EP2612380A4 - LIGHT EMITTING APPARATUS, ENERGY GENERATOR OR OTHER ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME - Google Patents
LIGHT EMITTING APPARATUS, ENERGY GENERATOR OR OTHER ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAMEInfo
- Publication number
- EP2612380A4 EP2612380A4 EP11822653.9A EP11822653A EP2612380A4 EP 2612380 A4 EP2612380 A4 EP 2612380A4 EP 11822653 A EP11822653 A EP 11822653A EP 2612380 A4 EP2612380 A4 EP 2612380A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- manufacturing
- light emitting
- same
- energy generator
- electronic apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/85—Packages
- H10H29/857—Interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
- H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/85—Packages
- H10H29/855—Optical field-shaping means, e.g. lenses
- H10H29/8552—Light absorbing arrangements, e.g. black matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
- H01L2224/95101—Supplying the plurality of semiconductor or solid-state bodies in a liquid medium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13034—Silicon Controlled Rectifier [SCR]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13062—Junction field-effect transistor [JFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37922510P | 2010-09-01 | 2010-09-01 | |
US37928410P | 2010-09-01 | 2010-09-01 | |
US37982010P | 2010-09-03 | 2010-09-03 | |
US37983010P | 2010-09-03 | 2010-09-03 | |
US13/223,297 US8415879B2 (en) | 2007-05-31 | 2011-08-31 | Diode for a printable composition |
US13/223,289 US9018833B2 (en) | 2007-05-31 | 2011-08-31 | Apparatus with light emitting or absorbing diodes |
US13/223,279 US8809126B2 (en) | 2007-05-31 | 2011-08-31 | Printable composition of a liquid or gel suspension of diodes |
US13/223,294 US8674593B2 (en) | 2007-05-31 | 2011-08-31 | Diode for a printable composition |
US13/223,293 US8877101B2 (en) | 2007-05-31 | 2011-08-31 | Method of manufacturing a light emitting, power generating or other electronic apparatus |
US13/223,286 US8852467B2 (en) | 2007-05-31 | 2011-08-31 | Method of manufacturing a printable composition of a liquid or gel suspension of diodes |
US13/223,302 US8846457B2 (en) | 2007-05-31 | 2011-08-31 | Printable composition of a liquid or gel suspension of diodes |
PCT/US2011/050174 WO2012031096A2 (en) | 2010-09-01 | 2011-09-01 | Light emitting, power generating or other electronic apparatus and method of manufacturing same |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2612380A2 EP2612380A2 (en) | 2013-07-10 |
EP2612380A4 true EP2612380A4 (en) | 2015-01-14 |
Family
ID=48607508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11822653.9A Withdrawn EP2612380A4 (en) | 2010-09-01 | 2011-09-01 | LIGHT EMITTING APPARATUS, ENERGY GENERATOR OR OTHER ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2612380A4 (en) |
KR (4) | KR102404843B1 (en) |
CN (1) | CN103582962B (en) |
WO (1) | WO2012031096A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2954361B1 (en) | 2009-12-23 | 2012-06-15 | Arjo Wiggins Fine Papers Ltd | ULTRA SMOOTH AND RECYCLABLE PRINTING SHEET AND METHOD OF MANUFACTURING THE SAME |
NO2802711T3 (en) | 2012-01-13 | 2018-03-24 | ||
DE102015215599A1 (en) * | 2015-08-14 | 2017-02-16 | Audi Ag | Energy storage arrangement, in particular for a motor vehicle, motor vehicle and method for producing an energy storage device |
CN111261653B (en) * | 2018-11-30 | 2023-08-01 | 成都辰显光电有限公司 | Micro light-emitting diode, display panel and transfer method thereof |
KR102731021B1 (en) * | 2020-01-23 | 2024-11-15 | 삼성디스플레이 주식회사 | Photodegradable thickening agent, light emitting element ink comprising the same and method of fabricating display device |
KR102791991B1 (en) * | 2019-03-18 | 2025-04-07 | 삼성디스플레이 주식회사 | Light emitting diode solvent, light emitting ink comprising the same and method of fabrication display device |
KR20210130889A (en) | 2020-04-22 | 2021-11-02 | 삼성디스플레이 주식회사 | Light emitting element ink and method of fabricating display device |
CN111739789B (en) * | 2020-06-30 | 2024-05-03 | 安徽安美半导体有限公司 | Reworking cleaning process of diode |
US12328931B2 (en) | 2022-03-04 | 2025-06-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Hybrid integrated circuit dies and methods of forming the same |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995017005A1 (en) * | 1993-12-17 | 1995-06-22 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
US5469020A (en) * | 1994-03-14 | 1995-11-21 | Massachusetts Institute Of Technology | Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes |
EP0747948A2 (en) * | 1995-06-07 | 1996-12-11 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
WO2000045443A1 (en) * | 1999-01-28 | 2000-08-03 | Nova Crystals, Inc. | High performance light emitting diodes |
US20060278886A1 (en) * | 2005-06-10 | 2006-12-14 | Sony Corporation | Light emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus |
WO2007149362A2 (en) * | 2006-06-16 | 2007-12-27 | Articulated Technologies, Llc | Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements |
US20080224153A1 (en) * | 2006-12-04 | 2008-09-18 | Sony Corporation | Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same |
EP2048704A1 (en) * | 2006-07-12 | 2009-04-15 | Sony Corporation | Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display |
US20090230174A1 (en) * | 2008-01-22 | 2009-09-17 | Washington, University Of | Self-assembly of elements using microfluidic traps |
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JPH0955538A (en) * | 1995-08-10 | 1997-02-25 | Furukawa Electric Co Ltd:The | Multi-wavelength light emitting diode |
US6611002B2 (en) * | 2001-02-23 | 2003-08-26 | Nitronex Corporation | Gallium nitride material devices and methods including backside vias |
US6918946B2 (en) * | 2001-07-02 | 2005-07-19 | Board Of Regents, The University Of Texas System | Applications of light-emitting nanoparticles |
JP4397394B2 (en) * | 2003-01-24 | 2010-01-13 | ディジタル・オプティクス・インターナショナル・コーポレイション | High density lighting system |
US6936193B2 (en) * | 2003-04-14 | 2005-08-30 | Research Frontiers Incorporated | Suspended particle device light valve film |
US20050146870A1 (en) * | 2004-01-06 | 2005-07-07 | Jeng-Shyong Wu | Elongated flexible lighting equipment and fabricating method of same |
US20070131925A1 (en) * | 2004-03-16 | 2007-06-14 | Paul Shalk | Organic light-emitting diode |
US7476557B2 (en) | 2004-03-29 | 2009-01-13 | Articulated Technologies, Llc | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
GB2418532A (en) * | 2004-09-28 | 2006-03-29 | Arima Optoelectronic | Textured light emitting diode structure with enhanced fill factor |
US7554257B2 (en) * | 2005-03-02 | 2009-06-30 | Osram Opto Semiconductors Gmbh | Method to generate high efficient devices which emit high quality light for illumination |
FR2892594B1 (en) * | 2005-10-21 | 2007-12-07 | Saint Gobain | LIGHT STRUCTURE COMPRISING AT LEAST ONE ELECTROLUMINESCENT DIODE, ITS MANUFACTURE AND ITS APPLICATIONS |
US20080121899A1 (en) * | 2006-11-07 | 2008-05-29 | World Properties, Inc. | Transparent electrode for LED array |
US8110425B2 (en) * | 2007-03-20 | 2012-02-07 | Luminus Devices, Inc. | Laser liftoff structure and related methods |
WO2008128554A1 (en) * | 2007-04-20 | 2008-10-30 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Highly conductive, transparent carbon films as electrode materials |
US8133768B2 (en) | 2007-05-31 | 2012-03-13 | Nthdegree Technologies Worldwide Inc | Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system |
US8889216B2 (en) * | 2007-05-31 | 2014-11-18 | Nthdegree Technologies Worldwide Inc | Method of manufacturing addressable and static electronic displays |
JP2013074070A (en) * | 2011-09-27 | 2013-04-22 | Fujitsu Ltd | Semiconductor device and manufacturing method of semiconductor device |
-
2011
- 2011-09-01 CN CN201180052548.5A patent/CN103582962B/en active Active
- 2011-09-01 WO PCT/US2011/050174 patent/WO2012031096A2/en active Application Filing
- 2011-09-01 KR KR1020217035378A patent/KR102404843B1/en active Active
- 2011-09-01 KR KR1020137008391A patent/KR102030331B1/en active Active
- 2011-09-01 EP EP11822653.9A patent/EP2612380A4/en not_active Withdrawn
- 2011-09-01 KR KR1020207025886A patent/KR102321916B1/en active Active
- 2011-09-01 KR KR1020197028661A patent/KR102156532B1/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995017005A1 (en) * | 1993-12-17 | 1995-06-22 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
US5469020A (en) * | 1994-03-14 | 1995-11-21 | Massachusetts Institute Of Technology | Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes |
EP0747948A2 (en) * | 1995-06-07 | 1996-12-11 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
WO2000045443A1 (en) * | 1999-01-28 | 2000-08-03 | Nova Crystals, Inc. | High performance light emitting diodes |
US20060278886A1 (en) * | 2005-06-10 | 2006-12-14 | Sony Corporation | Light emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus |
WO2007149362A2 (en) * | 2006-06-16 | 2007-12-27 | Articulated Technologies, Llc | Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements |
EP2048704A1 (en) * | 2006-07-12 | 2009-04-15 | Sony Corporation | Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display |
US20080224153A1 (en) * | 2006-12-04 | 2008-09-18 | Sony Corporation | Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same |
US20090230174A1 (en) * | 2008-01-22 | 2009-09-17 | Washington, University Of | Self-assembly of elements using microfluidic traps |
Non-Patent Citations (3)
Title |
---|
BARRY C R ET AL: "Approaching Programmable Self-Assembly fromNanoparticle-Based Devices to Integrated Circuits", PROCEEDINGS OF THE FOUNDATIONS OF NANOSCIENCE, XX, XX, 21 April 2004 (2004-04-21), XP002367627 * |
HWANG ET AL: "Optical and electrical properties of GaN micron-scale light-emitting diode", JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, PERGAMON PRESS, LONDON, GB, vol. 69, no. 2-3, 1 February 2008 (2008-02-01), pages 752 - 758, XP022456345, ISSN: 0022-3697, DOI: 10.1016/J.JPCS.2007.07.111 * |
See also references of WO2012031096A2 * |
Also Published As
Publication number | Publication date |
---|---|
KR20210136146A (en) | 2021-11-16 |
KR102030331B1 (en) | 2019-10-10 |
KR20200106995A (en) | 2020-09-15 |
WO2012031096A3 (en) | 2014-03-20 |
WO2012031096A2 (en) | 2012-03-08 |
KR102321916B1 (en) | 2021-11-05 |
CN103582962A (en) | 2014-02-12 |
KR20130108575A (en) | 2013-10-04 |
CN103582962B (en) | 2017-03-22 |
EP2612380A2 (en) | 2013-07-10 |
KR102156532B1 (en) | 2020-09-16 |
KR20190116535A (en) | 2019-10-14 |
KR102404843B1 (en) | 2022-06-07 |
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