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EP2105659A1 - LED lamp having higher efficiency - Google Patents

LED lamp having higher efficiency Download PDF

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Publication number
EP2105659A1
EP2105659A1 EP08251105A EP08251105A EP2105659A1 EP 2105659 A1 EP2105659 A1 EP 2105659A1 EP 08251105 A EP08251105 A EP 08251105A EP 08251105 A EP08251105 A EP 08251105A EP 2105659 A1 EP2105659 A1 EP 2105659A1
Authority
EP
European Patent Office
Prior art keywords
heatsink
housing
led lamp
plate
accordance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08251105A
Other languages
German (de)
French (fr)
Inventor
Wen-Long Chyn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP08251105A priority Critical patent/EP2105659A1/en
Publication of EP2105659A1 publication Critical patent/EP2105659A1/en
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lamp and, more particularly, to an LED (light emitting diode) lamp to provide a lighting function.
  • a conventional LED lamp comprises an LED (light emitting diode) to provide a lighting function.
  • the LED is a heat source and easily produces a high temperature during operation, so that it is necessary to provide a heat sink to carry away the heat produced by the LED so as to achieve a heat dissipation effect.
  • a conventional heat sink generally comprises a heatsink element, such as a metallic heatsink fin, a heat conductive tube, a chill enabling chip, a heat dissipation board, a cooling fan and the like, so as to achieve a heat dissipation effect.
  • the conventional heat sink cannot dissipate the heat from the heat source exactly and quickly, thereby greatly decreasing the heat dissipation efficiency.
  • the conventional heat sink has a very complicated construction, thereby increasing the costs of fabrication.
  • an LED (light emitting diode) lamp comprising a heatsink housing, a heatsink plate mounted on the heatsink housing, an LED module mounted on the heatsink plate, and a circuit board mounted in the heatsink housing and electrically connected to the LED module.
  • the primary objective of the present invention is to provide an LED lamp having a higher efficiency.
  • Another objective of the present invention is to provide an LED lamp having a greater heatsink effect.
  • a further objective of the present invention is to provide an LED lamp, wherein when the LED module is operated, the heat produced by the LED module is transferred by a heat conduction of the heatsink plate and by a heat convection between the heatsink plate and the heatsink housing, so that the heat produced by the LED module is carried away exactly and quickly, thereby enhancing the heat dissipation effect of the LED module.
  • a further objective of the present invention is to provide an LED lamp, wherein the heatsink housing has a heat radiation function to enhance the heat dissipation effect of the LED module.
  • a further objective of the present invention is to provide an LED lamp, wherein the heatsink housing is provided with a metallic screw base, an insulating gasket and a power contact plate so that the heatsink housing can be mounted on a traditional receptacle to replace the conventional electric bulb.
  • a further objective of the present invention is to provide an LED lamp, wherein the heatsink plate has a surface provided with a plurality of ventilating holes connected to the receiving space of the heatsink housing to enhance a heat convection effect between the heatsink plate and the heatsink housing.
  • a further objective of the present invention is to provide an LED lamp, wherein the heatsink housing has a surface provided with a plurality of heatsink grooves to increase a surface area of the heatsink housing so as to enhance the heat dissipation effect of the heatsink housing.
  • an LED (light emitting diode) lamp in accordance with the preferred embodiment of the present invention comprises a heatsink housing 4, a heatsink plate 2 mounted on the heatsink housing 4, an LED module 1 mounted on the heatsink plate 2, and a circuit board 3 mounted in the heatsink housing 4 and electrically connected to the LED module 1 to electrically connect the LED module 1 to an external power supply (not shown).
  • the LED lamp further comprises a lamp shade 7 mounted on the heatsink plate 2 to encompass the LED module 1.
  • the heatsink housing 4 forms a porous structure with a greater heat dissipation feature.
  • the porous structure formed by the heatsink housing 4 has a high specific surface area and is made of a nonmetallic powder (formed by an injection molding process) having greater heat conductivity, such as Al 2 O 3 , Zr 2 O, AlN, SiN, BN, WC, C, SiC, crystalline SiC, Recrystalline SiC (ReSiC) and the like.
  • the heatsink housing 4 has a substantially semi-spherical profile and has a first end provided with an opening 42 for mounting the heatsink plate 2 and a second end provided with a threaded stud 44 for mounting a metallic screw base 50, an insulating gasket 51 and a power contact plate 52 with a specification of E-27, E-14 and the like.
  • the metallic screw base 50 and the power contact plate 52 are electrically connected to the circuit board 3 so that the circuit board 3 is electrically connected between the LED module 1, the metallic screw base 50 and the power contact plate 52.
  • the heatsink housing 4 has an inside provided with a receiving space 40.
  • the receiving space 40 of the heatsink housing 4 is located between the opening 42 and the threaded stud 44.
  • the heatsink housing 4 has a surface provided with a plurality of heatsink grooves 41 which are parallel with each other and are connected to the receiving space 40 to increase a surface area of the heatsink housing 4 so as to enhance the heat dissipation effect of the heatsink housing 4.
  • the heatsink grooves 41 of the heatsink housing 4 are located between the opening 42 and the threaded stud 44.
  • the heatsink plate 2 is mounted on the opening 42 of the heatsink housing 4 to seal the opening 42 of the heatsink housing 4.
  • the heatsink plate 2 is made of a metal having greater heat conductivity, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like.
  • the heatsink plate 2 has an inside provided with a receiving chamber 20 to receive the LED module 1, and the lamp shade 7 has an end portion mounted in the receiving chamber 20 of the heatsink plate 2.
  • the heatsink plate 2 has a surface provided with a plurality of ventilating holes 21 connected to the receiving space 40 of the heatsink housing 4 to enhance a heat convection effect between the heatsink plate 2 and the heatsink housing 4.
  • the circuit board 3 is mounted in the receiving space 40 of the heatsink housing 4 and is located between the heatsink housing 4 and the heatsink plate 2.
  • the heat produced by the LED module 1 is transferred by a heat conduction of the heatsink plate 2 and by a heat convection between the heatsink plate 2 and the heatsink housing 4, so that the heat produced by the LED module 1 is carried away exactly and quickly, thereby enhancing the heat dissipation effect of the LED module 1.
  • the heatsink housing 4 has a heat radiation function to enhance the heat dissipation effect of the LED module 1.
  • the heatsink housing 4 is provided with a metallic screw base 50, an insulating gasket 51 and a power contact plate 52 so that the heatsink housing 4 can be mounted on a traditional receptacle to replace the conventional electric bulb.
  • the LED lamp further comprises a reflective shade 8 mounted on the heatsink plate 2 to encompass the LED module 1a.
  • the heatsink housing 4a has a first end provided with an opening 42a for mounting the heatsink plate 2 and a second end provided with a rectangular mounting stud 44a.
  • the heatsink housing 4a has an inside provided with a receiving space 40a.
  • the circuit board 3 a has a first end 30a electrically connected to the LED module 1a and a second end provided with two connecting pins 6 (with a specification of MR16 and the like) protruding outwardly from the mounting stud 44a of the heatsink housing 4a to electrically connect the LED module 1a to an external power supply (not shown).
  • the heat produced by the LED module 1 is transferred by a heat conduction of the heatsink plate 2 and by a heat convection between the heatsink plate 2 and the heatsink housing 4, so that the heat produced by the LED module 1 is carried away exactly and quickly, thereby enhancing the heat dissipation effect of the LED module 1.
  • the heatsink housing 4 has a heat radiation function to enhance the heat dissipation effect of the LED module 1.
  • the heatsink housing 4 is provided with a metallic screw base 50, an insulating gasket 51 and a power contact plate 52 so that the heatsink housing 4 can be mounted on a traditional receptacle to replace the conventional electric bulb.
  • the heatsink plate 2 has a surface provided with a plurality of ventilating holes 21 connected to the receiving space 40 of the heatsink housing 4 to enhance a heat convection effect between the heatsink plate 2 and the heatsink housing 4.
  • the heatsink housing 4 has a surface provided with a plurality of heatsink grooves 41 to increase a surface area of the heatsink housing 4 so as to enhance the heat dissipation effect of the heatsink housing 4.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

An LED lamp includes a heatsink housing (4), a heatsink plate (2) mounted on the heatsink housing, an LED module (1) mounted on the heatsink plate, and a circuit board (3) mounted in the heatsink housing and electrically connected to the LED module. Thus, when the LED module is operated, the heat produced by the LED module is transferred by a heat conduction of the heatsink plate and by a heat convection between the heatsink plate and the heatsink housing, so that the heat produced by the LED module is carried away exactly and quickly, thereby enhancing the heat dissipation effect of the LED module.

Description

  • The present invention relates to a lamp and, more particularly, to an LED (light emitting diode) lamp to provide a lighting function.
  • A conventional LED lamp comprises an LED (light emitting diode) to provide a lighting function. However, the LED is a heat source and easily produces a high temperature during operation, so that it is necessary to provide a heat sink to carry away the heat produced by the LED so as to achieve a heat dissipation effect. A conventional heat sink generally comprises a heatsink element, such as a metallic heatsink fin, a heat conductive tube, a chill enabling chip, a heat dissipation board, a cooling fan and the like, so as to achieve a heat dissipation effect. However, the conventional heat sink cannot dissipate the heat from the heat source exactly and quickly, thereby greatly decreasing the heat dissipation efficiency. In addition, the conventional heat sink has a very complicated construction, thereby increasing the costs of fabrication.
  • In accordance with the present invention, there is provided an LED (light emitting diode) lamp, comprising a heatsink housing, a heatsink plate mounted on the heatsink housing, an LED module mounted on the heatsink plate, and a circuit board mounted in the heatsink housing and electrically connected to the LED module.
  • The primary objective of the present invention is to provide an LED lamp having a higher efficiency.
  • Another objective of the present invention is to provide an LED lamp having a greater heatsink effect.
  • A further objective of the present invention is to provide an LED lamp, wherein when the LED module is operated, the heat produced by the LED module is transferred by a heat conduction of the heatsink plate and by a heat convection between the heatsink plate and the heatsink housing, so that the heat produced by the LED module is carried away exactly and quickly, thereby enhancing the heat dissipation effect of the LED module.
  • A further objective of the present invention is to provide an LED lamp, wherein the heatsink housing has a heat radiation function to enhance the heat dissipation effect of the LED module.
  • A further objective of the present invention is to provide an LED lamp, wherein the heatsink housing is provided with a metallic screw base, an insulating gasket and a power contact plate so that the heatsink housing can be mounted on a traditional receptacle to replace the conventional electric bulb.
  • A further objective of the present invention is to provide an LED lamp, wherein the heatsink plate has a surface provided with a plurality of ventilating holes connected to the receiving space of the heatsink housing to enhance a heat convection effect between the heatsink plate and the heatsink housing.
  • A further objective of the present invention is to provide an LED lamp, wherein the heatsink housing has a surface provided with a plurality of heatsink grooves to increase a surface area of the heatsink housing so as to enhance the heat dissipation effect of the heatsink housing.
  • Further benefits and advantages of the present invention will become apparent after a careful reading of the detailed description with appropriate reference to the accompanying drawings.
  • In the drawings:
    • Fig. 1 is a perspective view of an LED lamp in accordance with the preferred embodiment of the present invention.
    • Fig. 2 is an exploded perspective view of the LED lamp as shown in Fig. 1.
    • Fig. 3 is a front view of the LED lamp as shown in Fig. 1.
    • Fig. 4 is a perspective view of an LED lamp in accordance with another preferred embodiment of the present invention.
    • Fig. 5 is an exploded perspective view of the LED lamp as shown in Fig. 4.
    • Fig. 6 is a front view of the LED lamp as shown in Fig. 4.
  • Referring to the drawings and initially to Figs. 1-3, an LED (light emitting diode) lamp in accordance with the preferred embodiment of the present invention comprises a heatsink housing 4, a heatsink plate 2 mounted on the heatsink housing 4, an LED module 1 mounted on the heatsink plate 2, and a circuit board 3 mounted in the heatsink housing 4 and electrically connected to the LED module 1 to electrically connect the LED module 1 to an external power supply (not shown). The LED lamp further comprises a lamp shade 7 mounted on the heatsink plate 2 to encompass the LED module 1.
  • The heatsink housing 4 forms a porous structure with a greater heat dissipation feature. The porous structure formed by the heatsink housing 4 has a high specific surface area and is made of a nonmetallic powder (formed by an injection molding process) having greater heat conductivity, such as Al2O3, Zr2O, AlN, SiN, BN, WC, C, SiC, crystalline SiC, Recrystalline SiC (ReSiC) and the like.
  • The heatsink housing 4 has a substantially semi-spherical profile and has a first end provided with an opening 42 for mounting the heatsink plate 2 and a second end provided with a threaded stud 44 for mounting a metallic screw base 50, an insulating gasket 51 and a power contact plate 52 with a specification of E-27, E-14 and the like. The metallic screw base 50 and the power contact plate 52 are electrically connected to the circuit board 3 so that the circuit board 3 is electrically connected between the LED module 1, the metallic screw base 50 and the power contact plate 52.
  • The heatsink housing 4 has an inside provided with a receiving space 40. Thus, by provision of the porous structure formed by the heatsink housing 4, the air contained in the receiving space 40 of the heatsink housing 4 can pass through the heatsink housing 4 to produce a greater heat convection effect. The receiving space 40 of the heatsink housing 4 is located between the opening 42 and the threaded stud 44. The heatsink housing 4 has a surface provided with a plurality of heatsink grooves 41 which are parallel with each other and are connected to the receiving space 40 to increase a surface area of the heatsink housing 4 so as to enhance the heat dissipation effect of the heatsink housing 4. The heatsink grooves 41 of the heatsink housing 4 are located between the opening 42 and the threaded stud 44.
  • The heatsink plate 2 is mounted on the opening 42 of the heatsink housing 4 to seal the opening 42 of the heatsink housing 4. The heatsink plate 2 is made of a metal having greater heat conductivity, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like. The heatsink plate 2 has an inside provided with a receiving chamber 20 to receive the LED module 1, and the lamp shade 7 has an end portion mounted in the receiving chamber 20 of the heatsink plate 2. The heatsink plate 2 has a surface provided with a plurality of ventilating holes 21 connected to the receiving space 40 of the heatsink housing 4 to enhance a heat convection effect between the heatsink plate 2 and the heatsink housing 4.
  • The circuit board 3 is mounted in the receiving space 40 of the heatsink housing 4 and is located between the heatsink housing 4 and the heatsink plate 2.
  • In operation, when the LED module 1 is operated, the heat produced by the LED module 1 is transferred by a heat conduction of the heatsink plate 2 and by a heat convection between the heatsink plate 2 and the heatsink housing 4, so that the heat produced by the LED module 1 is carried away exactly and quickly, thereby enhancing the heat dissipation effect of the LED module 1.
  • In such a manner, the heatsink housing 4 has a heat radiation function to enhance the heat dissipation effect of the LED module 1. In addition, the heatsink housing 4 is provided with a metallic screw base 50, an insulating gasket 51 and a power contact plate 52 so that the heatsink housing 4 can be mounted on a traditional receptacle to replace the conventional electric bulb.
  • Referring to Figs. 4-6, the LED lamp further comprises a reflective shade 8 mounted on the heatsink plate 2 to encompass the LED module 1a. The heatsink housing 4a has a first end provided with an opening 42a for mounting the heatsink plate 2 and a second end provided with a rectangular mounting stud 44a. The heatsink housing 4a has an inside provided with a receiving space 40a. The circuit board 3 a has a first end 30a electrically connected to the LED module 1a and a second end provided with two connecting pins 6 (with a specification of MR16 and the like) protruding outwardly from the mounting stud 44a of the heatsink housing 4a to electrically connect the LED module 1a to an external power supply (not shown).
  • Accordingly, when the LED module 1 is operated, the heat produced by the LED module 1 is transferred by a heat conduction of the heatsink plate 2 and by a heat convection between the heatsink plate 2 and the heatsink housing 4, so that the heat produced by the LED module 1 is carried away exactly and quickly, thereby enhancing the heat dissipation effect of the LED module 1. In addition, the heatsink housing 4 has a heat radiation function to enhance the heat dissipation effect of the LED module 1. Further, the heatsink housing 4 is provided with a metallic screw base 50, an insulating gasket 51 and a power contact plate 52 so that the heatsink housing 4 can be mounted on a traditional receptacle to replace the conventional electric bulb. Further, the heatsink plate 2 has a surface provided with a plurality of ventilating holes 21 connected to the receiving space 40 of the heatsink housing 4 to enhance a heat convection effect between the heatsink plate 2 and the heatsink housing 4. Further, the heatsink housing 4 has a surface provided with a plurality of heatsink grooves 41 to increase a surface area of the heatsink housing 4 so as to enhance the heat dissipation effect of the heatsink housing 4.
  • Although the invention has been explained in relation to its preferred embodiment(s) as mentioned above, it is to be understood that many other possible modifications and variations can be made without departing from the scope of the present invention. It is, therefore, contemplated that the appended claim or claims will cover such modifications and variations that fall within the true scope of the invention.

Claims (10)

  1. An LED (light emitting diode) lamp, comprising:
    a heatsink housing;
    a heatsink plate mounted on the heatsink housing;
    an LED module mounted on the heatsink plate;
    a circuit board mounted in the heatsink housing and electrically connected to the LED module.
  2. The LED lamp in accordance with claim 1, wherein the heatsink housing has a first end provided with an opening for mounting the heatsink plate.
  3. The LED lamp in accordance with claim 2, wherein
    the heatsink housing has a second end provided with a threaded stud for mounting a metallic screw base, an insulating gasket and a power contact plate;
    the metallic screw base and the power contact plate are electrically connected to the circuit board so that the circuit board is electrically connected between the LED module, the metallic screw base and the power contact plate.
  4. The LED lamp in accordance with claim 2, wherein
    the heatsink housing has a second end provided with a mounting stud;
    the circuit board has a first end electrically connected to the LED module and a second end provided with two connecting pins protruding outwardly from the mounting stud of the heatsink housing.
  5. The LED lamp in accordance with claim 1, wherein the heatsink plate has an inside provided with a receiving chamber to receive the LED module.
  6. The LED lamp in accordance with claim 1, wherein the heatsink housing forms a porous structure with a greater heat dissipation feature.
  7. The LED lamp in accordance with claim 6, wherein the heatsink housing has an inside provided with a receiving space.
  8. The LED lamp in accordance with claim 7, wherein the heatsink housing has a surface provided with a plurality of heatsink grooves which are connected to the receiving space to increase a surface area of the heatsink housing.
  9. The LED lamp in accordance with claim 7, wherein the heatsink plate has a surface provided with a plurality of ventilating holes connected to the receiving space of the heatsink housing to enhance a heat convection effect between the heatsink plate and the heatsink housing.
  10. The LED lamp in accordance with claim 6, wherein the porous structure formed by the heatsink housing is made of a nonmetallic powder having greater heat conductivity.
EP08251105A 2008-03-27 2008-03-27 LED lamp having higher efficiency Withdrawn EP2105659A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08251105A EP2105659A1 (en) 2008-03-27 2008-03-27 LED lamp having higher efficiency

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Application Number Priority Date Filing Date Title
EP08251105A EP2105659A1 (en) 2008-03-27 2008-03-27 LED lamp having higher efficiency

Publications (1)

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EP2105659A1 true EP2105659A1 (en) 2009-09-30

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110156565A1 (en) * 2009-12-29 2011-06-30 Wen-Lung Chin LED Lamp Having Higher Efficiency
EP2341275A1 (en) 2009-12-29 2011-07-06 Wen-Lung Chin LED lamp having higher efficiency
CN102410451A (en) * 2010-09-26 2012-04-11 财团法人工业技术研究院 Light source device
CN102486266A (en) * 2010-12-03 2012-06-06 财团法人工业技术研究院 LED light module
WO2012099683A1 (en) * 2011-01-19 2012-07-26 GE Lighting Solutions, LLC Led light engine/heat sink assembly
US8591067B2 (en) 2010-08-06 2013-11-26 Industrial Technology Research Institute Light source device
TWI427238B (en) * 2011-04-26 2014-02-21 Lite On Electronics Guangzhou Led bulb lamp
CN104006315A (en) * 2014-03-27 2014-08-27 黄炳浩 LED lamp bulb with screw base
JP2016500194A (en) * 2012-07-23 2016-01-07 グイジョウ ジーゼットジーピーエス カンパニー・リミテッド Interchangeable and versatile LED bulb construction method and integrated LED bulb and lamp
RU2580825C1 (en) * 2014-11-12 2016-04-10 Виктор Васильевич Бармин Led lamp housing
EP2876357A4 (en) * 2012-07-23 2016-06-22 Guizhou Guangpusen Photoelectric Co Ltd Method for constructing universal led bulb and snap ring lens type led bulb and led lamp
CN106969297A (en) * 2017-03-24 2017-07-21 成都佰思汇信科技有限责任公司 A kind of LED Ceiling lights

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Publication number Priority date Publication date Assignee Title
US20060250800A1 (en) * 2005-05-09 2006-11-09 Chih-Chin Chang Light module
WO2007069119A1 (en) * 2005-12-14 2007-06-21 Philips Intellectual Property & Standards Gmbh Lighting device and method for manufacturing same
DE202007009655U1 (en) * 2007-07-11 2007-09-06 Aeon Lighting Technology Inc., Chung-Ho City Heat dissipation device for LED light emitting module
US20070230188A1 (en) 2006-03-30 2007-10-04 Yi Min Lin Light-emitting diode light

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060250800A1 (en) * 2005-05-09 2006-11-09 Chih-Chin Chang Light module
WO2007069119A1 (en) * 2005-12-14 2007-06-21 Philips Intellectual Property & Standards Gmbh Lighting device and method for manufacturing same
US20070230188A1 (en) 2006-03-30 2007-10-04 Yi Min Lin Light-emitting diode light
DE202007009655U1 (en) * 2007-07-11 2007-09-06 Aeon Lighting Technology Inc., Chung-Ho City Heat dissipation device for LED light emitting module

Cited By (16)

* Cited by examiner, † Cited by third party
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EP2341275A1 (en) 2009-12-29 2011-07-06 Wen-Lung Chin LED lamp having higher efficiency
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US20110156565A1 (en) * 2009-12-29 2011-06-30 Wen-Lung Chin LED Lamp Having Higher Efficiency
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CN102486266B (en) * 2010-12-03 2014-02-12 财团法人工业技术研究院 LED light module
US9127816B2 (en) 2011-01-19 2015-09-08 GE Lighting Solutions, LLC LED light engine/heat sink assembly
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TWI427238B (en) * 2011-04-26 2014-02-21 Lite On Electronics Guangzhou Led bulb lamp
JP2016500194A (en) * 2012-07-23 2016-01-07 グイジョウ ジーゼットジーピーエス カンパニー・リミテッド Interchangeable and versatile LED bulb construction method and integrated LED bulb and lamp
EP2886933A4 (en) * 2012-07-23 2016-04-27 Guizhou Gzgps Co Ltd METHOD FOR FORMING HIGHLY INTERCHANGEABLE, HIGH UNIVERSALITY LED BULB AND INTEGRATED LED BULB AND LAMP
EP2876357A4 (en) * 2012-07-23 2016-06-22 Guizhou Guangpusen Photoelectric Co Ltd Method for constructing universal led bulb and snap ring lens type led bulb and led lamp
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CN106969297A (en) * 2017-03-24 2017-07-21 成都佰思汇信科技有限责任公司 A kind of LED Ceiling lights

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