EP2818579A4 - Metal material, and surface treatment method and device - Google Patents

Metal material, and surface treatment method and device

Info

Publication number: EP2818579A4
Authority: EP; European Patent Office
Prior art keywords: metal material; surface treatment; treatment method; metal; treatment
Prior art date: 2012-02-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP13752521.8A

Other languages

German (de)

French (fr)

Other versions

EP2818579A1 (en

Inventor

Masayasu Nagoshi

Kaoru Sato

Hisato Noro

Kazuhiko Baba

Seiichi Watanabe

Souki Yoshida

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JFE Steel Corp

Original Assignee

JFE Steel Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-02-24

Filing date

2013-02-21

Publication date

2015-11-11

2013-02-21 Application filed by JFE Steel Corp filed Critical JFE Steel Corp

2014-12-31 Publication of EP2818579A1 publication Critical patent/EP2818579A1/en

2015-11-11 Publication of EP2818579A4 publication Critical patent/EP2818579A4/en

Status Withdrawn legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/06—Etching of iron or steel

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Engineering & Computer Science (AREA)
Other Surface Treatments For Metallic Materials (AREA)
ing And Chemical Polishing (AREA)
Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Electrolytic Production Of Metals (AREA)
Electroluminescent Light Sources (AREA)

EP13752521.8A 2012-02-24 2013-02-21 Metal material, and surface treatment method and device Withdrawn EP2818579A4 (en)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP2012038555		2012-02-24
JP2012038553		2012-02-24
JP2012038557		2012-02-24
PCT/JP2013/054413 WO2013125658A1 (en)	2012-02-24	2013-02-21	Metal material, and surface treatment method and device

Publications (2)

Publication Number	Publication Date
EP2818579A1 EP2818579A1 (en)	2014-12-31
EP2818579A4 true EP2818579A4 (en)	2015-11-11

Family

ID=49005835

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP13752521.8A Withdrawn EP2818579A4 (en)	2012-02-24	2013-02-21	Metal material, and surface treatment method and device

Country Status (7)

Country	Link
EP (1)	EP2818579A4 (en)
JP (1)	JP5817907B2 (en)
KR (1)	KR101687462B1 (en)
CN (1)	CN104114747A (en)
IN (1)	IN2014KN01697A (en)
TW (1)	TWI472424B (en)
WO (1)	WO2013125658A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6498091B2 (en) *	2015-09-25	2019-04-10	Ｊｘ金属株式会社	Surface-treated metal foil, laminate, printed wiring board, semiconductor package, electronic equipment
US11541516B2 (en) *	2019-09-25	2023-01-03	Snap-On Incorporated	Fastener retention and anti-camout tool bit
CN111805022A (en) *	2020-06-04	2020-10-23	南方科技大学	Plasma-assisted electrolytic machining method and implementation device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH06297252A (en) *	1993-04-09	1994-10-25	Sony Corp	Fine work method and device therefor
JPH09241865A (en) *	1996-03-01	1997-09-16	Kawasaki Steel Corp	Laminated steel sheet excellent in film adhesion and corrosion resistance
WO2002015245A2 (en) *	2000-08-10	2002-02-21	Nutool, Inc.	Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
WO2002038827A1 (en) *	2000-11-08	2002-05-16	Chang, Chak, Man, Thomas	Plasma electroplating
EP1598138A1 (en) *	2004-05-21	2005-11-23	Fuji Photo Film Co., Ltd.	Method for providing surface texturing of aluminium sheet, substrate for lithographic plate and lithographic plate
JP2008075064A (en) *	2006-08-21	2008-04-03	Kobe Steel Ltd	Water-repellent coating and water-repellent metal sheet
EP2112670A1 (en) *	2007-02-15	2009-10-28	National University Corporation Hokkaido University	Method for producing conductor fine particles
EP2133448A1 (en) *	2007-03-02	2009-12-16	The Furukawa Electric Co., Ltd.	Production method and device of surface roughened copper plate, and surface roughened copper plate
JP2010287648A (en) *	2009-06-10	2010-12-24	Seiko Epson Corp	Manufacturing method of semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59227241A (en) *	1983-06-09	1984-12-20	Taishi Shokuhin Kogyo Kk	Preparation of lactified soya milk
JPH04136198A (en) *	1990-09-26	1992-05-11	Nau Chem:Yugen	Method of electroplating
EP1371748A4 (en) *	2001-03-14	2009-07-29	Nippon Mining Co	SPRAY TARGET, SUPPORT PLATE OR APPARATUS IN SPRAY DEVICE PRODUCING VERY LITTLE PARTICLES, AND ELECTRIC DISCHARGE MACHINE RUGOSIFICATION METHOD
JP5569259B2 (en) *	2010-08-26	2014-08-13	Ｊｆｅスチール株式会社	Method for producing surface-modified conductive material
CN102041540A (en) *	2011-01-13	2011-05-04	中国科学院苏州纳米技术与纳米仿生研究所	Anodic aluminum oxide template with three-dimensional gradual-changed hole array nanostructure and preparation method of anodic aluminum oxide template

2013
- 2013-02-21 KR KR1020147022776A patent/KR101687462B1/en active IP Right Grant
- 2013-02-21 JP JP2014500933A patent/JP5817907B2/en active Active
- 2013-02-21 CN CN201380009686.4A patent/CN104114747A/en active Pending
- 2013-02-21 EP EP13752521.8A patent/EP2818579A4/en not_active Withdrawn
- 2013-02-21 IN IN1697KON2014 patent/IN2014KN01697A/en unknown
- 2013-02-21 WO PCT/JP2013/054413 patent/WO2013125658A1/en active Application Filing
- 2013-02-23 TW TW102106374A patent/TWI472424B/en not_active IP Right Cessation

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH06297252A (en) *	1993-04-09	1994-10-25	Sony Corp	Fine work method and device therefor
JPH09241865A (en) *	1996-03-01	1997-09-16	Kawasaki Steel Corp	Laminated steel sheet excellent in film adhesion and corrosion resistance
WO2002015245A2 (en) *	2000-08-10	2002-02-21	Nutool, Inc.	Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
WO2002038827A1 (en) *	2000-11-08	2002-05-16	Chang, Chak, Man, Thomas	Plasma electroplating
EP1598138A1 (en) *	2004-05-21	2005-11-23	Fuji Photo Film Co., Ltd.	Method for providing surface texturing of aluminium sheet, substrate for lithographic plate and lithographic plate
JP2008075064A (en) *	2006-08-21	2008-04-03	Kobe Steel Ltd	Water-repellent coating and water-repellent metal sheet
EP2112670A1 (en) *	2007-02-15	2009-10-28	National University Corporation Hokkaido University	Method for producing conductor fine particles
EP2133448A1 (en) *	2007-03-02	2009-12-16	The Furukawa Electric Co., Ltd.	Production method and device of surface roughened copper plate, and surface roughened copper plate
JP2010287648A (en) *	2009-06-10	2010-12-24	Seiko Epson Corp	Manufacturing method of semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013125658A1 *

Also Published As

Publication number	Publication date
CN104114747A (en)	2014-10-22
KR20140112559A (en)	2014-09-23
TWI472424B (en)	2015-02-11
KR101687462B1 (en)	2016-12-16
EP2818579A1 (en)	2014-12-31
JP5817907B2 (en)	2015-11-18
TW201341176A (en)	2013-10-16
JPWO2013125658A1 (en)	2015-07-30
IN2014KN01697A (en)	2015-10-23
WO2013125658A1 (en)	2013-08-29

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Legal Events

Date	Code	Title	Description
2014-11-28	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2014-12-31	17P	Request for examination filed	Effective date: 20140917
2014-12-31	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2014-12-31	AX	Request for extension of the european patent	Extension state: BA ME
2015-06-03	DAX	Request for extension of the european patent (deleted)
2015-08-05	RIC1	Information provided on ipc code assigned before grant	Ipc: C23C 26/00 20060101AFI20150702BHEP Ipc: B23H 1/00 20060101ALI20150702BHEP Ipc: C25D 3/02 20060101ALI20150702BHEP Ipc: C25D 5/02 20060101ALI20150702BHEP
2015-11-11	RA4	Supplementary search report drawn up and despatched (corrected)	Effective date: 20151009
2015-11-11	RIC1	Information provided on ipc code assigned before grant	Ipc: B23H 1/00 20060101ALI20151005BHEP Ipc: C25D 5/02 20060101ALI20151005BHEP Ipc: C23C 26/00 20060101AFI20151005BHEP Ipc: C25D 3/02 20060101ALI20151005BHEP
2017-10-13	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN
2017-11-15	18W	Application withdrawn	Effective date: 20171009