EP3085108B1 - Accoustic enclosure comprising a non heat-conducting external wall, an electrodynamic loudspeaker and an electronic control circuit - Google Patents
Accoustic enclosure comprising a non heat-conducting external wall, an electrodynamic loudspeaker and an electronic control circuit Download PDFInfo
- Publication number
- EP3085108B1 EP3085108B1 EP14821123.8A EP14821123A EP3085108B1 EP 3085108 B1 EP3085108 B1 EP 3085108B1 EP 14821123 A EP14821123 A EP 14821123A EP 3085108 B1 EP3085108 B1 EP 3085108B1
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- EP
- European Patent Office
- Prior art keywords
- loudspeaker
- acoustic enclosure
- electronic circuit
- motor
- heat
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/022—Cooling arrangements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic onlyÂ
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
- H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
- H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/007—Protection circuits for transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
- H04R2201/028—Structural combinations of loudspeakers with built-in power amplifiers, e.g. in the same acoustic enclosure
Definitions
- Such a device is usually described as an "active loudspeaker".
- these elements are enclosed in a substantially sealed box vis-Ă -vis the air outside the speaker.
- both the electronic circuit and the speaker (s) give off heat when the loudspeaker is in operation.
- the electronic circuit typically emits between 40 watts and 300 watts depending on the level of use.
- the power released is rather from 20 W to 50 W.
- the speaker (s) typically emit up to 100 W of heat per 1000 W of peak power received.
- the use of the loudspeaker is generally for a relatively long period.
- the electronic circuit may be damaged if the temperature of its components exceeds eg 65 ° C.
- the coil of a loudspeaker may be damaged if its temperature exceeds for example 200 ° C.
- the neodymium magnets generally present in the loudspeaker motor may experience permanent power loss if their temperature exceeds about 80 ° C.
- acoustic enclosure whose outer walls are heat conducting.
- the outer walls are for example metal.
- these walls are thermally insulated from the loudspeakers by a seal providing acoustic sealing.
- the cooling time constants of the loudspeakers are high, of the order of several hours.
- vent in English: bass reflex
- bass reflex acoustic speakers
- An object of the invention is therefore to provide an acoustic enclosure as described above and which is not limited or less limited in power due to the heating of its internal components.
- the subject of the invention is an acoustic enclosure according to claim 1.
- an acoustic enclosure 1 is described according to a first embodiment of the invention.
- the figure 1 is a section along a plane P which is for example horizontal when the acoustic chamber 1 is placed on a horizontal surface (not shown) or fixed on a wall (not shown).
- the acoustic enclosure 1 has a generally parallelepipedal general shape.
- the acoustic chamber 1 has another general shape, preferably substantially spherical.
- the loudspeaker 1 comprises a loudspeaker 5, an electronic control circuit 10 for the loudspeaker 5, a heat-conducting member 15, and an external wall 20 that is non-conductive of heat and at least partially defining a box. 25 of the loudspeaker.
- the acoustic chamber 1 further comprises a seal 30 interposed between the loudspeaker 5 and the outer wall 20, a seal 32 interposed between the outer wall 20 and a first face 34 of the member 15, and a seal 36 interposed between the outer wall 20 and a second face 38 of the member 15, opposite the first face 34 in a transverse direction T of the acoustic enclosure 1.
- the acoustic enclosure 1 also comprises a first thermal bridge 40 connecting the speaker 5 and the member 15, and a second thermal bridge 42 connecting the electronic circuit 10 and the member 15.
- the loudspeaker 5 comprises a frame 44, a diaphragm 46, and a motor 48.
- the motor 48 is able to release heat when the loudspeaker 1 is in operation.
- the motor 48 comprises a coil defining an axis D of the loudspeaker 5, for example substantially parallel to the transverse direction T.
- the motor 48 is fixed on the member 15 via the first thermal bridge 40.
- thermal bridge between two parts means one or more elements connecting the two parts and adapted (s) to conduct heat in one direction or the other between the two parts.
- the elements of the thermal bridge are adapted so that the thermal resistance between the two parts is less than or equal to 5 ° C / W, preferably less than or equal to 3 ° C / W, even more preferably less than or equal to at 1 ° C / W.
- the main material constituting the thermal bridge advantageously has a thermal conductivity greater than or equal to 1 W / m.K.
- chassis 44 or the motor 48 are fixed directly on or are in direct contact with the member 15.
- the frame 44 has a peripheral portion 50 with respect to the axis D and fixed on the outer wall 20, advantageously all around the periphery of the speaker 5 about the axis D.
- the membrane 46 is substantially flat, or substantially forms a sphere portion.
- the membrane 46 is suspended from the frame 44, advantageously by the seal 30.
- the electronic circuit 10 comprises for example a printed circuit 52 fixed on the second thermal bridge 42, and electronic components 54 mounted on the printed circuit 52.
- the printed circuit 52 is for example substantially parallel to a connecting portion 56 of the member 15.
- the electronic components 54 are able to release heat when the loudspeaker 1 is in operation.
- the member 15 extends inside and across the box 25, for example substantially perpendicular to the axis D of the speaker 5.
- the member 15 comprises the connecting portion 56, a radiator 58 disposed in an opening 60 of the box 25, and a third thermal bridge 62 connecting the connecting portion and the radiator.
- the third thermal bridge 62 is replaced by a frank contact between the connecting portion 56 and the radiator 58, or by a paste or a grease.
- the connecting portion 56 has for example a generally planar shape.
- the connecting portion 56 is for example substantially perpendicular to the axis D of the speaker 5.
- the connecting portion 56 is for example metal, preferably aluminum, magnesium, or steel.
- the connecting portion 56 is for example a single piece.
- the member 15 is in one piece.
- the radiator 58 extends in a plane substantially perpendicular to the connecting portion 56.
- the radiator 58 advantageously comprises fins 64 projecting outwardly of the acoustic chamber 1.
- the radiator 58 defines a clean exchange surface 66 to be traversed by a heat flow 68 flowing in the member 15 from the motor 48 and the electronic circuit 10 when the acoustic chamber 1 is in operation.
- conductor is meant that the member 15 has, at least on the path of the heat flux 68, a conductivity â greater than or equal to 1 W / m.K.
- the outer wall 20 comprises two half-shells 70, 72.
- non-heat conductor or âthermally insulatingâ is meant a material having a thermal conductivity â strictly less than 1 W / m.K.
- the half-shell 70 is fixed on the peripheral portion 50 of the loudspeaker 5 and on the first face 34 of the member 15.
- the half-shell 72 is fixed on the second 38 of the member 15.
- the seals 30, 32, the loudspeaker 5, the member 15 and the outer wall 20 define a first internal volume 74 that is substantially sealed with respect to 76.
- the half-shell 72 and the member 15 define a second internal volume 78 that is substantially airtight with respect to the outside air 76.
- the first internal volume 74 houses the motor 48.
- the second volume 78 houses the electronic circuit 10.
- the member 15 puts in thermal communication the motor 48, the electronic circuit 10 and the outside air 76.
- the motor 48 and the electronic circuit 10 give off heat.
- the heat released by the motor 48 passes into the member 15 via the first thermal bridge 40.
- the heat released in the electronic circuit 10 passes into the member 15 via the second thermal bridge 42. It is created in the member 15 the flow of heat 68 from the motor 48 and the electronic circuit 10.
- the heat flow 10 passes through the third thermal bridge 62 and arrives in the radiator 58.
- the heat flux 10 then passes through the exchange surface 66 to dissipate in the outside air 76.
- the member 15 it is possible to extract a large fraction of the heat that is released in the motor 48 and in the electronic circuit 10, and to evacuate it outside the the acoustic enclosure 1. Thus, it is possible to prevent overheating of the motor 48 or the electronic circuit 10.
- the loudspeaker 5 is heated by the electronic circuit 10.
- the heat generated by the electronic circuit 10 is driven by the second thermal bridge 42, member 15 and the first thermal bridge 40 to the motor 48.
- the motor 48 does not release, or very little heat as the sound volume of the speaker 1 remains low. Indeed, the power consumed 'at rest' by the electronic circuit is not zero, so for the void or low noise volumes, most of the heat production is performed at the electronic circuit.
- the member 15 it is possible to make the box 25 in a material other than metal, while properly discharging the heat released by the motor 48 and the electronic circuit 10.
- the member 15 constitutes an internal reinforcement of the acoustic enclosure 1, on which the external wall 20 is fixed in a substantially watertight manner.
- the acoustic enclosure 100 is similar to the acoustic enclosure 1 shown in FIG. figure 1 . Similar elements have the same numerical references on figures 2 and 3 . Only the differences between the loudspeaker 100 and the loudspeaker 1 will be described in detail below.
- the loudspeaker 100 comprises a second loudspeaker 105, and a second electronic circuit 110 for controlling the second loudspeaker 105.
- the second speaker 105 is advantageously structurally analogous to the loudspeaker 5.
- the second speaker 105 comprises in particular a motor 148 able to release heat when the loudspeaker 100 is in operation.
- the second speaker 105 is for example disposed on the other side of the member 15 with respect to the loudspeaker 5.
- the motor 148 is connected to the member 15 by a fourth thermal bridge 140.
- the electronic circuit 10 is located in the internal volume 74.
- the electronic circuit 10 is connected to the first face 34 of the member 15 by the second thermal bridge 42.
- the second electronic circuit 110 is located in the second internal volume 78.
- the second electronic circuit 110 is connected to the member 15 by a fifth thermal bridge 142.
- the fifth thermal bridge 142 is for example fixed on the second face 38 of the member 15.
- the member 15 occupies a substantially median position in the box 25 in the transverse direction T.
- the first electronic circuit 10 and the second electronic circuit 110 are for example connected by cables 112.
- the member 15 of the acoustic chamber 100 is for example devoid of a radiator extending in an opening defined by the box 25.
- the member 15 internally defines a passage 114 through the acoustic chamber 100.
- the passage 114 comprises at least one inlet 116 for the outside air 76, and an outlet 118.
- the passage 114 is adapted to allow an outside air flow from the inlet 116 to the outlet 118.
- the member 15 advantageously comprises fins 120 projecting into the passage 114.
- the exchange surface 66 defined by the member 15 delimits the passage 114.
- the input 116 is below the output 118.
- the passage 114 is adapted to function substantially as a chimney.
- the operation of the acoustic chamber 100 is similar to that of the acoustic chamber 1, except that the heat flow 68 from the motor 48 and the electronic circuit 10 passes through the exchange surface 66 to be carried away. by the air circulation F.
- a heat flux 168 from the motor 148 and the second electronic circuit 110 passes through the exchange surface 66 to pass into the air flow F.
- the heat dissipation mode of the acoustic enclosure 100 (chimney) and the heat dissipation mode of the acoustic enclosure 1 (radiator) are combined.
- the acoustic enclosure 100 comprises a fan (not shown) located in the passage 114 and adapted to create a forced circulation of outside air in the passage 144.
- Acoustic speaker 200 is similar to loudspeaker 1 shown in FIG. figure 1 . Similar elements bear identical numerical references. Only the differences between the loudspeaker 200 and the loudspeaker 1 represented on the figure 1 will be described in detail below.
- the member 15 comprises a connecting portion 156 lying on the surface of the acoustic chamber 200 so as to partially form the box 25.
- the electronic circuit 10 is located in the internal volume 74.
- the second thermal bridge 42 is fixed on the first face 34 of the member 15.
- the exchange surface 66 is defined by the radiator 58 and the second face 38 of the connecting portion 156.
- part of the heat flow 68 coming from the motor 48 and the electronic circuit 10 is evacuated in the outside air 76 by the second face 38 of the member 15.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Description
La prĂŠsente invention concerne une enceinte acoustique comprenant :
- une paroi externe non conductrice de la chaleur et dĂŠfinissant au moins en partie un caisson de l'enceinte acoustique,
- au moins un haut-parleur ĂŠlectrodynamique comportant un moteur, le haut-parleur ayant une portion pĂŠriphĂŠrique fixĂŠe sur la paroi externe, et
- au moins un circuit ĂŠlectronique de commande du haut-parleur.
- an outer wall which is non-conductive of heat and which at least partly defines a box of the acoustic enclosure,
- at least one electrodynamic loudspeaker comprising a motor, the loudspeaker having a peripheral portion fixed on the outer wall, and
- at least one electronic control circuit of the loudspeaker.
Un tel dispositif est habituellement dÊcrit sous le terme d'  enceinte acoustique active . En gÊnÊral, ces ÊlÊments sont enfermÊs dans un caisson sensiblement Êtanche vis-à -vis de l'air extÊrieur à l'enceinte acoustique. Or, tant le circuit Êlectronique que le ou les haut-parleur(s) dÊgagent de la chaleur lorsque l'enceinte acoustique est en fonctionnement. Par exemple, le circuit Êlectronique dÊgage typiquement entre 40 watts et 300 watts en fonction du niveau d'utilisation. En utilisant des technologies d'alimentation et d'amplification à très haut rendement, la puissance dÊgagÊe est plutôt de 20 W à 50 W.Such a device is usually described as an "active loudspeaker". In general, these elements are enclosed in a substantially sealed box vis-à -vis the air outside the speaker. However, both the electronic circuit and the speaker (s) give off heat when the loudspeaker is in operation. For example, the electronic circuit typically emits between 40 watts and 300 watts depending on the level of use. By using power and amplification technologies with very high efficiency, the power released is rather from 20 W to 50 W.
Le ou les haut-parleur(s) dÊgagent typiquement jusqu'à 100 W de chaleur, pour 1000 W de puissance Êlectrique reçue en crête. En outre, l'utilisation de l'enceinte acoustique se fait en gÊnÊral sur une durÊe assez longue.The speaker (s) typically emit up to 100 W of heat per 1000 W of peak power received. In addition, the use of the loudspeaker is generally for a relatively long period.
Ainsi, il existe un risque de surchauffe des composants internes de l'enceinte à cause d'un Êchauffement de l'air interne. Le circuit Êlectronique peut être endommagÊ si la tempÊrature de ses composants dÊpasse par exemple 65°C. De même, la bobine d'un haut-parleur peut être endommagÊe si sa tempÊrature dÊpasse par exemple 200°C. En outre, les aimants nÊodymes prÊsents en gÊnÊral dans le moteur du haut-parleur peuvent subir une perte permanente de puissance si leur tempÊrature dÊpasse environ 80°C.Thus, there is a risk of overheating of the internal components of the enclosure due to heating of the internal air. The electronic circuit may be damaged if the temperature of its components exceeds eg 65 ° C. Similarly, the coil of a loudspeaker may be damaged if its temperature exceeds for example 200 ° C. In addition, the neodymium magnets generally present in the loudspeaker motor may experience permanent power loss if their temperature exceeds about 80 ° C.
Pour remÊdier à ces inconvÊnients, il est connu de connecter un dissipateur thermique au circuit Êlectronique. Le dissipateur est placÊ à l'intÊrieur de l'enceinte acoustique. Le dissipateur thermique assure un Êchange thermique rapide entre le circuit Êlectronique et l'air interne de l'enceinte acoustique. Une telle solution règle en partie le problème de l'Êchauffement du circuit Êlectronique, mais elle ne convient qu'à une enceinte acoustique de relativement basse puissance.To remedy these drawbacks, it is known to connect a heat sink to the electronic circuit. The heat sink is placed inside the loudspeaker. The heat sink ensures a rapid heat exchange between the electronic circuit and the internal air of the acoustic enclosure. Such a solution partly solves the problem of the heating of the electronic circuit, but it is only suitable for a relatively low power acoustic enclosure.
Il est ĂŠgalement connu de recourir Ă un dissipateur thermique placĂŠ Ă l'extĂŠrieur de l'enceinte acoustique et connectĂŠ au circuit ĂŠlectronique. Ceci assure un refroidissement du circuit ĂŠlectronique, mais il subsiste un risque d'ĂŠchauffement des haut-parleurs et de l'air interne de l'enceinte acoustique.It is also known to use a heat sink placed outside the speaker and connected to the electronic circuit. This ensures a cooling of the electronic circuit, but there is a risk of overheating of the speakers and the internal air of the speaker.
De même, il est connu de fixer un radiateur à l'arrière du haut-parleur, dans le caisson de l'enceinte acoustique, comme proposÊ dans le document
Il est ĂŠgalement connu de rĂŠaliser une enceinte acoustique dont les parois externes sont conductrices de la chaleur. Les parois externes sont par exemple en mĂŠtal. En gĂŠnĂŠral, ces parois sont thermiquement isolĂŠes des haut-parleurs par un joint assurant l'ĂŠtanchĂŠitĂŠ acoustique. Les constantes de temps de refroidissement des haut-parleurs sont ĂŠlevĂŠes, de l'ordre de plusieurs heures.It is also known to provide an acoustic enclosure whose outer walls are heat conducting. The outer walls are for example metal. In general, these walls are thermally insulated from the loudspeakers by a seal providing acoustic sealing. The cooling time constants of the loudspeakers are high, of the order of several hours.
On connaÎt en outre des enceintes acoustiques dites  à Êvent  (en anglais : bass reflex) qui assurent un Êchange d'air avec l'extÊrieur et donc permettent un refroidissement de l'air interne, en particulier lors de forts dÊplacements de la membrane du haut-parleur. Il est connu de placer un dissipateur thermique du circuit Êlectronique à proximitÊ de l'Êvent, de façon à maximiser les Êchanges thermiques avec l'extÊrieur.Also known acoustic speakers called "vent" (in English: bass reflex ) which provide an air exchange with the outside and thus allow cooling of the internal air, especially during strong movements of the membrane of the speaker. It is known to place a heat sink of the electronic circuit near the vent, so as to maximize heat exchange with the outside.
Il est ĂŠgalement connu de protĂŠger le circuit ĂŠlectronique en utilisant des capteurs thermiques pour limiter la puissance thermique transmise par le circuit ĂŠlectronique aux haut-parleurs, ou de mettre l'ĂŠlectronique Ă l'arrĂŞt ou en ĂŠtat de veille jusqu'Ă refroidissement du circuit ĂŠlectronique Ă des tempĂŠratures acceptables.It is also known to protect the electronic circuit by using thermal sensors to limit the thermal power transmitted by the electronic circuit to the speakers, or to put the electronics off or in standby state until the cooling circuit electronics at acceptable temperatures.
Toutefois, ces solutions techniques n'Êliminent pas totalement le risque de surchauffe, notamment lors d'une utilisation de l'enceinte acoustique à très forte puissance. Ces technologies conduisent à limiter temporairement ou de manière permanente la puissance de l'enceinte acoustique.However, these technical solutions do not completely eliminate the risk of overheating, especially when using the loudspeaker with very high power. These technologies lead to temporarily or permanently limiting the power of the loudspeaker.
Un but de l'invention est donc de fournir une enceinte acoustique telle que dĂŠcrite ci-dessus et qui ne soit pas limitĂŠe, ou soit moins limitĂŠe, en puissance en raison de l'ĂŠchauffement de ses composants internes.An object of the invention is therefore to provide an acoustic enclosure as described above and which is not limited or less limited in power due to the heating of its internal components.
A cet effet, l'invention a pour objet une enceinte acoustique selon la revendication 1.For this purpose, the subject of the invention is an acoustic enclosure according to claim 1.
Selon des modes particuliers de rĂŠalisation, l'enceinte acoustique selon la revendication 1 comprend l'une ou plusieurs des caractĂŠristiques suivantes:
- le moteur haut-parleur est fixÊ sur l'organe directement ou par l'intermÊdiaire d'un châssis du haut-parleur ;
- le moteur du haut-parleur ou le circuit ĂŠlectronique est ou sont liĂŠ(s) Ă l'organe par au moins un pont thermique ;
- la portion de liaison est au moins Ă 80% en masse en mĂŠtal ;
- la portion de liaison se situe au moins en partie en surface de l'enceinte acoustique de manière à former en partie le caisson ; et
- la paroi externe est en outre fixĂŠe sur l'organe, le haut-parleur, la paroi externe et l'organe dĂŠfinissant un volume interne sensiblement ĂŠtanche vis-Ă -vis de l'air extĂŠrieur.
- the speaker motor is fixed to the body directly or via a loudspeaker chassis;
- the loudspeaker motor or the electronic circuit is or are connected to the body by at least one thermal bridge;
- the connecting portion is at least 80% by weight of metal;
- the connecting portion is located at least partly on the surface of the acoustic enclosure so as to form part of the box; and
- the outer wall is further fixed on the body, the speaker, the outer wall and the member defining an internal volume substantially sealed vis-Ă -vis the outside air.
L'invention sera mieux comprise Ă la lecture de la description qui va suivre, donnĂŠe uniquement Ă titre d'exemple et faite en se rĂŠfĂŠrant aux dessins annexĂŠs, sur lesquels :
- la
figure 1 est une vue schĂŠmatique en coupe d'une enceinte acoustique selon une premier mode de rĂŠalisation de l'invention, - la
figure 2 est une vue schĂŠmatique en coupe d'une enceinte acoustique selon un exemple non couvert par les revendications, - la
figure 3 est une vue schĂŠmatique de l'enceinte acoustique reprĂŠsentĂŠe sur lafigure 2 , en coupe selon un plan sensiblement perpendiculaire au plan de coupe de lafigure 2 , et - la
figure 4 est une vue schÊmatique en coupe d'une enceinte acoustique selon un deuxième mode de rÊalisation de l'invention.
- the
figure 1 is a schematic sectional view of an acoustic enclosure according to a first embodiment of the invention, - the
figure 2 is a schematic sectional view of an acoustic enclosure according to an example not covered by the claims, - the
figure 3 is a schematic view of the loudspeaker shown on thefigure 2 , in section along a plane substantially perpendicular to the section plane of thefigure 2 , and - the
figure 4 is a schematic sectional view of an acoustic chamber according to a second embodiment of the invention.
En rĂŠfĂŠrence Ă la
La
Dans l'exemple reprĂŠsentĂŠ, l'enceinte acoustique 1 prĂŠsente une forme gĂŠnĂŠrale sensiblement parallĂŠlĂŠpipĂŠdique. En variante (non reprĂŠsentĂŠe), l'enceinte acoustique 1 prĂŠsente une autre forme gĂŠnĂŠrale, avantageusement sensiblement sphĂŠrique.In the example shown, the acoustic enclosure 1 has a generally parallelepipedal general shape. Alternatively (not shown), the acoustic chamber 1 has another general shape, preferably substantially spherical.
L'enceinte acoustique 1 comprend un haut-parleur 5, un circuit ĂŠlectronique 10 de commande du haut-parleur 5, un organe 15 conducteur de la chaleur, et une paroi externe 20 non conductrice de la chaleur et dĂŠfinissant au moins en partie un caisson 25 de l'enceinte acoustique.The loudspeaker 1 comprises a
L'enceinte acoustique 1 comprend en outre un joint d'ÊtanchÊitÊ 30 interposÊ entre le haut-parleur 5 et la paroi externe 20, un joint d'ÊtanchÊitÊ 32 interposÊ entre la paroi externe 20 et une première face 34 de l'organe 15, et un joint d'ÊtanchÊitÊ 36 interposÊ entre la paroi externe 20 et une deuxième face 38 de l'organe 15, opposÊe à la première face 34 selon une direction transversale T de l'enceinte acoustique 1. L'enceinte acoustique 1 comprend aussi un premier pont thermique 40 reliant le haut-parleur 5 et l'organe 15, et un deuxième pont thermique 42 reliant le circuit Êlectronique 10 et l'organe 15.The acoustic chamber 1 further comprises a
Le haut-parleur 5 comprend un châssis 44, une membrane 46, et un moteur 48.
Le moteur 48 est propre à dÊgager de la chaleur lorsque l'enceinte acoustique 1 est en fonctionnement. Le moteur 48 comporte une bobine dÊfinissant un axe D du haut-parleur 5 par exemple sensiblement parallèle à la direction transversale T. Le moteur 48 est fixÊ sur l'organe 15 par l'intermÊdiaire du premier pont thermique 40.The
The
Par  pont thermique  entre deux pièces, on entend un ou plusieurs ÊlÊments reliant les deux pièces et adaptÊ(s) pour conduire la chaleur dans un sens ou dans l'autre entre les deux pièces. Par exemple, les ÊlÊments du pont thermique sont adaptÊs pour que la rÊsistance thermique entre les deux pièces soit infÊrieure ou Êgale à 5°C/W, de prÊfÊrence infÊrieure ou Êgale à 3°C/W, de manière encore plus prÊfÊrentielle infÊrieure ou Êgale à 1°C/W. Le matÊriau principal constituant le pont thermique prÊsente avantageusement une conductivitÊ thermique supÊrieure ou Êgale à 1 W/m.K.The term "thermal bridge" between two parts means one or more elements connecting the two parts and adapted (s) to conduct heat in one direction or the other between the two parts. For example, the elements of the thermal bridge are adapted so that the thermal resistance between the two parts is less than or equal to 5 ° C / W, preferably less than or equal to 3 ° C / W, even more preferably less than or equal to at 1 ° C / W. The main material constituting the thermal bridge advantageously has a thermal conductivity greater than or equal to 1 W / m.K.
Selon des variantes (non reprÊsentÊes), le châssis 44 ou le moteur 48 sont fixÊs directement sur, ou sont en contact franc avec, l'organe 15.According to variants (not shown), the
Le châssis 44 comporte une portion 50 pÊriphÊrique par rapport à l'axe D et fixÊe sur la paroi externe 20, avantageusement sur tout le pourtour du haut-parleur 5 autour de l'axe D.The
Par exemple, la membrane 46 est sensiblement plane, ou forme sensiblement une portion de sphère. La membrane 46 est suspendue au châssis 44, avantageusement par le joint d'ÊtanchÊitÊ 30.For example, the
Le circuit Êlectronique 10 comprend par exemple un circuit imprimÊ 52 fixÊ sur le deuxième pont thermique 42, et des composants Êlectroniques 54 montÊs sur le circuit imprimÊ 52.The
Le circuit imprimÊ 52 est par exemple sensiblement parallèle à une portion de liaison 56 de l'organe 15.The printed
Les composants ĂŠlectroniques 54 sont propres Ă dĂŠgager de la chaleur lorsque l'enceinte acoustique 1 est en fonctionnement.The
Dans l'exemple reprÊsentÊ, l'organe 15 s'Êtend à l'intÊrieur et en travers du caisson 25, par exemple sensiblement perpendiculairement à l'axe D du haut-parleur 5. L'organe 15 comprend la portion de liaison 56, un radiateur 58 disposÊ dans une ouverture 60 du caisson 25, et un troisième pont thermique 62 reliant la portion de liaison et le radiateur.In the example shown, the
Selon des variantes (non reprÊsentÊes), le troisième pont thermique 62 est remplacÊ par un contact franc entre la portion de liaison 56 et le radiateur 58, ou par une pâte ou une graisse.According to variants (not shown), the third
La portion de liaison 56 prÊsente par exemple une forme gÊnÊrale plane. La portion de liaison 56 est par exemple sensiblement perpendiculaire à l'axe D du haut-parleur 5. La portion de liaison 56 est par exemple en mÊtal, avantageusement en aluminium, en magnÊsium, ou en acier. La portion de liaison 56 est par exemple d'une seule pièce.The connecting
Selon une variante non-reprÊsentÊe, l'organe 15 est en une seule pièce.According to a variant not shown, the
Le radiateur 58 s'ĂŠtend dans un plan sensiblement perpendiculaire Ă la portion de liaison 56. Le radiateur 58 comporte avantageusement des ailettes 64 faisant saillie vers l'extĂŠrieur de l'enceinte acoustique 1. Le radiateur 58 dĂŠfinit une surface d'ĂŠchange 66 propre Ă ĂŞtre traversĂŠe par un flux de chaleur 68 circulant dans l'organe 15 en provenance du moteur 48 et du circuit ĂŠlectronique 10 lorsque l'enceinte acoustique 1 est en fonctionnement.The
Par ÂŤ conducteur Âť, on entend que l'organe 15 prĂŠsente, au moins sur le parcours du flux de chaleur 68, une conductivitĂŠ Îť supĂŠrieure ou ĂŠgale Ă 1 W/m.K.By "conductor" is meant that the
Dans l'exemple reprĂŠsentĂŠ, la paroi externe 20 comprend deux demi-coques 70, 72.In the example shown, the
Par  non conductrice de chaleur  ou  thermiquement isolante , on entend une matière prÊsentant une conductivitÊ thermique Ν strictement infÊrieure à 1 W/m.K.By "non-heat conductor" or "thermally insulating" is meant a material having a thermal conductivity Ν strictly less than 1 W / m.K.
La demi-coque 70 est fixÊe sur la portion pÊriphÊrique 50 du haut-parleur 5 et sur la première face 34 de l'organe 15.The half-
La demi-coque 72 est fixÊe sur la deuxième 38 de l'organe 15.The half-
Grâce aux joints d'ÊtanchÊitÊ 30, 32, le haut-parleur 5, l'organe 15 et la paroi externe 20 dÊfinissent un premier volume interne 74 sensiblement Êtanche vis-à -vis de l'air extÊrieur 76. La demi-coque 72 et l'organe 15 dÊfinissent un deuxième volume interne 78 sensiblement Êtanche vis-à -vis de l'air extÊrieur 76.Thanks to the
Dans l'exemple reprÊsentÊ, le premier volume interne 74 abrite le moteur 48. Le deuxième volume 78 abrite le circuit Êlectronique 10.In the example shown, the first
Le fonctionnement de l'enceinte acoustique 1 va maintenant ĂŞtre dĂŠcrit.The operation of the loudspeaker 1 will now be described.
L'organe 15 met en communication thermique le moteur 48, le circuit ĂŠlectronique 10 et l'air extĂŠrieur 76.The
Lorsque l'enceinte acoustique 1 est en fonctionnement, le moteur 48 et le circuit Êlectronique 10 dÊgagent de la chaleur. En rÊgime permanent, la chaleur dÊgagÊe par le moteur 48 passe dans l'organe 15 via le premier pont thermique 40. La chaleur dÊgagÊe dans le circuit Êlectronique 10 passe dans l'organe 15 via le deuxième pont thermique 42. Il se crÊe dans l'organe 15 le flux de chaleur 68 en provenance du moteur 48 et du circuit Êlectronique 10. Le flux de chaleur 10 traverse le troisième pont thermique 62 et arrive dans le radiateur 58. Le flux thermique 10 traverse alors la surface d'Êchange 66 pour se dissiper dans l'air extÊrieur 76.When the acoustic enclosure 1 is in operation, the
Grâce aux caractÊristiques dÊcrites ci-dessus, notamment l'organe 15, il est possible d'extraire une fraction importante de la chaleur qui se dÊgage dans le moteur 48 et dans le circuit Êlectronique 10, et de l'Êvacuer à l'extÊrieur de l'enceinte acoustique 1. Ainsi, il est possible de prÊvenir un Êchauffement trop important du moteur 48 ou du circuit Êlectronique 10.Thanks to the characteristics described above, in particular the
En outre, au dÊbut de l'utilisation de l'enceinte acoustique 1, le haut-parleur 5 est chauffÊ par le circuit Êlectronique 10. En effet, la chaleur dÊgagÊe par le circuit Êlectronique 10 est conduite par le deuxième pont thermique 42, l'organe 15 et le premier pont thermique 40 jusqu'au moteur 48. Le moteur 48 ne dÊgage pas, ou très peu, de chaleur tant que le volume sonore de l'enceinte acoustique 1 reste faible. En effet, la puissance consommÊe 'au repos' par le circuit Êlectronique n'est pas nulle, donc pour les volumes sonores nuls ou faibles, l'essentiel de la production de chaleur est rÊalisÊ au niveau du circuit Êlectronique.In addition, at the beginning of the use of the acoustic enclosure 1, the
Par ailleurs, grâce à l'organe 15, il est possible de rÊaliser le caisson 25 dans un autre matÊriau que du mÊtal, tout en Êvacuant correctement la chaleur dÊgagÊe par le moteur 48 et le circuit Êlectronique 10.Furthermore, thanks to the
Avantageusement, l'organe 15 constitue une armature interne de l'enceinte acoustique 1, sur laquelle est fixÊe la paroi externe 20 de manière sensiblement Êtanche.Advantageously, the
En rĂŠfĂŠrence aux
L'enceinte acoustique 100 est analogue Ă l'enceinte acoustique 1 reprĂŠsentĂŠe sur la
L'enceinte acoustique 100 comprend un deuxième haut-parleur 105, et un deuxième circuit Êlectronique 110 de commande du deuxième haut-parleur 105.The
Le deuxième haut-parleur 105 est avantageusement analogue structurellement au haut-parleur 5. Le deuxième haut-parleur 105 comprend notamment un moteur 148 propre à dÊgager de la chaleur lorsque l'enceinte acoustique 100 est en fonctionnement. Le deuxième haut-parleur 105 est par exemple disposÊ de l'autre côtÊ de l'organe 15 par rapport au haut-parleur 5.The
Le moteur 148 est liÊ à l'organe 15 par un quatrième pont thermique 140.The
Le circuit Êlectronique 10 se situe dans le volume interne 74. Le circuit Êlectronique 10 est liÊ à la première face 34 de l'organe 15 par le deuxième pont thermique 42.The
Le deuxième circuit Êlectronique 110 se situe dans le deuxième volume interne 78. Le deuxième circuit Êlectronique 110 est liÊ à l'organe 15 par un cinquième pont thermique 142.The second
Le cinquième pont thermique 142 est par exemple fixÊ sur la deuxième face 38 de l'organe 15.The fifth
Dans l'exemple reprĂŠsentĂŠ, l'organe 15 occupe une position sensiblement mĂŠdiane dans le caisson 25 selon la direction transversale T.In the example shown, the
Le premier circuit Êlectronique 10 et le deuxième circuit Êlectronique 110 sont par exemple reliÊs par des câbles 112.The first
L'organe 15 de l'enceinte acoustique 100 est par exemple dĂŠpourvu d'un radiateur s'ĂŠtendant dans une ouverture dĂŠfinie par le caisson 25. L'organe 15 dĂŠfinit intĂŠrieurement un passage 114 Ă travers l'enceinte acoustique 100.The
Comme visible sur la
L'organe 15 comprend avantageusement des ailettes 120 faisant saillie dans le passage 114.The
La circulation d'air extĂŠrieur dans le passage 114 est matĂŠrialisĂŠe sur les
La surface d'ĂŠchange 66 dĂŠfinie par l'organe 15 dĂŠlimite le passage 114.The
Dans une position normale d'utilisation de l'enceinte acoustique 100, l'entrĂŠe 116 se situe au-dessous de la sortie 118.In a normal position of use of the
Le passage 114 est adaptĂŠ pour fonctionner sensiblement comme une cheminĂŠe.The
Le fonctionnement de l'enceinte acoustique 100 est analogue Ă celui de l'enceinte acoustique 1, si ce n'est que le flux de chaleur 68 en provenance du moteur 48 et du circuit ĂŠlectronique 10 traverse la surface d'ĂŠchange 66 pour ĂŞtre emportĂŠ par la circulation d'air F.The operation of the
De même, un flux de chaleur 168 en provenance du moteur 148 et du deuxième circuit Êlectronique 110 traverse la surface d'Êchange 66 pour passer dans la circulation d'air F.Similarly, a
Selon une variante non reprĂŠsentĂŠe, le mode de dissipation thermique de l'enceinte acoustique 100 (cheminĂŠe) et le mode de dissipation thermique de l'enceinte acoustique 1 (radiateur) sont combinĂŠs.According to a variant not shown, the heat dissipation mode of the acoustic enclosure 100 (chimney) and the heat dissipation mode of the acoustic enclosure 1 (radiator) are combined.
En variante, l'enceinte acoustique 100 comprend un ventilateur (non reprĂŠsentĂŠ) situĂŠ dans le passage 114 et adaptĂŠ pour crĂŠer une circulation forcĂŠe d'air extĂŠrieur dans le passage 144.Alternatively, the
On va maintenant dÊcrire une enceinte acoustique 200 constituant un deuxième mode de rÊalisation de l'invention.An
L'enceinte acoustique 200 est analogue Ă l'enceinte acoustique 1 reprĂŠsentĂŠe sur la
L'organe 15 comprend une portion de liaison 156 se situant en surface de l'enceinte acoustique 200 de manière à former en partie le caisson 25.The
Le circuit Êlectronique 10 se situe dans le volume interne 74. Le deuxième pont thermique 42 est fixÊ sur la première face 34 de l'organe 15.The
La surface d'Êchange 66 est dÊfinie par le radiateur 58 et par la deuxième face 38 de la partie de liaison 156.The
Lorsque l'enceinte acoustique 200 est en fonctionnement, une partie du flux de chaleur 68 en provenance de moteur 48 et du circuit Êlectronique 10 s'Êvacue dans l'air extÊrieur 76 par la deuxième face 38 de l'organe 15.When the
Claims (6)
- An acoustic enclosure (1; 200), comprising:- a non-heat-conducting external wall (20) at least partially defining a casing (25) of the acoustic enclosure,- at least one electrodynamic loudspeaker (5) including a motor (48), the loudspeaker (5) having a peripheral portion (50) fastened on the external wall (20), and- at least one electronic control circuit (10) of the loudspeaker (5),wherein the motor (48) of the loudspeaker (5) and the electronic circuit (10) are connected to a same member (15) of the acoustic enclosure (1; 200), the member (15) conducting heat and including an exchange surface (66) able to be traversed by a heat flow (68) circulating in the member (15) originating from the motor (48) and the electronic circuit (10) when the acoustic enclosure (1; 200) is operating, the heat flow (68) being intended to dissipate in the air (76) outside the acoustic enclosure (1; 200) or to pass into a heat-conducting element outside the acoustic enclosure (1; 200), the member (15) includes a radiator (58) defining at least part of the exchange surface (56), and characterized in that the member (15) further comprises a connecting portion (56), to which the motor (48) of the loudspeaker and the electronic circuit (10) are connected, the connecting portion being connected to the radiator (58) directly or via a thermal bridge (62), the connecting portion (56) extends inside the casing (25), the radiator (58) extending in a plane perpendicular to the connecting portion (56).
- The acoustic enclosure (1; 200) according to claim 1, wherein the motor (48) of the loudspeaker (5) is fastened on the member (15) directly or via a chassis (44) of the loudspeaker (5).
- The acoustic enclosure (1; 200) according to claim 1, wherein the motor (48) of the loudspeaker (5) or the electronic circuit (10) is or are connected to the member (15) by at least one thermal bridge (40, 42).
- The acoustic enclosure (1; 200) according to any one of claims 1 to 3, wherein the connecting portion (56) is at least 80 wt% made from metal.
- The acoustic enclosure (200) according to any one of claims 1 to 4, wherein the connecting portion (56) is situated at least partially on the surface of the acoustic enclosure (200) so as to partially form the casing (25).
- The acoustic enclosure (1; 200) according to any one of claims 1 to 5, wherein the external wall (20) is further fastened on the member (15), the loudspeaker (5), the external wall (20) and the member defining a airtight inner volume (74) with respect to the outside air (76).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1362924A FR3015166B1 (en) | 2013-12-18 | 2013-12-18 | ACOUSTIC SPEAKER COMPRISING AN EXTERNAL NON-CONDUCTIVE HEAT WALL, AN ELECTRODYNAMIC SPEAKER AND AN ELECTRONIC CONTROL CIRCUIT |
PCT/EP2014/077907 WO2015091446A1 (en) | 2013-12-18 | 2014-12-16 | Accoustic enclosure comprising a non heat-conducting external wall, an electrodynamic loudspeaker and an electronic control circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3085108A1 EP3085108A1 (en) | 2016-10-26 |
EP3085108B1 true EP3085108B1 (en) | 2018-08-29 |
Family
ID=50179808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14821123.8A Active EP3085108B1 (en) | 2013-12-18 | 2014-12-16 | Accoustic enclosure comprising a non heat-conducting external wall, an electrodynamic loudspeaker and an electronic control circuit |
Country Status (4)
Country | Link |
---|---|
US (1) | US10187728B2 (en) |
EP (1) | EP3085108B1 (en) |
FR (1) | FR3015166B1 (en) |
WO (1) | WO2015091446A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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FR3087067A1 (en) * | 2018-10-08 | 2020-04-10 | Devialet | ACOUSTIC SPEAKER WITH TWO HEADLOCK SPEAKERS FIXED ON AN INTERNAL FRAME |
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ITUA20163146A1 (en) * | 2016-05-04 | 2017-11-04 | Luxdb Srl | Sound box |
US10104761B1 (en) | 2017-06-27 | 2018-10-16 | Bose Corporation | Cooling techniques to improve thermal performance of electroacoustic device |
US10524042B2 (en) | 2017-06-27 | 2019-12-31 | Bose Corporation | Electro-acoustical transducer arrangements of a sound system |
US10306386B2 (en) | 2017-06-27 | 2019-05-28 | Bose Corporation | Portable speaker configurations |
WO2019063070A1 (en) * | 2017-09-27 | 2019-04-04 | Harman Becker Automotive Systems Gmbh | Loudspeaker arrangement |
FR3087071B1 (en) * | 2018-10-08 | 2020-11-06 | Devialet | ACOUSTIC LOUDSPEAKER CONTAINING A MONOBLOCK PLASTIC MATERIAL SHELL |
DE102019108423B4 (en) * | 2019-04-01 | 2021-08-05 | Svetlomir Aleksandrov | Loudspeaker box and loudspeaker |
TW202102011A (en) * | 2019-06-18 | 2021-01-01 | čŻç˘Šéťč ŚčĄäť˝ćéĺ Źĺ¸ | Speaker |
US11521909B2 (en) * | 2019-10-14 | 2022-12-06 | Google Llc | Passive thermal-control system of an electronic speaker device and associated electronic speaker devices |
FR3131971B1 (en) * | 2022-01-18 | 2024-02-02 | Devialet | Housing for an acoustic system, associated acoustic system and manufacturing process |
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2013
- 2013-12-18 FR FR1362924A patent/FR3015166B1/en active Active
-
2014
- 2014-12-16 US US15/105,809 patent/US10187728B2/en active Active
- 2014-12-16 WO PCT/EP2014/077907 patent/WO2015091446A1/en active Application Filing
- 2014-12-16 EP EP14821123.8A patent/EP3085108B1/en active Active
Patent Citations (1)
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US4138593A (en) * | 1976-02-24 | 1979-02-06 | Braun Ag | Moving voice coil loudspeaker with heat dissipating enclosure |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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FR3087067A1 (en) * | 2018-10-08 | 2020-04-10 | Devialet | ACOUSTIC SPEAKER WITH TWO HEADLOCK SPEAKERS FIXED ON AN INTERNAL FRAME |
EP3637790A1 (en) * | 2018-10-08 | 2020-04-15 | Devialet | Acoustic enclosure with two head-to-tail loudspeakers attached to an internal frame |
Also Published As
Publication number | Publication date |
---|---|
EP3085108A1 (en) | 2016-10-26 |
WO2015091446A1 (en) | 2015-06-25 |
FR3015166B1 (en) | 2017-07-14 |
US10187728B2 (en) | 2019-01-22 |
US20160337756A1 (en) | 2016-11-17 |
FR3015166A1 (en) | 2015-06-19 |
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