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EP2936953A4 - Heat removal assembly - Google Patents

Heat removal assembly

Info

Publication number
EP2936953A4
EP2936953A4 EP12890444.8A EP12890444A EP2936953A4 EP 2936953 A4 EP2936953 A4 EP 2936953A4 EP 12890444 A EP12890444 A EP 12890444A EP 2936953 A4 EP2936953 A4 EP 2936953A4
Authority
EP
European Patent Office
Prior art keywords
heat removal
removal assembly
assembly
heat
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12890444.8A
Other languages
German (de)
French (fr)
Other versions
EP2936953A1 (en
Inventor
David Allen Moore
John P Franz
Tahir Cader
Michael Lawrence Sabotta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Enterprise Development LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of EP2936953A1 publication Critical patent/EP2936953A1/en
Publication of EP2936953A4 publication Critical patent/EP2936953A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
    • F28F2280/10—Movable elements, e.g. being pivotable
    • F28F2280/105—Movable elements, e.g. being pivotable with hinged connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP12890444.8A 2012-12-19 2012-12-19 Heat removal assembly Withdrawn EP2936953A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/070727 WO2014098851A1 (en) 2012-12-19 2012-12-19 Heat removal assembly

Publications (2)

Publication Number Publication Date
EP2936953A1 EP2936953A1 (en) 2015-10-28
EP2936953A4 true EP2936953A4 (en) 2016-07-13

Family

ID=50978937

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12890444.8A Withdrawn EP2936953A4 (en) 2012-12-19 2012-12-19 Heat removal assembly

Country Status (5)

Country Link
US (1) US20150354901A1 (en)
EP (1) EP2936953A4 (en)
CN (1) CN104938043B (en)
TW (1) TW201428226A (en)
WO (1) WO2014098851A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10855060B2 (en) * 2015-01-20 2020-12-01 Abb Schweiz Ag Switchgear cooling system comprising a heat pipe, fan and thermoelectric generation
US9750127B2 (en) * 2015-12-04 2017-08-29 General Electric Company Circuit card assembly including heat transfer assembly and method of manufacturing such
US10253595B2 (en) * 2016-10-12 2019-04-09 Baker Hughes, A Ge Company, Llc Evaporative cooling using a refrigerant, a selectively permeable membrane, and a drawing fluid
US10159165B2 (en) * 2017-02-02 2018-12-18 Qualcomm Incorporated Evaporative cooling solution for handheld electronic devices
US10670650B2 (en) * 2017-09-28 2020-06-02 Advantest Corporation Device testing with heat pipe cooling assembly
US12107032B2 (en) * 2018-12-19 2024-10-01 Abb Schweiz Ag Cooling of power semiconductors
US10788637B2 (en) * 2018-12-21 2020-09-29 Juniper Networks, Inc. Apparatus, system, and method for dissipating heat emitted by individual communication modules via ganged heat exchangers
US11153990B2 (en) * 2018-12-21 2021-10-19 Intel Corporation Movable heat-transfer system
US10856055B2 (en) * 2019-03-20 2020-12-01 Mellanox Technologies, Ltd. Apparatuses for improved thermal performance of dynamic network connections
CN112783299B (en) * 2019-11-06 2023-10-13 富联精密电子(天津)有限公司 LTS radiator and electronic equipment with same
US11647612B2 (en) * 2020-11-23 2023-05-09 Toyota Motor Engineering & Manufacturing North America, Inc. High-density integrated power electronic assembly including double-sided cooling structure
US11647579B2 (en) * 2021-05-04 2023-05-09 Toyota Motor Engineering & Manufacturing North America, Inc. Chip-on-chip power devices embedded in PCB and cooling systems incorporating the same
US11732976B1 (en) * 2022-03-02 2023-08-22 Aic Inc. Rapid heat dissipation device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0310039A2 (en) * 1987-09-30 1989-04-05 Hitachi, Ltd. Cooling system for heating body
US6125035A (en) * 1998-10-13 2000-09-26 Dell Usa, L.P. Heat sink assembly with rotating heat pipe
US20050141198A1 (en) * 2003-12-26 2005-06-30 Lee Hsieh K. Heat dissipating device incorporating heat pipe
US20060291172A1 (en) * 2005-06-24 2006-12-28 Foxconn Technology Co., Ltd. Heat dissipation device
US20090168356A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly with heat dissipation device
US20090229791A1 (en) * 2008-03-14 2009-09-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module assembly and heat sink assembly thereof
US20100139892A1 (en) * 2008-12-10 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110048681A1 (en) * 2009-08-26 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4422501A (en) * 1982-01-22 1983-12-27 The Boeing Company External artery heat pipe
US6209626B1 (en) * 1999-01-11 2001-04-03 Intel Corporation Heat pipe with pumping capabilities and use thereof in cooling a device
US6674643B2 (en) * 2001-08-09 2004-01-06 International Business Machines Corporation Thermal connector for transferring heat between removable printed circuit boards
TWM245507U (en) * 2003-10-29 2004-10-01 Ching-Yuan Ruan Bending structure of heat conducting pipe
US20050145371A1 (en) * 2003-12-31 2005-07-07 Eric Distefano Thermal solution for electronics cooling using a heat pipe in combination with active loop solution
KR100558065B1 (en) * 2004-03-15 2006-03-10 삼성전자주식회사 Semiconductor Module with Heat Sink
US6978828B1 (en) * 2004-06-18 2005-12-27 Schlumberger Technology Corporation Heat pipe cooling system
CN100455175C (en) * 2005-07-08 2009-01-21 富准精密工业(深圳)有限公司 Loop-type radiating module group
US20070119566A1 (en) * 2005-11-30 2007-05-31 Xue-Wen Peng Heat dissipation device
CN101776941B (en) * 2009-01-08 2013-03-13 富准精密工业(深圳)有限公司 Radiating device
CN102056461A (en) * 2009-11-05 2011-05-11 鸿富锦精密工业（深圳）有限公司 Heat dissipating device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0310039A2 (en) * 1987-09-30 1989-04-05 Hitachi, Ltd. Cooling system for heating body
US6125035A (en) * 1998-10-13 2000-09-26 Dell Usa, L.P. Heat sink assembly with rotating heat pipe
US20050141198A1 (en) * 2003-12-26 2005-06-30 Lee Hsieh K. Heat dissipating device incorporating heat pipe
US20060291172A1 (en) * 2005-06-24 2006-12-28 Foxconn Technology Co., Ltd. Heat dissipation device
US20090168356A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly with heat dissipation device
US20090229791A1 (en) * 2008-03-14 2009-09-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module assembly and heat sink assembly thereof
US20100139892A1 (en) * 2008-12-10 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110048681A1 (en) * 2009-08-26 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014098851A1 *

Also Published As

Publication number Publication date
CN104938043B (en) 2017-07-18
TW201428226A (en) 2014-07-16
US20150354901A1 (en) 2015-12-10
CN104938043A (en) 2015-09-23
EP2936953A1 (en) 2015-10-28
WO2014098851A1 (en) 2014-06-26

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20150609

AK Designated contracting states

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Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20160613

RIC1 Information provided on ipc code assigned before grant

Ipc: F28D 15/02 20060101ALI20160607BHEP

Ipc: H05K 7/20 20060101AFI20160607BHEP

Ipc: H01L 23/34 20060101ALI20160607BHEP

17Q First examination report despatched

Effective date: 20170824

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: HEWLETT PACKARD ENTERPRISE DEVELOPMENT L.P.

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20190927