EP2730153A1 - Arrangement for cooling subassemblies of an automation or control system - Google Patents
Arrangement for cooling subassemblies of an automation or control systemInfo
- Publication number
- EP2730153A1 EP2730153A1 EP12735785.3A EP12735785A EP2730153A1 EP 2730153 A1 EP2730153 A1 EP 2730153A1 EP 12735785 A EP12735785 A EP 12735785A EP 2730153 A1 EP2730153 A1 EP 2730153A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat
- circuit board
- temperature
- arrangement according
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 37
- 239000002918 waste heat Substances 0.000 claims abstract description 25
- 230000035945 sensitivity Effects 0.000 claims abstract description 4
- 230000000712 assembly Effects 0.000 claims description 20
- 238000000429 assembly Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims 1
- 238000004891 communication Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
Definitions
- the invention relates to an arrangement for cooling assemblies of an automation or control system, also referred to as a cooling device, which are used in particular for controlling and / or monitoring of outdoor facilities, such as a wind turbine.
- the aforementioned automation devices include, for example, central processing units, communication modules or couplers, bus modules and input / output units.
- Automation systems for controlling a technical process comprise a plurality of assemblies or devices, which usually include a central control unit, also called a central unit, communication modules and input / output units.
- a central control unit also called a central unit
- communication modules and input / output units.
- the assemblies of an automation system are, as described for example in EP 2187279 A1, constructed of printed circuit boards on which various electronic components, such as processors, memory modules and other active and passive electronic components are arranged.
- the operation of the modules leads through the power loss of arranged thereon current-carrying components to a heating of the module or the components arranged thereon.
- cooling devices are, for example, fans which in the housing build up a flow of air which circulates or flows through the electrical components and assemblies and thus cause a dissipation of the power loss or heat generated.
- the invention has for its object an arrangement for cooling of assemblies of, in particular outdoor suitable, automation or control system specify, which takes into account the different waste heat of arranged on a circuit board various types of electronic components and temperature-sensitive components protects against the waste heat of other components so To avoid a failure or destruction of the modules, especially in harsh climatic conditions.
- the arrangement according to the invention for cooling assemblies should furthermore make it possible to use standard components in the assemblies of an automation or control system operating under extreme climatic conditions and to avoid the use of special cost-intensive, temperature-insensitive components.
- This object is achieved by an arrangement for cooling assemblies of an automation or control system with the features specified in claim 1 and is particularly suitable for assemblies that are used for control and / or monitoring in outdoor facilities.
- the modules include, for example, central processing units, communication modules or couplers, bus modules and input / output units, which are constructed from so-called standard components, such as CPU, RAM and flash memory.
- the arrangement according to the invention for cooling assemblies of an automation or control system is provided for assemblies of a particular outdoor suitable automation or control system.
- the assemblies are constructed of at least one printed circuit board with electronic components of different temperature sensitivity and waste heat radiation arranged thereon, wherein the printed circuit board has at least one first subarea for temperature-sensitive components and at least one second subarea for temperature-insensitive components which dissipate heat to a considerable degree.
- the means listed below are provided which keep the heat generated by the power loss of the current-carrying components from the temperature-sensitive components arranged on the printed circuit board in a suitable manner.
- a first means relates to the formation of spaces between the first portion and the second portion, the spaces each forming a heat insulating trench.
- the means is formed as between the first and the second portion disposed heat barriers, which form a thermal insulation between the sub-areas.
- the separation trenches are made on the circuit board, for example, by "cutting" the surface, whereby a heat separation is achieved by the separation of the copper.
- the first portion is separated by a Querfräsung the printed circuit board material or by a targeted interruption of the conductor tracks from the second region, so as to form a heat-decoupled region on the circuit board.
- the means of at least one first heat sink whose cooling elements are arranged directly above the temperature-sensitive components, and at least a second heat sink formed over the waste heat-generating temperature-insensitive components is arranged, wherein the heat sink dissipate the waste heat over the respective components in a suitable manner.
- the cooling surfaces of the heat sinks which are each designed as separate parts, are adapted in accordance with the accumulated waste heat above the respective component in such a way that sufficient dissipation of the waste heat over the respective components is made possible.
- the first heat sink is preferably a heat sink whose cooling surface is located directly above or in the immediate vicinity of the temperature-sensitive components.
- the heat sink is preferably made in relation to other materials for heatsinks lightweight and inexpensive aluminum.
- the assemblies are used in offshore wind farms, it proves to be advantageous to manufacture the heat sink made of copper, since copper has better resistance to salt.
- the aforementioned measures can also be realized on the second heat sink.
- the second heat sink which is arranged, for example, over a processor and absorbs its waste heat, has a cooling surface on which elevations, such as cooling fins, are arranged.
- the heat sink is embodied as a so-called cooling block with depressions or depressions arranged thereon for better dissipation of the heat released by the processor.
- the first heat sink which extends over the temperature-sensitive components, is spaced from the circuit board LP by at least two, but preferably a plurality of heat-conducting elements or contacts.
- the heat-conducting contacts are formed from connecting elements and spacers pushed thereon.
- the second heat sink is connected by means of a suitable adhesive to the circuit board.
- the combination of the various heat sinks over the areas of the printed circuit board with differently dissipated waste heat, with the heat dissipating contacts which define the heat sinks over the printed circuit board in a defined Keep a distance and thus ensure optimum heat dissipation, a removal of waste heat from the circuit board reaches before it reaches the temperature-sensitive components.
- FIG. 1 shows an exemplary embodiment of an outdoor-suitable communication module with the cooling device according to the invention, which enables the use of the communication module made of standard components in outdoor systems up to a temperature range of about 70 ° C.
- the communication module is constructed from a printed circuit board LP, on which the electronic components required for its function, such as a processor 5, memory elements 6, a connector 7 and a power supply 8 are arranged. If the communication module is put into operation, some components emit waste heat to a considerable degree. In particular, the processor 5 develops a not inconsiderable waste heat during its operation, which in particular can destroy the flash memory 6 arranged in the vicinity of the processor 5.
- an arrangement which realizes different temperature ranges on the printed circuit board LP. This is achieved by subdividing the printed circuit board LP into at least two subregions, wherein components which emit high levels of waste heat (eg processors) are arranged in a first subarea and components which emit only little waste heat (eg flash memory) in a second subarea are arranged.
- components which emit high levels of waste heat eg processors
- components which emit only little waste heat eg flash memory
- the arrangement for dissipating the waste heat arising during operation of the communication module further comprises a first heat sink 1 and a second heat sink 2, preferably designed as a heat sink 1.
- the cooling plate 1 extends over the temperature-sensitive components 6, 8 and is held by means of at least two, but preferably a plurality of heat-conducting elements or contacts 3, 4 on the circuit board LP.
- the heat-conducting contacts 3, 4 are preferably formed from screws 4, which are first performed by provided in the circuit board LP openings 9.1. About the screws 4 spacers 3 are pushed. On the screws 4 and the spacers 3 slid thereon, the cooling plate 1 is applied by means provided for further openings 9.2 and secured in a suitable manner.
- the heat is transferred via the contacts made of heat-conducting metallic material, in particular via metallic spacers from the printed circuit board LP directly to the first heat sink 1.
- the second heat sink 2 has a cooling surface with elevations 2.1 arranged thereon, for example cooling ribs, whereby the cooling area of the second heat sink 2 is increased.
- the cooling body 2 is embodied as a so-called cooling block with depressions or depressions arranged thereon for better dissipation of the heat emitted by the processor 5.
- the waste heat from the circuit board LP is dissipated before it reaches the temperature-sensitive components 6, 8 and so from the processor. 5 emitted heat over the temperature-sensitive devices 6, 8 kept away in a suitable manner.
- the printed circuit board areas equipped with the waste heat-generating components can be thermally decoupled from the circuit board areas equipped with the heat-sensitive components.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Arrangement for cooling assemblies of an automation or
Steuerungssvstems Steuerungssvstems
Beschreibung description
Die Erfindung betrifft eine Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems, auch als Kühleinrichtung bezeichnet, welche insbesondere zur Steuerung und/oder Überwachung von Outdoor- Anlagen, wie beispielsweise einer Windkraftanlage, eingesetzt werden. Zu den vorgenannten Automatisierungsgeräten zählen beispielsweise Zentraleinheiten, Kommunikationsmodule bzw. -koppler, Busmodule und Ein-/ Ausgabeeinheiten. The invention relates to an arrangement for cooling assemblies of an automation or control system, also referred to as a cooling device, which are used in particular for controlling and / or monitoring of outdoor facilities, such as a wind turbine. The aforementioned automation devices include, for example, central processing units, communication modules or couplers, bus modules and input / output units.
Automatisierungssysteme zur Steuerung eines technischen Prozesses umfassen eine Vielzahl von Baugruppen oder Geräten, zu denen üblicherweise eine zentrale Steuereinheit, auch Zentraleinheit genannt, Kommunikationsmodule und Ein-/ Ausgabeeinheiten gehören. Automation systems for controlling a technical process comprise a plurality of assemblies or devices, which usually include a central control unit, also called a central unit, communication modules and input / output units.
Die Baugruppen eines Automatisierungssystems sind, wie beispielsweise in der EP 2187279 A1 beschrieben, aus Leiterplatten aufgebaut, auf denen verschiedene elektronische Bauelemente, wie Prozessoren, Speicherbausteine sowie weitere aktive und passive elektronische Bauelemente angeordnet sind. The assemblies of an automation system are, as described for example in EP 2187279 A1, constructed of printed circuit boards on which various electronic components, such as processors, memory modules and other active and passive electronic components are arranged.
Der Betrieb der Baugruppen führt durch die Verlustleistung der darauf angeordneten stromdurchflossenen Bauelemente zu einer Erwärmung der Baugruppe bzw. der darauf angeordneten Bauelemente. The operation of the modules leads through the power loss of arranged thereon current-carrying components to a heating of the module or the components arranged thereon.
BESTÄTIGUNGSKOPIE Insbesondere Prozessoren entwickeln während ihres Betriebes eine nicht unerhebliche Abwärme, welche benachbarte temperaturempfindliche Bauelemente, wie Speicherbausteine, zerstören kann. CONFIRMATION COPY In particular processors develop during their operation a considerable waste heat, which adjacent temperature-sensitive components, such as memory modules, can destroy.
Da elektrische Standardbauelemente für technische Geräte nur einen begrenzt zulässigen Betriebstemperaturbereich aufweisen, werden diese durch Kühleinrichtungen gekühlt. Diese Kühleinrichtungen sind beispielsweise Ventilatoren, die in dem Gehäuse eine die elektrischen Bauelemente und Baugruppen um- bzw. durchströmende Luftströmung aufbauen und somit ein Abführen der erzeugten Verlustleistung bzw. Wärme bewirken. Since electrical standard components for technical devices have only a limited permissible operating temperature range, they are cooled by cooling devices. These cooling devices are, for example, fans which in the housing build up a flow of air which circulates or flows through the electrical components and assemblies and thus cause a dissipation of the power loss or heat generated.
Für besondere Anwendungsfälle, beispielsweise für Steuerungen, die unter extremen Klimabedingungen eingesetzt werden, reichen diese Maßnahmen oft nicht aus, um eine vertretbare Lebensdauer der Geräte zu gewährleisten bzw. um den unzulässigen Betrieb von Bauelementen in zulässigen Umgebungstemperaturbereich zu verhindern. Auch besteht nicht immer die Möglichkeit beispielsweise Ventilatoren in geeigneter weise zu montieren. Um Steuerungssysteme in besonders rauen Umgebungsbedingungen zu betreiben, werden die in den eingesetzten Baugruppen verwendeten Standardbauelemente, die meist nur dem Industriestandard genügen und für eine Temperatur bis ca. 60°C vorgesehen sind, durch kostenintensive jedoch rauen Umgebungsbedingungen standhaltenden Bauelemente ersetzt, welche auch bei Temperaturen von ca. 70°C nicht zerstört werden. For special applications, for example, for controls that are used in extreme climates, these measures are often not sufficient to ensure a reasonable life of the devices or to prevent the improper operation of components in the allowable ambient temperature range. Also, there is not always the possibility, for example, to install fans in a suitable manner. In order to operate control systems in particularly harsh environmental conditions, the standard components used in the modules used, which usually meet only the industry standard and are provided for a temperature up to 60 ° C, replaced by costly but harsh environmental conditions-preserving components, which also at temperatures of about 70 ° C are not destroyed.
Der Erfindung liegt die Aufgabe zugrunde eine Anordnung zum Kühlen von Baugruppen eines, insbesondere outdoor- geeigneten, Automatisierungs- oder Steuerungssystems anzugeben, welche die unterschiedliche Abwärme der auf einer Leiterplatte angeordneten verschiedenartigen elektronischen Bauelemente berücksichtigt und temperaturempfindliche Bauelemente vor der Abwärme anderer Bauelemente schützt, um so einen Ausfall oder eine Zerstörung der Baugruppen, insbesondere unter rauen klimatischen Bedingungen, zu vermeiden. Die erfindungsgemäße Anordnung zum Kühlen von Baugruppen soll weiterhin ermöglichen, in den Baugruppen eines unter extremen Klimabedienungen arbeitenden Automatisierungs- oder Steuerungssystems Standardbauelemente zu verwenden und den Einsatz spezieller kostenintensiver temperaturunempfindlicherer Bauelemente vermeiden. Diese Aufgabe wird erfindungsgemäß durch eine Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems mit den im Anspruch 1 angegebenen Merkmalen gelöst und ist insbesondere für Baugruppen geeignet, die zur Steuerung und/oder Überwachung in Outdoor- Anlagen eingesetzt werden. Zu den Baugruppen zählen beispielsweise Zentraleinheiten, Kommunikationsmodule bzw. -koppler, Busmodule und Ein-/ Ausgabeeinheiten, welche aus sogenannten Standardbauelementen, wie beispielsweise CPU, RAM und Flash- Speicher aufgebaut sind. The invention has for its object an arrangement for cooling of assemblies of, in particular outdoor suitable, automation or control system specify, which takes into account the different waste heat of arranged on a circuit board various types of electronic components and temperature-sensitive components protects against the waste heat of other components so To avoid a failure or destruction of the modules, especially in harsh climatic conditions. The arrangement according to the invention for cooling assemblies should furthermore make it possible to use standard components in the assemblies of an automation or control system operating under extreme climatic conditions and to avoid the use of special cost-intensive, temperature-insensitive components. This object is achieved by an arrangement for cooling assemblies of an automation or control system with the features specified in claim 1 and is particularly suitable for assemblies that are used for control and / or monitoring in outdoor facilities. The modules include, for example, central processing units, communication modules or couplers, bus modules and input / output units, which are constructed from so-called standard components, such as CPU, RAM and flash memory.
Vorteilhafte Ausgestaltungen und Verbesserungen der erfindungsgemäßen Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems sind in weiteren Ansprüchen und in der Beschreibung angegeben. Advantageous embodiments and improvements of the arrangement according to the invention for cooling assemblies of an automation or control system are specified in further claims and in the description.
Die erfindungsgemäße Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystem ist für Baugruppen eines insbesondere outdoor- geeigneten Automatisierungs- oder Steuerungssystems vorgesehen. Die Baugruppen sind aus wenigstens einer Leiterplatte mit darauf angeordneten elektronischen Bauelementen unterschiedlicher Temperaturempfindlichkeit und Abwärmeabstrahlung aufgebaut, wobei die Leiterplatte wenigstens einen ersten Teilbereich für temperaturempfindliche Bauelemente und wenigstens einen zweiten Teilbereich für temperaturunempfindliche in nicht unerheblichem Maße Abwärme abgebende Bauelemente aufweist. The arrangement according to the invention for cooling assemblies of an automation or control system is provided for assemblies of a particular outdoor suitable automation or control system. The assemblies are constructed of at least one printed circuit board with electronic components of different temperature sensitivity and waste heat radiation arranged thereon, wherein the printed circuit board has at least one first subarea for temperature-sensitive components and at least one second subarea for temperature-insensitive components which dissipate heat to a considerable degree.
Erfindungsgemäß sind die nachfolgend aufgeführten Mittel vorgesehen, welche die durch die Verlustleistung der stromdurchflossenen Bauelemente entstehende Wärme von den auf der Leiterplatte angeordneten temperaturempfindlichen Bauelementen in geeigneter Weise fernhalten. According to the invention, the means listed below are provided which keep the heat generated by the power loss of the current-carrying components from the temperature-sensitive components arranged on the printed circuit board in a suitable manner.
Ein erstes Mittel betrifft die Bildung bzw. Anordnung von Zwischenräumen zwischen dem ersten Teilbereich und dem zweiten Teilbereich, wobei die Zwischenräume jeweils einen Wärmeisoliergraben bilden. Beispielsweise ist das Mittel als zwischen dem ersten und dem zweiten Teilbereich angeordnete Hitzebarrieren gebildet, welche eine thermische Isolation zwischen den Teilbereichen bilden. Vorzugsweise werden die Trenngräben auf der Leiterplatte hergestellt, beispielsweise durch„Einschneiden" der Oberfläche, wodurch durch das Auftrennen des Kupfers eine Wärme-Trennung erreicht wird. A first means relates to the formation of spaces between the first portion and the second portion, the spaces each forming a heat insulating trench. For example, the means is formed as between the first and the second portion disposed heat barriers, which form a thermal insulation between the sub-areas. Preferably, the separation trenches are made on the circuit board, for example, by "cutting" the surface, whereby a heat separation is achieved by the separation of the copper.
In einer vorteilhaften Ausführungsform der Erfindung ist der erste Teilbereich durch eine Querfräsung des Leiterplattenmaterials oder durch eine gezielte Unterbrechung der Leiterbahnen vom zweiten Bereich getrennt, um so einen wärmeentkoppelten Bereich auf der Leiterplatte zu bilden. In an advantageous embodiment of the invention, the first portion is separated by a Querfräsung the printed circuit board material or by a targeted interruption of the conductor tracks from the second region, so as to form a heat-decoupled region on the circuit board.
Weiterhin können die vorgesehenen Wärmeisoliergräben entweder ungefüllt oder mit einem wärmeisolierenden Füllmaterial gefüllt bzw. als Vertiefung oder Senke ausgebildet sein. Furthermore, the proposed Wärmeisoliergräben either unfilled or filled with a heat-insulating filler or formed as a depression or depression.
In einer weiteren vorteilhaften Ausführungsform der erfindungsgemäßen Anordnung zum Kühlen von Baugruppen des Automatisierungs- oder Steuerungssystems ist das Mittel aus wenigstens einem ersten Kühlkörper, dessen Kühlelemente direkt über den temperaturempfindlichen Bauelementen angeordnet sind, und aus wenigstens einem zweitem Kühlkörper gebildet, der über den abwärmeerzeugenden temperaturunempfindlichen Bauelementen angeordnet ist, wobei die Kühlkörper die anfallende Abwärme über den jeweiligen Bauelementen in geeigneter Weise abführen. In a further advantageous embodiment of the arrangement according to the invention for cooling assemblies of the automation or control system, the means of at least one first heat sink whose cooling elements are arranged directly above the temperature-sensitive components, and at least a second heat sink formed over the waste heat-generating temperature-insensitive components is arranged, wherein the heat sink dissipate the waste heat over the respective components in a suitable manner.
Die Kühlflächen der als jeweils separate Teile ausgeführten Kühlkörper sind entsprechend der anfallenden Abwärme über dem jeweiligen Bauelement so angepasst, dass eine ausreichende Abführung der Abwärme über dem jeweiligen Bauelemente ermöglicht ist. The cooling surfaces of the heat sinks, which are each designed as separate parts, are adapted in accordance with the accumulated waste heat above the respective component in such a way that sufficient dissipation of the waste heat over the respective components is made possible.
Der erste Kühlkörper ist vorzugsweise ein Kühlblech, dessen Kühlfläche sich direkt über oder in unmittelbarer Nachbarschaft der temperaturempfindlichen Bauelementen befindet. Das Kühlblech ist in bevorzugter Weise aus im Verhältnis zu anderen Materialien für Kühlbleche leichtem und kostengünstigem Aluminium gefertigt. Werden die Baugruppen jedoch in Offshore- Windanlagen eingesetzt, erweist es sich als vorteilhaft das Kühlblech aus Kupfer zu fertigen, da Kupfer bessere Beständigkeit gegenüber Salz aufweist. Die vorab genannten Maßnahmen lassen sich auch auf dem zweiten Kühlkörper verwirklichen. Der zweite Kühlkörper, der beispielsweise über einem Prozessor angeordnet ist und dessen Abwärme aufnimmt, weist eine Kühlfläche auf, auf der Erhebungen, wie beispielsweise Kühlrippen, angeordnet sind. The first heat sink is preferably a heat sink whose cooling surface is located directly above or in the immediate vicinity of the temperature-sensitive components. The heat sink is preferably made in relation to other materials for heatsinks lightweight and inexpensive aluminum. However, if the assemblies are used in offshore wind farms, it proves to be advantageous to manufacture the heat sink made of copper, since copper has better resistance to salt. The aforementioned measures can also be realized on the second heat sink. The second heat sink, which is arranged, for example, over a processor and absorbs its waste heat, has a cooling surface on which elevations, such as cooling fins, are arranged.
In einer vorteilhaften Ausführungsform ist der Kühlkörper als sogenannter Kühlblock mit darauf angeordneten Senken oder Vertiefungen zur besseren Ableitung der vom Prozessor abgegebenen Wärme ausgeführt. In an advantageous embodiment, the heat sink is embodied as a so-called cooling block with depressions or depressions arranged thereon for better dissipation of the heat released by the processor.
So wird eine Zerstörung der temperaturempfindlichen Bauelemente durch Abwärme benachbarter Bauelemente vermieden, da der als separates Teil ausgeführte zweite Kühlkörper eine direkte Verbindung mit dem die temperaturempfindlichen Bauelemente abdeckendem Kühlblech vermeidet. Thus, destruction of the temperature-sensitive components is avoided by waste heat of adjacent components, since the executed as a separate part second heat sink avoids a direct connection with the temperature-sensitive components covering the heat sink.
Der erste Kühlkörper, der sich über die temperaturempfindlichen Bauelemente erstreckt, ist mittels wenigstens zwei, vorzugsweise jedoch mehreren wärmeleitenden Elementen oder Kontakten von der Leiterplatte LP beabstandet. Die wärmeleitenden Kontakte sind aus Verbindungselementen und darauf aufgeschobenen Distanzstücken gebildet. The first heat sink, which extends over the temperature-sensitive components, is spaced from the circuit board LP by at least two, but preferably a plurality of heat-conducting elements or contacts. The heat-conducting contacts are formed from connecting elements and spacers pushed thereon.
Vorzugsweise wird der zweite Kühlkörper mittels eines geeigneten Klebers mit der Leiterplatte verbunden. Preferably, the second heat sink is connected by means of a suitable adhesive to the circuit board.
Zusätzlich zu den zwischen den auf der Leiterplatte gebildeten unterschiedlichen Temperaturbereichen, die durch Wärmeisoliergraben voneinander getrennt sind, wird durch die Kombination der verschiedener Kühlkörper über den Bereichen der Leiterplatte mit unterschiedlich abgegebener Abwärme, mit den wärmeableitenden Kontakten, welche die Kühlkörper über der Leiterplatte in einem definierten Abstand halten und so eine optimale Wärmeableitung gewährleisten, ein Abführen der Abwärme von der Leiterplatte erreicht bevor diese die temperaturempfindlichen Bauelemente erreicht. Somit ermöglicht die erfindungsgemäße Anordnung zum Kühlen von Baugruppen in einem unter Outdoor- Bedingungen arbeitendem Automatisierungs- oder Steuerungssystem die Baugruppen aus Standardbauelemente aufzubauen und den Einsatz spezieller kostenintensiver temperaturunempfindlicherer Bauelemente zu vermeiden. Anhand des in der folgenden Figur dargestellten outdoor-fähigen Kommunikationsmoduls sollen die erfindungsgemäße Kühleinrichtung sowie vorteilhafte Ausgestaltungen, Verbesserungen und weitere Vorteile der Erfindung näher erläutert und beschrieben werden. In addition to the different temperature ranges formed on the printed circuit board which are separated by heat insulating trenches, the combination of the various heat sinks over the areas of the printed circuit board with differently dissipated waste heat, with the heat dissipating contacts which define the heat sinks over the printed circuit board in a defined Keep a distance and thus ensure optimum heat dissipation, a removal of waste heat from the circuit board reaches before it reaches the temperature-sensitive components. Thus, the inventive arrangement for cooling of assemblies in an operating under outdoor conditions automation or control system allows to build the modules of standard components and to avoid the use of special cost-intensive temperaturunempfindlicherer components. Based on the outdoor-capable communication module shown in the following figure, the cooling device according to the invention and advantageous embodiments, improvements and other advantages of the invention will be explained and described in detail.
Fig. 1 zeigt eine beispielhafte Ausführungsform eines outdoor- geeigneten Kommunikationsmoduls mit der erfindungsgemäßen Kühleinrichtung, welche den Einsatz des aus Standard-Bauelementen ausgeführten Kommunikationsmoduls in Outdoor-Anlagen bis zu einem Temperaturbereich von ca. 70°C ermöglicht. 1 shows an exemplary embodiment of an outdoor-suitable communication module with the cooling device according to the invention, which enables the use of the communication module made of standard components in outdoor systems up to a temperature range of about 70 ° C.
Das Kommunikationsmodul ist aus einer Leiterplatte LP aufgebaut, auf welcher die für seine Funktion erforderlichen elektronischen Bauelemente, wie beispielsweise ein Prozessor 5, Speicherelemente 6, ein Steckverbinder 7 und einer Spannungsversorgung 8 angeordnet sind. Wird das Kommunikationsmodul in Betrieb genommen, geben einige Bauelemente in nicht unerheblichem Maße Abwärme ab. Insbesondere der Prozessor 5 entwickelt während seines Betriebes eine nicht unerhebliche Abwärme, welche insbesondere die im Nahbereich des Prozessors 5 angeordneten Flashspeicher 6 zerstören können. The communication module is constructed from a printed circuit board LP, on which the electronic components required for its function, such as a processor 5, memory elements 6, a connector 7 and a power supply 8 are arranged. If the communication module is put into operation, some components emit waste heat to a considerable degree. In particular, the processor 5 develops a not inconsiderable waste heat during its operation, which in particular can destroy the flash memory 6 arranged in the vicinity of the processor 5.
Um dies zu vermeiden ist eine Anordnung vorgesehen, welche verschiedene Temperaturbereiche auf der Leiterplatte LP realisiert. Dies wird durch eine Unterteilung der Leiterplatte LP in wenigstens zwei Teilbereiche erreicht, wobei Bauelemente, die eine hohe Abwärme abgeben (z.B. Prozessoren) in einem ersten Teilbereich angeordnet sind und Bauelemente, die nur wenig Abwärme abgeben (z.B. Flash- Speicher) in einem zweiten Teilbereich angeordnet sind. To avoid this, an arrangement is provided which realizes different temperature ranges on the printed circuit board LP. This is achieved by subdividing the printed circuit board LP into at least two subregions, wherein components which emit high levels of waste heat (eg processors) are arranged in a first subarea and components which emit only little waste heat (eg flash memory) in a second subarea are arranged.
Zwischen Teilbereichen, die Bauelemente unterschiedlicher Temperaturempfindlichkeit aufweisen, sind sogenannte Wärmeisoliergräben vorgesehen, die sich in die Tiefe der Leiterplatte LP erstrecken und die entweder ungefüllt oder mit einem wärmeisolierendem Füllmaterial, also Material von hohem thermischem Widerstand, gefüllt sind, um so die Abwärme erzeugenden Bauelemente von den wärmeempfindlichen Bauelementen zu trennen. So lassen sich thermisch die mit den abwärmeerzeugenden Bauelementen bestückten Leiterplattenbereiche von den mit den wärmeempfindlichen und nur eine geringe Abwärme abgebenden Bauelementen bestückten Leiterplattenbereichen entkoppeln. Die Anordnung zur Ableitung der beim Betrieb des Kommunikationsmoduls entstehenden Abwärme umfasst weiterhin einem, vorzugsweise als Kühlblech 1 ausgeführtem, ersten Kühlkörper 1 und einem zweiten Kühlkörper 2. Between sections which have components of different temperature sensitivity, so-called Wärmeisoliergräben are provided which extend into the depth of the printed circuit board LP and are either unfilled or filled with a heat-insulating filler material, ie material of high thermal resistance, so as to produce the heat-generating components of to separate the heat-sensitive components. Thus, the printed circuit board areas equipped with the waste heat generating components can be thermally decoupled from the printed circuit board areas equipped with the heat sensitive and only a small waste heat emitting devices. The arrangement for dissipating the waste heat arising during operation of the communication module further comprises a first heat sink 1 and a second heat sink 2, preferably designed as a heat sink 1.
Das Kühlblech 1 erstreckt sich über die temperaturempfindlichen Bauelemente 6, 8 und ist mittels wenigstens zwei, vorzugsweise jedoch mehreren wärmeleitenden Elementen oder Kontakten 3, 4 über der Leiterplatte LP gehalten. Die wärmeleitenden Kontakte 3, 4 sind vorzugsweise aus Schrauben 4 gebildet, die zuerst durch in der Leiterplatte LP vorgesehene Öffnungen 9.1 geführt sind. Über die Schrauben 4 sind Distanzstücke 3 aufgeschoben. Auf die Schrauben 4 und die darauf aufgeschobenen Distanzstücke 3 ist das Kühlblech 1 mittels dafür vorgesehenen weiteren Öffnungen 9.2 aufgebracht und in geeigneter Weise befestigt. So wird die Wärme über die aus wärmeleitendem metallischem Material bestehenden Kontakte, insbesondere über metallische Distanzhülsen von der Leiterplatte LP direkt auf den ersten Kühlkörper 1 zu übertragen. The cooling plate 1 extends over the temperature-sensitive components 6, 8 and is held by means of at least two, but preferably a plurality of heat-conducting elements or contacts 3, 4 on the circuit board LP. The heat-conducting contacts 3, 4 are preferably formed from screws 4, which are first performed by provided in the circuit board LP openings 9.1. About the screws 4 spacers 3 are pushed. On the screws 4 and the spacers 3 slid thereon, the cooling plate 1 is applied by means provided for further openings 9.2 and secured in a suitable manner. Thus, the heat is transferred via the contacts made of heat-conducting metallic material, in particular via metallic spacers from the printed circuit board LP directly to the first heat sink 1.
Der zweite Kühlkörper 2 weist eine Kühlfläche mit darauf angeordnete Erhebungen 2.1 , beispielsweise Kühlrippen, auf, wodurch die Kühlfläche des zweiten Kühlkörpers 2 vergrößert wird. In einer vorteilhaften Ausführungsform ist der Kühlkörper 2 als sogenannter Kühlblock mit darauf angeordneten Senken oder Vertiefungen zur besseren Ableitung der vom Prozessor 5 abgegebenen Wärme ausgeführt. The second heat sink 2 has a cooling surface with elevations 2.1 arranged thereon, for example cooling ribs, whereby the cooling area of the second heat sink 2 is increased. In an advantageous embodiment, the cooling body 2 is embodied as a so-called cooling block with depressions or depressions arranged thereon for better dissipation of the heat emitted by the processor 5.
Durch die vorgenannten konstruktiven Ausgestaltungen des zweiten Kühlkörpers 2 und die Ausführung des zweiten Kühlkörpers 2 als separates Teil wird eine Zerstörung der temperaturempfindlichen Bauelemente 6, 8 durch Abwärme und eine direkte Verbindung mit dem die temperaturempfindlichen Bauelemente 6, 8 abdeckendem Kühlblech 1 vermieden. Due to the aforementioned constructive embodiments of the second heat sink 2 and the execution of the second heat sink 2 as a separate part destruction of the temperature-sensitive components 6, 8 by waste heat and a direct connection with the temperature-sensitive components 6, 8 covering the cooling plate 1 is avoided.
Durch die Kombination der verschiedenartig ausgestalteten Kühlkörper 1 , 2 über den Bereichen der Leiterplatte LP mit unterschiedlich abgegebener Abwärme, mit den wärmeableitenden Kontakten 4, 5, welche die Kühlkörper 1 , 2 über der Leiterplatte LP in einem definierten Abstand halten und so eine optimale Wärmeableitung gewährleisten, wird die Abwärme von der Leiterplatte LP abgeführt bevor diese die temperaturempfindlichen Bauelemente 6, 8 erreicht und so die vom Prozessor 5 abgegebene Wärme über den temperaturempfindlichen Bauelementen 6, 8 in geeigneter Weise ferngehalten. By combining the differently configured heat sink 1, 2 over the areas of the PCB LP with different votes waste heat, with the heat-dissipating contacts 4, 5, which hold the heatsink 1, 2 over the PCB LP at a defined distance, thus ensuring optimal heat dissipation , the waste heat from the circuit board LP is dissipated before it reaches the temperature-sensitive components 6, 8 and so from the processor. 5 emitted heat over the temperature-sensitive devices 6, 8 kept away in a suitable manner.
So lassen sich thermisch die mit den abwärmeerzeugenden Bauelementen bestückten Leiterplattenbereiche von den mit den wärmeempfindlichen Bauelementen bestückten Leiterplattenbereichen entkoppeln. Thus, the printed circuit board areas equipped with the waste heat-generating components can be thermally decoupled from the circuit board areas equipped with the heat-sensitive components.
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011107316A DE102011107316A1 (en) | 2011-07-06 | 2011-07-06 | Arrangement for cooling assemblies of an automation or control system |
| PCT/EP2012/002825 WO2013004385A1 (en) | 2011-07-06 | 2012-07-05 | Arrangement for cooling subassemblies of an automation or control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2730153A1 true EP2730153A1 (en) | 2014-05-14 |
Family
ID=46516671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP12735785.3A Withdrawn EP2730153A1 (en) | 2011-07-06 | 2012-07-05 | Arrangement for cooling subassemblies of an automation or control system |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9485852B2 (en) |
| EP (1) | EP2730153A1 (en) |
| CN (1) | CN103797900B (en) |
| DE (1) | DE102011107316A1 (en) |
| WO (1) | WO2013004385A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9420722B2 (en) * | 2012-12-06 | 2016-08-16 | Gerald Ho Kim | Composite heat sink device for cooling of multiple heat sources in close proximity |
| JP6731398B2 (en) * | 2014-03-17 | 2020-07-29 | フィッシャー アンド ペイケル ヘルスケア リミテッド | Medical tubing for respiratory system |
| DE102019135060A1 (en) * | 2019-12-19 | 2021-06-24 | Dspace Digital Signal Processing And Control Engineering Gmbh | Multi-zone heat sinks for circuit boards |
| US11647609B2 (en) * | 2020-12-15 | 2023-05-09 | Arris Enterprises Llc | Multisided heat spreader |
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- 2012-07-05 EP EP12735785.3A patent/EP2730153A1/en not_active Withdrawn
- 2012-07-05 CN CN201280033492.3A patent/CN103797900B/en active Active
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2013
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Also Published As
| Publication number | Publication date |
|---|---|
| US20140111946A1 (en) | 2014-04-24 |
| CN103797900A (en) | 2014-05-14 |
| US9485852B2 (en) | 2016-11-01 |
| CN103797900B (en) | 2018-07-20 |
| DE102011107316A1 (en) | 2013-06-06 |
| WO2013004385A1 (en) | 2013-01-10 |
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