EP2454100B1 - Method for the production of a multilayer element, and multilayer element - Google Patents

Description

The invention relates to a method for producing a multilayer body having a carrier layer and a single-layer or multi-layer decorative layer formed on and / or in the carrier layer, as well as a multi-layer body obtainable therefrom according to claims 1 to 15.

Optical security elements are often used to make it difficult to copy documents or products to prevent their misuse. Thus, optical security elements find use for securing documents, banknotes, credit and debit cards, ID cards, packaging of high-quality products and the like. In this case, it is known to use optically variable elements as optical security elements which can not be duplicated by conventional copying methods. It is also known to provide security elements with a structured metal layer, which is in the form of a text, logos or other pattern.

The production of a structured metal layer from a metal layer applied in a planar manner, for example by sputtering or vapor deposition, requires a large number of processes, in particular if fine structures are to be produced which have a high degree of protection against counterfeiting. That's the way it is, for example It is known to partially demetallize a metal layer applied over the entire area by positive or negative etching or by laser ablation and to structure it. Alternatively, it is possible to apply metal layers by means of using vapor masks already in structured form on a support.

The more manufacturing steps are provided for the production of the security element, the greater importance receives the register or register accuracy of the individual process steps, i. the accuracy of the positioning of the individual tools relative to one another in the formation of the security element with respect to features or layers or structures already present on the security element.

From the WO 2006/084686 A2 For example, a method is known for producing a multilayer body which has a replication layer in which a diffractive first relief structure is molded. Then, in one embodiment, a metal layer is applied over the entire area, and a photosensitive layer is applied to the metal layer. The fact that the metal layer in the region of the diffractive first relief structure allows a higher transmission than outside this region results in the exposure of the photosensitive layer in the region of the diffractive first relief structure, but not outside it. The exposed area can be removed leaving the unexposed area, or vice versa.

The WO 03/095745 A1 discloses a multilayer body having a layer structure comprising at least one layer containing a laser-sensitive material.

1. a) auf und/oder in einer Trägerlage mit einer ersten Seite und einer zweiten Seite eine ein- oder mehrschichtige Dekorlage mit einem ersten Bereich und einem zweiten Bereich ausgebildet wird, wobei die Dekorlage senkrecht zur Ebene der Trägerlage gesehen in dem ersten Bereich einen ersten Transmissionsgrad und in dem zweiten Bereich einen im Vergleich zu dem ersten Transmissionsgrad größeren zweiten Transmissionsgrad aufweist, wobei sich die besagten Transmissionsgrade auf eine elektromagnetische Strahlung mit einer für eine Photoaktivierung geeigneten Wellenlänge beziehen,
2. b) mindestens eine zu strukturierende Schicht auf der ersten Seite der Trägerlage angeordnet wird,
3. c) eine mittels der besagten elektromagnetischen Strahlung photoaktivierbare Resistschicht (kurz als "Resist" bezeichnet) auf der ersten Seite der Trägerlage so angeordnet wird, dass die Resistschicht auf der von der Trägerlage abgekehrten Seite der mindestens einen zu strukturierenden Schicht und die Dekorlage auf der anderen Seite der mindestens einen zu strukturierenden Schicht angeordnet ist,
4. d) die Resistschicht von der zweiten Seite der Trägerlage her mittels der besagten elektromagnetischen Strahlung belichtet wird, wobei die Dekorlage durch die Ausbildung des ersten Bereichs und des zweiten Bereichs als eine Belichtungsmaske dient, und
5. e) die mindestens eine zu strukturierende Schicht und die Resistschicht mittels zueinander synchronisierter strukturgebender Prozesse zueinander passergenau strukturiert werden.

The object of the present invention is to provide a multilayer body which is particularly difficult to reproduce and a method for producing such a multilayer body, in which a partially formed layer is formed in register with a further partially formed layer The object is achieved by a method for producing a multilayer body, in which

1. a) on and / or in a carrier layer having a first side and a second side a single or multi-layer decorative layer is formed with a first region and a second region, the decorative layer seen perpendicular to the carrier layer in the first region a first degree of transmission and in the second region has a second transmittance greater than the first transmittance, said transmittances relating to an electromagnetic radiation having a wavelength suitable for photoactivation,
2. b) at least one layer to be structured is arranged on the first side of the carrier layer,
3. c) a photoactivatable by means of said electromagnetic radiation resist layer (hereinafter referred to as "resist") on the first side of the carrier layer is arranged so that the resist layer on the side facing away from the carrier layer side of at least one layer to be patterned and the decorative layer on the other Side of the at least one layer to be structured is arranged,
4. d) the resist layer is exposed from the second side of the carrier layer by means of said electromagnetic radiation, wherein the decorative layer serves as an exposure mask by the formation of the first region and the second region, and
5. e) the at least one layer to be structured and the resist layer are patterned in register with each other by means of mutually synchronized structuring processes.

The steps a) to e) of the process according to the invention are preferably carried out in the order indicated. During the exposure of the photoactivatable layer by means of said electromagnetic radiation from the side of the carrier layer facing away from the photoactivatable layer through the decorative layer, it acts on the first area and the second area Area defining decorative layer as an exposure mask, since the first region has a transmittance, which is lowered compared to the transmittance of the second region.

Such a method allows the formation of particularly forgery-proof multilayer body. As already mentioned, in the process the decorative layer during the manufacture of the multilayer body serves as an exposure mask for an exposure, i. a photoactivation, the photoactivatable resist layer and the finished multilayer body for decoration. The decorative layer thus fulfills several completely different functions. In particular, the decorative layer is designed such that a viewer of an article decorated by means of the multilayer body can view the at least one structured layer through the decorative layer. The typical transmission of the first regions of the decorative layer is thus at least an order of magnitude larger than the typical transmission of a conventional exposure mask, e.g. made of metal.

By using the decorative layer as an exposure mask, the resist layer is patterned in register with the first and second regions of the decorative layer, ie the structures of the structured resist layer are arranged in register with the first and second regions of the decorative layer. In addition, according to the method according to the invention, the at least one layer to be structured is patterned in register with the resist layer. The method therefore permits the formation of at least three layers formed in register with respect to one another: the decorative layer, the resist layer and the at least one layer to be structured. By means of the structuring step e), the at least one layer to be structured is formed as a structured layer. As a result of the method, the multilayer body has the structured layer register-accurate in the first region or in the second region of the decorative layer. Register or register accuracy is to be understood as meaning the positional arrangement of superimposed layers. The register accuracy or register accuracy of the layers is preferably controlled by means of register marks or register marks, which at all Layers are equally present and where, preferably by means of optical detection methods or sensors, it can be easily recognized whether the layers are arranged in the register. Register accuracy is given in both dimensions, ie length and width of the layers.

The register or register means the exact fitting or matching of different elements of the multilayer body. A layer comprises at least one layer. A decorative layer comprises one or more decorative and / or protective layers, in particular formed as paint layers. The decorative layers can be arranged over the entire surface or in pattern-like structured form on the carrier layer. In this case, the one or more decorative layers can be arranged on one or both sides of the carrier layer, which is formed for example as a base or carrier film. The decorative layer comprises at least one layer which weakens the electromagnetic radiation with the wavelength suitable for photoactivation. The decorative layer has an optical density greater than zero with respect to the electromagnetic radiation having the wavelength suitable for photoactivation.

The formation of the exposure mask as a decorative layer inevitably results in an absolutely 100% registration accuracy of the exposure mask to the decorative layer, i. The decorative layer itself acts at least in areas as an exposure mask. The decorative layer and the exposure mask thus form a common functional unit. By virtue of the method which is as simple as it is effective, the present invention offers a considerable advantage over conventional methods in which a separate exposure mask has to be registered in the decorative layer, wherein in practice register deviations can only be completely avoided in very few cases.

By means of the present invention, therefore, the layer to be structured can be registered in register with the components without additional technological effort Decorative layer defined first and second areas are structured. In conventional methods for producing an etching mask by means of a mask exposure, wherein the mask is present either as a separate unit, for example as a separate foil or as a separate glass plate / glass roller, or as a subsequently printed layer, the problem may arise that by previous, In particular, thermally and / or mechanically straining, process steps caused linear and / or non-linear distortions in the multilayer body can not be compensated completely by an alignment of the mask on the multilayer body over the entire surface of the multilayer body, although the mask alignment on existing, preferably on the horizontal and / or vertical edges of the multilayer body arranged register or registration marks takes place. The tolerance fluctuates over the entire surface of the multilayer body in a relatively large area. With the method according to the invention, the first and second regions defined by the decorative layer are used as a mask, wherein the parts of the decorative layer defining the first and second regions are applied in an early process step during the production of the multilayer body. The mask designed as a decorative layer is therefore subjected to all subsequent process steps of the multilayer body, and thus automatically follows all the distortions possibly caused by these process steps in the multilayer body itself. Thus, no additional tolerances, in particular no additional tolerance fluctuations, can occur over the surface of the multilayer body the subsequent generation of a mask and the necessary register-accurate subsequent positioning of this independent of the previous process history mask is avoided. The tolerances or registration accuracies in the method according to the invention are based only on possibly not absolutely exactly formed edges of the first and second regions, the quality of which is determined by the particular manufacturing method used. The tolerances or register accuracies in the method according to the invention are approximately in the micrometer range, and thus far below the Resolving power of the eye; ie the unarmed human eye can no longer perceive existing tolerances.

In the case of the exposure of the resist layer according to the invention from the second side of the carrier layer, the resist layer is exposed to different areas in different areas. This different exposure of the resist layer is due to the different transmittances in the first and the second region of the decorative layer, but independent of any existing relief structure, in particular independent of a relief structure formed in the carrier film or in a layer arranged on the carrier film. In other words, the different exposure of the resist layer is not due to a relief structure.

The structuring of the at least one layer to be patterned and the photoactivatable resist layer, which is arranged on the first side of the carrier layer, is determined by the differently intense exposure of the resist layer, which in turn is defined by the first and the second region of the decorative layer; However, the structuring is independent of any existing relief structure and not due to a relief structure, in particular independent of a in the carrier film or in a layer arranged on the carrier film shaped relief structure. The boundaries of the first and the second region of the decorative layer thus correspond, seen perpendicular to the plane of the carrier layer, the boundaries of structuring the at least one layer to be patterned and the photoactivatable resist layer, but are independent of and not limited by boundaries, in particular contours of a relief structure ,

According to step d) of the method according to the invention, the decorative layer is used as an exposure mask by the formation of the first region and the second region, the exposure mask thus formed being independent of an optionally existing relief structure, in particular independently of one in the carrier film or in one on the Carrier film arranged Layer shaped relief structure. According to step e) of the method according to the invention, the at least one layer to be patterned and the resist layer are patterned in registration with each other by means of mutually synchronized structuring processes, this structuring being dependent on the first and second regions of the decorative layer, but independent of any relief structure, in particular independently of a relief structure formed in the carrier film or in a layer arranged on the carrier film.

The function of the decorative layer as an exposure mask is independent of the layer to be structured. The physical properties, in particular the effective thickness or the optical density, of the layer to be structured have no influence on or are independent of the physical properties of the decorative layer, i. the exposure mask, in particular the degrees of transmission in the first and the second region of the decorative layer. The decorative layer alone and detached from any existing relief structures, in particular diffractive relief structures and other, in particular physical and / or chemical properties of the layer to be structured determines the exposure mask according to the invention. The layer to be patterned is not part of the exposure mask, i. In the present invention, the exposure mask (= decorative layer) and the layer to be structured are present separately and are functionally decoupled.

It is possible for the at least one layer to be structured to have a constant layer thickness over the entire surface on which it is arranged on the first side of the carrier layer.

It is possible for the decorative layer to comprise a first lacquer layer which is arranged in the first region with a first layer thickness and in the second region either not or with a smaller second layer thickness than the first layer thickness on the carrier layer, so that the decorative layer in the first region the said first transmittance and in the second region the said second transmittance.

It is possible that the decorative layer comprises a first coloring of the carrier layer which is formed in the first region with a first layer thickness and in the second region either not or with a smaller compared to the first layer thickness second layer thickness, so that the decorative layer in the first region has said first transmittance and in said second region said second transmittance. The coloring of the carrier layer may be formed as a colored or discolored area within the carrier layer. A preferred method for forming a coloring of the carrier layer is a laser marking in the carrier layer with color change or a method in which to diffuse pigments or dyes into the carrier layer.

An example of a laser marking in the form of blackening or darkening of a carrier layer is the action of a laser beam on a carrier layer, for example of polycarbonate (= PC), which is particularly effective when the polycarbonate is doped. Such carrier layers are for example in the EP 0 991 523 B1 or the EP 0 797 511 B1 described.

An example of a process for diffusing pigments or dyes is the printing of the carrier layer with a solvent-containing color coat, the subsequent temporary exposure to the color coat and the subsequent washing off of the color coat. The surface of the material of the carrier layer is partially attacked by the solvent (s) in the color coat, whereby parts of the color ink can diffuse at least into the upper layers of the carrier layer located in the region of the attacked surface. The material of the carrier layer is to be selected so that it can be attacked by a solvent used in the paint. Such a combination may be, for example, a carrier layer of polycarbonate and a lake based on aromatic solvents. After removal of the paint remains the diffused component of the color coat in the carrier layer. Depending on the layer thickness of the applied colored lake and depending on the selection of the material of the carrier layer, different amounts of pigments or dyes can diffuse into the carrier layer at different depths. Although, due to the diffusion in, a slight blurring arises at the edges of the first and / or second regions, the horizontal extent of which however lies only in the region of the preferably vertical layer thickness of the printed color coat. Here, "vertical" refers to an extent substantially perpendicular to the carrier layer, and "horizontal" to an extent substantially in the plane formed by the carrier layer. If, for example, a color coat layer of a few micrometers, for example 1 to 10 .mu.m, is printed in a printing process, the blur is also only in this range of 1 to 10 .mu.m and thus far below the resolution of the eye.

Another example of a process for diffusing pigments or dyes is the partial printing of a carrier layer with a lift-off lacquer for covering the second regions. Subsequently, the support layer is exposed to an atmosphere of a vaporized colorant, for example, an atmosphere of an inert gas such as argon or nitrogen and vaporized iodine. In the first areas not covered by the liftoff paint, the vaporized colorant now diffuses into the carrier layer. Subsequently, the liftoff paint can be removed. Alternatively or in combination, the carrier layer printed in regions with the lift-off lacquer may pass through a bath, for example containing apolar solvents such as toluene or benzine and a dye dissolved therein and preferably also a UV blocker (UV = ultraviolet) also dissolved in the bath. The lift-off lacquer must be resistant to the solvents of the bath, eg as a water-soluble lift-off lacquer. The dye and optionally the UV blocker diffuse into the first areas of the carrier layer not covered by the lift-off lacquer in the bath and thereby color the carrier layer. Subsequently, the lift-off lacquer can be removed from the carrier layer.

Another example of a process for diffusing pigments or dyes is to print the support layer by a thermal sublimation process in which dye sublimates from a separate ink carrier layer by means of local heat through a thermal printhead, i. it evaporates. This color vapor can then diffuse into the carrier layer, wherein high resolutions of about 300 dpi (= dots per inch) can be achieved. In order to further increase the edge sharpness when diffusing in, an additional mask can be used, which is arranged between the thermal print head and the carrier layer and covers areas of the carrier layer which are not to be inked.

It is possible that a layer of the decorative layer is formed in regions in different thickness on and / or within the carrier layer. It is possible that a layer of the decorative layer is formed as a layer of substantially uniform thickness and the layer is only partially, i. is formed in a pattern-shaped pattern, on and / or within the carrier layer. In this case, it is possible for the decorative layer to comprise only layers applied on one side of the carrier layer or layers applied on both sides of the carrier layer.

The object is further achieved by a multilayer body according to claim 7, having a carrier layer which has a first side and a second side, and a single-layer or multi-layer decorative layer which is formed on and / or in the carrier layer and which comprises a first region and a second region wherein the decorative layer has a first transmittance in the first region perpendicular to the plane of the carrier layer and a second transmittance greater in the second region than the first transmittance, said transmittances being suitable for electromagnetic radiation with one suitable for photoactivation Wavelength, wherein the multi-layer body also has at least one structured in the register to the first region and the second region layer.

The multilayer body according to the invention can be used, for example as a label, laminating, hot stamping or transfer film, to provide an optical security element used for securing documents, banknotes, credit and debit cards, identity cards, packaging of high-quality products and the like. In this case, the decorative layer and the at least one register-specific arranged structured layer can serve as optical security element.

When an arrangement of an object in the first area and / or in the second area is described below, it is to be understood that the object is arranged so that the object and the first and / or the second area of the decorative layer perpendicular to the plane of Overlap carrier layer seen. Also, in the following, the terms "first area" and "second area" will be applied to other objects, e.g. Layers / layers transferred to the multilayer body. A first / second region of an article means that the first / second region of the decorative layer and the first / second region of the article are congruent when viewed perpendicular to the plane of the carrier layer.

The exposure mask formed by the decoration layer includes the first region and the second region that have a different transmittance with respect to the radiation used in the exposure. The exposure mask, therefore, has no area absolutely impermeable to the radiation used in the exposure, but only a region with a higher transmittance and a region with a lower transmittance, and therefore may be referred to as a halftone mask. The area of the photoactivatable layer exposed through the first area is activated to a lesser extent than the area of the photoactivatable layer exposed through the second area, since the first area has a smaller transmittance than the second area.

It has proved useful to use a positive photoresist whose solubility increases upon activation by exposure or a negative photoresist whose solubility decreases upon activation by exposure to form the photoactivatable layer. Exposure is the selective irradiation of a photoactivatable layer through an exposure mask with the aim of locally modifying the solubility of the photoactivatable layer by a photochemical reaction. According to the nature of the photochemically achievable solubility change, a distinction is made between the following photoactivatable layers, which can be formed as photoresists: In a first type of photoactivatable layers (eg negative resist), their solubility decreases by exposure compared to unexposed areas of the layer For example, because the light leads to the curing of the layer; in a second type of photoactivatable layers (e.g., positive resist), their solubility increases by exposure to unexposed areas of the layer, for example, because the light results in the decomposition of the layer.

Further, it has been found useful to remove the resist layer using a positive photoresist in the second region or using a negative photoresist in the first region. This can be done by a solvent such as a caustic or acid. When using a positive photoresist, the more exposed second region of the resist layer has a higher solubility than the less exposed first region of the resist layer. Therefore, a solvent dissolves the material of the resist layer, ie, the positive photoresist disposed in the second region, faster and better than the material of the resist layer disposed in the first region. By using a solvent, the resist layer can thus be patterned, ie the resist layer is removed in the second region, but remains in the first region.

It has proven useful if the layer to be structured is removed in the first or second region in which the resist layer has been removed. This can be done by an etchant such as an acid or alkali. It is preferred if the partial removal of the resist layer in the first or second region and the regions of the layer to be structured which are thereby exposed in the first or second region occur in the same process step. This can be achieved in a simple manner by a solvent / etchant, such as a caustic or acid, which is capable of producing both the resist layer-in the case of a positive resist in the exposed region, in the case of a negative resist in the unexposed region-and the structure to be structured To remove layer, ie both materials are attacking. In this case, the resist layer must be formed in such a way that it, the solvent or etchant used in the exposure of a positive resist in the unexposed area, the use of a negative resist in the exposed area for at least a sufficient time, i. withstands the exposure time of the solvent or etchant.

A preferred embodiment provides that the resist is likewise largely completely removed (= "stripping") during the work step for removing the layer to be structured in the first or second region or in a separate subsequent subsequent working step. By reducing the number of superimposed layers in the multi-layer body, its durability and durability can be increased because adhesion problems between adjacent layers are minimized. Furthermore, the optical appearance of the multilayer body can be improved, since after removal of the resist, which in particular is colored and / or not completely transparent, but can only be translucent or opaque, the underlying areas are exposed again. For special applications without particularly high demands on the durability or the visual appearance, however, it is also possible to leave the resist on the structured layer. Leaving the resist on the patterned layer may be particularly advantageous if it is considered to be relatively stable Negative-resist is executed and colored. The resist can be printed to with two or more colors too. Thus, when viewing the multi-layer body from different sides different color impressions can be realized.

It is preferred if the resist layer is exposed from the side of the carrier layer facing away from the resist layer by means of the said electromagnetic radiation, the decorative layer serving as an exposure mask by forming the at least one first region and the at least one second region. The at least one layer to be structured is structured by means of the photoactivatable layer removed after exposure in the at least one first region or the at least one second region in register with the at least one first region and the at least one second region.

It is preferred if the resist layer comprises a UV-activatable material. In this case, UV radiation can be used for the exposure step d). As a result, the visual properties of the multilayer body can be separated from the desired process properties for structuring the at least one layer to be structured. The exposure step d) is designed such that the radiation completely penetrates the resist layer, that is, it reaches its outer surface facing away from the carrier layer. Only then is it easily possible to remove the resist by means of a solvent from the side of the outer surface of the resist layer. If the resist is not completely irradiated, it generally has a "skin" on its outer surface facing away from the carrier layer, which at least partially prevents the attack of a solvent.

The carrier layer must be permeable to the radiation used in the exposure step d). It has been proven to use for the exposure electromagnetic radiation with a maximum radiation in the range of 365 nm, since in this area PET (= polyethylene terephthalate), which is a substantial Part of the carrier layer can form, is transparent. In the range of this wavelength is the maximum of the emission of a high pressure mercury radiator. It is also possible to use electromagnetic radiation having a wavelength in the range of 254 to 314 nm for the following carrier materials: olefinic carrier material such as PP (= polypropylene) or PE (= polyethylene), carrier material based on PVC and PVC copolymer, Support material based on polyvinyl alcohol and polyvinyl acetate, polyester support based on aliphatic raw materials.

It has proven to be advantageous to choose the thickness and the material of the decorative layer so that the first transmittance is greater than zero. The thickness and the material of the decorative layer are chosen so that electromagnetic radiation with the suitable wavelength for the photoactivation partially penetrates the decorative layer in the first region. The exposure mask formed by the decorative layer is therefore designed to be radiation-permeable in the first region.

It has proven useful if the thickness and the material of the decorative layer are chosen such that the ratio between the second and the first transmittance is equal to or greater than two. The ratio between the first and the second transmittance is preferably 1: 2, also referred to as contrast 1: 2. A contrast of 1: 2 is at least an order of magnitude lower than with conventional masks. It has not been customary to use a mask for an exposure of a resist layer, which has such a low contrast as the decorative layer described here. When exposing a resist with a conventional mask (eg a chrome mask) opaque, ie with OD> 2, and completely transparent areas are present; So the mask has a high contrast. A conventional aluminum mask has a typical contrast of 1: 100 because the typical transmittance of an aluminum layer is at values around 1%, corresponding to an optical density (= OD) of 2.0. The transmittance (= T) and the OD are linked together as follows: T = 10 ^-OD (ie OD = 0 corresponds to T = 100%; OD = 2 corresponds to T = 1%; OD = 3 corresponds to T = 0.1%). In contrast to conventional exposure methods, in the present invention the resist layer is exposed not only by a mask with low contrast (= decorative layer) but also by the layer to be structured.

It is furthermore possible for at least one functional layer, in particular a release layer and / or a protective lacquer layer, to be arranged between the carrier layer and the at least one layer to be structured, preferably directly on the first side of the carrier layer. This is advantageous in particular when using the multilayer film as a transfer film, in which the functional layer enables a problem-free detachment of the carrier layer from a transfer layer comprising at least one layer of the decorative layer and the structured layer.

It has proven useful if the thickness and the material of the decorative layer is selected such that the electromagnetic radiation, measured after passing through a layer package consisting of the carrier layer, the at least one functional layer and the decorative layer, in the first region has a transmittance of about 0.3 and in the second region has a transmittance of about 0.7. Such a contrast between the two regions formed as different transmission regions, i. the first and the second region is sufficient, in particular for a positive resist layer.

It is possible that at least one relief structure is formed on the first side of the carrier layer, and that the at least one layer to be structured is arranged on the surface of the at least one relief structure. For this purpose, it may be provided to arrange a replication layer on the first side of the carrier layer and to impress the at least one relief structure in a surface of the replication layer facing away from the carrier layer. However, it can also be provided to impress the at least one relief structure directly into the carrier layer. The carrier layer on the first side of the Carrier layer have a replicable suitable replicable carrier material, for example PVC (= polyvinyl chloride), PC, PS (= polystyrene) or PVA (= polyvinyl acetate). A replication layer is generally understood as meaning a layer which can be produced superficially with a relief structure. These include, for example, organic layers such as plastic or lacquer layers or inorganic layers such as inorganic plastics (eg silicones), glass layers, semiconductor layers, metal layers, etc., but also combinations thereof. It is preferred that the replication layer is formed as a replicate varnish layer. To form the relief structure, a radiation-curable replication layer can be applied to the carrier layer, a relief can be shaped into the replication layer, and the replication layer can be cured with the embossment embossed therein. It is preferred if the relief is a light diffractive or refractive or light scattering, microscopic or macroscopic structure, such as a diffractive structure or a diffraction grating or a matt structure or combinations of light diffractive or refractive or light scattering, microscopic or macroscopic structures, such as diffractive structures, matt structures or Diffraction grating is formed.

It is possible for the at least one relief structure to be arranged at least partially in the first region and / or in the second region. In this case, the surface layout of the relief structure can be adapted to the surface layout of the first and second regions, in particular in the register, or the surface layout of the relief structure is designed, for example, as a continuous endless pattern independent of the surface layout of the first and second regions. The inventive arrangement of the resist layer on the first side of the carrier layer so that the resist layer is disposed on the side facing away from the carrier layer side of at least one layer to be structured and the decorative layer on the other side of the at least one layer to be structured, it is possible to arrange the layer to be structured at least partially on a relief structure, in contrast to patterning process using washcoat. At a conventional structuring methods using washcoat comprising silica (= silica) or titanium dioxide (eg rutile), the silica and the titanium dioxide by mechanical action destructive effect on the surface of the replication roller, in particular with a nickel surface. In addition, the differences in level between the washcoat layer and the underlying layer into which the relief structure is to be imprinted impede replication.

It is possible that after the step e) a leveling layer is applied on the first side of the carrier layer. By means of the structuring step e), the layer to be structured is formed as a structured layer. It is preferable that after the step e), the patterned layer and the resist layer are removed in the first or the second region and exist in the other region. By applying the compensating layer, recessed regions / depressions of the structured layer can be at least partially filled. It is possible that by applying the compensating layer, recessed regions / depressions of the resist layer are at least partially filled. The leveling layer may comprise one or more different layer materials. The compensation layer may be formed as a protective and / or adhesive and / or decorative layer. It is possible that on the side facing away from the carrier layer side of the compensation layer, an adhesive layer, for. B. adhesive layer is applied. Thus, the multilayer body formed as a laminating or transfer film may be bonded to a substrate adjacent to the primer layer, e.g. in a hot stamping or IMD (IMD = In-Mold Decoration) process. The substrate can be, for example, paper, cardboard, textile or another fibrous material, or a plastic and in that case flexible or predominantly rigid.

It is possible that at least one layer of the decorative layer is applied to the second side of the carrier layer. As a result, one or more layers of the at least one layer can be removed again after the exposure step in which the decorative layer serves as an exposure mask. It is therefore possible in that one or more layers of the at least one layer of the decorative layer applied to the second side of the carrier layer are removed from the carrier layer after the exposure step d).

It is preferable that the visible light decorative layer having a wavelength in a range of about 380 to 750 nm is at least partially transmissive. It is possible if the decorative layer is colored with at least one opaque and / or at least one transparent colorant which is colored or color-producing at least in one wavelength range of the electromagnetic spectrum, in particular colorfully colorful or color-producing, in particular that a colorant contained in the decorative layer is that can be excited outside the visible spectrum and produces a visually recognizable colored impression. It is possible for the decorative layer to contain at least one pigment or at least one colorant of the color cyan, magenta, yellow (= yellow) or black (= black) (CMYK = cyan magenta yellow key, key: black as color depth) or the color red , Green or blue (= RGB), in particular for producing a subtractive mixed color, is colored, and / or provided with at least one red and / or green and / or blue fluorescent radiation-stimulable pigment or dye and thereby in particular produces an additive mixed color upon irradiation can be. The coloring can be substantially constant over the entire inked surface area or as a particular continuous color gradient, for example, a linear or radial gradient, be formed, i. that the coloring has a gradient, wherein the coloring may in particular vary between two or more shades, for example from red to blue and further to green or between one or more shades and an achromatic, for example between red and transparent, d. H. a non-colored decorative layer. Such color gradients are known and widely used in security printing because their forgery is difficult.

As a result, the decorative layer fulfills a dual function. On the one hand, the decorative layer serves as an exposure mask for the formation of at least one structured Layer, which is arranged register accurate to the first and second region of the decorative layer. In particular, the decorative layer serves as an exposure mask for a partial demetallization of a metal layer. On the other hand, the decorative layer, or at least one or more layers of the decorative layer, serves on the multi-layer body as an optical element, in particular as a single- or multi-colored ink layer for coloring the at least one structured layer, the ink layer registering over and / or next to / adjacent to the at least one structured layer is arranged.

It is possible for the multi-layer body in the first area or the second area to have a photo-activatable resist layer, wherein the at least one structured layer and the resist layer are arranged precisely aligned with one another on the first side of the carrier layer such that the resist layer is arranged on the side facing away from the carrier layer side of the at least one structured layer and the decorative layer on the other side of the at least one structured layer.

It is possible for the decorative layer to comprise a first lacquer layer which is arranged in the first region with a first layer thickness and in the second region either not or with a smaller second layer thickness compared to the first layer thickness on the carrier layer, so that the decorative layer in the first region the said first transmittance and in the second region the said second transmittance.

It is possible that the decorative layer comprises a first coloring of the carrier layer, which is formed in the first region with a first layer thickness and in the second region either not or with a smaller compared to the first layer thickness second layer thickness, so that the decorative layer in the first region has said first transmittance and in said second region said second transmittance.

It is preferable that the ratio between the second transmittance and the first transmittance is greater than two.

It is possible that at least one relief structure is formed on the first side of the carrier layer and the at least one layer to be structured is arranged on the surface of the at least one relief structure. In this case, it is possible for a replication layer to be arranged on the first side of the carrier layer and for the at least one relief structure to be embossed in a surface of the replication layer facing away from the carrier layer. However, it is also possible that the at least one relief structure is embossed in the carrier layer. It is possible that the relief structure is formed as a diffractive relief structure. It is preferred if the at least one relief structure is arranged at least partially in the first region and / or in the second region.

It is possible for a compensation layer to be arranged on the side of the at least one structured layer facing away from the carrier layer. It is preferred if the refractive index n1 of the compensation layer in the visible wavelength range is in the range from 90% to 110% of the refractive index n2 of the replication layer. It is preferred if in the first or second areas where the patterned layer is removed and a spatial structure, i. a relief is formed on the surface, the depressions and elevations of the relief are leveled by means of a leveling layer having a similar refractive index as the replication layer, i. Δn = | n2-n1 | <0.3. In this way, the optical effect formed by the relief is no longer perceptible in the regions in which the compensating layer is applied directly to the replication layer.

It is possible that the compensating layer is formed as an adhesion layer, eg adhesive layer. It is possible that at least one layer of the decorative layer is arranged on the second side of the carrier layer. It is possible that the decorative layer at least two, different color impressions comprises causing lacquer layers. It is possible that the decorative layer comprises a first lacquer layer, which is applied only partially on the carrier layer, and a second lacquer layer, which is applied over the entire surface of the carrier layer comprises.

It is possible that the at least one structured layer comprises one or more of the following layers: metal layer, in particular containing copper, aluminum, silver and / or gold, HRI layer (HRI = High Refractive Index), in particular containing ZnS or TiO ₂ , Liquid crystal layer, polymer layer, in particular conductive or semiconducting polymer layer, interference thin film layer packet, pigment layer, semiconductor layer. The at least one structured layer is not limited to the mentioned exemplary embodiments. The layer to be patterned may be any material that is vulnerable, ie detachable or removable, to a solvent or etchant. It is possible for the at least one structured layer to have a thickness in the range from 20 to 1000 nm, in particular from 20 to 100 nm. It is preferable that the patterned layer of the multi-layered body as a reflection layer for light incident from the side of the replication layer. The combination of a relief structure of the replication layer and a structured layer arranged thereunder, for example as a metal layer, generates a multiplicity of different optical effects that can be used effectively for safety aspects. The structured layer may consist of metal, for example aluminum or copper or silver, which is galvanically reinforced in a subsequent process step. The metal used for galvanic reinforcement may be the same or different than the metal of the patterned layer. An example is, for example, the galvanic reinforcement of a thin silver layer with copper.

It is possible that the resist layer has a thickness in the range of 0.3 to 3 μm. It has been found to be useful if the resist layer is formed as an etch resist, the resist layer, if formed as a positive photoresist, in the unexposed area and, if it is a negative photoresist is formed, in the exposed region opposite to the layer to be structured etching etchant has a high resistance, which is sufficient to prevent the access of the etchant to the layer to be structured in the area covered by the resist layer substantially at least until the etchant has removed the layer to be structured in the desired area. The said desired area is, if the resist layer is formed as a positive photoresist, the exposed area and, if the resist layer is formed as a negative photoresist, the unexposed area.

It is possible that the decorative layer has a thickness in the range of 0.5 to 5 microns. It is possible that the decorative layer or highly disperse dyes pigments, in particular a Mikrolith ^® -K pigment dispersion has. This is particularly advantageous in a colored decorative layer with pigment content. It is possible that UV absorbers may be added to the decor layer forming material, especially if this material contains relatively few pigments or other UV absorbing components. It is possible that the decorative layer inorganic absorber with high Streuanteilteil, in particular nanoscale UV absorber based on inorganic oxides having. In particular, TiO ₂ and ZnO have been found to be suitable oxides in highly dispersed form, as used in sunscreen creams with a high sun protection factor. These inorganic absorbers lead to a high degree of scattering and are therefore particularly suitable for a matt, in particular semi-gloss, coloring of the decorative layer. It is possible that the decorative layer has organic absorbers, in particular benzotriazole derivatives, with a mass fraction in the range of about 3% to 5%. Suitable organic absorbers are sold under the trade name Tinuvin ^® from Ciba, Basel, Switzerland. It is possible that the decorative layer comprises fluorescent dyes or organic or inorganic fluorescent pigments in combination with finely divided pigments, especially Mikrolith ^® -K. By excitation of these fluorescent pigments, the UV radiation is filtered out for the most part already in the decorative layer, so that only an insignificant fraction of the Radiation reaches the resist layer. The fluorescent pigments can be used in the multilayer body as an additional security feature.

The use of a UV-activatable resist layer offers advantages: By using a UV absorber that is transparent in the visual wavelength range in the decorative layer, the "color" property of the decorative layer in the visual wavelength range of desired properties of the decorative layer for patterning the resist layer, e.g. sensitive in the near UV, and thereby the at least one layer to be structured to be separated. In this way, a high contrast between the first and the second area can be achieved, regardless of the visually discernible coloring of the decorative layer.

It is possible that the carrier layer is formed as a single-layer or multi-layer carrier film. A thickness of the carrier film of the multilayer body according to the invention in the range from 12 to 100 μm has proven itself. As a material for the carrier film is for example PET, but also other plastic materials, such as PEN (= polyethylene naphthalate) or PMMA (= polymethyl methacrylate) in question. It is possible for one or more functional layers, in particular a release layer and / or a protective lacquer layer, to be arranged directly on the first side of the carrier layer.

Fig. 1a

einen schematischen Schnitt einer ersten Fertigungsstufe des in Fig. 8a dargestellten Mehrschichtkörpers;

Fig. 1b-c

schematische Schnitte von zwei alternativen Ausgestaltungen einer ersten Fertigungsstufe;

Fig. 1d

eine schematische Draufsicht der in Fig. 1a dargestellten ersten Fertigungsstufe;

Fig. 2

einen schematischen Schnitt einer zweiten Fertigungsstufe des in Fig. 8a dargestellten Mehrschichtkörpers;

Fig. 2a

einen schematischen Schnitt einer alternativen Ausgestaltung einer zweiten Fertigungsstufe;

Fig. 3

einen schematischen Schnitt einer dritten Fertigungsstufe des in Fig. 8a dargestellten Mehrschichtkörpers;

Fig. 4

einen schematischen Schnitt einer vierten Fertigungsstufe des in Fig. 8a dargestellten Mehrschichtkörpers;

Fig. 5

einen schematischen Schnitt einer fünften Fertigungsstufe des in Fig. 8a dargestellten Mehrschichtkörpers;

Fig. 6

einen schematischen Schnitt einer sechsten Fertigungsstufe des in Fig. 8a dargestellten Mehrschichtkörpers;

Fig. 7

einen schematischen Schnitt einer siebten Fertigungsstufe des in Fig. 8a dargestellten Mehrschichtkörpers;

Fig. 7a

einen schematischen Schnitt einer achten Fertigungsstufe des in Fig. 8a dargestellten Mehrschichtkörpers;

Fig. 8a

einen schematischen Schnitt eines ersten Ausführungsbeispiels eines erfindungsgemäßen Mehrschichtkörpers, ausgebildet unter Verwendung eines positiven Resists;

Fig. 8b

einen schematischen Schnitt eines alternativen Ausführungsbeispiels eines erfindungsgemäßen Mehrschichtkörpers;

Fig. 9

einen schematischen Schnitt eines weiteren Ausführungsbeispiels eines erfindungsgemäßen Mehrschichtkörpers, ausgebildet unter Verwendung eines negativen Resists;

Fig. 10

einen schematischen Schnitt eines weiteren Ausführungsbeispiels eines erfindungsgemäßen Mehrschichtkörpers;

Fig. 11a-g

schematische Darstellungen von möglichen Ausgestaltungen der Dekorlage;

Fig. 12

einen schematischen Schnitt eines weiteren Ausführungsbeispiels eines erfindungsgemäßen Mehrschichtkörpers;

Fig. 13

einen schematischen Schnitt einer Fertigungsstufe eines Mehrschichtkörpers;

Fig. 14

einen schematischen Schnitt einer weiteren Fertigungsstufe eines Mehrschichtkörpers; und

Fig. 15

Transmissionsspektren verschiedener UV-Absorber.

The invention will be explained by way of example with reference to the drawings. Show it

Fig. 1a

a schematic section of a first manufacturing stage of in Fig. 8a illustrated multilayer body;

Fig. 1b-c

schematic sections of two alternative embodiments of a first manufacturing stage;

Fig. 1d

a schematic plan view of the in Fig. 1a illustrated first manufacturing stage;

Fig. 2

a schematic section of a second manufacturing stage of in Fig. 8a illustrated multilayer body;

Fig. 2a

a schematic section of an alternative embodiment of a second manufacturing stage;

Fig. 3

a schematic section of a third manufacturing stage of in Fig. 8a illustrated multilayer body;

Fig. 4

a schematic section of a fourth manufacturing stage of in Fig. 8a illustrated multilayer body;

Fig. 5

a schematic section of a fifth manufacturing stage of in Fig. 8a illustrated multilayer body;

Fig. 6

a schematic section of a sixth manufacturing stage of in Fig. 8a illustrated multilayer body;

Fig. 7

a schematic section of a seventh manufacturing stage of in Fig. 8a illustrated multilayer body;

Fig. 7a

a schematic section of an eighth manufacturing stage of in Fig. 8a illustrated multilayer body;

Fig. 8a

a schematic section of a first embodiment of a multi-layer body according to the invention, formed using a positive resist;

Fig. 8b

a schematic section of an alternative embodiment of a multi-layer body according to the invention;

Fig. 9

a schematic section of another embodiment of a multi-layer body according to the invention, formed using a negative resist;

Fig. 10

a schematic section of another embodiment of a multi-layer body according to the invention;

Fig. 11a-g

schematic representations of possible configurations of the decorative layer;

Fig. 12

a schematic section of another embodiment of a multi-layer body according to the invention;

Fig. 13

a schematic section of a manufacturing stage of a multi-layer body;

Fig. 14

a schematic section of another manufacturing stage of a multi-layer body; and

Fig. 15

Transmission spectra of various UV absorbers.

The Fig. 1a to 14th are each drawn schematically and not to scale to ensure a clear presentation of the essential features.

Fig. 8a 1 shows a multilayer body 100 which has a carrier layer 1 with a first side 11 and a second side 12, a functional layer 2 arranged on the first side 11 of the carrier layer 1, a decorative layer 3 arranged on the functional layer 2 with a first region 8 formed first lacquer layer 31, a replication layer 4 adjacent to the decorative layer 3, a structured layer 5 arranged on the replication layer 4 in register with the first lacquer layer 3 and on the replication layer 4 and the structured layer 5 arranged compensation layer 10.

The carrier layer 1 is a preferably transparent plastic film having a thickness of between 8 μm and 125 μm, preferably in the range of 12 to 50 μm, more preferably in the range of 16 to 23 μm. The carrier film 1 may be formed as a mechanically and thermally stable film of a transparent material, for example of ABS (= acrylonitrile-butadiene-styrene), BOPP (= Biaxially Oriented Polypropylene), PEN, PC, but preferably of PET. The carrier film 1 can hereby be monoaxially or biaxially stretched. Furthermore, it is also possible for the carrier foil 1 not only to consist of one layer, but also of several layers. For example, it is possible for the carrier film 1 to have, in addition to a plastic carrier, for example a plastic film described above, a release layer which makes it possible to detach the layer structure consisting of the layers 2 to 6 and 10 from the plastic film, for example when using the multilayer body 100 as a hot stamping foil

The functional layer 2 may comprise a release layer, e.g. of heat-melting material, which facilitates detachment of the carrier film 1 from the layers of the multilayer body 100, which are arranged on a side of the release layer 2 facing away from the carrier film 1. This is particularly advantageous when the multilayer body 100 is formed as a transfer layer, as e.g. is used in a hot stamping process or an IMD process. Furthermore, it has proven useful, in particular if the multilayer body 100 is used as a transfer film, if the functional layer 2 contains, in addition to a release layer, a protective layer, e.g. a protective lacquer layer. After bonding the multilayer body 100 to a substrate and peeling off the carrier foil 1 from the layers of the multilayer body 100, which are arranged on a side of the peel layer 2 facing away from the carrier foil 1, the protective layer forms one of the upper layers on the surface of the substrate arranged layers and layers arranged below it from abrasion, damage, chemical attack, etc. protect. The multilayer body 100 may be a section of a transfer film, for example a hot stamping film, which may be disposed on a substrate by means of an adhesive layer. The adhesive layer is preferably arranged on the side of the compensation layer 10 facing away from the carrier film 1. The adhesive layer may be a hot melt adhesive which melts upon thermal exposure and bonds the multi-layer body 100 to the surface of the substrate.

In one embodiment of the multilayer body 100 as a laminating film, ie without a release layer for detaching the carrier film 1 from the layers of the multilayer body 100, a further carrier film may additionally or alternatively be provided on the side of the compensating layer 10 facing away from the carrier film 1. This laminate body, which consists of two outer-side carrier films and the inner layers of the multilayer body 100, can be laminated, for example, for further use in card composites, for example from PC. For this purpose, it is advantageous if the carrier films made of the same material as those on the Laminate body adjacent layers of the card composite, for example, also made of PC.

On the functional layer 2, a transparent, colored lacquer layer 31 is printed in the region 8. Transparent means that the lacquer layer 31 is at least partially transparent to radiation in the visible wavelength range. Colored means that the varnish layer 31 shows a visible color impression with sufficient daylight.

Both the areas 8 printed with the lacquer layer 31 and the unprinted areas 9 of the functional layer 2 are covered by a replication layer 4 which equalizes the relief structure of the decorative layer 3, ie the differing levels in the printed 8 and the unprinted areas 9. The replication layer 4 has in a second zone 42 a relief structure which is not present in a first zone 41. In the register and when viewed perpendicular to the plane of the carrier layer 1 congruent to the lacquer layer 31, a thin metal layer 5 is arranged on the replication 4. Both the regions 8 of the replication layer 4 covered by the metal layer 5 and the uncovered regions 9 of the replication layer 4 are covered with a compensation layer 10, the structures caused by the relief structure 42 and the metal layer 5 arranged in regions 8 (eg relief structure 42, different layer thicknesses, Height offset) equalized, ie covered and fills, so that the multi-layer body on the side facing away from the carrier film 1 side of the compensation layer 10 has a flat, substantially featureless surface. If the compensation layer 10 has a similar refractive index as the replication layer 4, ie if the difference in refractive index is less than approximately 0.3, the regions of the relief structure 42 in the replication layer 4 which are not directly covered by the metal layer 5 and directly adjoin the compensation layer 10 become optically extinguished because there no longer exist any optically recognizable layer boundaries between the replication layer 4 and the leveling layer 10 because of the similar refractive index of both layers.

The FIGS. 1a to 7a now show manufacturing stages of in FIG. 8a shown multilayer body 100. Same elements as in FIG. 8a are designated by the same reference numerals.

FIG. 1 a shows a first manufacturing stage 100a of the multilayer body 100, in which a functional layer 2 and a decorative layer 3 are arranged on a first side 11 of a carrier film 1. One side of the functional layer 2 adjoins the carrier film 1, its other side adjoins the decorative layer 3. The decorative layer 3 has a first region 8, in which a lacquer layer 31 is formed, and a second region 9, in which the lacquer layer 31 is absent is on. The lacquer layer 31 is printed on the functional layer 2, for example by screen printing, gravure printing or offset printing. Due to the region-wise, ie limited to the first region 8, formation of the lacquer layer 31 results in a pattern-shaped configuration of the decorative layer. 3

Figure 1d shows a plan view of the in Fig. 1a In the first region 8, the lacquer layer 31 is printed on the entire surface of the carrier film 1 arranged functional layer 2, while the second region 9 of the functional layer 2 not with the lacquer layer 31 printed, that is released. In the in FIG. 1b illustrated embodiment, the first region 8 consists of two rectangular areas. In addition to such geometric patterns, the first region 8 provided with the lacquer layer 31 can have any shape, eg alphanumeric characters, symbols, logos, fine-line patterns, eg grid patterns, or ornaments, eg guilloches, geometric, pictorial or figurative patterns. In FIG. 1b a section plane la is given; when looking at the cutting plane la in the direction indicated by the arrows, the results in FIG. 1 a section shown.

Fig. 1b shows an alternative embodiment of a first manufacturing stage of a multilayer body according to the invention. Unlike the in Fig. 1a illustrated embodiment is in the in Fig. 1b illustrated embodiment, the decorative layer 3 is not formed on the carrier film 1, but in the carrier film 1. The carrier film 1 consists of three layers 1 a, 1 b and 1 c. The two outer layers 1a and 1c are made of PC. The intermediate, middle layer 1 b consists of a plastic material, such as a mixed with additives PC, which shows a color change from a transparent, colorless, first state to a transparent, colored, second state when exposed to laser radiation of a certain energy, ie so-called. laser Black. The plastic material remains in the once reached second state, even after the laser radiation has been removed. This means that the carrier film 1 is at the same time decorative layer and carrier.

Fig. 1c shows a further alternative embodiment of a first manufacturing stage of a multilayer body according to the invention. As with the in Fig. 1 b illustrated embodiment is also in the in Fig. 1c illustrated embodiment, the decorative layer 3 is not formed on the carrier film 1, but in the carrier film 1. The carrier film 1 consists of a plastic material in which dye / color pigments can diffuse. To form the decorative layer 3, the second surface 12 of the carrier film 1 in the first region 8 was brought into contact with a substance for a certain period of time, from which color pigments can diffuse into the carrier film 1. During this period, a part of these color pigments diffused into the carrier film 1, so that the discolored areas 34 formed with a certain layer thickness. This means that the carrier film 1 is at the same time decorative layer and carrier.

FIG. 2 shows a second manufacturing stage 100b of the multi-layer body 100, which consists of the first manufacturing stage 100a in FIG. 1 a is formed by a replication 4 was applied to the functional layer 2 and the region-wise, ie, limited to the first region 8, thereon disposed lacquer layer 31. This can be an organic layer which is applied in liquid form by conventional coating methods, such as printing, casting or spraying. The order of the replication layer 4 is here provided over the entire surface. The layer thickness of the replication layer 4 varies, as it compensates for the different levels of the decorative layer 3 comprising the printed first area 8 and the unprinted second area 9; In the first region 8, the layer thickness of the replication layer 4 is thinner than in the second region 9, so that the side of the replication layer 4 facing away from the carrier layer 1 has a flat, substantially featureless surface before the formation of the relief structure in the second zone 42. However, an application of the replication layer 4 may also be provided only in a partial region of the multilayer body 100. The surface of the replication layer 4 is patterned by known methods in a second zone 42 while unstructured in a first zone 41. For this purpose, for example, as a replication 4, a thermoplastic Replizierlack applied by printing, spraying or painting and molded a relief structure in the second zone 42 in the particular thermally curable / dry replicate 4 by means of a heated punch or a heated replicating roller. The replication layer 4 can also be a UV-curable replication lacquer which is structured, for example, by a replication roller and then cured by means of UV radiation. However, the structuring can also be produced by UV irradiation through an exposure mask. In this way, the second zone 42 can be molded into the replication layer 4.

FIG. 2a shows an alternative second manufacturing stage of a multilayer body, which consists of the in Fig. 1b shown first manufacturing stage is formed by a relief structure 42 is embossed in the first side 11 of the carrier film 1. This means that the carrier foil 1 is at the same time a decorative layer, carrier and replication layer. Of course, alternatives are also possible in which only a relief structure is embossed in the carrier layer 1, but the carrier layer 1 itself does not serve as a decorative layer.

FIG. 3 a third manufacturing stage 100c of the multi-layer body 100, which consists of the second manufacturing stage 100b in FIG FIG. 2 is formed by the structuring Layer 5 was applied to the replication layer 4. This layer 5 to be structured may be formed, for example, as a vapor-deposited metal layer, for example of silver or aluminum. The order of the layer to be structured is provided here over the entire area. However, an application may also be provided only in a partial region of the multilayer body 100, for example with the aid of a partially shielding vapor deposition mask.

FIG. 4 shows a fourth manufacturing stage 100d of the multi-layer body 100, which from the third manufacturing stage 100c in FIG. 3 is formed by a photoactivatable resist layer 6 has been applied to the layer 5 to be structured. The resist layer 6 is formed in the present embodiment as a positive resist, that is, as a resist in which the more exposed (= activated) regions are released after the exposure. The resist layer 6 may be an organic layer which is applied in a liquid form by classical coating methods such as printing, casting or spraying. It can also be provided that the resist layer 6 is vapor-deposited or laminated as a dry film.

The photoactivatable layer 6 may, for example, be a positive photoresist BAZ 1512 or AZ P 4620 from Clariant or S1822 from Shipley, which has an areal density of from 0.1 g / m ² to 10 g / m ² , preferably from 0, 1 g / m ² to 1 g / m ^{2 is} applied to the layer 5 to be structured. The layer thickness depends on the desired resolution and the process. The order is provided here over the entire area. However, an application may also be provided only in a partial area of the multilayer body 100.

FIG. 5 shows a fifth manufacturing stage 100d of the multilayer body 100, in which the present after the fourth manufacturing stage 100d multilayer body 100 is irradiated. Electromagnetic radiation 7 with a wavelength which is suitable for activating the photoactivatable resist layer 6, from the second side 12 of the carrier film 1 ago, ie the side of the carrier film 1, which with the resist layer 6 coated side of the carrier film 1 is opposite, blasted by the multi-layer body 100d. The irradiation serves to activate the photoactivatable resist layer 6 in the second region 9, in which the decorative layer 3 has a higher transmittance than in the first region 8. The intensity and duration of the exposure to the electromagnetic radiation 7 is matched to the multi-layer body 100e in such a way that the radiation 7 in the second area 9 leads to activation of the photoactivatable resist layer 6, but not into the first area 8 printed with the lacquer layer 31 an activation of the photoactivatable resist layer 6 leads. It has proven useful if the contrast between the first region 8 and the second region 9 caused by the lacquer layer 31 is greater than two. Furthermore, it has proven useful if the lacquer layer 31 are designed so that the radiation 7 after passing through the entire multi-layer body 100e has a ratio of the transmittances, ie a contrast ratio of about 1: 2 between the first region 8 and the second region 9.

FIG. 6 FIG. 12 shows a "developed" sixth manufacturing stage 100e of the multilayer body 100 that is produced from the fifth manufacturing stage 100d in FIG FIG. 5 is formed by a developer solution, for. As solvents or alkalis, in particular a sodium carbonate solution or a sodium hydroxide solution has acted on the side facing away from the carrier film 1 surface of the exposed photoactivatable resist layer 6. As a result, the exposed resist layer 6 in the second region 9 has been removed. In the first region 8, the resist layer 6 is obtained because the amount of radiation absorbed in these regions has not led to sufficient activation. As already mentioned, is in the in the FIG. 6 illustrated embodiment, the resist layer 6 thus formed of a positive photoresist. In such a photoresist, the more exposed areas 9 are soluble in the developing solution, eg, the solvent. In contrast, in a negative photoresist, the unexposed and less exposed portions 8 are soluble in the developing solution, as described later in FIG FIG. 9 illustrated embodiment.

FIG. 7 shows a seventh manufacturing stage 100f of the multi-layer body 100, which from the sixth manufacturing stage 100e in FIG. 6 is formed by the layer to be structured 5 has been removed in the second region 9 by an etchant. This is possible because in the second region 9, the layer 5 to be structured is not protected from the attack of the etchant by the developed resist layer 6 serving as an etching mask. The etchant may be, for example, an acid or alkali. In this way, the in FIG. 7 shown areas of the structured layer 5 is formed.

Figure 7a shows an eighth manufacturing stage 100g of the multilayer body 100, which from the seventh manufacturing stage 100f in FIG. 7 is formed by the surviving areas of the resist layer 6 are also still removed (= "stripping"). The resist of the resist layer 6 is generally poorly chemically stable because it must be vulnerable to attack by the developer solution in the present process. Therefore, if the remaining portions of the resist layer 6 were left on the multi-layer body, it would be possible for the remaining portions of the resist layer 6 to weaken the stability and durability of the security element, eg, counterfeiting the multilayer body using solvents or acids or alkalis , By completely removing the resist layer 6, therefore, this disadvantage is avoided. The fact that certain resists are chemically only slightly resistant, ie sensitive to solvents, can, however, occasionally be exploited to advantage. After application of the multilayer body 100 to a substrate, in particular the surface of a security document, the resist is washed out together with a color dye which dyes the resist during manipulation attempts by means of solvent. The manipulation attempt becomes visible by changing the color of the resist.

In this way, therefore, the layer to be structured 5 without additional technological effort register exactly to the through the paint layer 31st defined first and second areas 8 and 9 are structured. In conventional methods for producing an etching mask by means of mask exposure, wherein the mask is present either as a separate unit, for example as a separate film or as a separate glass plate / glass roller, or as a subsequently printed layer, the problem arises that by previous, in particular thermal and / or mechanically straining process steps, eg when generating the replication structure 42 in the replication layer 4, caused linear and / or non-linear distortions in the multi-layer body 100 can not be fully compensated over the entire surface of the multi-layer body 100, although the mask alignment on existing, preferably on the horizontal and / or vertical edges of the multilayer body arranged register or registration marks takes place. The tolerance fluctuates over the entire surface of the multi-layer body 100 in a relatively large area.

With the method according to the invention, the first and second regions 8 and 9 defined by the lacquer layer 31 are used as a mask, wherein the lacquer layer 31 is applied in an early process step in the production of the multilayer body 100 as described above. As a result, no additional tolerances and no additional tolerance fluctuations over the surface of the multi-layer body 100 occur, since the subsequent generation of a mask and thereby required register-accurate subsequent positioning of this independent of the previous process mask is avoided. The tolerances or registration accuracies in the method according to the invention lie only in the not absolutely exact course of the color edge of the first and second regions 8 and 9 defined by the lacquer layer 31, the quality of which is determined by the respectively applied printing method, and are approximately in the micrometer range, and thus far below the resolution of the eye; ie the unarmed human eye can no longer perceive existing tolerances.

The in FIG. 8a shown multilayer body 100 is made of the in Figure 7a illustrated manufacturing stage 100g of the multilayer body 100 formed by a compensation layer 10 is applied to the arranged in the first region 8, exposed structured layer 5 and on the second region 9 arranged by removing the layer to be patterned layer 5 and the photoresist layer 6 exposed replication 4. The order of the leveling layer 10 is provided here over the entire surface.

It is possible for the leveling layer 10 to be applied in each of the first area 8 and the second area 9 in a different layer thickness, e.g. by doctoring, printing or spraying, so that the leveling layer 10 has a flat, substantially featureless surface on its side facing away from the carrier layer 1 side. The layer thickness of the compensation layer 10 varies, since it compensates for the different levels of the structured layer 5 arranged in the first region 8 and the replication layer 4 exposed in the second region 9. In the second region 9, the layer thickness of the compensation layer 10 is greater than the layer thickness of the structured layer 5 in the first region 8, so that the side facing away from the carrier layer 1 side of the compensation layer 10 has a flat surface. However, an application of the compensating layer 10 may also be provided only in a partial region of the multilayer body 100. It is possible for one or more further layers, e.g. an adhesive or adhesive layer. It is also possible in an advantageous manner for the adhesion or adhesive layer to assume the level-compensating effect of the compensation layer 10, so that no separate compensation layer 10 is necessary.

Fig. 8b shows an alternative embodiment of the in Fig. 8a shown multilayer body 100, which consists of the in Figure 7a represented manufacturing stage 100f of the multilayer body 100 is formed by a compensation layer 10 on the remaining areas in the first region 8 of the resist layer 6 and on the arranged in the second region 9, by removing the structuring layer 5 and the photoresist layer 6 exposed replication layer 4 is applied. Unlike the in Fig. 8a The multilayer body 100 shown comprises the in Fig. 8b shown multi-layer body thus the preserved areas of the resist layer. 6

FIG. 9 shows an alternative embodiment of the invention multi-layer body 100 ', in which, in contrast to the in FIG. 8 illustrated multilayer body 100, instead of a positive resist layer 6, a negative resist layer 6 has been used. As a result, the structured layer 5 and the resist layer 6 are not arranged like the lacquer layer 31 in the first region 8, but in the second region 9. Although the structured layer 5 and the resist layer 6 of the alternative multilayer body 100 'are similar to those in FIG FIG. 8 shown multilayer body 100 in register with the range limits of the areas 8, 9 of the lacquer layer 31 is arranged, but not congruent to the lacquer layer 31, but in the unprinted spaces 9 of the lacquer layer 31st

FIG. 10 shows a multi-layer body 100 ", in which the decorative layer 3 consists of a partially formed lacquer layer 31, which is arranged on the second side 12 of the carrier film 1, wherein the second side 12 of the first side 11 of the carrier film 1, on which the structured layer. 5 is disposed opposite.

Fig. 11a to Fig. 11g Each shows a carrier film 1 with a bottom and a top, on which a decorative layer 3 comprising a first region 8 and / or a second region 9 is arranged in different arrangements. In all the illustrated embodiments, the top may be either the first or the second side of the multi-layer body according to the invention.

When reference is made below to a "first lacquer layer" and a "second lacquer layer", it is meant that these are two differently formed paint layers, for example, with different optical properties such as color and / or different mechanical properties such as modulus of elasticity, with different transmittance is. Two first coating layers, which are explicitly described as having a different layer thickness, also have a different degree of transmission. If it is not explicitly described that two layer elements of a first lacquer layer have a different layer thickness, it should be assumed that they are the same thickness and have the same transmittance.

Fig. 11a shows the already in Fig. 10 illustrated variant in which the decorative layer 3 consists of a first region 8 on the top of the carrier film 1 arranged first lacquer layer 31, which is not present in the second region 9.

Fig. 11b shows a variant in which the decorative layer 3 consists of a full surface on the top of the carrier film 1 arranged first resist layer 31, which has a greater thickness in the first region 8 than in the second region. 9

Fig. 11c shows a variant in which the decorative layer 3 consists of a in the first region 8 on the upper side of the carrier film 1 arranged first resist layer 31 and a second region 9 also on the upper side of the support film 1 arranged second resist layer 32. The lacquer layers 31 and 32 may be, for example, two different colored lacquer layers or two lacquer layers each with different optical effects.

Fig. 11d shows a variant in which the decorative layer 3 consists of a arranged in the first region 8 first lacquer layer 31, which is not present in the second region 9. The first lacquer layer comprises two layer elements, wherein a first layer element is arranged on the upper side of the carrier foil 1 and a second layer element is arranged on the underside of the carrier foil 1.

Fig. 11e 1 shows a variant in which the decorative layer 3 comprises a first lacquer layer 31 with a first thickness arranged in the first region 8 on the upper side of the carrier foil 1 and a first lacquer layer 31 with a second thickness arranged in the second region 9 on the underside of the carrier foil 1, which is less than the first thickness.

Fig. 11f shows a variant in which the decorative layer 3 consists of a in the first region 8 on the top of the carrier film 1 arranged first resist layer 31 and a second region 9 on the underside of the support film 1 arranged second resist layer 32.

Fig. 11g shows a variant in which the decorative layer 3 consists of a in the first region 8 on the top of the carrier film 1 arranged first lacquer layer 31 and a full surface on the underside of the carrier film 1 arranged second lacquer layer 32.

FIG. 12 shows a multi-layer body 100 ''', in which the decorative layer 3 by a first lacquer layer 31, which produces a first color impression, and a second lacquer layer 32, which produces a second color impression is formed, wherein both lacquer layers 31, 32 on the same side of Carrier layer 1 between the functional layer 2 and the replication layer 4 are arranged.

FIG. 13 shows a multi-layer body 10pa ', in which the decorative layer 3 is formed of a first partially applied lacquer layer 31 and a second over the entire surface applied lacquer layer 32, wherein both lacquer layers 31, 32 are arranged on the same side of the support layer 1.

FIG. 14 shows a multi-layer body 100a ", in which the decorative layer 3 of a first lacquer layer 31, which is applied over the entire surface on the second side 12 of the carrier film 1, and a second lacquer layer 32, which is partially applied on the first side 11 of the carrier film 1 consists ,

FIG. 15 shows transmission spectra of four different classes of UV absorbers, which may be present in the first region 8 of the decorative layer 3, to form a different transmittance in the first region 8 and in the second region 9. The UV absorbers are present in chloroform at a concentration of 0.00014 mol / l. Plotted is the percentage of transmission measured% T over the wavelength λ in the range of 280 to 410 nm. The dash-dot line A indicates the transmission of oxalanilide, the dash-dot-dot line B the transmission of hydroxybenzophenone, the dash -Strich line C the transmission of hydroxyphenyl-S-triazine, and the solid line D the transmission of benzotriazole again.

Claims (15)

1. Method for the production of a multilayer body (100), wherein

   a) a single- or multilayer decorative layer (3) is formed with a first region (8) and a second region (9) on and/or in a carrier layer (1) having a first side (11) and a second side (12), wherein the decorative layer (3), seen perpendicularly to the plane of the carrier layer (1), has a first degree of transmission in the first region (8) and, in the second region (9), a second degree of transmission that is greater in comparison with the first degree of transmission, wherein said degrees of transmission relate to electromagnetic radiation (7) having a wavelength that is suitable for photoactivation,

   characterised in that

   b) at least one layer (5) to be structured is arranged on the first side (11) of the carrier layer (1),

   c) a resist layer (6) that is photoactivatable by means of said electromagnetic radiation (7) is arranged on the first side (11) of the carrier layer (1) in such a way that the resist layer (6) is arranged on the side of the at least one layer (5) to be structured that is turned away from the carrier layer (1) and the decorative layer (3) is arranged on the other side of the at least one layer (5) to be structured,

   d) the resist layer (6) is exposed from the second side (12) of the carrier layer (1) by means of said electromagnetic radiation (7), wherein the decorative layer (3) serves as an exposure mask as a result of the formation of the first region (8) and the second region (9), and

   e) the at least one layer (5) to be structured and the resist layer (6) are structured in register with each other by means of structure-providing processes that are synchronised with one another.
2. Method according to claim 1,
   characterised in that
   the decorative layer (3) comprises a first lacquer layer (31) which is arranged on the carrier layer (1) with a first layer thickness in the first region (8) and, in the second region (9), either with a second layer thickness that is smaller in comparison with the first layer thickness, or without one, such that the decorative layer (3) has, in the first region (8), said first degree of transmission and, in the second region (9), said second degree of transmission, and/or the decorative layer (3) comprises a first colouration (33, 34) of the carrier layer (1), which is formed in the first region (8) with a first layer thickness and, in the second region (9), either with a second layer thickness that is smaller in comparison with the first layer thickness, or without one, such that the decorative layer (3) has, in the first region (8), said first degree of transmission and, in the second region (9), said second degree of transmission.
3. Method according to one of the preceding claims,
   characterised in that
   the layer thickness and the material of the decorative layer (3) are chosen in such a way that the first degree of transmission is greater than zero and/or the thickness and the material of the decorative layer (3) are selected in such a way that the relationship between the second degree of transmission and the first degree of transmission is greater than two.
4. Method according to one of the preceding claims,
   characterised in that
   at least one relief structure (42) is formed on the first side (11) of the carrier layer (1), and the at least one layer (5) to be structured is arranged on the surface (40) of the at least one relief structure (42), wherein, preferably, either

   a) a replicating layer (4) is arranged on the first side (11) of the carrier layer (1), and the at least one relief structure (42) is impressed into a surface (40) of the replicating layer (4) that is turned away from the carrier layer (1),

   or

   b) the at least one relief structure (42) is impressed into the carrier layer (1), and wherein the at least one relief structure (42) is particularly preferably at least partially arranged in the first region (8) and/or in the second region (9).
5. Method according to one of the preceding claims,
   characterised in that
   after step e), a compensation layer (10) is applied to the first side (11) of the carrier layer (1) and/or at least one layer of the decorative layer (3) is applied to the second side (12) of the carrier layer (1), wherein the at least one layer of the decorative layer (3) applied to the second side (12) of the carrier layer (1) is preferably removed from the carrier layer (1) after the exposure step d).
6. Method according to one of the preceding claims,
   characterised in that
   for the formation of the photoactivatable layer (6), a positive photoresist whose solubility increases during an activation by exposure, or a negative photoresist whose solubility decreases during an activation by exposure, is used, and
   the resist layer (6) is removed during the use of a positive photoresist in the second region (9) or during the use of a negative photoresist in the first region (8), preferably by a solvent, and wherein the layer (5) to be structured is preferably removed in the first or second region (8, 9) in which the resist layer (6) has been removed, particularly preferably by an etching agent.
7. Multilayer body (100) having a carrier layer (1) which has a first side (11) and a second side (12), and having a single- or multilayer decorative layer (3) formed on and/or in the carrier layer (1), said decorative layer having a first region (8) and a second region (9), wherein the decorative layer (3), seen perpendicularly to the plane of the carrier layer (1), has a first degree of transmission in the first region (8) and, in the second region (9), a second degree of transmission that is greater in comparison with the first degree of transmission, wherein said degrees of transmission relate to electromagnetic radiation (7) having a wavelength that is suitable for photoactivation,
   characterised in that
   the multilayer body (100) moreover has at least one layer (5) that is structured in register with the first region (8) and the second region (9).
8. Multilayer body (100) according to claim 7,
   characterised in that
   the multilayer body (100) has, in the first region (8) or the second region (9), a resist layer (6) that is photoactivatable by means of said electromagnetic radiation, wherein the at least one structured layer (5) and the resist layer (6) are arranged with a register accurate configuration relative to each other on the first side of the carrier layer (1) in such a way that the resist layer (6) is arranged on the side of the at least one structured layer (5) that is turned away from the carrier layer (1) and the decorative layer (3) is arranged on the other side of the at least one structured layer (5), and/or the decorative layer (3) comprises a first lacquer layer (31) which is arranged on the carrier layer (1) with a first layer thickness in the first region (8) and, in the second region (9), either with a second layer thickness that is smaller in comparison with the first layer thickness, or without one, such that the decorative layer (3) has, in the first region (8), said first degree of transmission and, in the second region (9), said second degree of transmission, and/or the decorative layer (3) comprises a first colouration (33, 34) of the carrier layer (1), which is formed in the first region (8) with a first layer thickness and, in the second region (9), either with a second layer thickness that is smaller in comparison with the first layer thickness, or without one, such that the decorative layer (3) has, in the first region (8), said first degree of transmission and, in the second region (9), said second degree of transmission, and/or the decorative layer (3) is at least partially permeable for visible light with a wavelength ranging from approximately 380 to 750nm, and/or the decorative layer (3) is coloured with at least one opaque and/or at least one transparent colourant which is coloured or colour-generating at least in one wavelength region of the electromagnetic spectrum, in particularly brightly coloured or brightly colour-generating, in particular a colourant is contained in the decorative layer (3), said colourant being able to be stimulated outside the visible spectrum and generating a visually recognisable, coloured impression, and/or the decorative layer (3) is coloured with at least one colourant of the colours yellow, magenta, cyan or black (CMYK) or of the colours red, green or blue (RGB), and/or is provided with at least one red and/or green and/or blue fluorescent, radiation-stimulable pigment or colourant and thus generates an additive colour during radiation.
9. Multilayer body (100) according to one of claims 7 or 8,
   characterised in that
   the first degree of transmission is greater than zero and/or the ratio between the second degree of transmission and the first degree of transmission is greater than two.
10. Multilayer body (100) according to one of claims 7 to 9,
    characterised in that
    at least one relief structure (42) is formed on the first side (11) of the carrier layer (1) and the at least one layer (5) to be structured is arranged on the surface (40) of the at least one relief structure (42), wherein, preferably, either

    a) a replicating layer (4) is arranged on the first side (11) of the carrier layer (1), and the at least one relief structure (42) is impressed into a surface (40) of the replicating layer (4) that is turned away from the carrier layer (1),

    or

    b) the at least one relief structure (42) is impressed into the carrier layer (1), and wherein the at least one relief structure (42) is particularly preferably at least partially arranged in the first region (8) and/or in the second region (9).
11. Multilayer body (100) according to one of claims 7 to 10,
    characterised in that
    a compensation layer (10) is arranged on the side of the at least one structured layer (5) turned away from the carrier layer (1), wherein
    the compensation layer (10) is preferably formed as an adhesion layer, and/or wherein at least one relief structure (42) is preferably formed on the first side (11) of the carrier layer (1) and the at least one layer (5) to be structured is arranged on the surface (40) of the at least one relief structure (42), a replicating layer (4) is arranged on the first side (11) of the carrier layer (1) and the at least one relief structure (42) is impressed into a surface (40) of the replicating layer (4) that is turned away from the carrier layer (1), and the refractive index of the compensation layer (10) in the visible wavelength range is in the range of 90% to 110% of the refractive index of the replicating layer (4).
12. Multilayer body (100) according to one of claims 7 to 11,
    characterised in that
    at least one layer of the decorative layer (3) is arranged on the second side (12) of the carrier layer (1), and/or the decorative layer (3) comprises at least two different lacquer layers (31, 32) that evoke different colour impressions, and/or the decorative layer (3) comprises a first lacquer layer (31) which is only applied in certain regions to the carrier layer (1) and a second lacquer layer (32) which is applied fully to the carrier layer (1), and/or the at least one structured layer (5) comprises one or more of the following layers: metallic layer, HRI layer, liquid crystal layer, polymer layer, thin film layer, pigment layer, semiconductor layer.
13. Multilayer body (100) according to one of claims 7 to 12,
    characterised in that
    the at least one structured layer (5) has a thickness ranging from 20 to 1000nm, in particular 20 to 100nm, and/or the decorative layer (3) has a thickness ranging from 0.5 to 5µm, and/or the resist layer (6) has a thickness ranging from 0.3 to 3µm.
14. Multilayer body (100) according to one of claims 7 to 13,
    characterised in that
    the decorative layer (3) has highly dispersive pigments, in particular a Mikrolith®-K pigment dispersion, and/or the decorative layer (3) has inorganic absorbers with a high scatter proportion, in particular nano-scaled UV absorbers based on inorganic oxides, and/or the decorative layer (3) has organic absorbers, in particular benzotriazole derivatives, having a mass proportion ranging from 3% to 5%, and/or the decorative layer (3) has organic or inorganic, fluorescent pigments in combination with highly dispersive pigments, in particular Mikrolith®-K.
15. Multilayer body (100) according to one of claims 7 to 14,
    characterised in that
    the carrier layer (1) is formed as a single- or multilayer carrier film and/or at least one functional layer (2), in particular a release layer and/or a protective lacquer layer, is arranged between the carrier layer (1) and the at least one layer (5) to be structured, preferably directly on the first side of the carrier layer (1).

Images