melted and printed on the circuit carrier via a nozzle, in particular applied.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The invention relates to a method for protecting an electronic circuit carrier against environmental influences, said electronic circuit carrier (1) is fitted with at least one electronic component (4). The circuit carrier (1) and the at least one electronic component (4) are materially fitted with, at least in sections, a capsule material (9). Said invention is characterized in that the method comprises the following steps: an electronic circuit carrier (1) is provided (100); a capsule material (9) is applied (104) to the electronic circuit carrier (1) by means of a 3D printing method.

Description

Verfahren zum Schutz eines elektronischen Schaltungsträgers vor Umwelteinflüssen und Schaltungsmodul  Method for protecting an electronic circuit substrate against environmental influences and circuit module
Die vorliegende Erfindung bezieht sich auf Verfahren gemäß den Merkmalen des Patentanspruchs 1 und ein elektronisches Schaltungsmodul gemäß den Merkmalen des Patentanspruchs 5. The present invention relates to methods according to the features of patent claim 1 and an electronic circuit module according to the features of patent claim 5.
Im Stand der Technik ist insbesondere zur Bildung eines Kraftfahrzeug- Steuergerät bekannt, eine bestückte Leiterplatte mit einem oder mehreren Gehäuseelementen zu versehen, welche die Bauelemente auf einer der beiden Seiten der Leiterplatte umgeben. In the prior art, in particular for the formation of a motor vehicle control unit, it is known to provide a populated printed circuit board with one or more housing elements which surround the components on one of the two sides of the printed circuit board.
Zum Schutz vor Umwelteinflüssen werden elektronische Schaltungsträger in ein Gehäuse eingebracht. Ein derartiges Gehäuseelement ist z.B. aus Aluminium, Kunststoff oder ähnlichem geeigneten Material gebildet. Aus dem Stand der Technik ist auch bekannt, dass das Gehäuse mittels einer Moldmasse gebildet ist, wobei das Schaltungsmodul in einem Umspritzvorgang mit der Moldmasse umspritzt wird. Von einem Gehäuse für eine elektronische Schaltung wird u.a. gefordert, dass es die elektronische Schaltung vor mechanischen und klimatischen Einflüssen schützt. Darüber hinaus soll die elektronische Schaltung im Gehäuse vor Staub, Fremdkörpern und Flüssigkeiten geschützt werden. To protect against environmental influences electronic circuit board are placed in a housing. Such a housing element is e.g. made of aluminum, plastic or similar suitable material. From the prior art it is also known that the housing is formed by means of a molding compound, wherein the circuit module is encapsulated in a molding process with the molding compound. From a housing for an electronic circuit u.a. required that it protects the electronic circuit from mechanical and climatic influences. In addition, the electronic circuit in the housing to be protected from dust, foreign bodies and liquids.
Bei der Verwendung einer Moldmasse als Gehäuse ergeben sich Nachteile in Bezug auf Prozess- und Materialkosten. Darüber hinaus ist ein hoher Aufwand zu betreiben, um die Moldmasse optimal in ein entsprechendes Spritzwerkzeug einzubringen. When using a molding compound as a housing, there are disadvantages in terms of process and material costs. In addition, a high effort to operate to bring the molding compound optimally in a corresponding injection mold.
Aufgabe der Erfindung ist es, ein einfaches und kostengünstiges Verfahren anzugeben, mit welchem ein elektronischer Schaltungsträger zumindest abschnittsweise vor Umwelteinflüssen geschützt werden kann. Eine weitere Aufgabe besteht in der Angabe eines entsprechenden elektronischen Schaltungsmoduls. The object of the invention is to provide a simple and inexpensive method with which an electronic circuit substrate can be protected at least in sections from environmental influences. Another object is to specify a corresponding electronic circuit module.
Diese Aufgaben werden mit den Merkmalen der Patentansprüche 1 und 5 gelöst. Vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand von Unteransprüchen. Die Erfindung geht aus von einem Verfahren zum Schutz eines elektronischen Schaltungsträgers vor Umwelteinflüssen. Der elektronische Schaltungsträger ist hierbei mit wenigstens einem elektronischen Bauelement bestückt ist, wobei der Schaltungsträger und das wenigstens eine elektronische Bauelement zumindest abschnittsweise mit einem Kapselmaterial stoffschlüssig bedeckt sind. Im Weiteren wird unter einem elektronischen Schaltungsträger ein Zusammenschluss von elektrischen und insbesondere elektronischen Bauelementen (beispielsweise Dioden und Transistoren) zu einer Anordnung auf einer Leiterplatte verstanden. Das Kapselungsmaterial kann also Abschnitte der Leiterplatte als auch Abschnitte der darauf angeordneten elektronischen Bauelemente bedecken. Dadurch wird sichergestellt, dass keine Feuchtigkeit von Außen an Kontaktstellen der Leiterplatte bzw. der elektronischen Bauelemente gelangt. These objects are achieved with the features of claims 1 and 5. Advantageous embodiments of the invention are the subject of dependent claims. The invention is based on a method for protecting an electronic circuit substrate from environmental influences. The electronic circuit carrier is in this case equipped with at least one electronic component, wherein the circuit carrier and the at least one electronic component are at least partially covered with a capsule material cohesively. In the following, an association of electronic and in particular electronic components (for example diodes and transistors) to an arrangement on a printed circuit board will be understood by an electronic circuit carrier. The encapsulation material may thus cover portions of the printed circuit board as well as portions of the electronic components disposed thereon. This ensures that no moisture gets from the outside to contact points of the circuit board or the electronic components.
Die Erfindung zeichnet sich dadurch aus, dass in einem ersten Verfahrensschritt ein elektronischer Schaltungsträger bereitgestellt wird. In einem weiteren Verfahrensschritt wird das Kapselmaterial mittels eines 3D-Druckverfahres auf den elektronischen Schaltungsträger aufgebracht. The invention is characterized in that an electronic circuit carrier is provided in a first method step. In a further method step, the capsule material is applied to the electronic circuit carrier by means of a 3D printing method.
Bei dem Kapselmaterial handelt es sich zweckmäßig um einen Kunststoff, z.B. Epoxidharz, welcher üblicherweise bei einem 3D-Druckverfahren zum Einsatz kommt. The capsule material is conveniently a plastic, e.g. Epoxy resin, which is commonly used in a 3D printing process.
Ein Vorteil dieses Verfahrens ist, dass eine kostengünstige Umhüllung (Kapselung) des elektronischen Schaltungsträgers möglich ist. Ferner ist das Verfahren flexibel gegenüber verschiedenen Anordnungen von elektronischen Bauelementen auf elektronischen Schaltungsträgern. Das Verfahren ist somit schnell und einfach auf den jeweiligen zu bearbeitenden elektronischen Schaltungsträger adaptierbar. An advantage of this method is that a cost-effective envelope (encapsulation) of the electronic circuit substrate is possible. Furthermore, the method is flexible with respect to various arrangements of electronic components on electronic circuit carriers. The method is thus quickly and easily adaptable to the particular electronic circuit carrier to be processed.
In einer Ausführungsform der Erfindung wird das Kapselmaterial im In one embodiment of the invention, the capsule material is in
3D-Druckprozess aufgeschmolzen und tröpfchen- oder schichtweise auf den elektronischen Schaltungsträger aufgebracht. Damit ist es eine exakte und materialsparende Umhüllung des elektronischen Schaltungsträgers möglich. In einer Ausführungsform der Erfindung wird der elektronische Schaltungsträger auf die Vernetzungstemperatur des Kapselmatehals erwärmt. Zweckmäßig erfolgt die Erwärmung in einem Verfahrensschritt vor dem Aufbringen des Kapselmaterials auf den Schaltungsträger. Aus dem Stand der Technik sind die Vernetzungstemperaturen der unterschiedlichen Materialen für einen 3D-Druckprozess bekannt. Die Vernetzungstemperatur gibt dabei die Temperatur an, bei welcher sich das SD- Druckmaterial, also das Kapselmaterial, optimal mit dem Werkstoff, also dem elektronischen Schaltungsträger, verbindet. 3D printing process melted and droplets or layers applied to the electronic circuit board. Thus, it is an exact and material-saving enclosure of the electronic circuit board possible. In one embodiment of the invention, the electronic circuit substrate is heated to the crosslinking temperature of the capsule matehal. Expediently, the heating takes place in one method step before the application of the capsule material to the circuit carrier. From the prior art, the crosslinking temperatures of the different materials for a 3D printing process are known. In this case, the crosslinking temperature indicates the temperature at which the SD printing material, ie the capsule material, optimally bonds to the material, that is to say the electronic circuit carrier.
In einer Ausführungsform der Erfindung wird der elektronische Schaltungsträger vor Aufbringendes Kapselmaterials mittels eines Waschverfahrens gereinigt. Damit ist sichergestellt, dass zwischen Kapselmaterial und elektronischem Schaltungsträger eine optimale Verbindung ausgebildet werden kann. In one embodiment of the invention, the electronic circuit substrate is cleaned by applying a washing process before applying the capsule material. This ensures that an optimal connection can be formed between capsule material and electronic circuit carrier.
Das erfindungsgemäße Verfahren kann insbesondere zum Einsatz kommen bei der Herstellung und Bearbeitung von Sensoren und/oder Steuergeräten für Kraftfahrzeuge, insbesondere bei der Herstellung von Getriebesteuergeräten für Kraftfahrzeuge. The inventive method can be used in particular in the manufacture and processing of sensors and / or control devices for motor vehicles, in particular in the production of transmission control devices for motor vehicles.
Ein weiterer Aspekt der Erfindung geht aus von einem elektronischen Schaltungsmodul mit einem Gehäuse, wobei das Schaltungsmodul einen elektronische Schaltungsträger aufweist, wobei der Schaltungsträger mit wenigstens einem elektronischen Bauelement bestückt ist und wobei der Schaltungsträger und das wenigstens eine elektronische Bauelement mit einem Kapselmaterial zumindest abschnittsweise stoffschlüssig bedeckt ist, so dass das Kapselmaterial das Gehäuse bildet. Die Erfindung zeichnet sich dadurch aus, dass das Kapselmaterial ein Material ist, welches mittels eines 3D-Druckverfahrens auf den Schaltungsträger aufbringbar ist. Another aspect of the invention is based on an electronic circuit module having a housing, wherein the circuit module has an electronic circuit carrier, wherein the circuit carrier is equipped with at least one electronic component and wherein the circuit carrier and the at least one electronic component with a capsule material at least partially cohesively covered is, so that the capsule material forms the housing. The invention is characterized in that the capsule material is a material which can be applied to the circuit carrier by means of a 3D printing method.
In einer Ausführungsform der Erfindung bedeckt das Kapselmaterial den Schaltungsträger und das wenigstens einer elektronische Bauelement auf einer Ober- und/oder Unterseite des Schaltungsträger abschnittsweise oder vollständig oder das Kapselmaterial umgibt den Schaltungsträger das wenigstens einer elektronische Bauelement vollständig. Die Ausdehnung des Kapselmaterials über den Schaltungsträger kann somit je nach Ausführungsform der Bestückung des Schaltungsträgers individuell angepasst werden. In one embodiment of the invention, the capsule material covers the circuit carrier and the at least one electronic component on an upper and / or lower side of the circuit carrier in sections or completely, or the encapsulation material surrounds the circuit carrier completely the at least one electronic component. The expansion of the capsule material over the Circuit carrier can thus be adjusted individually depending on the embodiment of the assembly of the circuit substrate.
Das elektronische Schaltungsmodul kann ein Steuergerät oder ein Teil eines Steuergeräts in einem Kraftfahrzeug sein, insbesondere ein Steuergerät für eine Getriebesteuerung in einem Kraftfahrzeug. The electronic circuit module may be a control device or a part of a control device in a motor vehicle, in particular a control device for a transmission control in a motor vehicle.
Die Erfindung wird im Weiteren anhand von Figuren näher erläutert. Es zeigen The invention will be explained in more detail with reference to figures. Show it
Fig .1 einen beispielhaften Aufbau zur Ausführung eines erfindungsgemäßen SD- Druckverfahrens, 1 shows an exemplary structure for carrying out an SD printing method according to the invention,
Fig. 2 den Verfahrensablauf gemäß der Erfindung. Fig. 2 shows the procedure according to the invention.
Fig. 1 zeigt einen beispielhaften Aufbau zur Ausführung eines erfindungsgemäßen 3D-Druckverfahrens zur Herstellung eines Schaltungsmoduls 10. Ein elektronischer Schaltungsträger 1 des Schaltungsmoduls 10 weist eine Oberseite 2 und eine Unterseite 3 auf. Die Oberseite 2 und die Unterseite 3 sind mit elektronischen Bauteilen 4 bestückt. Über dem elektronischen Schaltungsträger 1 ist eine Düse 5 eines 3D-Druckers 6 angeordnet. Diese Düse 5 ist entsprechend eines bekannten 3D-Druckers 6 in sämtliche Raumrichtung (Richtungspfeile) bewegbar. Alternativ o- der zusätzlich ist es auch möglich, dass der Schaltungsträger 1 auf einer Haltevorrichtung 7 angeordnet ist, welche den Schaltungsträger 1 in sämtliche Raumrichtung (Richtungspfeile) bewegen kann. Diese Haltevorrichtung 7 kann zudem derart ausgebildet sein, dass sie als Wärmeplatte zur Aufwärmung des Schaltungsträgers 1 auf die gewünschte Vernetzungstemperatur des Druckmaterials des 3D-Drucker 6 dient. Das Druckmaterial befindet sich in einem im 3D-Drucker vorgesehenen Bevorratungsbehälter 8 1 shows an exemplary structure for carrying out a 3D printing method according to the invention for producing a circuit module 10. An electronic circuit carrier 1 of the circuit module 10 has an upper side 2 and a lower side 3. The upper side 2 and the lower side 3 are equipped with electronic components 4. About the electronic circuit substrate 1, a nozzle 5 of a 3D printer 6 is arranged. This nozzle 5 is movable according to a known 3D printer 6 in all spatial direction (direction arrows). Alternatively or additionally, it is also possible for the circuit carrier 1 to be arranged on a holding device 7 which can move the circuit carrier 1 in all spatial directions (directional arrows). This holding device 7 can also be designed such that it serves as a heating plate for heating the circuit substrate 1 to the desired cross-linking temperature of the printing material of the 3D printer 6. The printing material is located in a storage container 8 provided in the 3D printer
Auf der Oberseite 2 des Schaltungsträgers 1 ist beispielhaft eine Schicht eines Kapselmaterials 9 dargestellt. Dieses, auf den Schaltungsträger 1 aufgebrachte Kapselmaterial dient als Gehäuse des Schaltungsträgers 1 . Es ist zu erkennen, dass im Bereich des elektronischen Bauteils 4 auf der Oberseite 2 des Schaltungsträgers 1 mittels des 3D-Druckverfahrens eine weitere Schicht aufgetragen ist, wobei das Kapselmaterial 9 aus der Düse 5 in Richtung der Oberseite 2 des Schaltungsträgers 1 ausgebracht wird. Es ist somit möglich, das Kapselmaterial 9 lokal aufzutragen und die Höhe der jeweiligen Schicht an die lokalen Gegebenheiten des elektronischen Schaltungsträgers 1 , z.B. Höhe eines elektronischen Bauteils 4 gegenüber einer Oberfläche des Schaltungsträgers 1 anzupassen. On the upper side 2 of the circuit substrate 1, a layer of a capsule material 9 is exemplified. This, applied to the circuit substrate 1 capsule material serves as a housing of the circuit substrate. 1 It can be seen that in the region of the electronic component 4 on the upper side 2 of the circuit substrate 1 by means of the 3D printing process, a further layer is applied, wherein the capsule material 9 from the nozzle 5 in the direction of the upper side 2 of the circuit substrate. 1 is applied. It is thus possible to apply the capsule material 9 locally and to adjust the height of the respective layer to the local conditions of the electronic circuit substrate 1, eg height of an electronic component 4 with respect to a surface of the circuit substrate 1.
In der Düse 5 des 3D-Druckers 6 erfolgt gemäß dem Stand der Technik zum 3D-Drucken eine Vorbehandlung bzw. Vortemperierung des zu druckenden Materials 9. Dieses Material 9 wird anschließend über die Düse 5 tröpfchen- und/oder schichtweise auf den Schaltungsträger 1 aufgebracht. In the nozzle 5 of the 3D printer 6 takes place according to the prior art for 3D printing, a pretreatment or pre-tempering of the material to be printed 9. This material 9 is then applied via the nozzle 5 droplets and / or layers on the circuit substrate 1 ,
Fig.2 zeigt einen beispielhaften Ablauf eines erfindungsgemäßen Verfahrens. In einem ersten Schritt 100 wird ein elektronischer Schaltungsträger bereitgestellt. Anschließend wird in einem weiteren Schritt 101 der Schaltungsträger von Staub etc. gereinigt. In einem weiteren Verfahrensschritt 102 wird der gereinigte Schaltungsträger in einen 3D-Drucker eingelegt. Anschließend erfolgt in einem weiteren Schritt 103 die Temperierung des Schaltungsträgers auf eine gewünschte Temperatur, zweckmäßig auf die Vernetzungstemperatur des Druckmediums (Kapselmaterial). In dem nachfolgend beginnenden Druckvorgang wird in einem Schritt 104 das Kapselmaterial in dem 3D-Drucker vorbereitet, insbesondere aufgeschmolzen und über eine Düse auf den Schaltungsträger gedruckt, insbesondere aufgebracht. 2 shows an exemplary sequence of a method according to the invention. In a first step 100, an electronic circuit carrier is provided. Subsequently, in a further step 101, the circuit carrier is cleaned of dust, etc. In a further method step 102, the cleaned circuit carrier is inserted into a 3D printer. Thereafter, in a further step 103, the temperature control of the circuit carrier to a desired temperature, advantageously to the crosslinking temperature of the pressure medium (capsule material). In the subsequent printing process, in a step 104, the capsule material is prepared in the 3D printer, in particular melted and printed on the circuit carrier via a nozzle, in particular applied.
Bezugszeichen reference numeral
Schaltungsträger circuit support
Oberseite  top
Unterseite  bottom
Elektronisches Bauelement  Electronic component
Düse  jet
3D-Drucker 3D printer
Haltevorrichtung holder
Bevorratungsbehälter storage container
Kapselmaterial capsule material
Schaltungsmodul circuit module
Bereitstellen Schaltungsträger Provide circuit carrier
Reinigung Schaltungsträger Cleaning circuit carrier
Einlegen des Schaltungsträgers in 3D-Drucker Temperierung Schaltungsträger Inserting the circuit carrier in 3D printer Temperature control circuit carrier
Bedrucken Schaltungsträger Printing circuit carrier

Claims

Patentansprüche claims
1 . Verfahren zum Schutz eines elektronischen Schaltungsträgers vor Umwelteinflüssen, wobei der elektronische Schaltungsträger (1 ) mit wenigstens einem elektronischen Bauelement (4) bestückt ist, wobei der Schaltungsträger (1 ) und das wenigstens eine elektronische Bauelement (4) zumindest abschnittsweise mit einem Kapselmaterial (9) stoffschlüssig bedeckt sind, dadurch gekennzeichnet, dass das Verfahren folgende Schritte umfasst: 1 . Method for protecting an electronic circuit substrate against environmental influences, wherein the electronic circuit carrier (1) is equipped with at least one electronic component (4), wherein the circuit carrier (1) and the at least one electronic component (4) at least partially with a capsule material (9) are cohesively covered, characterized in that the method comprises the following steps:
- Bereitstellen (100) eines elektronischen Schaltungsträgers (1 ),  Providing (100) an electronic circuit carrier (1),
- Aufbringen (104) des Kapselmaterials (9) auf den elektronischen Schaltungsträger (1 ) mittels eines 3D-Druckverfahrens.  - Applying (104) of the capsule material (9) on the electronic circuit substrate (1) by means of a 3D printing process.
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass das Kapselmaterial (9) in dem 3D-Druckverfahren aufgeschmolzen und tröpfchen- oder schichtweise auf den elektronischen Schaltungsträger (1 ) aufgebracht wird. 2. The method according to claim 1, characterized in that the capsule material (9) is melted in the 3D printing process and droplet or layer by layer on the electronic circuit substrate (1) is applied.
3. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass der elektronische Schaltungsträger (1 ) auf die Vernetzungstemperatur des Kapselmaterials (9) erwärmt (103) wird. 3. The method according to any one of the preceding claims, characterized in that the electronic circuit substrate (1) to the crosslinking temperature of the capsule material (9) is heated (103).
4. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass der elektronische Schaltungsträger (1 ) vor Aufbringen (104) des Kapselmaterials mittels eines Waschverfahrens (101 ) gereinigt wird. 4. The method according to any one of the preceding claims, characterized in that the electronic circuit substrate (1) before application (104) of the capsule material by means of a washing process (101) is cleaned.
5. Elektronisches Schaltungsmodul (10) mit einem Gehäuse, wobei das Schaltungsmodul (10) einen elektronische Schaltungsträger (1 ) aufweist, wobei der Schaltungsträger (1 ) mit wenigstens einem elektronischen Bauelement (4) bestückt ist und wobei der Schaltungsträger (1 ) und das wenigstens eine elektronische Bauelement (4) mit einem Kapselmaterial (9) zumindest abschnittsweise stoffschlüssig bedeckt ist, so dass das Kapselmaterial (9) das Gehäuse bildet, dadurch gekennzeichnet, dass das Kapselmaterial (9) ein Material ist, welches mittels eines SD- Druckverfahrens auf den Schaltungsträger (1 ) aufbringbar ist. 5. Electronic circuit module (10) with a housing, wherein the circuit module (10) comprises an electronic circuit carrier (1), wherein the circuit carrier (1) is equipped with at least one electronic component (4) and wherein the circuit carrier (1) and the at least one electronic component (4) with a capsule material (9) is at least partially cohesively covered, so that the capsule material (9) forms the housing, characterized in that the capsule material (9) is a material which by means of an SD printing process on the circuit carrier (1) can be applied.
6. Elektronisches Schaltungsmodul nach Anspruch 5, dadurch gekennzeichnet, dass das Kapselmaterial (9) den Schaltungsträger (1 ) und das wenigstens einer elektronische Bauelement (4) auf einer Ober- und/oder Unterseite (2, 3) des Schaltungsträger (1 ) abschnittsweise oder vollständig bedeckt oder dass das Kapselmaterial (9) den Schaltungsträger (1 ) das wenigstens einer elektronische Bauelement (4) vollständig umgibt. 6. Electronic circuit module according to claim 5, characterized in that the capsule material (9) the circuit carrier (1) and the at least one electronic component (4) on an upper and / or lower side (2, 3) of the circuit carrier (1) sections or completely covered or that the capsule material (9) completely surrounds the circuit carrier (1), the at least one electronic component (4).
EP15713159.0A 2014-04-23 2015-03-25 Method for protecting an electronic circuit carrier against environmental influences and circuit module Withdrawn EP3135083A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014207633.1A DE102014207633A1 (en) 2014-04-23 2014-04-23 Method for protecting an electronic circuit substrate against environmental influences and circuit module
PCT/EP2015/056331 WO2015161971A1 (en) 2014-04-23 2015-03-25 Method for protecting an electronic circuit carrier against environmental influences and circuit module

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EP3135083A1 true EP3135083A1 (en) 2017-03-01

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EP (1) EP3135083A1 (en)
CN (1) CN106233823A (en)
DE (1) DE102014207633A1 (en)
WO (1) WO2015161971A1 (en)

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DE102017123307A1 (en) * 2017-10-06 2019-04-11 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with at least one part formed as a three-dimensional printed structure
DE102018125216B3 (en) * 2018-10-11 2020-02-06 Neotech AMT GmbH Process for preparing the automated manufacture of an electronic component, process for the automated manufacture and / or automated post-processing of an electronic component, computing device, computer program and electronically readable data carrier
KR102663222B1 (en) 2019-03-06 2024-05-07 삼성전자주식회사 Display apparatus and manufacturing method thereof

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US10064279B2 (en) 2018-08-28
US20170042031A1 (en) 2017-02-09
CN106233823A (en) 2016-12-14
DE102014207633A1 (en) 2015-10-29
WO2015161971A1 (en) 2015-10-29

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