EP2614395A2

EP2614395A2 - Optoelectronic component

Info

Publication number: EP2614395A2
Application number: EP11771005.3A
Authority: EP
Inventors: Wojciech Piotr Giziewicz; Thomas Albert Hall
Original assignee: Amphenol Tuchel Electronics GmbH
Current assignee: Amphenol Tuchel Electronics GmbH
Priority date: 2010-09-12
Filing date: 2011-09-12
Publication date: 2013-07-17
Also published as: US9294197B2; US20140072311A1; DE102011113212A1; JP2014502363A; CN103140786A; WO2012031780A2; WO2012031780A3

Abstract

The invention relates to an optoelectronic component, which comprises the following: an optical component which emits optical signals to an input/output end face of an optical waveguide and/or receives optical signals and converts them to electronic signals, a component support on which the optical componentarranged is arranged, and a housing part which encloses the optical component and comprises coupling means that form optical coupling means and mechanical coupling means (alignment means), the optical coupling means guiding the optical signals stemming from the optical component to the input end face of the optical waveguide and/or guiding the optical beams exiting the input/output end face of the optical waveguide to the optical component, the mechanical alignment means aligning the optical waveguide relative to the optical component for efficient signal transmission.

Description

Optoelectronic component

The present invention relates to an optical coupling device and an optoelectronic device (e.g., an electro / optical (E / O) converter (transmitter) and / or an optical / electrical (O / E) converter (receiver) and methods of manufacture.

The invention preferably relates to an optoelectronic transceiver (in short: an optical transceiver) in which electrical-optical transmission devices (which, for example, have an optical transmitter element, a VCSEL) and optical / electrical reception devices (which, for example, act as an optical reception element) Photodiode have) can be used. While in the use of electrical transceivers, the transmission and reception information between two electric transceivers by using electric waves or signals, the transmission and reception information is transmitted by optical waves or signals when using two optical transceivers.

In the receive mode of a transceiver, it converts those received, for example, from an optical fiber, e.g. a fiber, supplied on an optical link transmitted optical input signals in electrical see signals, which are then further processed in the optical transceiver itself and / or in connected circuits.

In the transmit mode, the transceiver converts electrical input signals into optical signals to be transmitted on the optical link. For this purpose, the optical transceiver on an operating as an E / O converter optical element, for. B. a VCSEL laser. In the case of an optoelectronic component, for example a transceiver, there is the need to provide a sufficiently efficient optical coupling between the optical transmitter element and the light guide, especially on the one hand (in the transmission case) between the optical signal generating E / O converter and the light guide, for example, between the input end face of a glass fiber, and also on the other (in the case of reception) between the emerging from the exit surface of the optical fiber optical signals to the electrical signals generating optical receiving element (O / E converter) run.

For example, from US Pat. No. 6,560,385 an optical coupling arrangement is known that uses a fiber optic prism 10 and comprises: a substrate 20 having at least one light element 24 and at least one waveguide 22 overlying a substrate 20, further comprising a fiber optic prism Prism 10 is provided. The fiber optic prism 10 receives light through the first side surface 12, reflects the received light from a third side surface 16, and transmits the reflected light from the third side surface 16 through a second side surface 14. Referring to FIG. 3, the fiber optic prism 10 is disposed such that the first side surface 12 is arranged adjacent to the light element 24, and the second side surface 14 is adjacent to the waveguide 22. The light element 24 may comprise a light-emitting device such as an LED or a VCSEL or a light-receiving device, such as a photodiode. An alternative arrangement is shown in Figure 4 of the '385 patent.

It should be noted that the fiber optic prism is a separate component, which must be made separately and also needs to be adjusted when it is installed in the transceiver. The present invention is in particular based on the object of providing an optoelectronic component, wherein coupling means are provided for an electro / optical transmitter and for an optical / electrical receiver as well as in particular for an optoelectronic transceiver, such that the adjustment effort for the optical components, z. B. the optical element and the light guide is low.

According to the invention, optical coupling means or a coupling device are provided which has an integrated optical waveguide orientation (preferably 1-0 optical fiber alignment) and integrated mirror structures or integrated mirror properties.

According to the invention, the optical coupling means comprise both optical and mechanical coupling means. These can take the form of an op-

15 toelektronische semiconductor package (opto-electronic semiconductor package) be formed, i. an optoelectronic component housing (semiconductor housing or housing part) is provided, which has the feature of optical fiber alignment (physical or mechanical optical fiber alignment) with the feature of a beam deflection, which is a nearly vertical

20 radiation incident in the input end face of the light guide ensures combined, combined. This is preferably done by beam deflection by means of collimation.

According to the invention, there is provided an opto-electronic transceiver employing such an optical coupling device which can be made small enough to be usable in the USB 1.0, 2.0, 3.0 plug connector technique.

According to the invention, the critical functions of the fiber alignment as well as the beam deflection and collimation are achieved in a single production step by shaping the optoelectronic component or semiconductor housing part forming the optical coupling device, wherein no further active alignment step is required. The optical coupling device designed according to the invention as a molded plastic body forms a first housing part of a component housing and forms an encapsulation with a second housing part or component carrier carrying an optical element. According to the invention, the plastic body is preferably formed directly on the component carrier carrying the optical element.

In the component housing or optoelectronic semiconductor housing (also called semiconductor package), therefore, an optical element is e.g. in the form of a VCSEL for the driver (optical transmitter) and / or an optical element in the form of a photodiode for the receiver (receiver), i. If the optoelectronic semiconductor housing contains an optical transmitter and / or an optical receiver, it may also form further electrical circuits, an optoelectronic component according to the invention, e.g. , preferably a transceiver.

According to the invention, the optoelectronic component or semiconductor housing having the optical coupling device is achieved by an efficient coupling between an optical fiber (optical waveguide) and an optical element (transmitting and / or receiving element), preferably with a 90 ° beam deflection, in that the coupling device provides optical fiber alignment and beam deflection and focusing by providing or molding a molded, highly transparent plastic body forming the optical coupling device (coupling means) directly on a component carrier carrying the active element (s). The plastic body forms the optical coupling means. Preferably, the so-called "overmold packaging technology" is used for production Alternatively, other plastic molding processes such as transfer overmolding with light-curable plastic can be used. According to the invention, the optoelectronic housing part (semiconductor housing) is formed in such a way that the plastic or overmold material is highly transparent and forms a mechanical connection with a further material of a second housing part or component carrier when the housing part is formed. As mentioned, the second housing part may be a component carrier and carries an optical element and optionally other components or electrical circuits. The second component carrier is for example a substrate or a leadframe or a ceramic. When using the coupling device according to the invention having semiconductor housing or the optical component housing, for example, when installed in a connector, this is resistant.

According to the invention, the plastic or the overmold plastic material which forms the housing part forms a reflector or reflecting mirror, which forms a reflection interface, preferably a total reflection interface for the light, between the optical element (s) positioned on the support the entrance end face of the light guide (and possibly vice versa) is to be transmitted. Preferably, the reflection mirror forming the reflection interface is an internal conical total reflection mirror.

According to the invention, at its interface with the surrounding air, the plastic forms the reflection mirror as a result of the transition from the plastic material with a higher refractive index to the air with the refractive index 1.

In addition, it is preferably provided that the first housing part formed by the plastic, in particular by the overmolding process, forms an encapsulating optoelectronic component housing when forming it together with the component carrier, the optical coupling device acting as optical coupling means and mechanical coupling means the latter are preferably provided as alignment means for the light guide. The alignment means are preferably formed by a V-groove in the housing part. Preferred embodiments of the invention will become apparent from the claims.

Further advantages, objects and details of the invention will become apparent from the description 5 embodiments with reference to the drawing; in the drawing shows:

Figure 1 is a schematic side view of an optoelectronic device according to the invention with a first and a second housing part 10 having optoelectronic housing (or an optoelectronic semiconductor package) in which an optical element and coupling means are provided for light to and / or from a light guide.

FIG. 2 is a schematic view of two housing parts forming the housing of the optical component of FIG. 1; FIG.

Fig. S is a schematic representation similar to FIG. 1, wherein it is assumed here that the electro-optical component as an embodiment of the invention is an optoelectronic transceiver, in which a formed by the first of a preferably highly transparent plastic internal conical Tollreflektionsspiegel for the optical connection between the optical receiver / optical transmitter and the optical waveguide and, furthermore, alignment means for the optical waveguide are provided;

Fig. 4 shows schematically an electro-optical transducer (transmitter) with its preferred

Dimensions, wherein in the transmission mode, a light beam emanating from a VCSEL is reflected and collimated toward an input end face of the light guide through a reflection surface formed by the first housing part;

FIG. 5 shows a schematic cross section of the optical component, in particular of the optical transmitter of FIG. 4, from the right in FIG. 4 approximately along the line AA in FIG. 6, wherein the alignment means only indicated in FIG are clearly visible from the first housing part in the form of an alignment groove for the light guide;

Fig. 6 is a schematic plan view similar to Fig. 1 1 on a device according to FIG.

5 on a connecting plate; 7 shows a flowchart of the method according to the invention for producing an optoelectronic transmitter or receiver or transceiver;

FIG. 8 schematically and analogously to FIG. 3 a transceiver with its schematically shown light transmission paths; FIG.

Fig. 39 is similar to Fig. 8 but shows an electro-optical transmitter;

Fig. 10 similar to FIG. 8, but with an electro-optical receiver;

Fig. FIG. 1 1 shows a perspective top view of an optoelectronic component designed according to the invention, for example a transmitter, a receiver or a transceiver according to FIGS. 3 to 10; FIG. and

Figl 0l 2, the device of Figure 1 1 from a different perspective.

FIGS. 13 and 14 schematically show the invention with two reflection surfaces formed by the optoelectronic component or its coupling means;

Fig. Figure 15 is a schematic view of the beam path for a receive beam and a transmit beam similar to Figures 13 and 14;

FigL5l 6 schematic views similar to FIGS. 1 1 and 12, but here in each case two reflection surfaces, formed by the component housing, are provided.

FIG. 1 generally shows an optoelectronic component 20 according to the invention (in short: component) 10 with an optoelectronic housing, which may also be referred to as a capsule, encapsulating the housing or the capsule 9 at least one optical element 17 and possibly others. Coupling means 300 provide efficient connection or coupling between the optical element 17 and a cooperating optical fiber (eg, a fiberglass) 12. According to the invention, the coupling means 300 are provided by a coupling structure, in particular by the shape or construction of the housing 9, such that at the same time an optical coupling by optical coupling means 301 and a mechanical coupling and alignment by mechanical coupling / alignment means 302 between the optical element 17 and the light guide 12 is reached. The coupling means 300 cause a 90 ° change in the optical path and a passive alignment of all elements, in particular the optical element 17 and the light guide 12 of the device 10th The housing 9 consists essentially of two housing parts, a first housing part 1 and a second housing part 14 carrying the optical element 17. The first housing part 11 essentially forms the coupling means 300, which on the one hand form the optical connection (one optical transmission path). between the light guide 12 and the optical element 17 (by the optical coupling means 301) and the orientation (by the mechanical coupling / alignment means 302) for the light guide 12, in particular its entrance / exit surface 24, 25th

The second housing part 14 may be a carrier, preferably as shown, in the form of a leadframe (substrate) 14. The optical element 17 is connected by a wire bonding 21 to the conductors of the second housing part 14 so as to be as shown in FIGS. 3-6, to produce an electrical connection, for example with an ASIC 13 likewise arranged on the second housing part 14. One could also mount the ASIC and possibly the optical element 17 with a flip-chip method. By a method of embedding, in particular overmolding (or another method), the first housing part 11 consisting of a highly transparent plastic material 30 is formed according to the invention, and connected to another material, namely the material of the second housing part 14, by the overmolding spraying method , The first housing part 11 forms the optoelectronic component 10 with the second housing part 14 carrying the optical element 17.

The first, in particular overmold, housing part 11 and the second housing part 14, ie the housing, when they comprise an optical element 17, form a capsule, ie an optoelectronic semiconductor housing or an optoelectronic semiconductor package. The coupling means 300 and the mechanical coupling / alignment means 302 also form, as clearly shown in Fig. 5, Lichtleiter- or Faserausrichtnut 20 for receiving the light guide 12. The groove is in the illustrated embodiment by two obliquely extending side walls 210, 220 and a lower wall 230 formed. The Faserausrichtnut 20 further includes a rear wall 240.

Thus, FIG. 1 generally shows an optical component 10 which, depending on how the optical element 17 is embodied as a transceiver 110 as illustrated in FIG. 8, as a transmitter 120 as illustrated in FIG. 9 or as a receiver 130 as illustrated in FIG can work, with the optical elements 170, 171, 172 cooperating electrical circuits, such as an ASIC 13 may be provided. The ASIC 13 is connected by wires or connecting wires 22, 23 with conductors in the second housing part 14. Also, the optical element 17 is connected to a conductor of the second housing part 14.

In the case of a transceiver 110 (see Figures 3 and 8), the optical element 170 includes both a transmitter and a receiver and communicates with the optical fiber 12 via a transmit transmission path 1 and a receive transmission path 2. In the case of Fig. 9, the optical device is a transmitter or transmitter 120 and has as optical element a transmitting optical element 171 (e.g., a VCSEL) connected to the optical fiber 12 via a transmitting beam 1. The optical device 130 in FIG. 10 is a receiver or receiver 120, the optical element being, for example, a photodiode 172 receiving a receive beam 2 coming from the light guide 12.

2, it should also be noted that here clearly the two housing parts, i. the first housing part 11 and the second housing part 14 are shown.

In the following, the invention will now be described specifically with reference to Figures 3 to 7 and 11 and 12, in particular with regard to In that the optical component is a transceiver 110, which can advantageously be used in a USB 3x connector according to the invention, in particular in a socket of a transceiver which has a corresponding cable, which also has light conductors with another Device is in communication, which also has a corresponding socket.

In Fig. 3 it can be seen that the transceiver 1 10 according to the invention is in principle constructed so that the optical component 10 shown in FIG. 1, here replaced by the optical element 170, which comprises a transmitting device and receiving device, which is not shown in detail in FIG 3 is shown.

Further, as in the general case of FIG. 1, the plastic material specifically the overmold material 30 forms the coupling means 300 between the optic element 170 and the light guide 12. The coupling means 300 comprise, as mentioned, optical coupling means 301 and mechanical coupling means 302. The optical coupling means 301 form, through the material 30 at the interface with the air, a reflector with a reflecting surface 321, preferably in the form of a conical mirror with total internal reflection. The reflection surface 321 is formed such that both the transmitted optical beams and the received optical beams are efficiently deflected by the reflection surface 321.

As shown in Figures 4 and 5, the first housing part 11 and the second housing part 14 each have a longitudinal extent of the order of 2.5 mm and the width is approximately 2.1 mm. As a result of these small dimensions, the use of a component 10 according to the invention designed as optoelectronic transceiver 110 is advantageous, in particular in the design of a socket for USB 3x connections, since the electronic-optical transceiver together with the existing USB 3.0 sockets and the USB 2 , 0 sockets can be used, which do not provide optical transmission (backward compatibility). As shown in FIG. 4, the radiation 1 emitted from the optical transmitting / receiving element 170, for example in the transmission mode by a VCSEL 170a, is reflected by the reflection surface 321 of a reflector formed by the housing part 11, formed by the first housing part 30 and thereby collimated and then impinges on the input end face 24 of the optical fiber 12 substantially perpendicularly to be forwarded therefrom. The optical fiber or the optical fiber 12 may be a single-mode or a multi-mode optical fiber. According to the invention, the optical component 10, and in the case of FIGS. 3 - 8 and 11 and 12, the entire optoelectronic transceiver 110 is formed by the first housing part together with the second housing part carrying the optical element and circuits. In this case, the optical fiber alignment and the preferably 90 ° beam deflection and collimation is achieved in an integral manner by the first housing part 11, for example the overmold housing part and the second housing part 14 of the transceiver 110.

The optoelectronic semiconductor package thus comprises the first housing part 11, and the second housing part, for example the leadframe 14, in which case the optical component 10 is formed together with a driver and / or a receiver and an ASIC, in the case of FIG. 3 the optical transceiver 110 becomes. The leadframe 14 is typically a metallic stamped part on which the chips, such as the optical element 170; 170a and ASIC 13 are secured by die pads 124 and contacted by wire bonding 21-23. After bonding, the leadframe 14 is typically further encapsulated with a thermosetting plastic and its connecting legs are punched free and optionally angled. The separate encapsulation with a thermoset can be omitted according to the invention. FIG. 6 shows a schematic plan view of the arrangement according to FIG. 4. In the initial punching of the leadframe 14, according to the invention, two or more alignment openings or holes 50, 51, 52 are punched out near the attachment area of the optical element 170. Using a die bonder, the optical element 170 is disposed at a predetermined position with respect to the alignment openings 50-52 with high accuracy. After that, the component carrier embodied as a leadframe 14 is in particular overmolded, ie overmolded with the overmold material 30 of the housing part 1, whereby the overmold material 30 or the overmold housing part 11 is connected to the component carrier 14, preferably in the form of the leadframe There are also possible alternative "overmolding" technologies, eg stamping / embossing, UV methods (eg similar to Thin Fusion), but with emphasis on "transfer overmolding".

The tolerance chain for the course of the optical radiation between the optical element 170 and the light guide or the optical fiber 12 is therefore the following: The placement accuracy (accuracy of placement of the optical element 17 or 170, or 171 or 171 172 forming chips) and the alignment accuracy of Overmoldgehäuseteils 1 1 + mold material quality is taken into account.

Since the fiber alignment feature is located in the overmold housing part (or mold material) itself, only the mold tooling affect the mold repeatability and alignment accuracy with the reflective surface 32 and 321 in the case of the transceiver 1 10th

The steps according to the invention for producing the electrooptical transceiver 110 according to the invention or its coupling means are shown in FIG.

In step 70, the leadframe 14 is provided and in step 71, the corresponding conductor tracks are punched and the leadframe 14 is gegege If necessary, undergo a bending process. In step 72, the lead frame 14 is plated, for example, with gold, in which case the ASIC 75 is attached to the leadframe 14 by a conductive epoxy resin by means of die bonding 24 in step 73. In step 76, also using the conductive epoxy resin, the precise attachment of the optical element 170, such as a VCSEL as shown in FIG. 4, or a photodiode, not shown, is also performed.

After the step 76 of precise alignment, in step 77 the wire bonds z. B. 21, 22, 23, attached.

Step 81 is the overmold process step. In this step 81, the overmold material (mold compound) held available in step 78 is injected over the leadframe 14 with optical elements 17 or 170 and ASIC 13 mounted thereon, forming an internal reflection mirror with the reflection surface 321, preferably one internal conical total reflection mirror with the reflection surface 32.

In step 84, punching / bending separation takes place when the transceivers 110 are manufactured on a conveyor belt.

In step 85, the functions of the optical transceiver 110 are tested. In step 86, the final assembly is made for the optical fiber 12 provided in step 79, optionally mounting an additional metal housing made available in steps 80 and 83 in step 86, like the metal also provided after steps 82 and 83 in the final assembly.

Figures 11 and 12 show external views of the transceiver 110 shown and described in Figures 3-7. It should be noted that instead of overmolding, one could also use the word "encapsulation" to express that other molding methods can be used. Also, a bidirectional version is possible. Based on the above explanations, the invention provides an optoelectronic component 100 which, in addition to a reflector D, has another conical reflector B also formed by the optical coupling means 30. The left reflector A embodied in Figs. 13-17 is an additional feature of this invention. The additional reflector A is, as shown in FIGS. 13-17, downstream of the reflector C. The combination of the two reflectors works as explained below.

The two reflectors A, C are formed by the above-described first housing part 11, which is shaped such that it forms the respective reflection surfaces x, y.

It can be seen that the receiver 172 receives the light entering through the optical fiber (optical fiber core) over the surface D. As a result of the total internal reflection, the light is reflected away at the conical surface C and thereby turned by 90 ° and approximately collimated. It then falls on the photodiode or photodetector 672 below the reflector C, specifically within the first housing part 11, specifically the overmold connection or the overmold plastic. The emitter 171, on the other hand, (VCSEL) emits the light incident on the conical reflector surface A. The beam is turned (by less than 90 °) and partially collimated due to total internal reflection. The beam exits the first housing part 1 1, especially the overmold plastic, through the surface B and re-enters the housing part 1 1 through the conical surface C. C and D effectively form a spherical plane convex lens.

A notable feature of the invention is that the VCSEL photodiode crosstalk should be substantially zero, with potential contributions could only occur from scattering due to surface roughness.

The following important points should be noted.

In the prior art, the "Transparent Transfer Overmoldung" is known for example in the field of LED packaging.

In the invention, it is advantageous that the overmold offers a protective function in the sense of a housing, against mechanical forces and environmental influences, such. B. water.

As regards the manufacturing process, it should be noted that the "die" and then "wire bond" of the ASIC and possibly also the OE components could be monotoped in a flip-chip process. Furthermore, one could therefore use other substrate materials such as FR-4 or ceramic instead of a "leadframe".

It should be emphasized that the invention not only relates to a transmission direction, but, as explained, two optoelectronic components as well as one or two ASICs, furthermore two mirrors and two fiber trenches can be used.

Although the emphasis is on transfer overmolding, there are possible alternative overmolding technologies, such as: B. Stamping / Embossing and UV methods.

In particular to the invention especially according to FIGS. 13 to 17 it should be noted that the miniaturization of the optoelectronic transceiver is achieved by the invention and also the number and the size of the components in an optoelectronic transceiver is reduced. Essentially, the optical transceiver comprises an optical transmitter 171, an optical receiver 172 and coupling means 300, consisting of a first th and second optical lens, see. Fig. 15, for changing / deflection of optical paths of one hand, optical output signals of the optical transmitter 171 to a connectable optical light guide 12 and the other part of input signals of the same light guide 12 to the receiver 172, in particular according to the invention, the first lens in the coupling means 300 lying concave Reflecting surface for signals of the optical transmitter and the second lens forms an inner concave reflection surface for incoming signals via an outer convex transmission surface for outgoing signals of the optical transmitter. The position of the lenses formed in this way is provided in such a way that an efficient transmission of both the transmitted and the received signals takes place. The material forming the coupling agent preferably has a refractive index of> 1.3. Further, the inner surface of the second lens having a radius of curvature is formed so as to satisfy the condition of total reflection, with respect to optical paths of optical signals incident on the interface from the optical fiber 12. Furthermore, material with a refractive index of> 1.3 may be used, wherein the inner surface of the first lens is formed with a radius of curvature such that the condition of total reflection is satisfied with respect to optical paths of optical signals coming from the transmitter 171 onto the Meet interface.

In the case of the production method according to the invention, the alignment of the photoelements is already ensured in the production process, the deflection of the light being achieved by the encapsulation, ie the overmold material. In this way, a finished, self-contained unit is produced, in which the light emission angle is always independent of the position and position of the circuit board perpendicular or in the direction of the optical axis. In addition, the mirror effect is enhanced or improved by the fact that the mirror curve, also referred to as "Conic Mirror", is designed so that one does not spot-like light rays, but rather a spot, a light spot, and thus safely coupled into the fiber optics. For the invention shown in particular in FIGS. 13 to 17, it should be noted that the two reflectors operate as follows. Due to the total internal reflection, the light is reflected by the conical surface C and thereby deflected by 90 ° and approximately collimated. It then falls on a arranged below the reflector within the overmold material 30 photodiode. As far as the emitter is concerned, the light emitted by a VCSL will strike a conical reflector surface A. The beam is turned around (less than 90 °) and partially collimated, due to total internal reflection. The beam then exits the overmold material through the surface B and re-enters through the conical surface C, and finally exits through the surface D. As previously mentioned, C and D effectively form an eccentric aspheric plane convex Lens.

It should be noted that instead of "overmolding" one could also use the word "encapsulation" to express that other molding methods can be used. Also, a bidirectional version is possible. Based on the above embodiments, the present invention additionally provides another conical reflector in front of the reflector as described in the foregoing. In Figs. 13-17, the left reflector A represents the additional feature of this invention. The additional reflector A is, as shown in FIG. 5, arranged downstream of the reflector C. The combination of the two reflectors works as explained below.

The two reflectors are formed by the first housing part described above, which is shaped to form the respective reflection surfaces X and Y.

It can be seen that the receiver receives the light entering through the optical fiber core over the surface D. As a result of the internal Total reflection, the light on the conical surface C reflected away and thereby turned by 90 ° and approximately collimated. It then falls on the photodiode or the photodetector below the reflector, specifically within the first housing part of the overmold connection or the over-mold plastic. The emitter on the other hand (VCSEL) emits the light which impinges on the conical reflector surface A. The beam is turned (by less than 90 °) and partially collimated due to total internal reflection. The jet exits the first housing part, especially the overmold plastic, through the surface B and re-enters the conical surface C and finally exits through the surface D. Where C and D effectively form a spherical plane convex lens.

A notable feature of the invention is that the VCSEL photodiode crosstalk should be substantially zero, with potential contributions only from scattering due to surface roughness. This is not necessarily the case in other implementations where, for example, temperature stabilization may be required to avoid crosstalk. It should be noted that the geometry shown in FIG. 15 is only one possible implementation. For example, surface A could be formed in some cases as a flat tilted surface. The surfaces B and D could be provided with outward orientations, either to facilitate release of the molded first housing part or to act as an optical prism.

The precise choice of geometry depends on the core diameter and the numerical aperture of the optical fiber. More specifically, the numerical aperture dictates the maximum angle of incidence of the beam on the fiber. Therefore, the smaller the numerical aperture, the more accurate is the control or control of the reflector geometry in the assembly.

Claims

claims

An optoelectronic device (10) comprising

an optical component (17) which emits optical signals to an input / output end face (24, 25) of a light guide (12) and / or

receives optical signals and converts them into electronic signals, arranges a component carrier (14) on the optical component (17), and

a housing part (11) enclosing said optical component (17) and having coupling means (300) forming optical coupling means (301) and mechanical coupling means (aligning means) (302), said optical coupling means (301) being separate from said optical coupling means (301) Passing device (17) coming optical signals to the input end face (24) of the light guide (12) and / or direct the emerging from the input / output end face (25) of the light guide (12) optical beams to the optical component (17), wherein the mechanical alignment means (302) align the optical fiber (12) with respect to the optical device (17) for efficient signal transmission.

2. Optoelectronic component (10), in particular according to claim 1, which has the following:

a) an electrical-optical transmitter (171),

the optical signals to an input / output end face (24, 25) of a light guide (12) emits and / or

b) an optical-electrical receiver (172) that receives optical signals and converts them into electronic signals,

c) a component carrier (14) on which the transmitter and / or receiver to a housing part (11) enclosing the transmitter and / or receiver and the coupling means (300), the optical coupling means (301) and mechanical coupling means (302 ), wherein the optical coupling means (301) from the optical-optical transmitter (171) coming optical Directing signals to the input face (24) of the light pipe (12), and / or coupling the optical beams emerging from the input / output face (25) of the light pipe (12) to the optical-electrical receiver (172) , wherein the mechanical alignment means (302) the

Align optical fiber (12) with respect to the electrical-optical transmitter (171) and / or the optical-electrical receiver (172) for efficient signal transmission.

3. Optoelectronic component (10) according to claim 2,

characterized in that the housing part (11) is preferably formed by an over-molding process and is connected to the component carrier (14) or its material by the injection molding process.

4. The optoelectronic component (10) according to claim 1 or 2, wherein the optical coupling means (301) form a reflection surface (321) for the optical signals.

5. The optoelectronic component (10) according to claim 1 or 2, wherein the first housing part (1 1) further forms the mechanical alignment means (302) which the input / output surface (24) of the light guide with the reflection surface (321) reflected aligns optical signals or directed toward the reflection surface optical signals.

6. Optoelectronic component (10) according to claim 1 or 2, which is transparent to the plastic material, in particular the overmold material and has a refractive index n = 1, 5. 7. An optoelectronic component (10) according to claim 1 or 2, wherein the mechanical coupling means (302) in the form of alignment means in the first housing part (11) are formed, wherein preferably the alignment means in the form of a V-groove (20) are formed , the preferential wise obliquely mutually extending side surfaces (210, 220).

Optoelectronic component (10), comprising

an electrical-optical transmitting device (171),

a support (14) on which the electrical-optical transmission device (171) is arranged,

Coupling means (300) formed by a first housing part, which is preferably connected by an overmold spray method with the material of the second housing part (14), wherein the plastic material forms a reflection surface at the transition between plastic material and air above the optical transmitter (171) in that the light emanating from the optical transmitter (171) is reflected approximately 90 ° angled onto the input end face of the optical guide (12), preferably being collimated.

An optical coupling device comprising both optical and mechanical coupling means in the form of a device package which combines optical fiber alignment (physical or mechanical optical fiber alignment) and beam excursion ensuring nearly perpendicular incidence of radiation into the input face of the optical fiber, preferably by beam deflection Collimation happens.

An optical coupling device according to claim 9, usable in the USB 1.0, 2.0, 3.0 plug connector technique, widening it by optical connection means, wherein critical functions of fiber alignment as well as beam deflection and collimation in a single manufacturing step are formed by shaping the optoelectronic optical coupling device Housing is reached, with no further active alignment step is required.

1 1. formed as a molded plastic body optical coupling device according to any one of claims 9 and 10, which forms with a first housing part an encapsulation with an optical element supporting the second housing part, wherein preferably the plastic body directly on the second optical element protruding housing part (support) is shaped.

12. Coupling device comprising a housing for efficient coupling between an optical fiber and an optical element (transmitting and / or receiving element), preferably with a 90 ° beam deflection, wherein the coupling provides optical fiber alignment and beam deflection and focusing, by providing or forming a molded, highly transparent plastic body forming the optical coupling device directly on a support carrying the active element (s), the plastic body forming the optical coupling device, ie the first housing part of the housing, whose second housing part is e.g. is formed by the carrier.

13. Coupling device according to claim 12, wherein the housing is designed in such a way that the highly transparent plastic or the overmold material is highly transparent and when forming the first housing part forms a (mechanical) connection with a further material of a second housing part, wherein the second housing part is a carrier for an optical element and optionally other components or electrical circuits.

14. Coupling device according to claim 13, wherein the plastic or the overmold plastic material which forms the first housing part, a reflector or reflection mirror, which forms a reflection surface for the light, which is positioned between the positioned on the carrier optical Element (s) and the entrance end face of the light guide (and optionally vice versa) is to be transmitted, preferably the reflecting surface forming reflection mirror is an internal conical total reflection mirror, wherein the plastic forms the reflection mirror at its boundary to the surrounding air due to the transition from the plastic material with a higher refractive index to the air with the refractive index. 1

15. Optical coupling device, in particular according to claim 9, wherein a further conical reflector (A) next to the reflector (32) is provided.

16. An optical coupling device according to claim 15, wherein the two reflectors are formed by the first housing part (1 1) which is shaped such that it forms the respective reflecting surfaces.

17. An optical coupling device according to claim 15 or 16, wherein the receiver receives the light entering through the optical fiber over a surface, whereby due to the total internal reflection the light is reflected off the conical surface and thereby turned 90 ° and is approximately collimated, in which case it then falls on the photodiode or the photodetector below the reflector, specifically within the first housing part (11), especially the overmold or overmold plastic, the emitter (VCSEL), on the other hand, emitting the light which is incident on the conical reflector surface with the beam being turned (by less than 90 °) and partially collimated as a result of total internal reflection so that the beam from the first housing part, especially the overmold plastic, exits the surface B and reenters the conical surface C and finally through the surface D emerges.

The optical coupling device of claim 17, wherein the surfaces effectively form a spherical planar convex lens.

19. An optoelectronic transceiver (10), comprising:

a) an optical transmitter (171),

b) an optical receiver (172),

c) coupling means (300) consisting of a first and

second optical lens (400, 401) formed with optically active interfaces (410.411) for changing / deflection optical paths of one hand, optical output signals A of the optical transmitter (171) to a connectable optical light guide (12) and on the other hand of input signals E of the same light guide ( 12) to the receiver (172),

characterized in that the first lens (400) has a concave reflection surface (410) for signals of the optical transmitter inside the coupling means (300) and the second lens has an outer convex transmission surface (4 1) for outgoing signals of the optical transmitter and an inboard concave reflective surface (412) for incoming signals.

20. A transceiver according to claim 19, wherein the material forming the coupling means (300) defines or defines the position of the lenses relative to each other.

21. A transceiver according to claim 19 or 20, wherein the material has a refractive index of> 1, 3 and the inner surface of the second lens is formed with a radius of curvature such that the condition of total reflection is satisfied with respect to optical paths of optical signals from the light guide (12) hit the interface.

A transceiver according to any one of the preceding claims, wherein the material having a refractive index> 1, 3, and the inner surface of the first lens is formed with a radius of curvature such that the condition of total reflection is satisfied with respect to optical paths of optical signals that hit the interface from the transmitter.

An optoelectronic transceiver (10), comprising:

a) an electrical-optical transmitter (171),

b) receiving an optical-electrical receiver (172) which converts optical signals into electronic signals,

c) a component carrier (14) on which the transmitter and / or receiver is or are arranged, and

a housing portion (11) enclosing the transmitter and / or receiver having coupling means (300) forming optical coupling means (303) and mechanical coupling means (302), the optical coupling means (301) being of electrical-optical Transmit (171) coming optical signals to the input end face (24) of the light guide (12) or couple, and / or from the input / output end face (25) of the light guide (12) exiting optical radiation to the optical-electrical receiver ( 172), the mechanical alignment means (302) aligning the optical fiber (12) with respect to the electro-optical transmitter (171) and / or the optical-electrical receiver (172) for efficient signal transmission, the optical coupling means (303) forming a form the first reflection interface (412) for the optical signals coming from the transmitter, a second reflection interface (410) for the optical Si emerging from the optical fiber and a first and second transmission surface (415, 4) for the optical signals coming from the transmitter.

Optoelectronic transceiver (10) according to claim 23, characterized in that the housing part (11) is preferably formed by an over-molding process and is connected to the component carrier (14) or its material by the injection molding process.

Optoelectronic transceiver (10) according to one of the preceding claims, wherein the housing part (11) forms a mechanical alignment means (302) comprising the one light guide (12) and thus the input / output face (24) of the light guide (12) aligned by the reflective interfaces (410, 412) reflected optical signals.

26. Optoelectronic transceiver (10) according to one or more of the preceding claims, that the plastic material, in particular the overmold material is transparent and has a refractive index n> 1, 3, preferably n = 1, 5.

27. An optoelectronic transceiver (10) according to one or more of the preceding claims, that the mechanical coupling means (302) in the form of alignment means for the light guide (12) in the housing part (11) is formed, wherein preferably the alignment means in the form of a V -Nut (20) are formed, which preferably has obliquely mutually extending side surfaces (210, 220).

The optoelectronic transceiver (10) according to any one of claims 24 to 28, wherein the plastic material forms a reflective interface (321) at the junction between plastic material and air above the optical transmitter (171) such that the light emitted from the optical transmitter (171) Light is reflected by the first and second transmission surface (411, 415) on the input end face of the light guide (12), preferably is collimated.

29. An optoelectronic transceiver according to one or more of the preceding claims, wherein the housing part formed of highly transparent plastic and formed in the formation of the first housing part with a material of a second housing part, a mechanical connection, wherein the second housing part is a support for an optical element and optionally other components or electrical circuits. Optoelectronic transceiver according to one of the several of claims 23 to 29, wherein the component carrier (14) is a stamped component carrier, preferably a leadframe.

Optoelectronic transceiver according to one or more of the preceding claims, wherein the overmold plastic material forming the housing part (11), two reflectors, each forming a reflection surface for the light, each positioned between the on the component carrier (14) optical elements and the entrance end face of the one light guide (and possibly vice versa) to be transmitted, wherein preferably the reflective surfaces forming the reflection surfaces are each an internal total conical reflection mirror, the plastic forms the reflection mirror at its boundary to the surrounding air due to the transition from the plastic material with a higher refractive index to the air with the refractive index 1.