EP2396815A4 - DETECTION OF DEFECTS ON A WAFER - Google Patents

DETECTION OF DEFECTS ON A WAFER

Info

Publication number: EP2396815A4
Authority: EP; European Patent Office
Prior art keywords: wafer; defects; detection
Prior art date: 2009-02-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP10741683A

Other languages

German (de)

French (fr)

Other versions

EP2396815A2 (en

Inventor

Junqing Huang

Yong Zhang

Stephanie Chen

Tao Luo

Lisheng Gao

Richard Wallingford

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

KLA Corp

Original Assignee

KLA Tencor Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-02-13

Filing date

2010-02-10

Publication date

2012-11-28

2010-02-10 Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp

2011-12-21 Publication of EP2396815A2 publication Critical patent/EP2396815A2/en

2012-11-28 Publication of EP2396815A4 publication Critical patent/EP2396815A4/en

Status Withdrawn legal-status Critical Current

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- H10P74/203—
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features

Landscapes

Physics & Mathematics (AREA)
Health & Medical Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Chemical & Material Sciences (AREA)
Analytical Chemistry (AREA)
Biochemistry (AREA)
General Health & Medical Sciences (AREA)
General Physics & Mathematics (AREA)
Immunology (AREA)
Pathology (AREA)
Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Image Processing (AREA)

EP10741683A 2009-02-13 2010-02-10 DETECTION OF DEFECTS ON A WAFER Withdrawn EP2396815A4 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US15247709P	2009-02-13	2009-02-13
PCT/US2010/023802 WO2010093733A2 (en)	2009-02-13	2010-02-10	Detecting defects on a wafer

Publications (2)

Publication Number	Publication Date
EP2396815A2 EP2396815A2 (en)	2011-12-21
EP2396815A4 true EP2396815A4 (en)	2012-11-28

Family

ID=42562263

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP10741683A Withdrawn EP2396815A4 (en)	2009-02-13	2010-02-10	DETECTION OF DEFECTS ON A WAFER

Country Status (7)

Country	Link
EP (1)	EP2396815A4 (en)
JP (1)	JP5570530B2 (en)
KR (1)	KR101674698B1 (en)
CN (1)	CN102396058B (en)
IL (1)	IL214488A (en)
SG (1)	SG173586A1 (en)
WO (1)	WO2010093733A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
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US7570796B2 (en)	2005-11-18	2009-08-04	Kla-Tencor Technologies Corp.	Methods and systems for utilizing design data in combination with inspection data
US7676077B2 (en)	2005-11-18	2010-03-09	Kla-Tencor Technologies Corp.	Methods and systems for utilizing design data in combination with inspection data
WO2008086282A2 (en)	2007-01-05	2008-07-17	Kla-Tencor Corporation	Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US8213704B2 (en)	2007-05-09	2012-07-03	Kla-Tencor Corp.	Methods and systems for detecting defects in a reticle design pattern
US7796804B2 (en)	2007-07-20	2010-09-14	Kla-Tencor Corp.	Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8139844B2 (en)	2008-04-14	2012-03-20	Kla-Tencor Corp.	Methods and systems for determining a defect criticality index for defects on wafers
KR101623747B1 (en)	2008-07-28	2016-05-26	케이엘에이-텐코어 코오포레이션	Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8775101B2 (en)	2009-02-13	2014-07-08	Kla-Tencor Corp.	Detecting defects on a wafer
US8204297B1 (en)	2009-02-27	2012-06-19	Kla-Tencor Corp.	Methods and systems for classifying defects detected on a reticle
US8112241B2 (en)	2009-03-13	2012-02-07	Kla-Tencor Corp.	Methods and systems for generating an inspection process for a wafer
US8781781B2 (en)	2010-07-30	2014-07-15	Kla-Tencor Corp.	Dynamic care areas
JP2012119512A (en) *	2010-12-01	2012-06-21	Hitachi High-Technologies Corp	Substrate quality evaluation method and apparatus therefor
US9170211B2 (en)	2011-03-25	2015-10-27	Kla-Tencor Corp.	Design-based inspection using repeating structures
US9087367B2 (en)	2011-09-13	2015-07-21	Kla-Tencor Corp.	Determining design coordinates for wafer defects
US8831334B2 (en) *	2012-01-20	2014-09-09	Kla-Tencor Corp.	Segmentation for wafer inspection
US8826200B2 (en)	2012-05-25	2014-09-02	Kla-Tencor Corp.	Alteration for wafer inspection
US9189844B2 (en)	2012-10-15	2015-11-17	Kla-Tencor Corp.	Detecting defects on a wafer using defect-specific information
US9053527B2 (en)	2013-01-02	2015-06-09	Kla-Tencor Corp.	Detecting defects on a wafer
US9134254B2 (en)	2013-01-07	2015-09-15	Kla-Tencor Corp.	Determining a position of inspection system output in design data space
US9311698B2 (en)	2013-01-09	2016-04-12	Kla-Tencor Corp.	Detecting defects on a wafer using template image matching
WO2014149197A1 (en)	2013-02-01	2014-09-25	Kla-Tencor Corporation	Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en)	2013-04-08	2018-01-09	Kla-Tencor Corp.	Dynamic design attributes for wafer inspection
US9310320B2 (en)	2013-04-15	2016-04-12	Kla-Tencor Corp.	Based sampling and binning for yield critical defects
US9355208B2 (en) *	2013-07-08	2016-05-31	Kla-Tencor Corp.	Detecting defects on a wafer
US10338004B2 (en) *	2014-03-27	2019-07-02	KLA—Tencor Corp.	Production sample shaping that preserves re-normalizability
US9535010B2 (en) *	2014-05-15	2017-01-03	Kla-Tencor Corp.	Defect sampling for electron beam review based on defect attributes from optical inspection and optical review
US10127653B2 (en) *	2014-07-22	2018-11-13	Kla-Tencor Corp.	Determining coordinates for an area of interest on a specimen
US10267746B2 (en) *	2014-10-22	2019-04-23	Kla-Tencor Corp.	Automated pattern fidelity measurement plan generation
US9518934B2 (en) *	2014-11-04	2016-12-13	Kla-Tencor Corp.	Wafer defect discovery
US9830421B2 (en) *	2014-12-31	2017-11-28	Kla-Tencor Corp.	Alignment of inspection to design using built in targets
US10062543B2 (en) *	2015-06-23	2018-08-28	Kla-Tencor Corp.	Determining multi-patterning step overlay error
CN108475422B (en) *	2015-08-12	2019-09-06	科磊股份有限公司	Locating defects in electron beam images
US10535131B2 (en) *	2015-11-18	2020-01-14	Kla-Tencor Corporation	Systems and methods for region-adaptive defect detection
CN105699396A (en) *	2016-03-29	2016-06-22	同高先进制造科技（太仓）有限公司	Pollution detection device and method of welding laser head protective glasses based on light scanning
US10699926B2 (en) *	2017-08-30	2020-06-30	Kla-Tencor Corp.	Identifying nuisances and defects of interest in defects detected on a wafer
US11114324B2 (en) *	2019-04-10	2021-09-07	KLA Corp.	Defect candidate generation for inspection

Citations (2)

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Publication number	Priority date	Publication date	Assignee	Title
US20040246476A1 (en) *	2003-06-06	2004-12-09	Bevis Christopher F.	Systems for inspection of patterned or unpatterned wafers and other specimen
US20090037134A1 (en) *	2007-07-30	2009-02-05	Ashok Kulkarni	Semiconductor device property extraction, generation, visualization, and monitoring methods

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KR100335491B1 (en) *	1999-10-13	2002-05-04	윤종용	Wafer inspection system having recipe parameter library and method of setting recipe prameters for wafer inspection
CN100428277C (en) *	1999-11-29	2008-10-22	奥林巴斯光学工业株式会社	Defect inspection system
CN1398348A (en) *	2000-10-02	2003-02-19	应用材料有限公司	Defect source identifier
US7693323B2 (en) *	2002-03-12	2010-04-06	Applied Materials, Inc.	Multi-detector defect detection system and a method for detecting defects
KR20060075691A (en) *	2004-12-29	2006-07-04	삼성전자주식회사	Fault inspection method
JP2007147376A (en) *	2005-11-25	2007-06-14	Nikon Corp	Inspection device
JP4851960B2 (en) *	2006-02-24	2012-01-11	株式会社日立ハイテクノロジーズ	Foreign matter inspection method and foreign matter inspection device
JP2007298284A (en) *	2006-04-27	2007-11-15	Mitsui Mining & Smelting Co Ltd	Determination of hexavalent chromium
JP4641278B2 (en) *	2006-05-02	2011-03-02	リンナイ株式会社	Gas burner
JP5022191B2 (en) *	2007-11-16	2012-09-12	株式会社日立ハイテクノロジーズ	Defect inspection method and defect inspection apparatus

2010
- 2010-02-10 EP EP10741683A patent/EP2396815A4/en not_active Withdrawn
- 2010-02-10 CN CN201080016422.8A patent/CN102396058B/en active Active
- 2010-02-10 JP JP2011550208A patent/JP5570530B2/en active Active
- 2010-02-10 WO PCT/US2010/023802 patent/WO2010093733A2/en not_active Ceased
- 2010-02-10 KR KR1020117021145A patent/KR101674698B1/en active Active
- 2010-02-10 SG SG2011056926A patent/SG173586A1/en unknown
2011
- 2011-08-07 IL IL214488A patent/IL214488A/en active IP Right Revival

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20040246476A1 (en) *	2003-06-06	2004-12-09	Bevis Christopher F.	Systems for inspection of patterned or unpatterned wafers and other specimen
US20090037134A1 (en) *	2007-07-30	2009-02-05	Ashok Kulkarni	Semiconductor device property extraction, generation, visualization, and monitoring methods

Also Published As

Publication number	Publication date
KR101674698B1 (en)	2016-11-09
CN102396058A (en)	2012-03-28
IL214488A (en)	2016-04-21
WO2010093733A3 (en)	2010-10-28
CN102396058B (en)	2014-08-20
WO2010093733A2 (en)	2010-08-19
EP2396815A2 (en)	2011-12-21
JP2012518278A (en)	2012-08-09
KR20110124303A (en)	2011-11-16
SG173586A1 (en)	2011-09-29
IL214488A0 (en)	2011-09-27
JP5570530B2 (en)	2014-08-13

Publication	Publication Date	Title
EP2396815A4 (en)	2012-11-28	DETECTION OF DEFECTS ON A WAFER
EP2503013A4 (en)	2016-04-06	REFRACTORY SUPERALLIAGE
EP2494594A4 (en)	2014-05-28	SEMICONDUCTOR COMPONENT
EP2435892A4 (en)	2016-06-08	GESTUAL SHORTCUTS
DK2411163T3 (en)	2013-06-10	WAFER BONDED CMUT-ARRAY WITH LEADING CONTACT HOLES
DK2442771T3 (en)	2020-04-27	Silicon ARBEHANDLINGSPRÆPARAT
EP2503207A4 (en)	2013-06-26	PIPE CONNECTION
DK3279313T3 (en)	2021-01-25	STRONGLY BLISDING SHIGELLA STEM
DK2435742T3 (en)	2015-10-12	BUOY RESTRICT
EP2442355A4 (en)	2012-10-17	SEMICONDUCTOR COMPONENT
EP2480916A4 (en)	2013-07-17	SEMICONDUCTOR LUMINAIRE
NO345070B1 (en)	2020-09-14	Pressure testable pipe connection
IT1395108B1 (en)	2012-09-05	BOILER
DE112009005292B8 (en)	2015-04-02	Object detecting device
BRPI1011267A2 (en)	2016-03-22	protease inhibitors
FI20095459A0 (en)	2009-04-24	New Assay Methods
EP2378176A4 (en)	2013-08-07	PIPE CONNECTION
AT508477A3 (en)	2011-04-15	PIPELINE INSPECTION UNIT
DK2287510T3 (en)	2014-01-06	Pipe Prop
DE102010037629B8 (en)	2015-07-16	gas sensor
EP2485753A4 (en)	2013-12-11	Chaperonin-10 VARIATIONS
DE102009039671A8 (en)	2011-06-01	plumbing fixture
FI20095030A0 (en)	2009-01-15	Opening tile with seal
BR112012010525A2 (en)	2015-09-29	new processes
DK2517018T3 (en)	2015-02-16	Biomarkers

Legal Events

Date	Code	Title	Description
2011-11-18	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2011-12-21	17P	Request for examination filed	Effective date: 20110913
2011-12-21	AK	Designated contracting states	Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
2012-05-23	DAX	Request for extension of the european patent (deleted)
2012-11-28	A4	Supplementary search report drawn up and despatched	Effective date: 20121026
2012-11-28	RIC1	Information provided on ipc code assigned before grant	Ipc: G01N 21/956 20060101ALI20121023BHEP Ipc: H01L 21/66 20060101AFI20121023BHEP Ipc: G01N 21/88 20060101ALI20121023BHEP Ipc: G01N 21/95 20060101ALI20121023BHEP
2017-01-06	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2017-02-08	18D	Application deemed to be withdrawn	Effective date: 20160901