EP2879164A4 - Zerteilungsvorrichtung und zerteilungsverfahren - Google Patents

Zerteilungsvorrichtung und zerteilungsverfahren

Info

Publication number: EP2879164A4
Authority: EP; European Patent Office
Prior art keywords: dicing; dicing method; dicing device
Prior art date: 2012-06-15
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP13803775.9A

Other languages

English (en)

French (fr)

Other versions

EP2879164B1 (de

EP2879164A1 (de

Inventor

Junji Watanabe

Takashi Fujita

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Seimitsu Co Ltd

Original Assignee

Tokyo Seimitsu Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-06-15

Filing date

2013-06-14

Publication date

2015-11-25

2013-06-14 Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd

2015-06-03 Publication of EP2879164A1 publication Critical patent/EP2879164A1/de

2015-11-25 Publication of EP2879164A4 publication Critical patent/EP2879164A4/de

2017-09-13 Application granted granted Critical

2017-09-13 Publication of EP2879164B1 publication Critical patent/EP2879164B1/de

Status Not-in-force legal-status Critical Current

2033-06-14 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Chemical & Material Sciences (AREA)
Ceramic Engineering (AREA)
Inorganic Chemistry (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Polishing Bodies And Polishing Tools (AREA)
Dicing (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

EP13803775.9A 2012-06-15 2013-06-14 Zerteilungsvorrichtung und zerteilungsverfahren Not-in-force EP2879164B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2012136060		2012-06-15
PCT/JP2013/066501 WO2013187510A1 (ja)	2012-06-15	2013-06-14	ダイシング装置及びダイシング方法

Publications (3)

Publication Number	Publication Date
EP2879164A1 EP2879164A1 (de)	2015-06-03
EP2879164A4 true EP2879164A4 (de)	2015-11-25
EP2879164B1 EP2879164B1 (de)	2017-09-13

Family

ID=49758328

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP13803775.9A Not-in-force EP2879164B1 (de)	2012-06-15	2013-06-14	Zerteilungsvorrichtung und zerteilungsverfahren

Country Status (6)

Country	Link
US (1)	US20150099428A1 (de)
EP (1)	EP2879164B1 (de)
JP (2)	JP5748914B2 (de)
KR (2)	KR20150004931A (de)
CN (1)	CN104364884B (de)
WO (1)	WO2013187510A1 (de)

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JP6077799B2 (ja) *	2012-08-31	2017-02-08	三星ダイヤモンド工業株式会社	カッターホイール並びにその製造方法
JP6287774B2 (ja) *	2014-11-19	2018-03-07	住友電気工業株式会社	炭化珪素半導体装置の製造方法
JP6600267B2 (ja) *	2016-03-15	2019-10-30	株式会社ディスコ	被加工物の切削方法
US10707146B2 (en) *	2016-04-21	2020-07-07	Mitsubishi Electric Corporation	Semiconductor device and method for manufacturing same, for releaved stress and high heat conductivity
WO2018066508A1 (ja) *	2016-10-05	2018-04-12	日本電気硝子株式会社	ガラス樹脂積層体の製造方法及びガラス樹脂積層体
KR102313832B1 (ko) *	2018-03-16	2021-10-15	아다만도 나미키 세이미츠 호오세키 가부시키가이샤	다이아몬드 결정의 연마 방법과 다이아몬드 결정
JP7009306B2 (ja) *	2018-05-21	2022-01-25	株式会社ディスコ	切削装置
CN113692332B (zh) *	2019-07-31	2024-06-11	马尼株式会社	牙科用金刚砂车针
JP2021040097A (ja) *	2019-09-05	2021-03-11	株式会社ディスコ	被加工物の切削方法
CN112318337A (zh) *	2019-12-20	2021-02-05	沈阳和研科技有限公司	一种砂轮划片机切割有翘曲变形玻璃的方法
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JP7394712B2 (ja) *	2020-06-24	2023-12-08	Ｔｏｗａ株式会社	切断装置及び切断品の製造方法
TWI832179B (zh) *	2022-03-22	2024-02-11	盛新材料科技股份有限公司	晶圓定位治具及使用其的晶圓加工方法
CN115026824B (zh) *	2022-06-16	2025-03-18	华北电力大学	一种临场机器人风轮叶片打磨控制方法
CN117300844B (zh) *	2023-11-28	2024-02-02	中铁工程装备集团(天津)有限公司	一种具有圆跳动检测功能的磨削设备

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2013
- 2013-06-14 CN CN201380031514.7A patent/CN104364884B/zh not_active Expired - Fee Related
- 2013-06-14 EP EP13803775.9A patent/EP2879164B1/de not_active Not-in-force
- 2013-06-14 KR KR20147034629A patent/KR20150004931A/ko not_active Ceased
- 2013-06-14 WO PCT/JP2013/066501 patent/WO2013187510A1/ja active Application Filing
- 2013-06-14 JP JP2014521434A patent/JP5748914B2/ja not_active Expired - Fee Related
- 2013-06-14 KR KR1020167003252A patent/KR102022754B1/ko not_active Expired - Fee Related
2014
- 2014-12-12 US US14/569,061 patent/US20150099428A1/en not_active Abandoned
2015
- 2015-05-11 JP JP2015096460A patent/JP5888827B2/ja not_active Expired - Fee Related

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JPH05144937A (ja) *	1991-11-18	1993-06-11	Fujitsu Miyagi Electron:Kk	ダイシングブレード
JPH06151586A (ja) *	1992-11-12	1994-05-31	Sony Corp	ダイシング方法および装置
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JP2012030992A (ja) *	2010-07-29	2012-02-16	Mitsuboshi Diamond Industrial Co Ltd	スクライビングホイール、スクライブ装置、およびスクライブ方法

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Title
See also references of WO2013187510A1 *

Also Published As

Publication number	Publication date
JPWO2013187510A1 (ja)	2016-02-08
WO2013187510A1 (ja)	2013-12-19
CN104364884B (zh)	2017-06-23
EP2879164B1 (de)	2017-09-13
US20150099428A1 (en)	2015-04-09
KR20160021904A (ko)	2016-02-26
JP2015164215A (ja)	2015-09-10
EP2879164A1 (de)	2015-06-03
KR20150004931A (ko)	2015-01-13
CN104364884A (zh)	2015-02-18
JP5748914B2 (ja)	2015-07-15
JP5888827B2 (ja)	2016-03-22
KR102022754B1 (ko)	2019-09-18

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