EP2910334A4 - Polishing method and method for producing alloy material - Google Patents

Polishing method and method for producing alloy material

Info

Publication number: EP2910334A4
Authority: EP; European Patent Office
Prior art keywords: alloy material; producing alloy; polishing; polishing method; producing
Prior art date: 2012-10-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP13844066.4A

Other languages

German (de)

French (fr)

Other versions

EP2910334A1 (en

Inventor

Hitoshi Morinaga

Kazusei Tamai

Yutaka Niwano

Maiko Asai

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fujimi Inc

Original Assignee

Fujimi Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-10-03

Filing date

2013-10-01

Publication date

2016-08-03

2013-10-01 Application filed by Fujimi Inc filed Critical Fujimi Inc

2015-08-26 Publication of EP2910334A1 publication Critical patent/EP2910334A1/en

2016-08-03 Publication of EP2910334A4 publication Critical patent/EP2910334A4/en

Status Withdrawn legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

EP13844066.4A 2012-10-03 2013-10-01 Polishing method and method for producing alloy material Withdrawn EP2910334A4 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2012221448		2012-10-03
PCT/JP2013/076647 WO2014054611A1 (en)	2012-10-03	2013-10-01	Polishing method and method for producing alloy material

Publications (2)

Publication Number	Publication Date
EP2910334A1 EP2910334A1 (en)	2015-08-26
EP2910334A4 true EP2910334A4 (en)	2016-08-03

Family

ID=50434937

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP13844066.4A Withdrawn EP2910334A4 (en)	2012-10-03	2013-10-01	Polishing method and method for producing alloy material

Country Status (7)

Country	Link
US (1)	US20150251293A1 (en)
EP (1)	EP2910334A4 (en)
JP (1)	JPWO2014054611A1 (en)
KR (1)	KR20150065757A (en)
CN (1)	CN104684684A (en)
TW (1)	TW201424933A (en)
WO (1)	WO2014054611A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6415569B2 (en) *	2014-08-07	2018-10-31	株式会社フジミインコーポレーテッド	Composition for polishing titanium alloy material
JP6085708B1 (en) *	2016-04-01	2017-02-22	株式会社フジミインコーポレーテッド	Polishing composition for alloy material and method for polishing alloy material
JP6760880B2 (en) *	2017-03-31	2020-09-23	株式会社フジミインコーポレーテッド	Magnesium or magnesium alloy polishing composition and polishing method using it
KR102349153B1 (en) *	2019-12-16	2022-01-10	주식회사 포스코	Polishing composition for aluminum alloy, manufacturing method thereof, and polishing method using thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001323254A (en) *	2000-05-12	2001-11-22	Kao Corp	Polishing liquid composition
JP2004243518A (en) *	2004-04-08	2004-09-02	Toshiba Corp	Polishing device
US20060112647A1 (en) *	2004-11-30	2006-06-01	Kao Corporation	Polishing composition
US20070010098A1 (en) *	2005-06-30	2007-01-11	Cabot Microelectronics Corporation	Use of CMP for aluminum mirror and solar cell fabrication
US20100227435A1 (en) *	2009-03-09	2010-09-09	Joon-Sang Park	Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same
JP2010205796A (en) *	2009-02-27	2010-09-16	Ebara Corp	Substrate processing device and method, semiconductor manufacturing device, semiconductor manufacturing device engineering system, and system
JP2011219358A (en) *	2004-02-25	2011-11-04	Hoya Corp	Method for manufacturing glass substrate for mask blank, method for manufacturing mask blank, method for manufacturing exposure mask, method for manufacturing reflective mask blank and method for manufacturing reflective mask blank
US20120058709A1 (en) *	2010-09-08	2012-03-08	Makoto Fukushima	Polishing apparatus and method

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JPH01246068A (en)	1988-03-29	1989-10-02	Kobe Steel Ltd	Mirror face finishing of aluminum alloy substrate
JPH03228564A (en)	1990-02-02	1991-10-09	Nkk Corp	Specular finishing method for magnetic disc substrate made of titanium
JPH07142430A (en) *	1993-09-24	1995-06-02	Fujitsu Ltd	Semiconductor substrate polishing equipment
JP3788810B2 (en) *	1995-02-20	2006-06-21	株式会社東芝	Polishing equipment
US5597442A (en) *	1995-10-16	1997-01-28	Taiwan Semiconductor Manufacturing Company Ltd.	Chemical/mechanical planarization (CMP) endpoint method using measurement of polishing pad temperature
JP2005056987A (en) *	2003-08-01	2005-03-03	Nitta Haas Inc	Polishing apparatus and method
US8075372B2 (en) *	2004-09-01	2011-12-13	Cabot Microelectronics Corporation	Polishing pad with microporous regions
TWI385050B (en) *	2005-02-18	2013-02-11	Nexplanar Corp	Customized polishing pads for cmp and methods of fabrication and use thereof
CN101628389A (en) *	2008-07-17	2010-01-20	西北工业大学	Method for grinding plane of TC17 titanium alloy
WO2010138724A1 (en) *	2009-05-27	2010-12-02	Rogers Corporation	Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer
JP2012148376A (en) *	2011-01-20	2012-08-09	Ebara Corp	Polishing method and polishing apparatus
US8821215B2 (en) *	2012-09-07	2014-09-02	Cabot Microelectronics Corporation	Polypyrrolidone polishing composition and method

2013
- 2013-10-01 WO PCT/JP2013/076647 patent/WO2014054611A1/en active Application Filing
- 2013-10-01 EP EP13844066.4A patent/EP2910334A4/en not_active Withdrawn
- 2013-10-01 US US14/432,905 patent/US20150251293A1/en not_active Abandoned
- 2013-10-01 KR KR1020157010719A patent/KR20150065757A/en not_active Application Discontinuation
- 2013-10-01 JP JP2014539746A patent/JPWO2014054611A1/en active Pending
- 2013-10-01 CN CN201380051652.1A patent/CN104684684A/en active Pending
- 2013-10-02 TW TW102135673A patent/TW201424933A/en unknown

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001323254A (en) *	2000-05-12	2001-11-22	Kao Corp	Polishing liquid composition
JP2011219358A (en) *	2004-02-25	2011-11-04	Hoya Corp	Method for manufacturing glass substrate for mask blank, method for manufacturing mask blank, method for manufacturing exposure mask, method for manufacturing reflective mask blank and method for manufacturing reflective mask blank
JP2004243518A (en) *	2004-04-08	2004-09-02	Toshiba Corp	Polishing device
US20060112647A1 (en) *	2004-11-30	2006-06-01	Kao Corporation	Polishing composition
US20070010098A1 (en) *	2005-06-30	2007-01-11	Cabot Microelectronics Corporation	Use of CMP for aluminum mirror and solar cell fabrication
JP2010205796A (en) *	2009-02-27	2010-09-16	Ebara Corp	Substrate processing device and method, semiconductor manufacturing device, semiconductor manufacturing device engineering system, and system
US20100227435A1 (en) *	2009-03-09	2010-09-09	Joon-Sang Park	Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same
US20120058709A1 (en) *	2010-09-08	2012-03-08	Makoto Fukushima	Polishing apparatus and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014054611A1 *

Also Published As

Publication number	Publication date
US20150251293A1 (en)	2015-09-10
KR20150065757A (en)	2015-06-15
EP2910334A1 (en)	2015-08-26
JPWO2014054611A1 (en)	2016-08-25
WO2014054611A1 (en)	2014-04-10
CN104684684A (en)	2015-06-03
TW201424933A (en)	2014-07-01

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GB201217979D0 (en)	2012-11-21	Article and method for producing an article
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Legal Events

Date	Code	Title	Description
2015-07-24	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2015-08-26	17P	Request for examination filed	Effective date: 20150428
2015-08-26	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2015-08-26	AX	Request for extension of the european patent	Extension state: BA ME
2016-01-06	DAX	Request for extension of the european patent (deleted)
2016-08-03	RA4	Supplementary search report drawn up and despatched (corrected)	Effective date: 20160630
2016-08-03	RIC1	Information provided on ipc code assigned before grant	Ipc: B24B 37/015 20120101AFI20160624BHEP
2017-05-26	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2017-06-28	18D	Application deemed to be withdrawn	Effective date: 20170131