EP2853350A4 - Polishing pad and method for manufacturing same - Google Patents

Polishing pad and method for manufacturing same

Info

Publication number: EP2853350A4
Authority: EP; European Patent Office
Prior art keywords: polishing pad; manufacturing same; manufacturing; same; polishing
Prior art date: 2012-05-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP13793745.4A

Other languages

German (de)

French (fr)

Other versions

EP2853350A1 (en

Inventor

Bong-Su Ahn

Young-Jun Jang

Jin-Su Jeong

Sang-Mok Lee

Kee-Cheon Song

Seung-Geun Kim

Jang-Won Seo

Jeong-Seon Choo

Hak-Su Kang

Gyoung-Pyo Kong

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Samsung Electronics Co Ltd

KPX CHEMICAL CO Ltd

Original Assignee

Samsung Electronics Co Ltd

KPX CHEMICAL CO Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-05-23

Filing date

2013-02-12

Publication date

2016-01-13

2013-02-12 Application filed by Samsung Electronics Co Ltd, KPX CHEMICAL CO Ltd filed Critical Samsung Electronics Co Ltd

2015-04-01 Publication of EP2853350A1 publication Critical patent/EP2853350A1/en

2016-01-13 Publication of EP2853350A4 publication Critical patent/EP2853350A4/en

Status Withdrawn legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/16—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for close-grained structure, i.e. of high density
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Manufacturing & Machinery (AREA)
Chemical & Material Sciences (AREA)
Ceramic Engineering (AREA)
Inorganic Chemistry (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Mechanical Treatment Of Semiconductor (AREA)

EP13793745.4A 2012-05-23 2013-02-12 Polishing pad and method for manufacturing same Withdrawn EP2853350A4 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
KR1020120054523A KR101417274B1 (en)	2012-05-23	2012-05-23	Polishing pad and manufacturing method thereof
PCT/KR2013/001085 WO2013176378A1 (en)	2012-05-23	2013-02-12	Polishing pad and method for manufacturing same

Publications (2)

Publication Number	Publication Date
EP2853350A1 EP2853350A1 (en)	2015-04-01
EP2853350A4 true EP2853350A4 (en)	2016-01-13

Family

ID=49624027

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP13793745.4A Withdrawn EP2853350A4 (en)	2012-05-23	2013-02-12	Polishing pad and method for manufacturing same

Country Status (7)

Country	Link
US (1)	US20150133039A1 (en)
EP (1)	EP2853350A4 (en)
JP (1)	JP5959724B2 (en)
KR (1)	KR101417274B1 (en)
CN (1)	CN104507641B (en)
SG (1)	SG11201407257TA (en)
WO (1)	WO2013176378A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6120965B2 (en)	2013-07-05	2017-04-26	旭化成株式会社	Electrical component including insulating resin molded body and method for stabilizing flame retardancy
CN104802099B (en) *	2015-05-04	2017-07-21	华侨大学	A kind of abrading block, its preparation method and application with big filings-containing cavity
US10457790B2 (en) *	2016-04-06	2019-10-29	Kpx Chemical Co., Ltd.	Method of manufacturing polishing pad
KR101894071B1 (en)	2016-11-03	2018-08-31	에스케이씨 주식회사	Uv-curable resin composition, polishing pad and preparation method thereof
KR102608960B1 (en) *	2016-12-05	2023-12-01	삼성전자주식회사	Method of manufacturing polishing pad for manufacturing integrated circuit device
US11642752B2 (en)	2017-09-11	2023-05-09	Sk Enpulse Co., Ltd.	Porous polyurethane polishing pad and process for preparing the same
KR101949911B1 (en) *	2017-09-11	2019-02-19	에스케이씨 주식회사	Porous polyurethane polishing pad and preparation method thereof
KR102088919B1 (en) *	2017-09-11	2020-03-13	에스케이씨 주식회사	Porous polyurethane polishing pad and preparation method thereof
CN109080061B (en) *	2018-07-25	2021-06-11	南通德亿新材料有限公司	Thermoplastic elastomer foaming particle casting molding process
CN109093538A (en) *	2018-08-24	2018-12-28	成都时代立夫科技有限公司	A kind of CMP pad treatment process
KR102502516B1 (en) *	2021-03-12	2023-02-23	에스케이엔펄스 주식회사	Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same
CN113414705B (en) *	2021-07-12	2022-07-29	苏州赛尔特新材料有限公司	Large-size double-layer flexible polishing pad and preparation method and application thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1175965A2 (en) *	2000-07-25	2002-01-30	Ebara Corporation	Polishing tool, manufacturing method therefor, polishing apparatus for polishing a semiconductor wafer and method of polishing a substrate
EP1201368A2 (en) *	2000-10-24	2002-05-02	JSR Corporation	Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof
EP1357161A2 (en) *	2002-04-22	2003-10-29	JSR Corporation	Aqueous dispersion for chemical mechanical polishing
US20030220061A1 (en) *	2002-05-23	2003-11-27	Cabot Microelectronics Corporation	Microporous polishing pads
WO2004076127A1 (en) *	2003-02-21	2004-09-10	Dow Global Technologies Inc.	Method of manufacturing a fixed abrasive material
WO2010053729A1 (en) *	2008-11-04	2010-05-14	Guiselin Olivier L	Coated abrasive article for polishing or lapping applications and system and method for producing the same
WO2011041438A2 (en) *	2009-09-30	2011-04-07	Applied Materials, Inc.	Chemical mechanical planarization pad with surface characteristics

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US2216728A (en) *	1935-12-31	1940-10-08	Carborundum Co	Abrasive article and method of making the same
US2901337A (en) *	1956-07-31	1959-08-25	Union Carbide Corp	Abrasive articles and method of making the same
MY114512A (en)	1992-08-19	2002-11-30	Rodel Inc	Polymeric substrate with polymeric microelements
US5441549A (en) *	1993-04-19	1995-08-15	Minnesota Mining And Manufacturing Company	Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
US5958794A (en) *	1995-09-22	1999-09-28	Minnesota Mining And Manufacturing Company	Method of modifying an exposed surface of a semiconductor wafer
KR20010055971A (en) *	1999-12-13	2001-07-04	김진우	Polymeric polising pad
JP3490431B2 (en) *	2000-06-13	2004-01-26	東洋ゴム工業株式会社	Method for producing polyurethane foam, polyurethane foam and polishing sheet
JP2003011066A (en) *	2000-07-25	2003-01-15	Ebara Corp	Polishing tool and manufacturing method therefor
US7632434B2 (en) *	2000-11-17	2009-12-15	Wayne O. Duescher	Abrasive agglomerate coated raised island articles
US7579071B2 (en) *	2002-09-17	2009-08-25	Korea Polyol Co., Ltd.	Polishing pad containing embedded liquid microelements and method of manufacturing the same
US7074115B2 (en) *	2003-10-09	2006-07-11	Rohm And Haas Electronic Materials Cmp Holdings, Inc.	Polishing pad
US6986705B2 (en) *	2004-04-05	2006-01-17	Rimpad Tech Ltd.	Polishing pad and method of making same
TW200734379A (en) *	2005-10-31	2007-09-16	Kure Norton Co Ltd	Method of manufacturing resin bonding grinding wheel
JP4873667B2 (en) *	2009-09-18	2012-02-08	東洋ゴム工業株式会社	Polishing pad
KR101080572B1 (en)	2009-09-29	2011-11-04	삼성전자주식회사	Polishing pad and manufacturing method thereof
KR100986969B1 (en) *	2010-01-29	2010-10-11	차윤종	Microporous polyurethane material having antistatic property for polishing pad and method for preparing the same and polishing pad using the same

2012
- 2012-05-23 KR KR1020120054523A patent/KR101417274B1/en active Active
2013
- 2013-02-12 WO PCT/KR2013/001085 patent/WO2013176378A1/en active Application Filing
- 2013-02-12 EP EP13793745.4A patent/EP2853350A4/en not_active Withdrawn
- 2013-02-12 US US14/397,542 patent/US20150133039A1/en not_active Abandoned
- 2013-02-12 SG SG11201407257TA patent/SG11201407257TA/en unknown
- 2013-02-12 CN CN201380025329.7A patent/CN104507641B/en active Active
- 2013-02-12 JP JP2015508847A patent/JP5959724B2/en active Active

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1175965A2 (en) *	2000-07-25	2002-01-30	Ebara Corporation	Polishing tool, manufacturing method therefor, polishing apparatus for polishing a semiconductor wafer and method of polishing a substrate
EP1201368A2 (en) *	2000-10-24	2002-05-02	JSR Corporation	Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof
EP1357161A2 (en) *	2002-04-22	2003-10-29	JSR Corporation	Aqueous dispersion for chemical mechanical polishing
US20030220061A1 (en) *	2002-05-23	2003-11-27	Cabot Microelectronics Corporation	Microporous polishing pads
WO2004076127A1 (en) *	2003-02-21	2004-09-10	Dow Global Technologies Inc.	Method of manufacturing a fixed abrasive material
WO2010053729A1 (en) *	2008-11-04	2010-05-14	Guiselin Olivier L	Coated abrasive article for polishing or lapping applications and system and method for producing the same
WO2011041438A2 (en) *	2009-09-30	2011-04-07	Applied Materials, Inc.	Chemical mechanical planarization pad with surface characteristics

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013176378A1 *

Also Published As

Publication number	Publication date
JP5959724B2 (en)	2016-08-02
CN104507641A (en)	2015-04-08
EP2853350A1 (en)	2015-04-01
SG11201407257TA (en)	2014-12-30
JP2015514598A (en)	2015-05-21
WO2013176378A1 (en)	2013-11-28
CN104507641B (en)	2018-01-05
KR101417274B1 (en)	2014-07-09
US20150133039A1 (en)	2015-05-14
KR20130130893A (en)	2013-12-03

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EP2853350A4 (en)	2016-01-13	Polishing pad and method for manufacturing same
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Legal Events

Date	Code	Title	Description
2015-02-27	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2015-04-01	17P	Request for examination filed	Effective date: 20141028
2015-04-01	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2015-04-01	AX	Request for extension of the european patent	Extension state: BA ME
2015-06-10	RIN1	Information on inventor provided before grant (corrected)	Inventor name: KIM, SEUNG-GEUN Inventor name: KANG, HAK-SU Inventor name: LEE, SANG-MOK Inventor name: JEONG, JIN-SU Inventor name: SONG, KEE-CHEON Inventor name: SEO, JANG-WON Inventor name: AHN, BONG-SU Inventor name: KONG, GYOUNG-PYO Inventor name: JANG, YOUNG-JUN Inventor name: CHOO, JEONG-SEON
2015-08-26	DAX	Request for extension of the european patent (deleted)
2016-01-13	RA4	Supplementary search report drawn up and despatched (corrected)	Effective date: 20151216
2016-01-13	RIC1	Information provided on ipc code assigned before grant	Ipc: B24D 3/16 20060101ALI20151210BHEP Ipc: B24D 11/00 20060101AFI20151210BHEP
2019-01-23	17Q	First examination report despatched	Effective date: 20181220
2019-08-30	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2019-10-02	18D	Application deemed to be withdrawn	Effective date: 20190501