EP2113350B1 - Plaque mise en forme comprenant deux couches et un matériau entre les deux couches - Google Patents
Plaque mise en forme comprenant deux couches et un matériau entre les deux couches Download PDFInfo
- Publication number
- EP2113350B1 EP2113350B1 EP09005897.5A EP09005897A EP2113350B1 EP 2113350 B1 EP2113350 B1 EP 2113350B1 EP 09005897 A EP09005897 A EP 09005897A EP 2113350 B1 EP2113350 B1 EP 2113350B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- grains
- binder
- granulate
- layer
- granules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
Definitions
- the invention relates to a plate according to claim 1.
- Modern materials must today have a variety of required properties and often equal fulfill a whole series of requirements simultaneously.
- appropriate properties such as stability, strength, flexural rigidity, mass and density, or thermal properties may be essential.
- additional properties are often important, such as. B. a fire and fire resistance.
- an increasing scarcity of raw materials sets additional restrictions with regard to the usable basic and starting materials.
- a recycling of already used materials and parts, as well as the possibility of re-use of newly produced materials and parts are increasingly desirable. So today already puffed cereal grains are common in packaging and insulation technology.
- the invention relates to a generic plate or a molded part according to the preamble of the independent claim, which is known ( AU 2005200282 A1 ).
- a plate having a first and second on both sides glued on a layer of material cover layers.
- the material layer is provided with a material comprising granules of a granule formed as porous air or gas filled granules of a glass foam granule.
- fibers of a natural material, eg wool are provided on the surface of the coated grains.
- the material further comprises constituents, for example grains of a further granulate, wherein the coated granules of the granules are mixed with the granules of the further granules and bound together.
- This known plate may have a minimum density of 150 g / l.
- a suitable material for forming sheets, sheets and moldings, granules of a granule and a surface comprising granules of the granules This new material has very good swelling values, in particular for the plates produced therefrom.
- the strength of the plates made with the material is improved when fibers are additionally provided, the binder binding a portion of the fibers to the surface of the granules of the granules.
- This material may advantageously have an improved or desired strength.
- the material may be light in an advantageous manner, ie lighter than comparable materials or have a lower mass density, defined by the ratio of mass to volume. Therefore, the material can provide a favorable relationship between weight or density and strength.
- the mechanical strength of a single grain, and thus also of the material can be improved.
- the granules of the granules for the density of the material are significantly determining.
- the granules provide more than 50%, more than 75% or more than 90% of the volume of the material.
- the weight fraction of the fibers and binder relative to the grains of the granules may be less than 50%, less than 25% or less than 10%.
- a grain of the granules on a porous base material wherein the pores are filled with air or with a gas.
- corresponding grains for this purpose are popped grains of a cereal, such as. Corn, wheat, oats, or amaranth; Popp grain; Granules of a foamed plastic, of an expanded plastic, of an extruded plastic or of a flexible material; Grains of a foam; Styrofoam, Styrodur, or Styrofoam grains; Grains of a puffed extrudate, granules of crushed carpet, or other recyclable or recycled materials such as packaging material, textiles or the like.
- natural products or plastics can be used, such.
- PS polystyrene
- PVC polyvinyl chloride
- PU polyurethane
- the gases used are air, nitrogen, carbon dioxide, halogenated hydrocarbons and the like.
- foamed metals such as grains of aluminum foam, can be used. Grains for the purposes of the present invention may thus be particles, chips, chips or parts of a comminuted material.
- the basic material used according to the invention are natural substances.
- materials already used or recycled, and possibly also otherwise not otherwise usable can be used as raw materials for a material according to an embodiment of the invention.
- the use of renewable, environmentally friendly and environmentally compatible raw materials can be made possible in a further advantageous manner.
- Another advantage may lie in a cost-effective production of the material.
- an average density of the grains is below 0.1 kg / l.
- This average density where the density is averaged over a representative plurality of grains, may correspond to the density of Styrofoam, Poppkorn, and may be lower than the average density of solid wood, e.g. Spruce, chipboard or medium density fibreboard (MDF).
- MDF medium density fibreboard
- a material can be obtained whose density is in a range of a density of light materials.
- a mean diameter of a grain size of the grains according to another embodiment may be in a range of 0.5 mm to 5 mm, in a range of 1 mm to 10 mm, or even more than 10 mm.
- a grain shape can correspond to possible or conventional forms such.
- a mean diameter of the fibers may be in a range of 10 ⁇ m to 100 ⁇ m , in a range of 100 ⁇ m to 500 ⁇ m , or more than 500 ⁇ m .
- an average length of the fibers may be in a range of 100 ⁇ m to 1 mm, in a range of 1 mm to 10 mm, or even over 10 mm.
- Applicable fibers include wood fibers, staple fibers, medium density fibers, fibers of renewable resources, natural fibers, hemp, flax, straw, textile fibers, glass fibers, metal wires or metal shavings, plastic fibers, and the like.
- the binder comprises a cured adhesive, a partially cured adhesive or a curable adhesive. Curing or partial curing of the adhesive can be carried out by evaporation or partial evaporation of a solvent, a heat treatment or a polymerization.
- the binder may be mixed with a hardener.
- a comprehensive curing by special storage or handling such. As a cooled storage, initially be suppressed.
- the fibers can already be firmly or finally firmly bonded to the surface of the grains, while further processing, reshaping of the material or bonding of the grains to each other is still possible.
- binders in this context are thermosets, urea-formaldehyde (urea-formaldehyde, UF), melamine-formaldehyde (MF), phenol-formaldehyde (PF), isocyanate, diphenylmethane diisocyanate, epoxy resin, acrylic resin, dispersion glues, glues, adhesives, starch , Proteins, polymers and the like.
- the material comprises constituents, for example granules of a further granulate, wherein the granules of the granules with the grains of the further granules can be mixed.
- the mixing ratio of the grains of the granules to the grains of the further granules may vary within the material or a unit made therefrom, for example in order to advantageously influence or determine the mechanical properties.
- the mechanical, chemical or physical properties of the material can advantageously be changed or adjusted independently of the properties of the granules, of the fibers or of the binder.
- the strength can be further increased, the weight can be further reduced, or else a fire resistance can be increased, for example by mixing in flame retardants.
- other granules include wood chips, fibers, particles, grains of certain active chemical substances such as flame retardants or hydrophobic or hydrophilic substances, rock or metal particles, natural or synthetic grains or the like.
- the material may once again comprise the fibers with which the grains of the starting granules are coated, ie the fibers are added to the material once again, regardless of the bond to a surface of a grain of the granules, in the sense of another granule.
- the material comprises a further binder, wherein the further binder the coated granules of the granules and / or the grains of the further granules binds to each other.
- the further binder may correspond to the binder which binds the fibers to the grains, so that advantageously only one binder is used.
- the invention provides a plate according to claim 1 ready.
- the grains of granules or granules are bound together, so that they form a solid, coherent and stable material.
- a corresponding plate can represent an insulation board or a building board in building or equipment construction according to one embodiment.
- a chipboard which comprises a first chipboard layer, a second chipboard layer and a material layer.
- the material layer is arranged between the first chipboard layer and the second chipboard layer.
- a chipboard according to the invention can advantageously increase the strength of the board, wherein at the same time the weight and / or the board thickness can be advantageously reduced in comparison to a chip board with comparable strength.
- FIGS. 2A to 2C schematic representations of plates and layers according to embodiments of the present invention.
- the Figure 1A shows a schematic representation of a bulk material.
- a bulk material 100 comprises coated grains 31.
- the grains 31 comprise grains 30 of granules which are coated on their surface, at least partially, with fibers 10 and a binder 20.
- the individual grains 31 may vary both in shape and in size, and are not bound together according to this embodiment, so that the bulk material 100, even when touching the grains 31 with each other, is freely deformable or deformable or remains.
- the FIG. 1B shows a schematic, general representation of a material. Accordingly, a material 110 comprises the coated grains 31, which are bonded together with another binder 21 to each other. This further binder 21 may correspond to the binder 20, as it is in connection with the Fig. 1A has been described and according to the fibers 10 binds to the surface of a grain 30.
- the Figure 1C shows a schematic, general representation of a material according to the present invention.
- a material 120 comprises the coated grains 31, as well as grains 32 of a further granulate and further fibers 11, which are bonded to each other with the further binder 21 to each other.
- these Presentation shows both the grains 32 of the other granules and other fibers 11, also advantageous materials are possible in which either the grains 32 of the other granules or the other fibers 11 are missing.
- the FIG. 2A shows a schematic representation of a plate according to an embodiment.
- a plate 130 comprises a material with the coated grains 31 and the further binder 21.
- the plate 130 may be in the form of a single-layer plate, so that they z. B. can be used in a cost effective manner in equipment, machinery or building application, such as insulation board or load-bearing plate.
- FIG. 2B shows a schematic representation of an insulation board according to another embodiment.
- an insulating board 140 comprises a material having the coated grains 31 and the further binder 21 according to the above-mentioned embodiment, and is made of this material.
- the insulation board 140 also has knobs 141, which advantageously increase a surface of the insulation board 140 and / or absorb sound, vibrations, shocks or even heat, intercept or dam.
- the Figure 2C further shows a schematic representation of a chipboard according to the Embodiment of the present invention.
- a chipboard 150 comprises a first chipboard layer 151 and a second chipboard layer 152, between which is disposed a material layer 153 comprising a material according to an embodiment of the plate of the invention.
- the material layer 153 can advantageously improve the mechanical, physical or other properties compared to a normal particle board, wherein a normal chipboard without a material layer 153 or a material inclusion would be provided.
- By the arrangement of the material layer 153 between the chipboard layers 151, 152 can according to this embodiment also preserve an optical impression of a chip, wood or veneer plate, although although advantageous properties of the material desired, but z. B. the optical properties and / or its aesthetic impression of the material layer 153 are not desirable.
- Example in general For the production of all chipboard, industrially processed chips were used as grains of the additional granules, as far as the middle layer is concerned. The chips were removed from the belt scale after drying and immediately before gluing. The material is composed of various raw material assortments and is subdivided into cover and middle layer fractions due to the process.
- Example 1 Production of UF resin bound, three-layer chipboards with low bulk density and with 33% pure Maisextrudat than the Granules of the granules according to independent claim 1 in the middle layer (middle layer chips).
- aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 with a solids content of about 68% was used.
- a curing accelerator a 33% aqueous ammonium sulfate solution was used.
- the hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%.
- the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.
- the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
- the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
- Example 2 Production of UF resin bonded, three-layer chipboard with less Bulk density and 33% fiber-reinforced maize trudate as the granules of the granules according to independent claim 1 and the fibers on their surface in the middle layer (middle layer chips).
- Middle layer chips From industrially produced spun and Maisextrudat, which is reinforced with the fibers bonded to its surface, 20 mm thick three-layer chipboard with a density of 500 kg / m 3 were prepared with an industrially standardized binder composition.
- the middle layer chips were admixed with 33% of the fiber-reinforced extrudate. For this purpose, the extrudate was coated with 10% fiber type C120 from Rettenmeier.
- the fixation of the fiber on the extrudate surface was carried out by the adhesive effect of starch from the corn as a binder.
- an aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 with a solids content of about 68% was used.
- a 33% aqueous ammonium sulfate solution was used.
- the hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%.
- the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.
- the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
- the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
- Example 3 Preparation of low bulk density three-layer chipboard bound UF resin and 33% acrylate (as binder) reinforced maize trudate as the granules of the granule of independent claim 1 in the middle layer (middle layer chips).
- the middle layer shavings as further granules were admixed with 33% acrylate as binder reinforced extrudate as granules.
- the extrudate was glued with 12.5% percent of a 50 percent acrylate dispersion type BV 595 of the polymer latex polymer and dried at 60 ° C in a stream of hot air.
- aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%.
- a curing accelerator a 33% ammonium sulfate aqueous solution was used.
- a water repellent came a Paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50% is used.
- the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin based on dry chip, 2% Ammonioumsulfatates (hardener) based on dry solid resin and 1% water repellents based on atro chip.
- the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
- the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
- Example 4 Production of UF resin bonded, three-layer chipboard with low bulk density and 33% with acrylate as a binder reinforced Maisextrudat grains of the granules according to independent claim 1 and fibers on the surface in the middle layer (middle layer chips).
- the extrudate was glued with 12.5 percent of a 50% acrylate dispersion type BV 595 of the polymer latex, coated with 10% fiber type C120 Fa Rettenmeier and then at 60 ° C in Warm air stream dried.
- aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%.
- a curing accelerator a 33% aqueous ammonium sulfate solution was used.
- the hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%.
- the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.
- the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
- the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
- Example 5 Production of UF resin bonded, three-layer chipboard with low bulk density and 33% acrylate reinforced as a binder Maisextrudat grains of the granules with fibers on the surface in the middle layer (middle layer chips).
- Spangut and Maisextrudat which is reinforced with fiber and acrylate, were 20 mm thick three-layered Particleboard with a density of 500 kg / m 3 made with an industrially standardized binder composition.
- the middle layer chips were mixed with 33% fiber- and acrylate-reinforced extrudate.
- the extrudate was glued with 12.5 percent of a 50 percent acrylate dispersion type DV 455 of the polymer latex polymer coated with 10% fiber type C120 Fa Rettenmeier and then dried at 60 ° C in a stream of hot air.
- aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%.
- a curing accelerator a 33% ammonium sulfate aqueous solution was used.
- the hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%.
- the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin based on dry chip, 2% Ammonioumsulfatates (hardener) based on dry solid resin and 1% water repellents based on atro chip.
- the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
- the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
- Example 6 Preparation of UF resin bonded, three-layer chipboard with low density of pure industrial chips as a reference.
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Claims (5)
- Panneau (150) comprenant une première couche (151) et une deuxième couche (152), comprenant un matériau (100, 110, 120) approprié pour la formation de panneaux et de couches, comprenant des grains (30) d'un granulat et un liant (20) prévu sur la surface des grains (30) du granulat, le liant (20) comprenant un adhésif durci, un adhésif partiellement durci ou un adhésif durcissable, des fibres (10) étant en outre prévues, le liant (20) reliant une partie des fibres (10) sur la surface des grains revêtus (31) du granulat, un grain (30) du granulat comprenant une matière de base poreuse, les pores de la matière de base étant remplis avec de l'air ou avec un gaz, le matériau des grains (32) comprenant un granulat supplémentaire et les grains revêtus (31) du granulat étant mélangés avec les grains (32) du granulat supplémentaire,
caractérisé
en ce que le matériau comprend un liant supplémentaire (21), et le liant supplémentaire (21) relie les grains revêtus (31) du granulat et les grains (32) du granulat supplémentaire les uns avec les autres, en ce que la matière de base du granulat est une matière naturelle, en ce que les grains (30, 31) du granulat sont configurés sous la forme de grains soufflés d'une céréale, et en ce que la densité moyenne des grains est inférieure à 0,1 kg/l. - Panneau selon la revendication 1, caractérisé en ce que la première couche (151) ou la deuxième couche (152) est configurée sous la forme d'une couche de panneau aggloméré.
- Panneau selon la revendication 1 ou 2, caractérisé en ce qu'un diamètre moyen d'une taille de grain des grains (30) se situe dans une plage allant de 0,5 mm à 50 mm.
- Panneau selon l'une quelconque des revendications précédentes, caractérisé en ce qu'un diamètre moyen des fibres (10) se situe dans une plage allant de 10 µm à 1 mm.
- Panneau selon l'une quelconque des revendications précédentes, caractérisé en ce qu'une longueur moyenne des fibres (10) se situe dans une plage allant de 100 µm à 50 mm.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES09005897T ES2718473T3 (es) | 2009-04-28 | 2009-04-28 | Placa formada con dos capas y material entre éstas |
EP09005897.5A EP2113350B1 (fr) | 2009-04-28 | 2009-04-28 | Plaque mise en forme comprenant deux couches et un matériau entre les deux couches |
PT09005897T PT2113350T (pt) | 2009-04-28 | 2009-04-28 | Placa formada com duas camadas e matéria-prima entre as mesmas |
PL09005897T PL2113350T3 (pl) | 2009-04-28 | 2009-04-28 | Płyta ukształtowana z dwiema warstwami i tworzywem pomiędzy nimi |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09005897.5A EP2113350B1 (fr) | 2009-04-28 | 2009-04-28 | Plaque mise en forme comprenant deux couches et un matériau entre les deux couches |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2113350A1 EP2113350A1 (fr) | 2009-11-04 |
EP2113350B1 true EP2113350B1 (fr) | 2019-01-16 |
Family
ID=40943752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09005897.5A Not-in-force EP2113350B1 (fr) | 2009-04-28 | 2009-04-28 | Plaque mise en forme comprenant deux couches et un matériau entre les deux couches |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2113350B1 (fr) |
ES (1) | ES2718473T3 (fr) |
PL (1) | PL2113350T3 (fr) |
PT (1) | PT2113350T (fr) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB659731A (en) * | 1946-03-02 | 1951-10-24 | Alfred Mauricio Monath | Improvements in and relating to the manufacture of sheet material from wood particles |
ES262289A1 (es) * | 1959-11-18 | 1961-04-01 | Fahrmi Fred | Procedimiento y dispositivo para revestir en un aglutinante pulverizable particulas sueltas |
DE2263964A1 (de) * | 1972-12-29 | 1974-07-04 | B Maier Kg 4812 Maschf | Verfahren zur herstellung von holzwerkstoff-formteilen |
CH628521A5 (de) * | 1978-05-20 | 1982-03-15 | Kaiser Wirz Max | Verfahren und vorrichtung zum beimischen von fluessigen komponenten in schuettbare gueter. |
EP1207572A1 (fr) * | 2000-11-15 | 2002-05-22 | Dr. Sugnaux Consulting | Electrodes mésoporeuses pour cellules électrochimiques et leur méthode de production |
AU2005200282B2 (en) * | 2004-02-13 | 2011-06-16 | Kluger, Gerard F | A Material for Building or Other Purposes |
JP2008215061A (ja) * | 2007-02-07 | 2008-09-18 | Ez Bright Corp | 路面構造体 |
-
2009
- 2009-04-28 EP EP09005897.5A patent/EP2113350B1/fr not_active Not-in-force
- 2009-04-28 PL PL09005897T patent/PL2113350T3/pl unknown
- 2009-04-28 ES ES09005897T patent/ES2718473T3/es active Active
- 2009-04-28 PT PT09005897T patent/PT2113350T/pt unknown
Non-Patent Citations (1)
Title |
---|
None * |
Also Published As
Publication number | Publication date |
---|---|
ES2718473T3 (es) | 2019-07-02 |
PL2113350T3 (pl) | 2019-07-31 |
PT2113350T (pt) | 2019-04-18 |
EP2113350A1 (fr) | 2009-11-04 |
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