EP2845452A1 - Injection moulded circuit carrier having an integrated circuit board - Google Patents
Injection moulded circuit carrier having an integrated circuit boardInfo
- Publication number
- EP2845452A1 EP2845452A1 EP12733626.1A EP12733626A EP2845452A1 EP 2845452 A1 EP2845452 A1 EP 2845452A1 EP 12733626 A EP12733626 A EP 12733626A EP 2845452 A1 EP2845452 A1 EP 2845452A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- electronic unit
- injection
- plastic mold
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002347 injection Methods 0.000 title claims abstract description 8
- 239000007924 injection Substances 0.000 title claims abstract description 8
- 239000004033 plastic Substances 0.000 claims abstract description 44
- 229920003023 plastic Polymers 0.000 claims abstract description 44
- 239000004020 conductor Substances 0.000 claims description 52
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 101100173447 Caenorhabditis elegans ger-1 gene Proteins 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
Definitions
- the invention relates to an electronic unit with a printed circuit board integrated in an injection-molded conductor carrier, and to a hearing device with such an electronic unit.
- An injection-molded conductor support also called "molded inter- connect device” (MID) is known, consists of a spritzgegos ⁇ Senen resistant plastic mold whose surface is provided with conductor tracks.
- MID molded inter- connect device
- the injection molding process basically allows the shape of the plastic molded free to choose.
- injection-molded conductor support can be conductively connected to other electronic components, in particular a printed circuit board, and forms an electronic unit together with them.
- electronic components in particular a printed circuit board
- a hearing aid amplifies acoustic signals, which requires multiple electronic components, and all electronic components must be on a small volume be packaged, since the housing of the hearing aid for cosmetic reasons should be as small as possible.
- the production of an electronic unit, in particular a hearing aid the lowest possible cost verur- things.
- an electric machine comprising a gear housing for receiving Getriebebau ⁇ share and a printed circuit board, wherein the gear housing is made of a plastic material and tracks are integrated into the gear housing to an electrical Ver ⁇ bond with the circuit board manufacture, wherein the conductor track by means of MID technology integrated into the transmission housing is, wherein contact surfaces are arranged on at least one of the narrow side surfaces of the circuit board.
- the object of the invention is to reduce the complexity and size of an electronic unit comprising an injection-molded conductor carrier and a printed circuit board.
- the object is achieved by a device according to claim 1.
- the invention is based on the idea of a printed circuit board in an injection-molded conductor carrier in the form of a solid
- the conductor track of the printed circuit board and the conductor track of the injection-molded conductor carrier are connected by soldering and / or with the aid of electrically conductive adhesive, whereby the compound has a particularly high electrical conductivity and robustness.
- the printed circuit board is attached to the plastic mold by means of a chemical or mechanical fastening means, whereby the printed circuit board is connected to the plastic mold in a particularly robust manner.
- an electronic component is mounted directly to the plastics molding and elekt ⁇ driven conductively connected to a conductor track of the injection-molded conductor support. This approach erdale the electronic unit highly integrated and compact decor with dark ⁇ th, which simplifies their production.
- At least one surface mountable component is mounted on the printed circuit board and electrically conductively connected thereto, whereby the degree of integration of the electronic unit is further increased.
- At least one surface-mounted component is an integrated circuit, which makes it possible to electrically connect even integrated circuits with very closely spaced electrical contacts in a simple manner with a spritzgegosse ⁇ nen line carrier.
- the printed circuit board with the integrated circuit is formed as an amplifier, which may ⁇ by the electronic unit performing the function of a Verstär ⁇ kers, in particular in a hearing aid.
- at least one microphone is mounted directly to the plastics molding and is electrically conductively connected to a conductor track of the injection-molded conductor support, whereby the electronic unit can be used as micro ⁇ fonmodul, in particular in a hearing aid.
- At least one loudspeaker is attached directly to the plastic mold and electrically conductively connected to a conductor track of the injection-molded line carrier, whereby the electronic unit can be used as a loudspeaker module, in particular in a hearing aid.
- it is a hearing device, comprising an electronic unit in one of the aforementioned embodiments, whereby the degree of integration of the hearing aid is increased and it can be constructed in a particularly compact form.
- the plastic mold of the electronic unit is formed as a part of the housing of Hörge ⁇ Raets. Due to the dual function of the injection-molded cable carrier as a housing and as an essential component of the electronic unit, the hearing aid can be made particularly compact.
- Fig. 2 shows a cross section of the integrated electronic
- Fig. 3 shows a cross section through a hearing aid.
- Fig. 1 shows an integrated electronic unit 2 in ⁇ view, comprising the following components: an integrated circuit 8, mounted on a printed circuit board 7, surface-mountable components 9, which are also mounted on the Leiterplat ⁇ te 7, and an injection molded Kaussträ ⁇ ger 1 in the form of a solid plastic mold 6 with traces 4 on the surface of the plastic mold 6.
- the circuit board 7 is embedded in the plastic mold 6 and electrically connected by solder 3 with traces 4 of the injection molded conductor carrier 1.
- a microphone 5 is mounted on the plastic mold 6 and electrically connected to a conductor track 4 of the injection-molded conductor carrier 1 conductively connected so that the coming of the microphone 5 electrical signals to the electronic unit 2 happenge ⁇ leads and can be processed by this.
- an electronic unit 2 Comp ⁇ component is generally a Signalverarbei ⁇ processing unit, the tert coming from the microphone 5 and amplified signals fil ⁇ to then wei ⁇ terzu meeting to the speaker 18th
- the electronic unit 2 can therefore also be referred to as an amplifier.
- Such an amplifier typically has at least one integrated circuit 8.
- the integrated circuit 8 can be electrically connected to the circuit board 7, for example, by the flip-chip technique or wire bonding.
- further surface-mountable component 9 can be ⁇ placed on the circuit board 7, and are electrically conductively connected to it, play as examples resistors, capacitors or inductances. Additional components allow, by interconnection with the integrated circuit 8, a greater flexibility in the design of the characteristics of the amplifier. However, it is also possible to mount microphones 5, loudspeakers 18, coils or other components on the printed circuit board 7.
- At least one conductor track of the printed circuit board 16 is electrically conductively connected to at least one conductor 4 mounted on the surface of the plastic mold 6.
- This compound can be prepared for example by solder 3 or by means of electrically conductive adhesive. A wire or cable connection between circuit board te 7 and the interconnects 4 of the injection-molded conductor carrier 1 is therefore not necessary.
- the printed circuit board 7 is let into the plastic mold 6 such that the surface closes one side of the printed circuit board 7 substantially flush with the surface of the plastic mold 6 along one side of the printed circuit board 7.
- the upper ⁇ surface of the circuit board 7 is then directly with the angren ⁇ collapsing surface of the injection-molded conductor support essen- sentlichen 1 in one plane.
- the printed circuit board 7 can be easily electrically connected by flush closing with the tracks 4.
- a solder connection ⁇ upon impact, that is, without overlapping or through rings of the parts to be soldered is easily possible here because the solder joint is exposed to only low loads.
- the temperature of the built-in electronic unit 2 is exposed in a hearing aid 20 by the low elekt ⁇ generic performance and constant ambient temperature only minor fluctuations. Therefore, when soldering to the electrical connection of printed conductors of the printed circuit board 16 and on the surface of the plastic mold 6 mounted printed conductors 4 in particular no hairline cracks of the solder joint, so the solder 3 itself or between solder and conductor to be feared during regular use of the hearing aid 20.
- all common soldering methods can be used, in particular wave soldering and remelting, also known as reflow soldering.
- Injection-molded conductor supports 1 are based on a plastic mold 6, which usually consists of a thermoplastic. There ⁇ nen but coming Kings also elastomers and thermosets and when Mehrkom ⁇ -component injection molding different plastics for the production of the plastic mold 6 used. Insbesonde- re the respective plastics can be provided with metallic Additi ⁇ ven.
- the injection molding process allows great freedom in the design of the plastic mold 6, in particular it can be used as part of the housing 17 of a plastic mold. be formed bilfunkauss or a hearing aid 20. Due to the free, three-dimensional shaping injection-molded Lei ⁇ carrier 1, it is also possible to connect electronic components functionally together on a very small volume. In particular, molds with recesses in the form of a recess 10 for the admission of other components, such as a printed circuit board 7, easily made who ⁇ the.
- the printed conductors 4 can be produced, for example, by hot embossing,
- Mask exposure or laser direct structuring on the plastic mold 6 are applied.
- the laser direct structuring the areas of the surface which is provided with me ⁇ -metallic additives for plastic molding 6 with a laser serstrahl processed to serve as conductor tracks 4 later.
- the conductor tracks 4 are formed by a copper bath in which a conductive copper film is formed in the laser-processed areas. This can be further coated with other conductive materials, in particular with gold.
- various electronic components can be mounted on the injection-molded conductor carrier 1, for example, a microphone 5, or a speaker 18, but also SPU len or integrated circuits 8, whereby the electronic ⁇ specific unit 2 is compact and has a higher integration ⁇ degrees.
- the electronic components can be fixed by übli ⁇ che method on the injection-molded cable carrier 1, for example by soldering, wire bonding or connectors.
- the recess 10 in the plastic mold 6 for the circuit board 7 is designed so that the circuit board 7, the recess 10 fills the exact fit. This has the advantage that the circuit board 7 is pre-fixed in position. Furthermore, one side of the printed circuit board 7 essentially closes. Chen flush with the surrounding surface of the plastic mold 6, whereby the electrical connection of the circuit board 7 is facilitated with the injection-molded conductor carrier 1. In particular, a soldering on impact, so without overlapping or
- the printed circuit board 7 is additionally connected by adhesive 11 to the plastic mold 6.
- recess 10 for the circuit board 7 in turn recesses for adhesive 11 are formed. If these formations are filled with the correct adhesive volume, this ensures that only defined parts of the guide plate 7 are in contact with the adhesive 11. Natuer ⁇ Lich bonding of the lead plate 7 can also be made easily without the ones shown, recesses for the adhesive.
- Adhesive 11 can also be adhesive strips or mechanical fastening means such as
- Screws, wires, nails, plug or clamp connections and solder joints are used. Different fastening means can also be combined with one another.
- FIG. 3 shows a cross section through a hearing aid 20, which is designed as a behind-the-ear hearing device.
- the hearing aid 20 has an electronic unit 2, which is designed as an amplifier, and which is connected to a power source in the form of a battery 19 and two microphones 5 and a Lautspre ⁇ cher 18.
- the electronic unit 2 amplifies and filters the signals coming from the microphones 5 and forwards them to the loudspeaker 18. These electronic components are enclosed by a housing 17.
- the hearing device 20 can be equipped with an integrated device in an injection-molded conductor carrier 1.
- Strengthen unit both a behind-the-ear hearing aid as well as an in-ear hearing aid.
- it may be a Conchaieri or a so- ⁇ -called “in the canal” in an in-ear hearing aid (ITC) device, or a so-called “completely in the canal” (CIC) acting device.
- ITC in-ear hearing aid
- CIC completely in the canal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Neurosurgery (AREA)
- Otolaryngology (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Structure Of Printed Boards (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Beschreibung description
Spritzgegossener Leitungsträger mit integrierter Leiterplatte Die Erfindung betrifft eine elektronische Einheit mit einer in einen spritzgegossenen Leitungsträger integrierten Leiterplatte sowie ein Hörgerät mit einer solchen elektronischen Einheit . Ein spritzgegossener Leitungsträger, auch als „molded inter- connect device" (MID) bekannt, besteht aus einer spritzgegos¬ senen festen Kunststoffform, deren Oberfläche mit Leiterbahnen versehen ist. Das Spritzgießverfahren erlaubt grundsätzlich die Gestalt der Kunststoffform frei zu wählen. Daher sind spritzgegossenen Leitungsträger sehr gut geeignet um elektrische Schalkreise besonders kompakt zu gestalten. Ein spritzgegossener Leitungsträger kann leitend mit weiteren elektronischen Komponenten, insbesondere einer Leiterplatte, verbunden werden und bildet zusammen mit diesen eine elektro- nische Einheit. Die Notwendigkeit zur kompakten Gestaltung einer elektronischen Einheit mit einer Leiterplatte besteht in vielen technologischen Gebieten, beispielsweise bei Elektromotoren, Mobilfunkgeräten sowie Hörgeräten. Ein Hörgerät verstärkt akustische Signale, wofür mehrere elektronische Bauteile notwendig sind. Alle elektronischen Bauteile müssen auf einem kleinen Volumen verpackt werden, da das Gehäuse des Hörgeräts aus kosmetischen Gründen möglichst klein sein soll. Weiterhin soll die Produktion einer elektronischen Einheit, insbesondere eines Hörgeräts, möglichst geringe Kosten verur- Sachen. The invention relates to an electronic unit with a printed circuit board integrated in an injection-molded conductor carrier, and to a hearing device with such an electronic unit. An injection-molded conductor support, also called "molded inter- connect device" (MID) is known, consists of a spritzgegos ¬ Senen resistant plastic mold whose surface is provided with conductor tracks. The injection molding process basically allows the shape of the plastic molded free to choose. Therefore, injection-molded conductor support An injection-molded conductor carrier can be conductively connected to other electronic components, in particular a printed circuit board, and forms an electronic unit together with them.The necessity for the compact design of an electronic unit with a printed circuit board exists In many technological fields, such as electric motors, mobile phones, and hearing aids, a hearing aid amplifies acoustic signals, which requires multiple electronic components, and all electronic components must be on a small volume be packaged, since the housing of the hearing aid for cosmetic reasons should be as small as possible. Furthermore, the production of an electronic unit, in particular a hearing aid, the lowest possible cost verur- things.
Aus EP 1 662 635 A2 ist eine elektrische Maschine bekannt, umfassend ein Getriebegehäuse zur Aufnahme von Getriebebau¬ teilen und einer Leiterplatte, wobei das Getriebegehäuse aus einem Kunststoffmaterial hergestellt ist und Leiterbahnen in das Getriebegehäuse integriert sind, um eine elektrische Ver¬ bindung mit der Leiterplatte herzustellen, wobei die Leiterbahn mittels MID-Technik in das Getriebegehäuse integriert ist, wobei Kontaktflächen an wenigsten einer der schmalen Seitenflächen der Leiterplatte angeordnet sind. From EP 1 662 635 A2 an electric machine is known comprising a gear housing for receiving Getriebebau ¬ share and a printed circuit board, wherein the gear housing is made of a plastic material and tracks are integrated into the gear housing to an electrical Ver ¬ bond with the circuit board manufacture, wherein the conductor track by means of MID technology integrated into the transmission housing is, wherein contact surfaces are arranged on at least one of the narrow side surfaces of the circuit board.
Es ist Aufgabe der Erfindung die Komplexität und Größe einer elektronischen Einheit, umfassend einen spritzgegossenen Leitungsträger sowie eine Leiterplatte, zu verringern. The object of the invention is to reduce the complexity and size of an electronic unit comprising an injection-molded conductor carrier and a printed circuit board.
Die Aufgabe wird gelöst durch eine Vorrichtung nach Anspruch 1. The object is achieved by a device according to claim 1.
Die Erfindung beruht auf der Idee eine Leiterplatte in einen spritzgegossenen Leitungsträger in Gestalt einer festen The invention is based on the idea of a printed circuit board in an injection-molded conductor carrier in the form of a solid
Kunststoffform mit elektrisch leitenden Bahnen auf der Oberfläche der Kunststoffform zu integrieren, indem die Leiter- platte so in die Kunststoffform eingelassen wird, dass die Oberfläche einer Seite der Leitplatte innerhalb der Kunst¬ stoffform liegt und die Oberfläche einer Seite der Leiter¬ platte im Wesentlichen bündig mit der Oberfläche der Kunst¬ stoffform schließt, und indem zumindest eine Leiterbahn der Leiterplatte mit zumindest einer Leiterbahn des spritzgegos¬ senen Leitungsträger elektrisch leitend verbunden wird. Dadurch wird die Komplexität und Größe der elektronischen Ein¬ heit verringert sowie deren Herstellung vereinfacht. In einer weiteren Ausführungsform sind die Leiterbahn der Leiterplatte und die Leiterbahn des spritzgegossenen Leitungsträgers durch Löten und/oder mit Hilfe von elektrisch leitendem Kleber verbunden, wodurch die Verbindung eine besonders hohe elektrische Leitfähigkeit sowie Robustheit auf- weist. To incorporate plastic moldings with electrically conductive traces on the surface of the plastic form by the wire is so plate in the plastics molding admitted that the surface of one side of the baffle within the art ¬ material form is, and the surface of one side of the printed circuit ¬ plate substantially flush with the surface of the plastic ¬ form closes, and by at least one conductor of the circuit board with at least one conductor of the spritzgegos ¬ senen line carrier is electrically connected. This increases the complexity and size of the electronic ¬ A uniform is reduced and simplifies the manufacture thereof. In a further embodiment, the conductor track of the printed circuit board and the conductor track of the injection-molded conductor carrier are connected by soldering and / or with the aid of electrically conductive adhesive, whereby the compound has a particularly high electrical conductivity and robustness.
In einer weiteren Ausführungsform wird die Leiterplatte mit Hilfe von einem chemischen oder mechanischen Befestigungsmittel an der Kunststoffform befestigt, wodurch die Leiterplatte auf besonders robuste Art und Weise mit der Kunststoffform verbunden ist. In einer weiteren Ausführungsform wird ein elektronisches Bauteil direkt an der Kunststoffform angebracht und elekt¬ risch leitend mit einer Leiterbahn des spritzgegossenen Leitungsträgers verbunden. Dieses Vorgehen ermöglichst die elektronische Einheit hoch integriert und kompakt zu gestal¬ ten, wodurch sich auch ihre Herstellung vereinfacht. In a further embodiment, the printed circuit board is attached to the plastic mold by means of a chemical or mechanical fastening means, whereby the printed circuit board is connected to the plastic mold in a particularly robust manner. In another embodiment, an electronic component is mounted directly to the plastics molding and elekt ¬ driven conductively connected to a conductor track of the injection-molded conductor support. This approach ermöglichst the electronic unit highly integrated and compact decor with dark ¬ th, which simplifies their production.
In einer weiteren Ausführungsform wird wenigstens ein ober- flächenmontierbares Bauteil auf der Leiterplatte angebracht und elektrisch leitend mit dieser verbunden, wodurch der Integrationsgrad der elektronischen Einheit weiter erhöht wird. In a further embodiment, at least one surface mountable component is mounted on the printed circuit board and electrically conductively connected thereto, whereby the degree of integration of the electronic unit is further increased.
In einer weiteren Ausführungsform handelt es sich bei wenigstens einem oberflächenmontierbaren Bauteil um einen integ- rierten Schaltkreis, wodurch es möglich wird auch integrierte Schaltkreise mit sehr eng beieinander liegenden elektrischen Kontakten auf einfache Art und Weise mit einem spritzgegosse¬ nen Leitungsträger elektrisch leitend zu verbinden. In einer weiteren Ausführungsform ist die Leiterplatte mit dem integrierten Schaltkreis als Verstärker ausgebildet, wo¬ durch die elektronische Einheit die Funktion eines Verstär¬ kers, insbesondere in einem Hörgerät, erfüllen kann. In einer weiteren Ausführungsform ist wenigstens ein Mikrofon direkt an der Kunststoffform angebracht und elektrisch leitend mit einer Leiterbahn des spritzgegossenen Leitungsträgers verbunden, wodurch die elektronische Einheit als Mikro¬ fonmodul, insbesondere in einem Hörgerät, eingesetzt werden kann. In a further embodiment, at least one surface-mounted component is an integrated circuit, which makes it possible to electrically connect even integrated circuits with very closely spaced electrical contacts in a simple manner with a spritzgegosse ¬ nen line carrier. In another embodiment, the printed circuit board with the integrated circuit is formed as an amplifier, which may ¬ by the electronic unit performing the function of a Verstär ¬ kers, in particular in a hearing aid. In another embodiment, at least one microphone is mounted directly to the plastics molding and is electrically conductively connected to a conductor track of the injection-molded conductor support, whereby the electronic unit can be used as micro ¬ fonmodul, in particular in a hearing aid.
In einer weiteren Ausführungsform ist wenigstens ein Lautsprecher direkt an der Kunststoffform angebracht und elektrisch leitend mit einer Leiterbahn des spritzgegossenen Lei- tungsträgers verbunden, wodurch die elektronische Einheit als Lautsprechermodul, insbesondere in einem Hörgerät, eingesetzt werden kann. Bei einer weiteren Ausführungsform handelt es sich um ein Hörgerät, umfassend eine elektronische Einheit in eine der zuvor genannten Ausführungsformen, wodurch der Integrationsgrad des Hörgeräts erhöht wird und es in besonders kompakter Form aufgebaut werden kann. In a further embodiment, at least one loudspeaker is attached directly to the plastic mold and electrically conductively connected to a conductor track of the injection-molded line carrier, whereby the electronic unit can be used as a loudspeaker module, in particular in a hearing aid. In a further embodiment, it is a hearing device, comprising an electronic unit in one of the aforementioned embodiments, whereby the degree of integration of the hearing aid is increased and it can be constructed in a particularly compact form.
In einer weiteren Ausführungsform ist die Kunststoffform der elektronischen Einheit als ein Teil des Gehäuses des Hörge¬ räts ausgebildet. Durch die doppelte Funktion des spritzge- gossenen Leitungsträgers als Gehäuse sowie als wesentliches Bauteil der elektronischen Einheit kann das Hörgerät besonders kompakt gestaltet werden. In another embodiment, the plastic mold of the electronic unit is formed as a part of the housing of Hörge ¬ Raets. Due to the dual function of the injection-molded cable carrier as a housing and as an essential component of the electronic unit, the hearing aid can be made particularly compact.
Im Folgenden wird die Erfindung anhand der in den Figuren dargestellten Ausführungsbeispiele näher beschrieben und erläutert . In the following the invention will be described and explained in more detail with reference to the embodiments illustrated in the figures.
Es zeigen: Fig. 1 eine integrierte elektronische Einheit in Aufsicht, 1 shows an integrated electronic unit in supervision,
Fig. 2 einen Querschnitt der integrierte elektronischen Fig. 2 shows a cross section of the integrated electronic
Einheit in Seitenansicht, und Fig. 3 einen Querschnitt durch ein Hörgerät. Unit in side view, and Fig. 3 shows a cross section through a hearing aid.
Fig. 1 zeigt eine integrierte elektronische Einheit 2 in Auf¬ sicht, die folgende Bauteile aufweist: einen integrierten Schaltkreis 8, angebracht auf einer Leiterplatte 7, oberflä- chenmontierbare Bauteile 9, die ebenfalls auf der Leiterplat¬ te 7 angebracht sind, und einen spritzgegossenen Leitungsträ¬ ger 1 in Gestalt einer festen Kunststoffform 6 mit Leiterbahnen 4 auf der Oberfläche der Kunststoffform 6. Die Leiterplatte 7 ist in die Kunststoffform 6 eingelassen und durch Lötzinn 3 elektrisch leitend mit Leiterbahnen 4 des spritzgegossenen Leitungsträgers 1 verbunden. Weiterhin ist ein Mikrofon 5 auf der Kunststoffform 6 angebracht und mit einer Leiterbahn 4 des spritzgegossenen Leitungsträger 1 elektrisch leitend verbunden, so dass die vom Mikrofon 5 kommenden elektrischen Signale an die elektronische Einheit 2 weiterge¬ leitet werden und von dieser verarbeitet werden können. Bei der hier als elektronische Einheit 2 bezeichneten Kompo¬ nente handelt es sich allgemeiner um eine Signalverarbei¬ tungseinheit, die die vom Mikrofon 5 kommenden Signale fil¬ tert und verstärkt, um sie dann an den Lautsprecher 18 wei¬ terzuleiten. In der hier gezeigten Ausführungsform kann die elektronische Einheit 2 daher auch als Verstärker bezeichnet werden. Ein solcher Verstärker weist typischer Weise wenigstens einen integrierten Schaltkreis 8 auf. Der integrierte Schaltkreis 8 kann beispielsweise durch die Flip-Chip-Technik oder Draht-Bonden elektrisch mit der Leiterplatte 7 verbunden werden. Fig. 1 shows an integrated electronic unit 2 in ¬ view, comprising the following components: an integrated circuit 8, mounted on a printed circuit board 7, surface-mountable components 9, which are also mounted on the Leiterplat ¬ te 7, and an injection molded Leitungssträ ¬ ger 1 in the form of a solid plastic mold 6 with traces 4 on the surface of the plastic mold 6. The circuit board 7 is embedded in the plastic mold 6 and electrically connected by solder 3 with traces 4 of the injection molded conductor carrier 1. Furthermore, a microphone 5 is mounted on the plastic mold 6 and electrically connected to a conductor track 4 of the injection-molded conductor carrier 1 conductively connected so that the coming of the microphone 5 electrical signals to the electronic unit 2 weiterge ¬ leads and can be processed by this. When referred to herein as an electronic unit 2 Comp ¬ component is generally a Signalverarbei ¬ processing unit, the tert coming from the microphone 5 and amplified signals fil ¬ to then wei ¬ terzuleiten to the speaker 18th In the embodiment shown here, the electronic unit 2 can therefore also be referred to as an amplifier. Such an amplifier typically has at least one integrated circuit 8. The integrated circuit 8 can be electrically connected to the circuit board 7, for example, by the flip-chip technique or wire bonding.
Zusätzlich zu dem integrierten Schaltkreis 8 können weitere oberflächenmontierbare Bauteil 9 auf der Leiterplatte 7 ange¬ bracht und elektrisch leitend mit ihr verbunden werden, bei- spielsweise Widerstände, Kondensatoren oder Induktivitäten. Zusätzliche Bauelemente erlauben durch Verschaltung mit dem integrierten Schaltkreis 8 eine größere Flexibilität in der Auslegung der Eigenschaften des Verstärkers. Es können aber auch Mikrofone 5, Lautsprecher 18, Spulen oder andere Bautei- le auf der Leiterplatte 7 montiert werden. In addition to the integrated circuit 8 further surface-mountable component 9 can be ¬ placed on the circuit board 7, and are electrically conductively connected to it, play as examples resistors, capacitors or inductances. Additional components allow, by interconnection with the integrated circuit 8, a greater flexibility in the design of the characteristics of the amplifier. However, it is also possible to mount microphones 5, loudspeakers 18, coils or other components on the printed circuit board 7.
Durch das Einlassen der Leiterplatte 7 in die Kunststoffform 6 wird es möglich, die Leiterplatte 7 auf besonders einfache Art und Weise mit den Leiterbahnen 4 des spritzgegossenen Leitungsträgers 1 elektrisch leitend zu verbinden. Um dieBy admitting the circuit board 7 in the plastic mold 6, it is possible to connect the printed circuit board 7 in a particularly simple manner with the conductor tracks 4 of the injection-molded conductor carrier 1 in an electrically conductive manner. To the
Leiterplatte 7 elektrisch mit dem spritzgegossenen Leitungsträger 1 zu verbinden, wird mindestens eine Leiterbahn der Leiterplatte 16 mit mindestens einer auf der Oberfläche der Kunststoffform 6 angebrachten Leiterbahn 4 elektrisch leitend verbunden. Diese Verbindung kann beispielsweise durch Lötzinn 3 oder mit Hilfe von elektrisch leitendem Kleber hergestellt werden. Eine Draht- oder Kabelverbindung zwischen Leiterplat- te 7 und den Leiterbahnen 4 des spritzgegossenen Leitungsträgers 1 ist also nicht notwendig. To connect printed circuit board 7 electrically to the injection-molded conductor carrier 1, at least one conductor track of the printed circuit board 16 is electrically conductively connected to at least one conductor 4 mounted on the surface of the plastic mold 6. This compound can be prepared for example by solder 3 or by means of electrically conductive adhesive. A wire or cable connection between circuit board te 7 and the interconnects 4 of the injection-molded conductor carrier 1 is therefore not necessary.
Die Leiterplatte 7 ist dabei so in die Kunststoffform 6 ein- gelassen, dass die Oberfläche eine Seite der Leiterplatte 7 im Wesentlichen bündig mit der Oberfläche der Kunststoffform 6 entlang einer Seite der Leiterplatte 7 schließt. Die Ober¬ fläche der Leiterplatte 7 liegt dann mit der direkt angren¬ zenden Oberfläche des spritzgegossenen Leitungsträgers im We- sentlichen 1 in einer Ebene. Die Leiterplatte 7 kann durch bündiges Schließen besonders einfach mit den Leiterbahnen 4 elektrisch leitend verbunden werden. Insbesondere eine Löt¬ verbindung auf Stoß, d.h. ohne ein Überlappen oder Durchringen der zu verlötenden Teile ist hier problemlos möglich, da die Lötverbindung nur geringen Belastungen ausgesetzt ist. Beispielsweise ist die Temperatur der verbauten elektronischen Einheit 2 in einem Hörgerät 20 durch die geringe elekt¬ rische Leistung sowie die konstante Umgebungstemperatur nur geringen Schwankungen ausgesetzt. Daher sind beim Stoßlöten zur elektrischen Verbindung von Leiterbahnen der Leiterplatte 16 und auf der Oberfläche der Kunststoffform 6 angebrachten Leiterbahnen 4 insbesondere keine Haarrisse der Lötstelle, also des Lötzinns 3 selbst oder zwischen Lötzinn und Leiterbahn, beim regelmäßigen Gebrauch des Hörgeräts 20 zu befürch- ten. Zur elektrisch leitenden Verbindung von Leiterplatte 7 und spritzgegossenem Leitungsträger 1 können alle gängigen Lötverfahren zum Einsatz kommen, insbesondere Wellenlöten und Wiederaufschmelzlöten, auch als Reflow-Löten bekannt. Spritzgegossene Leitungsträger 1 basieren auf einer Kunststoffform 6, die meist aus einem Thermoplast besteht. Es kön¬ nen jedoch auch Elastomere und Duroplaste sowie beim Mehrkom¬ ponenten-Spritzgießen unterschiedliche Kunststoffe zur Herstellung der Kunststoffform 6 zum Einsatz kommen. Insbesonde- re können die jeweiligen Kunststoffe mit metallischen Additi¬ ven versehen sein. Das Spritzgussverfahren ermöglicht eine große Freiheit bei der Gestaltung der Kunststoffform 6, insbesondere kann sie als Bestandteil des Gehäuses 17 eines Mo- bilfunkgerätes oder eines Hörgeräts 20 ausgeformt sein. Durch die freie, dreidimensionale Formgebung spritzgegossener Lei¬ tungsträger 1 ist es außerdem möglich elektronische Bauteile auf einem sehr kleinen Volumen funktional miteinander zu ver- binden. Insbesondere können Formen mit Aussparungen in Form einer Vertiefung 10 für das Einlassen anderer Bauteile, beispielsweise einer Leiterplatte 7, problemlos hergestellt wer¬ den . Die Leiterbahnen 4 können beispielsweise durch Heißprägen,In this case, the printed circuit board 7 is let into the plastic mold 6 such that the surface closes one side of the printed circuit board 7 substantially flush with the surface of the plastic mold 6 along one side of the printed circuit board 7. The upper ¬ surface of the circuit board 7 is then directly with the angren ¬ collapsing surface of the injection-molded conductor support essen- sentlichen 1 in one plane. The printed circuit board 7 can be easily electrically connected by flush closing with the tracks 4. In particular, a solder connection ¬ upon impact, that is, without overlapping or through rings of the parts to be soldered is easily possible here because the solder joint is exposed to only low loads. For example, the temperature of the built-in electronic unit 2 is exposed in a hearing aid 20 by the low elekt ¬ generic performance and constant ambient temperature only minor fluctuations. Therefore, when soldering to the electrical connection of printed conductors of the printed circuit board 16 and on the surface of the plastic mold 6 mounted printed conductors 4 in particular no hairline cracks of the solder joint, so the solder 3 itself or between solder and conductor to be feared during regular use of the hearing aid 20. For the electrically conductive connection of printed circuit board 7 and injection-molded conductor carrier 1, all common soldering methods can be used, in particular wave soldering and remelting, also known as reflow soldering. Injection-molded conductor supports 1 are based on a plastic mold 6, which usually consists of a thermoplastic. There ¬ nen but coming Kings also elastomers and thermosets and when Mehrkom ¬-component injection molding different plastics for the production of the plastic mold 6 used. Insbesonde- re the respective plastics can be provided with metallic Additi ¬ ven. The injection molding process allows great freedom in the design of the plastic mold 6, in particular it can be used as part of the housing 17 of a plastic mold. be formed bilfunkgerätes or a hearing aid 20. Due to the free, three-dimensional shaping injection-molded Lei ¬ carrier 1, it is also possible to connect electronic components functionally together on a very small volume. In particular, molds with recesses in the form of a recess 10 for the admission of other components, such as a printed circuit board 7, easily made who ¬ the. The printed conductors 4 can be produced, for example, by hot embossing,
Maskenbelichtungsverfahren oder Laserdirektstrukturierung auf die Kunststoffform 6 aufgetragen werden. Bei der Laserdirektstrukturierung werden die Bereiche der Oberfläche der mit me¬ tallischen Additiven versehen Kunststoffform 6 mit einem La- serstrahl bearbeitet, die später als Leiterbahnen 4 dienen sollen. Dann werden die Leiterbahnen 4 durch ein Kupferbad ausgebildet, bei dem sich in den mit dem Laser bearbeiteten Bereichen ein leitender Kupferfilm bildet. Dieser kann weiter mit anderen leitenden Materialien, insbesondere mit Gold, be- schichtet werden. Mask exposure or laser direct structuring on the plastic mold 6 are applied. In the laser direct structuring the areas of the surface which is provided with me ¬-metallic additives for plastic molding 6 with a laser serstrahl processed to serve as conductor tracks 4 later. Then, the conductor tracks 4 are formed by a copper bath in which a conductive copper film is formed in the laser-processed areas. This can be further coated with other conductive materials, in particular with gold.
Weiterhin können verschiedene elektronische Bauteile auf dem spritzgegossenen Leiterträger 1 angebracht werden, beispielsweise ein Mikrofon 5 oder ein Lautsprecher 18, aber auch Spu- len oder integrierte Schaltkreise 8, wodurch die elektroni¬ sche Einheit 2 kompakter wird und einen höheren Integrations¬ grad aufweist. Die elektronischen Bauteile können durch übli¬ che Verfahren auf dem spritzgegossenen Leitungsträger 1 befestigt werden, beispielsweise durch Löten, Draht-Bonden oder durch Steckverbindungen. Further, various electronic components can be mounted on the injection-molded conductor carrier 1, for example, a microphone 5, or a speaker 18, but also SPU len or integrated circuits 8, whereby the electronic ¬ specific unit 2 is compact and has a higher integration ¬ degrees. The electronic components can be fixed by übli ¬ che method on the injection-molded cable carrier 1, for example by soldering, wire bonding or connectors.
Fig. 2 zeigt einen Querschnitt der bereits in Fig. 1 darge¬ stellten elektronischen Einheit 2. In der hier gezeigten Ausführungsform ist die Vertiefung 10 in der Kunststoffform 6 für die Leiterplatte 7 so gestaltet, dass die Leiterplatte 7 die Vertiefung 10 passgenau ausfüllt. Dies hat den Vorteil, dass die Leiterplatte 7 in ihrer Position vorfixiert ist. Weiterhin schließt eine Seite der Leiterplatte 7 im Wesentli- chen bündig mit der umliegenden Oberfläche der Kunststoffform 6, wodurch die elektrische Verbindung der Leiterplatte 7 mit dem spritzgegossenen Leitungsträger 1 erleichtert wird. Insbesondere ein Löten auf Stoß, also ohne Überlappen oder 2 shows a cross section of the already in Fig. 1 Darge ¬ presented electronic unit 2. In the embodiment shown here, the recess 10 in the plastic mold 6 for the circuit board 7 is designed so that the circuit board 7, the recess 10 fills the exact fit. This has the advantage that the circuit board 7 is pre-fixed in position. Furthermore, one side of the printed circuit board 7 essentially closes. Chen flush with the surrounding surface of the plastic mold 6, whereby the electrical connection of the circuit board 7 is facilitated with the injection-molded conductor carrier 1. In particular, a soldering on impact, so without overlapping or
Durchringen der zu verlötenden Bauteile ist dadurch problemlos möglich. Durch das passgenaue Einlassen der Leitplatte 7 in den spritzgegossenen Leitungsträger 1 ist die Lötverbindung nur geringen mechanischen Belastungen ausgesetzt und kann daher auch zur Befestigung der Leiterplatte 7 benutzt werden. Penetration of the components to be soldered is easily possible. By precisely fitting the guide plate 7 in the injection-molded conductor carrier 1, the solder joint is exposed only to low mechanical loads and can therefore also be used to attach the circuit board 7.
In der hier gezeigten Ausführungsform ist die Leiterplatte 7 jedoch zusätzlich durch Klebstoff 11 mit der Kunststoffform 6 verbunden. In der Vertiefung 10 für die Leiterplatte 7 sind wiederum Vertiefungen für Klebstoff 11 ausgeformt. Werden diese Ausformungen mit dem richtigen Klebstoffvolumen befüllt, wird dadurch sichergestellt, dass nur definierte Teile der Leitplatte 7 Kontakt mit dem Klebstoff 11 haben. Natür¬ lich kann das Kleben der Leitplatte 7 auch ohne die darge- stellten Vertiefungen für den Klebstoff erfolgen. AnstattIn the embodiment shown here, however, the printed circuit board 7 is additionally connected by adhesive 11 to the plastic mold 6. In the recess 10 for the circuit board 7 in turn recesses for adhesive 11 are formed. If these formations are filled with the correct adhesive volume, this ensures that only defined parts of the guide plate 7 are in contact with the adhesive 11. Natuer ¬ Lich bonding of the lead plate 7 can also be made easily without the ones shown, recesses for the adhesive. Instead of
Klebstoff 11 können als Befestigungsmittel auch Klebestreifen oder mechanische Befestigungsmittel wie beispielsweise Adhesive 11 can also be adhesive strips or mechanical fastening means such as
Schrauben, Drähte, Nägel, Steck- oder Klemmverbindungen sowie Lötverbindungen zum Einsatz kommen. Es können auch verschie- dene Befestigungsmittel miteinander kombiniert werden. Screws, wires, nails, plug or clamp connections and solder joints are used. Different fastening means can also be combined with one another.
Fig. 3 zeigt einen Querschnitt durch ein Hörgerät 20, das als hinter-dem-Ohr-Hörgerät ausgebildet ist. Das Hörgerät 20 weist eine elektronische Einheit 2 auf, die als Verstärker ausgelegt ist, und die mit einer Energiequelle in Form einer Batterie 19 sowie mit zwei Mikrofonen 5 und einem Lautspre¬ cher 18 verbunden ist. Die elektronische Einheit 2 verstärkt und filtert die von den Mikrofonen 5 kommenden Signale und leitet diese an den Lautsprecher 18 weiter. Diese elektroni- sehen Bauteile werden von einem Gehäuse 17 umschlossen. FIG. 3 shows a cross section through a hearing aid 20, which is designed as a behind-the-ear hearing device. The hearing aid 20 has an electronic unit 2, which is designed as an amplifier, and which is connected to a power source in the form of a battery 19 and two microphones 5 and a Lautspre ¬ cher 18. The electronic unit 2 amplifies and filters the signals coming from the microphones 5 and forwards them to the loudspeaker 18. These electronic components are enclosed by a housing 17.
Es kann sich bei dem erfindungsgemäßen Hörgerät 20 mit einer in einen spritzgegossenen Leitungsträger 1 integrierten Ver- Stärkereinheit sowohl um ein hinter-dem-Ohr-Hörgerät als auch um ein im-Ohr-Hörgerät handeln. Insbesondere kann es sich bei einem im-Ohr-Hörgerät um ein Conchageräte oder um ein soge¬ nanntes „in the canal" (ITC) Gerät, oder um ein sogenanntes „completely in the canal" (CIC) Gerät handeln. In the case of the hearing device 20 according to the invention, it can be equipped with an integrated device in an injection-molded conductor carrier 1. Strengthen unit both a behind-the-ear hearing aid as well as an in-ear hearing aid. In particular, it may be a Conchageräte or a so-¬-called "in the canal" in an in-ear hearing aid (ITC) device, or a so-called "completely in the canal" (CIC) acting device.
Obwohl die Erfindung im Detail durch die bevorzugten Ausführungsbeispiele näher illustriert und beschrieben wurde, so ist die Erfindung nicht durch die offenbarten Beispiele ein- geschränkt und andere Variationen können vom Fachmann hieraus abgeleitet werden, ohne den Schutzumfang der Erfindung zu Verlassen . While the invention has been further illustrated and described in detail by the preferred embodiments, the invention is not limited by the disclosed examples, and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.
Claims
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2012/061805 WO2013189531A1 (en) | 2012-06-20 | 2012-06-20 | Injection moulded circuit carrier having an integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2845452A1 true EP2845452A1 (en) | 2015-03-11 |
Family
ID=46506318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP12733626.1A Withdrawn EP2845452A1 (en) | 2012-06-20 | 2012-06-20 | Injection moulded circuit carrier having an integrated circuit board |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9374891B2 (en) |
| EP (1) | EP2845452A1 (en) |
| CN (1) | CN104396352A (en) |
| WO (1) | WO2013189531A1 (en) |
Cited By (1)
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|---|---|---|---|---|
| EP2910034B1 (en) | 2012-10-22 | 2016-10-19 | Sivantos Pte. Ltd. | Routing building block for complex mid structures in hearing instruments |
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| DE102015205431A1 (en) * | 2015-03-25 | 2016-09-29 | Sivantos Pte. Ltd. | Method for producing a circuit |
| EP4159144A1 (en) * | 2019-03-25 | 2023-04-05 | Erbe Elektromedizin GmbH | Fluid control assembly for a medical device |
| CN117013285B (en) * | 2023-09-28 | 2023-12-22 | 武汉嘉晨电子技术有限公司 | High-low voltage integrated connecting piece, BDU and processing method thereof |
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- 2012-06-20 EP EP12733626.1A patent/EP2845452A1/en not_active Withdrawn
- 2012-06-20 US US14/410,280 patent/US9374891B2/en active Active
- 2012-06-20 WO PCT/EP2012/061805 patent/WO2013189531A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| US9374891B2 (en) | 2016-06-21 |
| WO2013189531A1 (en) | 2013-12-27 |
| CN104396352A (en) | 2015-03-04 |
| US20150208497A1 (en) | 2015-07-23 |
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