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EP2268777A4 - Stable aqueous slurry suspensions - Google Patents

Stable aqueous slurry suspensions

Info

Publication number
EP2268777A4
EP2268777A4 EP08743223A EP08743223A EP2268777A4 EP 2268777 A4 EP2268777 A4 EP 2268777A4 EP 08743223 A EP08743223 A EP 08743223A EP 08743223 A EP08743223 A EP 08743223A EP 2268777 A4 EP2268777 A4 EP 2268777A4
Authority
EP
European Patent Office
Prior art keywords
aqueous slurry
stable aqueous
slurry suspensions
suspensions
stable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08743223A
Other languages
German (de)
French (fr)
Other versions
EP2268777A1 (en
Inventor
Irl E Ward
Deliang Ding
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPT Research Inc
Original Assignee
PPT Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPT Research Inc filed Critical PPT Research Inc
Publication of EP2268777A1 publication Critical patent/EP2268777A1/en
Publication of EP2268777A4 publication Critical patent/EP2268777A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00Lubricating compositions containing more than 10% water
    • C10M173/02Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06Metal compounds
    • C10M2201/061Carbides; Hydrides; Nitrides
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06Metal compounds
    • C10M2201/062Oxides; Hydroxides; Carbonates or bicarbonates
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/08Inorganic acids or salts thereof
    • C10M2201/084Inorganic acids or salts thereof containing sulfur, selenium or tellurium
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/04Ethers; Acetals; Ortho-esters; Ortho-carbonates
    • C10M2207/0406Ethers; Acetals; Ortho-esters; Ortho-carbonates used as base material
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/04Ethers; Acetals; Ortho-esters; Ortho-carbonates
    • C10M2207/046Hydroxy ethers
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2215/00Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant Compositions
    • C10M2215/02Amines, e.g. polyalkylene polyamines; Quaternary amines
    • C10M2215/04Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10NINDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00Specified use or application for which the lubricating composition is intended
    • C10N2040/20Metal working
    • C10N2040/22Metal working with essential removal of material, e.g. cutting, grinding or drilling
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10NINDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2050/00Form in which the lubricant is applied to the material being lubricated
    • C10N2050/015Dispersions of solid lubricants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP08743223A 2008-04-24 2008-04-24 Stable aqueous slurry suspensions Withdrawn EP2268777A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2008/005256 WO2009131556A1 (en) 2008-04-24 2008-04-24 Stable aqueous slurry suspensions

Publications (2)

Publication Number Publication Date
EP2268777A1 EP2268777A1 (en) 2011-01-05
EP2268777A4 true EP2268777A4 (en) 2011-11-23

Family

ID=41217080

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08743223A Withdrawn EP2268777A4 (en) 2008-04-24 2008-04-24 Stable aqueous slurry suspensions

Country Status (5)

Country Link
EP (1) EP2268777A4 (en)
JP (1) JP5539321B2 (en)
KR (1) KR20110013417A (en)
CN (1) CN102027101A (en)
WO (1) WO2009131556A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010014551A1 (en) * 2010-03-23 2011-09-29 Schott Solar Ag Fluid useful e.g. for sawing brittle material block and for producing wafers, photovoltaic cells and electronic components, comprises at least one glycol base, aqueous acid and optionally at least one additive
CN102451623A (en) * 2010-10-15 2012-05-16 Ppt研究公司 Stable aqueous slurry suspensions
CN102453439B (en) * 2010-10-22 2015-07-29 安集微电子(上海)有限公司 A kind of chemical mechanical polishing liquid
JP2012135870A (en) * 2010-12-10 2012-07-19 Nagasaki Univ Cutting method
CN103192297B (en) * 2012-08-24 2016-09-21 广东工业大学 A kind of chemical cluster magneto-rheological combined processing method of single crystal silicon carbide wafer
CN102983071B (en) * 2012-12-12 2015-05-06 天津中环领先材料技术有限公司 Back damage processing method for monocrystalline silicon wafer using common sand
US11026765B2 (en) * 2013-07-10 2021-06-08 H2O Tech, Inc. Stabilized, water-jet slurry apparatus and method
CN103740452B (en) * 2013-12-20 2015-04-29 开封恒锐新金刚石制品有限公司 Environment-friendly cooling liquid for diamond wire cutting and preparation method thereof
CN105908154B (en) * 2016-06-04 2018-02-02 常州大学 A kind of TiO 2 sol and its application for being used to prepare diamond fretsaw
KR20190021186A (en) * 2016-06-23 2019-03-05 피피티 리서치 , 인코포레이티드 On-site formation of stable suspension of gelatinous particles for separation and suspension of inert abrasive particles
CN106590904B (en) * 2016-11-14 2019-08-06 武汉宜田科技发展有限公司 A kind of Buddha's warrior attendant wire cutting mono-/multi- crystalline silicon rod coolant liquid
CN108034486B (en) * 2017-12-20 2020-06-19 苏州禾川化学技术服务有限公司 High-lubrication self-defoaming easy-cleaning environment-friendly oily wire cutting fluid
EP3632618B1 (en) 2018-10-04 2021-03-10 Politecnico di Milano Abrasive water-jet cutting machine and method, and composition comprising abrasive material
WO2020160286A1 (en) * 2019-01-31 2020-08-06 Eminess Technologies, LLC Multi-modal diamond abrasive package or slurry for polishing hard substrates
CN111437973B (en) * 2020-04-15 2022-03-29 山东格润德环保科技有限公司 Grinding method and application of magnesium hydroxide suspension with uniform particle size distribution
US20220017781A1 (en) * 2020-07-20 2022-01-20 Cmc Materials, Inc. Silicon wafer polishing composition and method
CN115746789B (en) * 2022-12-12 2024-03-22 郑州磨料磨具磨削研究所有限公司 Diamond grinding fluid for stable full-suspension grinding and preparation method thereof
JPWO2024162437A1 (en) * 2023-02-02 2024-08-08

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU956529A1 (en) * 1981-01-05 1982-09-07 Волжский Филиал Всесоюзного Научно-Исследовательского Института Абразивов И Шлифования Suspension for metal machining
US20020128327A1 (en) * 2000-07-05 2002-09-12 Showa Denko K.K. Polishing composition and magnetic recording disk substrate polished with the polishing composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990005053A1 (en) 1988-11-03 1990-05-17 Photec Industrie S.A. Abrasion-type splitting unit
JP3296781B2 (en) * 1998-04-21 2002-07-02 信越半導体株式会社 Aqueous cutting fluid, method for producing the same, and cutting method using this aqueous cutting fluid
FR2789998B1 (en) * 1999-02-18 2005-10-07 Clariant France Sa NOVEL MECHANICAL CHEMICAL POLISHING COMPOSITION OF A LAYER OF ALUMINUM OR ALUMINUM ALLOY CONDUCTIVE MATERIAL
US6054422A (en) 1999-02-19 2000-04-25 Ppt Research, Inc. Cutting and lubricating composition for use with a wire cutting apparatus
US6402978B1 (en) * 1999-05-06 2002-06-11 Mpm Ltd. Magnetic polishing fluids for polishing metal substrates
JP3721497B2 (en) * 1999-07-15 2005-11-30 株式会社フジミインコーポレーテッド Method for producing polishing composition
US6503418B2 (en) * 1999-11-04 2003-01-07 Advanced Micro Devices, Inc. Ta barrier slurry containing an organic additive
JP2001284296A (en) * 2000-03-02 2001-10-12 Eternal Chemical Co Ltd Polishing slurry and its use
JP2002020732A (en) * 2000-07-05 2002-01-23 Showa Denko Kk Polishing composition
US6602834B1 (en) 2000-08-10 2003-08-05 Ppt Resaerch, Inc. Cutting and lubricating composition for use with a wire cutting apparatus
TW575660B (en) * 2001-09-07 2004-02-11 Dai Ichi Kogyo Seiyaku Co Ltd Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid
JP3813865B2 (en) * 2001-12-11 2006-08-23 株式会社荏原製作所 Polishing method and polishing apparatus
US7294044B2 (en) * 2005-04-08 2007-11-13 Ferro Corporation Slurry composition and method for polishing organic polymer-based ophthalmic substrates
JP2006352096A (en) * 2005-05-17 2006-12-28 Jsr Corp Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU956529A1 (en) * 1981-01-05 1982-09-07 Волжский Филиал Всесоюзного Научно-Исследовательского Института Абразивов И Шлифования Suspension for metal machining
US20020128327A1 (en) * 2000-07-05 2002-09-12 Showa Denko K.K. Polishing composition and magnetic recording disk substrate polished with the polishing composition

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 198329, Derwent World Patents Index; AN 1983-715136, XP002661480 *
See also references of WO2009131556A1 *

Also Published As

Publication number Publication date
JP2011524814A (en) 2011-09-08
CN102027101A (en) 2011-04-20
JP5539321B2 (en) 2014-07-02
KR20110013417A (en) 2011-02-09
WO2009131556A1 (en) 2009-10-29
EP2268777A1 (en) 2011-01-05

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Effective date: 20111025

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