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EP3089573A4 - ELECTRONIC COMPONENT MOUNTING MACHINE - Google Patents

ELECTRONIC COMPONENT MOUNTING MACHINE

Info

Publication number
EP3089573A4
EP3089573A4 EP13900566.4A EP13900566A EP3089573A4 EP 3089573 A4 EP3089573 A4 EP 3089573A4 EP 13900566 A EP13900566 A EP 13900566A EP 3089573 A4 EP3089573 A4 EP 3089573A4
Authority
EP
European Patent Office
Prior art keywords
electronic component
component mounting
mounting machine
machine
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13900566.4A
Other languages
German (de)
French (fr)
Other versions
EP3089573B1 (en
EP3089573A1 (en
Inventor
Yoshinori Nagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of EP3089573A1 publication Critical patent/EP3089573A1/en
Publication of EP3089573A4 publication Critical patent/EP3089573A4/en
Application granted granted Critical
Publication of EP3089573B1 publication Critical patent/EP3089573B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/101—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11—Vats or other containers for liquids or other fluent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67D—DISPENSING, DELIVERING OR TRANSFERRING LIQUIDS, NOT OTHERWISE PROVIDED FOR
    • B67D1/00—Apparatus or devices for dispensing beverages on draught
    • B67D1/08—Details
    • B67D1/0871—Level gauges for beverage storage containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
EP13900566.4A 2013-12-23 2013-12-23 Electronic component mounting machine Active EP3089573B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/084387 WO2015097731A1 (en) 2013-12-23 2013-12-23 Electronic component mounting machine

Publications (3)

Publication Number Publication Date
EP3089573A1 EP3089573A1 (en) 2016-11-02
EP3089573A4 true EP3089573A4 (en) 2016-12-07
EP3089573B1 EP3089573B1 (en) 2018-03-07

Family

ID=53477675

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13900566.4A Active EP3089573B1 (en) 2013-12-23 2013-12-23 Electronic component mounting machine

Country Status (5)

Country Link
US (1) US9961818B2 (en)
EP (1) EP3089573B1 (en)
JP (1) JP6280931B2 (en)
CN (1) CN105830552B (en)
WO (1) WO2015097731A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3383157B1 (en) * 2015-11-25 2021-02-24 Fuji Corporation Tool searching device
EP3525564B1 (en) * 2016-10-05 2023-12-27 Fuji Corporation Component mounting machine
EP3606302B1 (en) * 2017-03-31 2024-04-24 Fuji Corporation Electronic component mounting machine and mounting method
DE102017131322B4 (en) * 2017-12-27 2019-07-04 Asm Assembly Systems Gmbh & Co. Kg Use of equippable marker blocks for a gradual loading of a carrier with components
CN113906834B (en) 2019-05-01 2024-09-13 Io技术集团公司 Method for electrically connecting chip and top connector using 3D printing
JP7535737B2 (en) * 2019-11-18 2024-08-19 パナソニックＩｐマネジメント株式会社 Component mounting system, mounting head, and component mounting method
US11446750B2 (en) 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
US11622451B2 (en) 2020-02-26 2023-04-04 Io Tech Group Ltd. Systems and methods for solder paste printing on components
US11497124B2 (en) 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
US11691332B2 (en) 2020-08-05 2023-07-04 Io Tech Group Ltd. Systems and methods for 3D printing with vacuum assisted laser printing machine
JP7572458B2 (en) 2020-12-24 2024-10-23 株式会社Fuji Substrate working machine and method for measuring depth of viscous body

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1909652A (en) * 1931-06-01 1933-05-16 Nat Tile Company Glazing thickness gauge
US4169319A (en) * 1978-09-06 1979-10-02 Paul N. Gardner Company Methods and apparatus for measuring the thickness of wet films
JP2008010525A (en) * 2006-06-28 2008-01-17 Fuji Mach Mfg Co Ltd Flux transfer device
US20080163481A1 (en) * 2003-03-20 2008-07-10 Satoshi Shida Component mounting apparatus and component mounting method
JP2009016650A (en) * 2007-07-06 2009-01-22 Elpida Memory Inc Flux transfer device and electronic component mounting method
JP2010165702A (en) * 2009-01-13 2010-07-29 Panasonic Corp Electronic component mounting device and electronic component mounting method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4345371A (en) * 1979-03-14 1982-08-24 Sony Corporation Method and apparatus for manufacturing hybrid integrated circuits
US4869418A (en) * 1986-06-11 1989-09-26 International Business Machines Corporation Solder leveling method and apparatus
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
JP2601075B2 (en) * 1991-10-21 1997-04-16 株式会社日立製作所 Analysis method and analyzer using test piece
JPH1034456A (en) * 1996-07-24 1998-02-10 Fuji Mach Mfg Co Ltd Electronic parts feeder
JP4494547B2 (en) * 1999-03-10 2010-06-30 Ｊｕｋｉ株式会社 Electronic component detector
JP4187873B2 (en) * 1999-05-27 2008-11-26 日立ビアメカニクス株式会社 Flux supply device for conductive ball mounting device
US6546797B2 (en) * 2000-08-24 2003-04-15 Mlho, Inc. Absolute position measure with multi-beam optical encoding
US6672156B1 (en) * 2001-08-08 2004-01-06 Mlno, Inc. Absolute liquid level sensor with refractive encoding
US20030077396A1 (en) * 2001-10-23 2003-04-24 Lecompte Robert S. Dip coating system
JP3899902B2 (en) * 2001-11-07 2007-03-28 松下電器産業株式会社 Paste supply device
JP2005150340A (en) * 2003-11-14 2005-06-09 Hitachi Ltd Etching condition setting method and apparatus
US20070084283A1 (en) * 2005-10-18 2007-04-19 Bj Services Company Safety tank level gauging system
JP4816194B2 (en) * 2006-03-29 2011-11-16 パナソニック株式会社 Electronic component mounting system, electronic component mounting apparatus, and electronic component mounting method
EP1921427B1 (en) * 2006-11-07 2019-02-27 LG Electronics Inc. Automatic liquid dispensers with liquid level detector
JP4783717B2 (en) 2006-11-24 2011-09-28 Ｊｕｋｉ株式会社 Flux supply / recovery device for electronic component mounting equipment
JP5610915B2 (en) * 2010-08-17 2014-10-22 富士機械製造株式会社 Dip flux unit
JP5786138B2 (en) * 2011-09-27 2015-09-30 パナソニックＩｐマネジメント株式会社 Electronic component mounting apparatus and paste transfer method in electronic component mounting apparatus
KR102034820B1 (en) * 2012-11-30 2019-11-08 삼성전자주식회사 Apparatus for mounting semiconductor chips on a circuit board and method of mounting semiconductor chips on a circuit using the same
US8944001B2 (en) * 2013-02-18 2015-02-03 Nordson Corporation Automated position locator for a height sensor in a dispensing system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1909652A (en) * 1931-06-01 1933-05-16 Nat Tile Company Glazing thickness gauge
US4169319A (en) * 1978-09-06 1979-10-02 Paul N. Gardner Company Methods and apparatus for measuring the thickness of wet films
US20080163481A1 (en) * 2003-03-20 2008-07-10 Satoshi Shida Component mounting apparatus and component mounting method
JP2008010525A (en) * 2006-06-28 2008-01-17 Fuji Mach Mfg Co Ltd Flux transfer device
JP2009016650A (en) * 2007-07-06 2009-01-22 Elpida Memory Inc Flux transfer device and electronic component mounting method
JP2010165702A (en) * 2009-01-13 2010-07-29 Panasonic Corp Electronic component mounting device and electronic component mounting method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015097731A1 *

Also Published As

Publication number Publication date
EP3089573B1 (en) 2018-03-07
CN105830552A (en) 2016-08-03
CN105830552B (en) 2019-01-18
US9961818B2 (en) 2018-05-01
JPWO2015097731A1 (en) 2017-03-23
US20160330882A1 (en) 2016-11-10
WO2015097731A1 (en) 2015-07-02
EP3089573A1 (en) 2016-11-02
JP6280931B2 (en) 2018-02-14

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