EP2268777A4 - Stable aqueous slurry suspensions - Google Patents
Stable aqueous slurry suspensionsInfo
- Publication number
- EP2268777A4 EP2268777A4 EP08743223A EP08743223A EP2268777A4 EP 2268777 A4 EP2268777 A4 EP 2268777A4 EP 08743223 A EP08743223 A EP 08743223A EP 08743223 A EP08743223 A EP 08743223A EP 2268777 A4 EP2268777 A4 EP 2268777A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- aqueous slurry
- stable aqueous
- slurry suspensions
- suspensions
- stable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002002 slurry Substances 0.000 title 1
- 239000000725 suspension Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/06—Metal compounds
- C10M2201/061—Carbides; Hydrides; Nitrides
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/06—Metal compounds
- C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/08—Inorganic acids or salts thereof
- C10M2201/084—Inorganic acids or salts thereof containing sulfur, selenium or tellurium
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
- C10M2207/0406—Ethers; Acetals; Ortho-esters; Ortho-carbonates used as base material
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
- C10M2207/046—Hydroxy ethers
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant Compositions
- C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
- C10M2215/04—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2040/00—Specified use or application for which the lubricating composition is intended
- C10N2040/20—Metal working
- C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2050/00—Form in which the lubricant is applied to the material being lubricated
- C10N2050/015—Dispersions of solid lubricants
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2008/005256 WO2009131556A1 (en) | 2008-04-24 | 2008-04-24 | Stable aqueous slurry suspensions |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2268777A1 EP2268777A1 (en) | 2011-01-05 |
EP2268777A4 true EP2268777A4 (en) | 2011-11-23 |
Family
ID=41217080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08743223A Withdrawn EP2268777A4 (en) | 2008-04-24 | 2008-04-24 | Stable aqueous slurry suspensions |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2268777A4 (en) |
JP (1) | JP5539321B2 (en) |
KR (1) | KR20110013417A (en) |
CN (1) | CN102027101A (en) |
WO (1) | WO2009131556A1 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010014551A1 (en) * | 2010-03-23 | 2011-09-29 | Schott Solar Ag | Fluid useful e.g. for sawing brittle material block and for producing wafers, photovoltaic cells and electronic components, comprises at least one glycol base, aqueous acid and optionally at least one additive |
CN102451623A (en) * | 2010-10-15 | 2012-05-16 | Ppt研究公司 | Stable aqueous slurry suspensions |
CN102453439B (en) * | 2010-10-22 | 2015-07-29 | 安集微电子(上海)有限公司 | A kind of chemical mechanical polishing liquid |
JP2012135870A (en) * | 2010-12-10 | 2012-07-19 | Nagasaki Univ | Cutting method |
CN103192297B (en) * | 2012-08-24 | 2016-09-21 | 广东工业大学 | A kind of chemical cluster magneto-rheological combined processing method of single crystal silicon carbide wafer |
CN102983071B (en) * | 2012-12-12 | 2015-05-06 | 天津中环领先材料技术有限公司 | Back damage processing method for monocrystalline silicon wafer using common sand |
US11026765B2 (en) * | 2013-07-10 | 2021-06-08 | H2O Tech, Inc. | Stabilized, water-jet slurry apparatus and method |
CN103740452B (en) * | 2013-12-20 | 2015-04-29 | 开封恒锐新金刚石制品有限公司 | Environment-friendly cooling liquid for diamond wire cutting and preparation method thereof |
CN105908154B (en) * | 2016-06-04 | 2018-02-02 | 常州大学 | A kind of TiO 2 sol and its application for being used to prepare diamond fretsaw |
KR20190021186A (en) * | 2016-06-23 | 2019-03-05 | 피피티 리서치 , 인코포레이티드 | On-site formation of stable suspension of gelatinous particles for separation and suspension of inert abrasive particles |
CN106590904B (en) * | 2016-11-14 | 2019-08-06 | 武汉宜田科技发展有限公司 | A kind of Buddha's warrior attendant wire cutting mono-/multi- crystalline silicon rod coolant liquid |
CN108034486B (en) * | 2017-12-20 | 2020-06-19 | 苏州禾川化学技术服务有限公司 | High-lubrication self-defoaming easy-cleaning environment-friendly oily wire cutting fluid |
EP3632618B1 (en) | 2018-10-04 | 2021-03-10 | Politecnico di Milano | Abrasive water-jet cutting machine and method, and composition comprising abrasive material |
WO2020160286A1 (en) * | 2019-01-31 | 2020-08-06 | Eminess Technologies, LLC | Multi-modal diamond abrasive package or slurry for polishing hard substrates |
CN111437973B (en) * | 2020-04-15 | 2022-03-29 | 山东格润德环保科技有限公司 | Grinding method and application of magnesium hydroxide suspension with uniform particle size distribution |
US20220017781A1 (en) * | 2020-07-20 | 2022-01-20 | Cmc Materials, Inc. | Silicon wafer polishing composition and method |
CN115746789B (en) * | 2022-12-12 | 2024-03-22 | 郑州磨料磨具磨削研究所有限公司 | Diamond grinding fluid for stable full-suspension grinding and preparation method thereof |
JPWO2024162437A1 (en) * | 2023-02-02 | 2024-08-08 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU956529A1 (en) * | 1981-01-05 | 1982-09-07 | Волжский Филиал Всесоюзного Научно-Исследовательского Института Абразивов И Шлифования | Suspension for metal machining |
US20020128327A1 (en) * | 2000-07-05 | 2002-09-12 | Showa Denko K.K. | Polishing composition and magnetic recording disk substrate polished with the polishing composition |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990005053A1 (en) | 1988-11-03 | 1990-05-17 | Photec Industrie S.A. | Abrasion-type splitting unit |
JP3296781B2 (en) * | 1998-04-21 | 2002-07-02 | 信越半導体株式会社 | Aqueous cutting fluid, method for producing the same, and cutting method using this aqueous cutting fluid |
FR2789998B1 (en) * | 1999-02-18 | 2005-10-07 | Clariant France Sa | NOVEL MECHANICAL CHEMICAL POLISHING COMPOSITION OF A LAYER OF ALUMINUM OR ALUMINUM ALLOY CONDUCTIVE MATERIAL |
US6054422A (en) | 1999-02-19 | 2000-04-25 | Ppt Research, Inc. | Cutting and lubricating composition for use with a wire cutting apparatus |
US6402978B1 (en) * | 1999-05-06 | 2002-06-11 | Mpm Ltd. | Magnetic polishing fluids for polishing metal substrates |
JP3721497B2 (en) * | 1999-07-15 | 2005-11-30 | 株式会社フジミインコーポレーテッド | Method for producing polishing composition |
US6503418B2 (en) * | 1999-11-04 | 2003-01-07 | Advanced Micro Devices, Inc. | Ta barrier slurry containing an organic additive |
JP2001284296A (en) * | 2000-03-02 | 2001-10-12 | Eternal Chemical Co Ltd | Polishing slurry and its use |
JP2002020732A (en) * | 2000-07-05 | 2002-01-23 | Showa Denko Kk | Polishing composition |
US6602834B1 (en) | 2000-08-10 | 2003-08-05 | Ppt Resaerch, Inc. | Cutting and lubricating composition for use with a wire cutting apparatus |
TW575660B (en) * | 2001-09-07 | 2004-02-11 | Dai Ichi Kogyo Seiyaku Co Ltd | Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid |
JP3813865B2 (en) * | 2001-12-11 | 2006-08-23 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
US7294044B2 (en) * | 2005-04-08 | 2007-11-13 | Ferro Corporation | Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
JP2006352096A (en) * | 2005-05-17 | 2006-12-28 | Jsr Corp | Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion |
-
2008
- 2008-04-24 CN CN2008801287872A patent/CN102027101A/en active Pending
- 2008-04-24 JP JP2011506239A patent/JP5539321B2/en not_active Expired - Fee Related
- 2008-04-24 WO PCT/US2008/005256 patent/WO2009131556A1/en active Application Filing
- 2008-04-24 KR KR1020107026288A patent/KR20110013417A/en not_active Application Discontinuation
- 2008-04-24 EP EP08743223A patent/EP2268777A4/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU956529A1 (en) * | 1981-01-05 | 1982-09-07 | Волжский Филиал Всесоюзного Научно-Исследовательского Института Абразивов И Шлифования | Suspension for metal machining |
US20020128327A1 (en) * | 2000-07-05 | 2002-09-12 | Showa Denko K.K. | Polishing composition and magnetic recording disk substrate polished with the polishing composition |
Non-Patent Citations (2)
Title |
---|
DATABASE WPI Week 198329, Derwent World Patents Index; AN 1983-715136, XP002661480 * |
See also references of WO2009131556A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2011524814A (en) | 2011-09-08 |
CN102027101A (en) | 2011-04-20 |
JP5539321B2 (en) | 2014-07-02 |
KR20110013417A (en) | 2011-02-09 |
WO2009131556A1 (en) | 2009-10-29 |
EP2268777A1 (en) | 2011-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2268777A4 (en) | Stable aqueous slurry suspensions | |
HRP20180629T1 (en) | Aqueous suspensions of tmc278 | |
IL212919A0 (en) | Low viscosity highly concentrated suspensions | |
EP2384266A4 (en) | Razor with independent suspension | |
GB2468302B (en) | Vehicle suspension | |
HK1161985A1 (en) | Riluzole aqueous suspensions | |
AP2008004691A0 (en) | Stable aqueous suspension | |
EG26602A (en) | Pesticidal aqueous suspension composition | |
EP2263891A4 (en) | Suspension system | |
EP2464786A4 (en) | High strength paper | |
GB0913082D0 (en) | Suspension device | |
GB2468487B (en) | Vehicle suspension | |
EP2339929A4 (en) | Cereal suspension | |
GB0902695D0 (en) | Trailer suspension | |
GB0908852D0 (en) | Tractor suspension | |
GB0813878D0 (en) | Biocapsulate suspensions | |
GB0703923D0 (en) | Aqueous mica suspension | |
GB0610246D0 (en) | Stable aqueous suspension | |
GB0610058D0 (en) | Stable aqueous suspension | |
GB0921004D0 (en) | Suspension biasing | |
GB0914906D0 (en) | Suspension arrangement | |
GB0902675D0 (en) | Slurry applicator | |
GB0702639D0 (en) | Suspension means | |
GB0917892D0 (en) | Improved suspension hook | |
GB0907238D0 (en) | Vehicle suspension |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20101115 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20111025 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C09G 1/02 20060101ALI20111019BHEP Ipc: C09K 3/14 20060101ALI20111019BHEP Ipc: C10M 103/06 20060101AFI20111019BHEP |
|
17Q | First examination report despatched |
Effective date: 20130621 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20181101 |