EP2103717B1 - Pyrophosphate-based bath for depositing tin alloy layers - Google Patents
Pyrophosphate-based bath for depositing tin alloy layers Download PDFInfo
- Publication number
- EP2103717B1 EP2103717B1 EP08003786A EP08003786A EP2103717B1 EP 2103717 B1 EP2103717 B1 EP 2103717B1 EP 08003786 A EP08003786 A EP 08003786A EP 08003786 A EP08003786 A EP 08003786A EP 2103717 B1 EP2103717 B1 EP 2103717B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carbamoyl
- benzyl
- electrolyte bath
- free electrolyte
- pyrophosphate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 17
- 235000011180 diphosphates Nutrition 0.000 title claims description 27
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 title claims description 22
- 238000000151 deposition Methods 0.000 title description 7
- 239000003792 electrolyte Substances 0.000 claims abstract description 51
- 238000000576 coating method Methods 0.000 claims abstract description 19
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 229910001432 tin ion Inorganic materials 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims abstract description 4
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical group [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 6
- GEZAUFNYMZVOFV-UHFFFAOYSA-J 2-[(2-oxo-1,3,2$l^{5},4$l^{2}-dioxaphosphastannetan-2-yl)oxy]-1,3,2$l^{5},4$l^{2}-dioxaphosphastannetane 2-oxide Chemical group [Sn+2].[Sn+2].[O-]P([O-])(=O)OP([O-])([O-])=O GEZAUFNYMZVOFV-UHFFFAOYSA-J 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 4
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 4
- CEFLXLHGQRDACM-UHFFFAOYSA-N 1-[(4-methoxyphenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].C1=CC(OC)=CC=C1C[N+]1=CC=CC(C(N)=O)=C1 CEFLXLHGQRDACM-UHFFFAOYSA-N 0.000 claims description 3
- XLYNVJJFQHWCEU-UHFFFAOYSA-N 1-benzylpyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C=CC=CC=2)=C1 XLYNVJJFQHWCEU-UHFFFAOYSA-N 0.000 claims description 3
- GJDSYDAXTMMFNK-UHFFFAOYSA-N 1-(1-methylnaphthalen-2-yl)pyridin-1-ium-3-carboxamide;bromide Chemical compound [Br-].C1=CC2=CC=CC=C2C(C)=C1[N+]1=CC=CC(C(N)=O)=C1 GJDSYDAXTMMFNK-UHFFFAOYSA-N 0.000 claims description 2
- ODFRNPXCOBDLRH-UHFFFAOYSA-N 1-(1-methylnaphthalen-2-yl)pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].C1=CC2=CC=CC=C2C(C)=C1[N+]1=CC=CC(C(N)=O)=C1 ODFRNPXCOBDLRH-UHFFFAOYSA-N 0.000 claims description 2
- KQFFMMJHLWHNKB-UHFFFAOYSA-N 1-[(2-carbamoylphenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C(=CC=CC=2)C(N)=O)=C1 KQFFMMJHLWHNKB-UHFFFAOYSA-N 0.000 claims description 2
- UHCAUJLPTKVOIU-UHFFFAOYSA-N 1-[(2-chlorophenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C(=CC=CC=2)Cl)=C1 UHCAUJLPTKVOIU-UHFFFAOYSA-N 0.000 claims description 2
- RRGZYJNSZZINRV-UHFFFAOYSA-N 1-[(2-fluorophenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C(=CC=CC=2)F)=C1 RRGZYJNSZZINRV-UHFFFAOYSA-N 0.000 claims description 2
- RLHAPVVMEMJTKQ-UHFFFAOYSA-N 1-[(2-methoxyphenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].COC1=CC=CC=C1C[N+]1=CC=CC(C(N)=O)=C1 RLHAPVVMEMJTKQ-UHFFFAOYSA-N 0.000 claims description 2
- MQSFSOLPRJHQKM-UHFFFAOYSA-N 1-[(3-carbamoylphenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=CC(C[N+]=2C=C(C=CC=2)C(N)=O)=C1 MQSFSOLPRJHQKM-UHFFFAOYSA-N 0.000 claims description 2
- KXVGWHDBXYWJIB-UHFFFAOYSA-N 1-[(3-fluorophenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C=C(F)C=CC=2)=C1 KXVGWHDBXYWJIB-UHFFFAOYSA-N 0.000 claims description 2
- SCDFRRPBNANBHZ-UHFFFAOYSA-N 1-[(3-methoxyphenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].COC1=CC=CC(C[N+]=2C=C(C=CC=2)C(N)=O)=C1 SCDFRRPBNANBHZ-UHFFFAOYSA-N 0.000 claims description 2
- OJAQSCDIMFJZQG-UHFFFAOYSA-N 1-[(4-carbamoylphenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].C1=CC(C(=O)N)=CC=C1C[N+]1=CC=CC(C(N)=O)=C1 OJAQSCDIMFJZQG-UHFFFAOYSA-N 0.000 claims description 2
- GBVWJFWBQJZXFW-UHFFFAOYSA-N 1-[(4-chlorophenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C=CC(Cl)=CC=2)=C1 GBVWJFWBQJZXFW-UHFFFAOYSA-N 0.000 claims description 2
- KOLVSZJIDJUYOG-UHFFFAOYSA-N 1-[(4-fluorophenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C=CC(F)=CC=2)=C1 KOLVSZJIDJUYOG-UHFFFAOYSA-N 0.000 claims description 2
- LLTJGZWIKGLSKT-UHFFFAOYSA-N 2-[(3-carbamoylpyridin-1-ium-1-yl)methyl]benzoic acid;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C(=CC=CC=2)C(O)=O)=C1 LLTJGZWIKGLSKT-UHFFFAOYSA-N 0.000 claims description 2
- HNXGGWNCFXZSAI-UHFFFAOYSA-N 2-morpholin-2-ylethanesulfonic acid Chemical compound OS(=O)(=O)CCC1CNCCO1 HNXGGWNCFXZSAI-UHFFFAOYSA-N 0.000 claims description 2
- KPLNNAJUSNAKCL-UHFFFAOYSA-N 3-[(3-carbamoylpyridin-1-ium-1-yl)methyl]benzoic acid;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C=C(C=CC=2)C(O)=O)=C1 KPLNNAJUSNAKCL-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 150000003842 bromide salts Chemical class 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000004985 dialkyl amino alkyl group Chemical group 0.000 claims description 2
- 150000002222 fluorine compounds Chemical class 0.000 claims description 2
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 2
- 150000004694 iodide salts Chemical class 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- VKFFEYLSKIYTSJ-UHFFFAOYSA-N tetraazanium;phosphonato phosphate Chemical class [NH4+].[NH4+].[NH4+].[NH4+].[O-]P([O-])(=O)OP([O-])([O-])=O VKFFEYLSKIYTSJ-UHFFFAOYSA-N 0.000 claims description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 235000013877 carbamide Nutrition 0.000 claims 1
- 150000003672 ureas Chemical class 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 20
- 229940048084 pyrophosphate Drugs 0.000 description 18
- 239000000203 mixture Substances 0.000 description 12
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 11
- 239000004327 boric acid Substances 0.000 description 11
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 10
- 235000011007 phosphoric acid Nutrition 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- 229910052719 titanium Inorganic materials 0.000 description 10
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 9
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 239000011135 tin Substances 0.000 description 8
- 229910052718 tin Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 6
- 239000007795 chemical reaction product Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- 238000005275 alloying Methods 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 235000006708 antioxidants Nutrition 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- DKSLOEZTCJORBN-UHFFFAOYSA-N 4-[(3-carbamoylpyridin-1-ium-1-yl)methyl]benzoic acid;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C=CC(=CC=2)C(O)=O)=C1 DKSLOEZTCJORBN-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 2
- 125000002256 xylenyl group Chemical group C1(C(C=CC=C1)C)(C)* 0.000 description 2
- UOWKGIUYMOGOMF-UHFFFAOYSA-M 1-(1-benzylpyridin-1-ium-3-yl)ethanone;chloride Chemical compound [Cl-].CC(=O)C1=CC=C[N+](CC=2C=CC=CC=2)=C1 UOWKGIUYMOGOMF-UHFFFAOYSA-M 0.000 description 1
- VHWMRNPYSUAJRI-UHFFFAOYSA-N 1-(1-methylnaphthalen-2-yl)pyridin-1-ium-3-carboxamide;fluoride Chemical compound [F-].C1=CC2=CC=CC=C2C(C)=C1[N+]1=CC=CC(C(N)=O)=C1 VHWMRNPYSUAJRI-UHFFFAOYSA-N 0.000 description 1
- JZWSYQCGDCOKCI-UHFFFAOYSA-N 1-[(2,3,4,5,6-pentafluorophenyl)methyl]pyridin-1-ium-3-carboxamide chloride Chemical compound [Cl-].FC1=C(C(=C(C(=C1C[N+]1=CC(=CC=C1)C(N)=O)F)F)F)F JZWSYQCGDCOKCI-UHFFFAOYSA-N 0.000 description 1
- JHYPGNHKGCUFSN-UHFFFAOYSA-N 1-[(3-chlorophenyl)methyl]pyridin-1-ium-3-carboxamide;chloride Chemical compound [Cl-].NC(=O)C1=CC=C[N+](CC=2C=C(Cl)C=CC=2)=C1 JHYPGNHKGCUFSN-UHFFFAOYSA-N 0.000 description 1
- KVGOXGQSTGQXDD-UHFFFAOYSA-N 1-decane-sulfonic-acid Chemical compound CCCCCCCCCCS(O)(=O)=O KVGOXGQSTGQXDD-UHFFFAOYSA-N 0.000 description 1
- LDMOEFOXLIZJOW-UHFFFAOYSA-N 1-dodecanesulfonic acid Chemical compound CCCCCCCCCCCCS(O)(=O)=O LDMOEFOXLIZJOW-UHFFFAOYSA-N 0.000 description 1
- SXGZJKUKBWWHRA-UHFFFAOYSA-N 2-(N-morpholiniumyl)ethanesulfonate Chemical compound [O-]S(=O)(=O)CC[NH+]1CCOCC1 SXGZJKUKBWWHRA-UHFFFAOYSA-N 0.000 description 1
- 229910000669 Chrome steel Inorganic materials 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- BRXCDHOLJPJLLT-UHFFFAOYSA-N butane-2-sulfonic acid Chemical compound CCC(C)S(O)(=O)=O BRXCDHOLJPJLLT-UHFFFAOYSA-N 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- VNTLIPZTSJSULJ-UHFFFAOYSA-N chromium molybdenum Chemical compound [Cr].[Mo] VNTLIPZTSJSULJ-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- BSXVKCJAIJZTAV-UHFFFAOYSA-L copper;methanesulfonate Chemical compound [Cu+2].CS([O-])(=O)=O.CS([O-])(=O)=O BSXVKCJAIJZTAV-UHFFFAOYSA-L 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- FYAQQULBLMNGAH-UHFFFAOYSA-N hexane-1-sulfonic acid Chemical compound CCCCCCS(O)(=O)=O FYAQQULBLMNGAH-UHFFFAOYSA-N 0.000 description 1
- 231100000086 high toxicity Toxicity 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- OPUAWDUYWRUIIL-UHFFFAOYSA-N methanedisulfonic acid Chemical compound OS(=O)(=O)CS(O)(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-N 0.000 description 1
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RJQRCOMHVBLQIH-UHFFFAOYSA-M pentane-1-sulfonate Chemical compound CCCCCS([O-])(=O)=O RJQRCOMHVBLQIH-UHFFFAOYSA-M 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- HNDXKIMMSFCCFW-UHFFFAOYSA-N propane-2-sulphonic acid Chemical compound CC(C)S(O)(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-N 0.000 description 1
- 125000002577 pseudohalo group Chemical group 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- -1 tin (II) ions Chemical class 0.000 description 1
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 125000005490 tosylate group Chemical group 0.000 description 1
- 150000008648 triflates Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- OMSYGYSPFZQFFP-UHFFFAOYSA-J zinc pyrophosphate Chemical compound [Zn+2].[Zn+2].[O-]P([O-])(=O)OP([O-])([O-])=O OMSYGYSPFZQFFP-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Definitions
- the present invention relates to an aqueous cyanide-free bath and a process for the cyanide-free deposition of tin alloys, in particular tin-copper alloys containing N-methylpyrrolidone as organic brightener.
- the invention enables the cyanide-free deposition of homogeneous, shiny tin alloy layers, in particular tin-copper alloy layers, the alloy ratio of which can be selectively adjusted depending on the metal salt ratio used within the electrolyte.
- Tin alloys and especially copper-tin alloys, have come into focus as an alternative to nickel deposits. Electrodeposited nickel layers are commonly used for both decorative and functional applications.
- Cyanide-containing copper-tin alloy baths are industrially established. Due to stricter regulations and the high toxicity and problematic and expensive disposal of these cyanide-containing baths, there is a growing demand for cyanide-free copper-tin electrolytes.
- JP 10-102278 A a pyrophosphate-based copper-tin alloy bath which contains as an additive a reaction product of an amine and an epihalodrin derivative (molar ratio 1: 1), an aldehyde derivative and, optionally, depending on the application, surfactants.
- the US 6416571 B1 also describes a pyrophosphate-based bath which also contains as additives a reaction product of an amine and an epihalohydrin derivative (molar ratio 1: 1), a cationic surfactant, optionally further surface-active surfactants and an antioxidant.
- a disadvantage of the abovementioned baths is that no uniform alloy layers are obtained, especially in the case of drum galvanizations, so that the products do not have a uniform coloring and gloss.
- a pyrophosphate-containing copper-tin alloy bath containing as an additive a reaction product of an amine derivative, more preferably piperazine, an epihalohydrin derivative, especially epichlorohydrin, and a glycidyl ether.
- an amine derivative more preferably piperazine
- an epihalohydrin derivative especially epichlorohydrin
- a glycidyl ether for the preparation of this reaction product, a mixture consisting of epichlorohydrin and the glycidyl ether is added slowly under precise temperature control to an aqueous solution of piperazine, wherein the temperature from 65 to 80 ° C must be maintained.
- a disadvantage of this additive is the difficult to control reaction, especially at high temperatures, since such reaction products tend at too high reaction and / or storage temperatures for post-reaction and thus formation of high molecular weight and thus partially water-insoluble and ineffective polymers.
- a way out of this dilemma can be achieved only by a reaction in very high dilution ( ⁇ 1 wt .-%). It comes with such low concentration additive solutions with repeated replenishment to an adverse solution buildup of the electrolyte. This can lead to fluctuating deposits with longer use of electrolyte.
- this electrolyte exhibits weaknesses in rack plating applications.
- the quality of the deposited layers which often show a haze, very much depends on the nature of the movement of goods during the electrolysis.
- the copper-tin coatings obtained in this way also often have pores, which is problematic especially in decorative coatings.
- the invention is therefore based on the object to develop a galvanic bath for tin alloys, which allows the production of optically attractive tin alloy layers.
- a more homogeneous tin-alloy metal distribution and an optimal tin-metal ratio should be set.
- a uniform layer thickness with high gloss and the uniformity of the distribution of the alloy components in the coating should be maintained over a wide current density range.
- the electrolytic bath according to the invention may further comprise an acid (iii) and / or a pyrophosphate source (iv).
- the component (iii) of the aqueous cyanide-free electrolyte bath according to the invention is any acid which can be used in known electrolyte baths.
- they are organic sulfonic acids, orthophosphoric acid, sulfuric acid and boric acid.
- the aqueous cyanide-free electrolyte bath according to the invention preferably also contains additives which are selected from antioxidants and / or further organic brighteners.
- Preferred organic brighteners here are morpholine, 2-morpholineethanesulfonic acid, hexamethylenetetramine, 3- (4-morpholino) -1,2-propanediol, 1,4-diazabicyclo [2.2.2] octane, 1-benzyl-3-carbamoyl-pyridinium chloride , 1- (2'-Chloro-benzyl) -3-carbamoyl-pyridinium chloride, 1- (2'-fluoro-benzyl) -3-carbamoyl-pyridinium chloride, 1- (2'-methoxy-benzyl) - 3-carbamoyl-pyridinium chloride, 1- (2'-carboxy-benzyl) -3-carbamoyl-pyridinium chloride, 1- (2'-carbamoyl-benzyl) -3-carbamoyl-pyridinium chloride, 1- (3 'Chloro-benzy
- the additives according to the invention can be used with N-methylpyrrolidone alone or as a mixture of a plurality of different brightener systems of the abovementioned representatives in a concentration of 0.0001 to 20 g / l and more preferably of 0.001 to 1 g / l.
- the tin ion source and the source of another alloying element may be pyrophosphates.
- the tin ion source and the source of another alloying element are also pyrophosphate sources within the meaning of the aforementioned component (iv) of the electrolytic bath according to the invention.
- the pyrophosphate concentration of the source for another alloying element is 0.5 to 50 g / l, and preferably 1 to 5 g / l.
- the bath according to the invention may contain copper pyrophosphate in an amount of 0.5 to 50 g / l, preferably 1 to 5 g / l or zinc pyrophosphate in these amounts.
- the concentration is generally 0.5 to 100 g / l, with concentrations of 10 to 40 g / l being particularly preferred.
- tin and metal pyrophosphates In addition to the above-mentioned tin and metal pyrophosphates, other water-soluble tin and metal salts, such as tin sulfate, tin methanesulfonate, copper sulfate, copper methanesulfonate, or the corresponding Zinc salts are used, which can be umkomplexiert by the addition of suitable alkali metal pyrophosphates within the electrolyte into the corresponding pyrophosphates.
- the concentration ratio of pyrophosphate to tin / metal should be 3 to 80, more preferably 5 to 50.
- Pyrophosphate sources according to component (iv) are particularly preferably the sodium, potassium and ammonium pyrophosphates in concentrations of 50 to 500 g / l, more preferably from 100 to 400 g / l.
- the aforementioned antioxidants include hydroxylated aromatic compounds, e.g. Catechol, resorcinol, pyrocatechol, hydroquinone, pyrogallol, ⁇ - or ⁇ -naphthol, phloroglucin and sugar-based systems such as e.g. Ascorbic acid, sorbitol in concentrations of 0.1 to 1 g / l.
- hydroxylated aromatic compounds e.g. Catechol, resorcinol, pyrocatechol, hydroquinone, pyrogallol, ⁇ - or ⁇ -naphthol, phloroglucin
- sugar-based systems such as e.g. Ascorbic acid, sorbitol in concentrations of 0.1 to 1 g / l.
- organic sulfonic acids both mono- and polyalkylsulfonic acids, e.g. Methanesulfonic acid, methanedisulfonic acid, ethanesulfonic acid, propanesulfonic acid, 2-propanesulfonic acid, butanesulfonic acid, 2-butanesulfonic acid, pentanesulfonic acid, hexanesulfonic acid, decanesulfonic acid, dodecanesulfonic acid and salts thereof and their hydroxylated derivatives are used. Particularly preferred is the use of methanesulfonic acid in a concentration of 0.01 to 1 g / l.
- the baths according to the invention have a pH of 3 to 9, more preferably 6 to 8.
- N-methylpyrrolidone a significant improvement in the deposited layers can be achieved with regard to gloss and freedom from pores, preferably in a concentration of 0.1 to 50 g / l, more preferably 0.1 to 4 g / l.
- the baths according to the invention can be prepared by conventional methods, for example by adding the specific amounts of the above-described components to water.
- the amount of bases, acids and acids Buffer components such as sodium pyrophosphate, methanesulfonic acid and / or boric acid should preferably be chosen so that the bath reaches the pH range of at least 6 to 8.
- the baths according to the invention deposit a bright, even and ductile copper-tin alloy layer at any customary temperature of about 15 to 50 ° C, preferably 20 ° C to 40 ° C, more preferably 25 ° C to 30 ° C from. At these temperatures, the baths according to the invention are stable and effective over a wide current density range of 0.01 to 2 A / dm 2 , more preferably 0.25 to 0.75 A / dm 2 .
- the baths of the invention may be operated in a continuous or intermittent manner, and from time to time the components of the bath will have to be supplemented.
- the components of the bath may be added singly or in combination. Furthermore, they can be varied over a wide range, depending on the consumption and present concentration of the individual components.
- An advantage of the baths according to the invention compared to the electrolyte of WO 2004/005528 is the good reproducibility and long-term stability of the formulations according to the invention in comparison to the reaction products of piperazine with epichlorohydrin and glycidyl ether.
- the aqueous baths according to the invention can generally be used for all types of substrates on which tin alloys can be deposited.
- substrates on which tin alloys can be deposited.
- useful substrates include copper-zinc alloys, chemically copper or chemically nickel-coated ABS plastic surfaces, mild steel, stainless steel, spring steel, chrome steel, chromium-molybdenum steel, copper and tin.
- Another object is therefore a process for the electrodeposition of copper-tin alloys on conventional substrates, wherein the inventive Bath is used.
- the substrate to be coated is introduced into the electrolyte bath.
- the deposition of the coatings at a current density of 0.25 to 0.75 A / dm 2 and at a temperature of 15 to 50 ° C, preferably 25 to 30 ° C.
- the method according to the invention can be carried out in the application for mass parts, for example as a drum electroplating method and for depositing on larger workpieces as a rack electroplating method.
- anodes are used which may be soluble, such as copper anodes, tin anodes or suitable copper-tin alloy anodes, which also serve as copper and / or tin ion source, so that deposited on the cathode copper and / or tin by dissolution is substituted by copper and / or tin at the anode.
- insoluble anodes e.g., platinum-mixed titanium mixed oxide anodes
- the copper and tin ions withdrawn from the electrolyte must be re-added in some other way, e.g. by addition of the corresponding soluble metal salts.
- galvanic deposition it is also possible to operate the process according to the invention under nitrogen or argon injection, with goods movement or without movement, without resulting in any disadvantages for the coatings obtained.
- the tin (II) ions can be used with the separation of the electrode spaces or with the use of membrane anodes, whereby a significant stabilization of the electrolyte can be achieved.
- the current source used are commercial DC converters or pulse rectifiers.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 g / l boric acid 32.4 ml / l 85% phosphoric acid 40 ml / l N-methylpyrrolidone 0.1 g / l 1- (pentafluorobenzyl) -3-carbamoyl pyridinium chloride 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A high gloss deposit was obtained.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 g / l boric acid 32.4 ml / l 85% phosphoric acid 20 ml / l N-methylpyrrolidone 0.06 g / l 1-benzyl-3-acetyl-pyridinium chloride 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A high glossy, light veil deposit in the low current density range was obtained.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 g / l boric acid 32.4 ml / l 85% phosphoric acid 40 ml / l N-methylpyrrolidone 0.03 g / l 1- (4-methoxy-benzyl) -3-carbamoyl pyridinium chloride 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A brilliant deposit was obtained.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 g / l boric acid 32.4 ml / l 85% phosphoric acid 40 ml / l N-methylpyrrolidone 0.03 g / l 1,1 '- (xylenyl) -3', 3-bis-carbamoyl-bis-pyridinium dichloride 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1 A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A high gloss deposit was obtained.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 gel boric acid 32.4 ml / l 85% phosphoric acid 40 ml / l N-methylpyrrolidone 0.12 g / l 1- (4'-Carboxy-benzyl) -3-carbamoyl pyridinium chloride 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A high gloss deposit was obtained.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 g / l boric acid 32.4 ml / l 85% phosphoric acid 40 ml / l N-methylpyrrolidone 3 ml / l 1- (Benzyl) -3-carbamoylpyridinium chloride 35% solution 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A high gloss deposit was obtained.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 g / l boric acid 32.4 ml / l 85% phosphoric acid 40 ml / l N-methylpyrrolidone 3 g / l morpholine 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A high gloss deposit was obtained.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 g / l boric acid 32.4 ml / l 85% phosphoric acid 40 ml / l N-methylpyrrolidone 5 g / l 2-morpholino-ethane sulfonic acid 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A high gloss deposit was obtained.
- An electrolyte with the following composition is used: 300 g / l tetrapotassiumpyrophosphate 10 g / l copper pyrophosphate 30 g / l pyrophosphate 50 g / l boric acid 32.4 ml / l 85% phosphoric acid 40 ml / l N-methylpyrrolidone 3 g / l 3- (4-morpholino) -1,2-propanediol 250 ml of the electrolyte with a pH of 7 are filled into a Hull cell.
- the anode used is a titanium mixed oxide electrode.
- the cathode sheet is coated at 1A for 10 minutes. After completion of the coating, the sheet is rinsed and dried under compressed air. A high gloss deposit was obtained.
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Abstract
Description
Die vorliegende Erfindung betrifft ein wässriges cyanid-freies Bad und ein Verfahren zur cyanid-freien Abscheidung von Zinn-Legierungen, insbesondere Zinn-Kupfer-Legierungen, das N-Methylpyrrolidon als organischen Glanzbildner enthält.The present invention relates to an aqueous cyanide-free bath and a process for the cyanide-free deposition of tin alloys, in particular tin-copper alloys containing N-methylpyrrolidone as organic brightener.
Die Erfindung ermöglicht die cyanid-freie Abscheidung von homogenen, glänzenden Zinn-Legierungsschichten, insbesondere Zinn-Kupfer-Legierungsschichten, deren Legierungsverhältnis je nach eingesetztem Metallsalzverhältnis innerhalb des Elektrolyten gezielt eingestellt werden kann.The invention enables the cyanide-free deposition of homogeneous, shiny tin alloy layers, in particular tin-copper alloy layers, the alloy ratio of which can be selectively adjusted depending on the metal salt ratio used within the electrolyte.
Zinn-Legierungen und insbesondere Kupfer-Zinn-Legierungen sind als Alternative zu Nickelabscheidungen in den Fokus des Interesses gekommen. Galvanisch abgeschiedene Nickelschichten werden üblicherweise sowohl für dekorative als auch funktionale Anwendungen eingesetzt.Tin alloys, and especially copper-tin alloys, have come into focus as an alternative to nickel deposits. Electrodeposited nickel layers are commonly used for both decorative and functional applications.
Trotz ihrer guten Eigenschaften sind Nickelschichten auf Grund ihrer sensibilisierenden Eigenschaften gerade bei direktem Hautkontakt gesundheitlich problematisch. Aus diesem Grund sind Alternativen von höchstem Interesse. Neben den im Elektronik-Sektor etablierten aber ökologisch problematischen Zinn-Blei-Legierungen, sind in den letzten Jahren vor allem Kupfer-Zinn-Legierungen als Ersatz ins Auge gefasst worden.
Industriell etabliert sind cyanid-haltige Kupfer-Zinn-Legierungsbäder. Aufgrund strenger werdender Regularien und der hohen Toxizität und problematischen und teuren Entsorgung dieser cyanid-haltigen Bäder besteht ein wachsender Bedarf an cyanid-freien Kupfer-Zinn-Elektrolyten.Cyanide-containing copper-tin alloy baths are industrially established. Due to stricter regulations and the high toxicity and problematic and expensive disposal of these cyanide-containing baths, there is a growing demand for cyanide-free copper-tin electrolytes.
Zu diesem Zweck sind vereinzelt cyanid-freie pyrophosphat-haltige Elektrolyte entwickelt worden. So beschreibt die
Nachteilig bei den oben genannten Bädern ist, dass gerade bei Trommelgalvanisierungen keine einheitlichen Legierungsschichten erhalten werden, so dass die Produkte keine einheitliche Farbgebung und Glanz aufweisen.A disadvantage of the abovementioned baths is that no uniform alloy layers are obtained, especially in the case of drum galvanizations, so that the products do not have a uniform coloring and gloss.
Zur Lösung dieses Problems wird in der
Ferner zeigt dieser Elektrolyt Schwächen bei Anwendungen in der Gestellgalvanisierung. So ist die Qualität der abgeschiedenen Schichten, die oftmals einen Schleier zeigen, sehr stark von der Art der Warenbewegung während der Elektrolyse abhängig. Die auf diese Weise erhaltenen Kupfer-Zinn-Überzüge weisen zudem oftmals Poren auf, was gerade bei dekorativen Überzügen problematisch ist.Further, this electrolyte exhibits weaknesses in rack plating applications. Thus, the quality of the deposited layers, which often show a haze, very much depends on the nature of the movement of goods during the electrolysis. The copper-tin coatings obtained in this way also often have pores, which is problematic especially in decorative coatings.
Der Erfindung liegt deshalb die Aufgabe zugrunde, ein galvanisches Bad für Zinn-Legierungen zu entwickeln, welches die Herstellung von optisch ansprechenden Zinn-Legierungsschichten ermöglicht.The invention is therefore based on the object to develop a galvanic bath for tin alloys, which allows the production of optically attractive tin alloy layers.
Dabei soll zusätzlich eine homogenere Zinn-Legierungsmetallverteilung und ein optimales Zinn-Metall-Verhältnis eingestellt werden. Außerdem sollen eine einheitliche Schichtdicke mit hohem Glanz und die Gleichmäßigkeit der Verteilung der Legierungskomponenten im Überzug über einen weiten Stromdichtebereich aufrechterhalten werden.In addition, a more homogeneous tin-alloy metal distribution and an optimal tin-metal ratio should be set. In addition, a uniform layer thickness with high gloss and the uniformity of the distribution of the alloy components in the coating should be maintained over a wide current density range.
Gegenstand der Erfindung ist ein wässriges cyanid-freies Elektrolytbad zur Abscheidung von Zinn-Legierungsschichten auf Substratoberflächen, umfassend
- (i) eine Zinn-Ionenquelle und eine Quelle für ein weiteres Legierungselement sowie
- (ii) N-Methylpyrrolidon.
- (i) a tin ion source and a source of another alloying element as well
- (ii) N-methylpyrrolidone.
Neben den vorgenannten Komponenten (i) und (ii) kann das erfindungsgemäße Elektrolytbad weiterhin eine Säure (iii) und/oder eine Pyrophosphat-Quelle (iv) umfassen.In addition to the aforementioned components (i) and (ii), the electrolytic bath according to the invention may further comprise an acid (iii) and / or a pyrophosphate source (iv).
Bei der Komponente (iii) des erfindungsgemäßen wässrigen cyanid-freien Elektrolytbads handelt es sich um eine beliebige Säure, wie sie in bekannten Elektrolytbädern eingesetzt werden kann. Vorzugsweise handelt es sich um organische Sulfonsäuren, Orthophosphorsäure, Schwefelsäure und Borsäure.The component (iii) of the aqueous cyanide-free electrolyte bath according to the invention is any acid which can be used in known electrolyte baths. Preferably, they are organic sulfonic acids, orthophosphoric acid, sulfuric acid and boric acid.
Das erfindungsgemäße wässrige cyanid-freie Elektrolytbad enthält vorzugsweise weiterhin Zusätze, die aus Antioxidationsmitteln und/oder weiteren organischen Glanzbildnern ausgewählt sind.The aqueous cyanide-free electrolyte bath according to the invention preferably also contains additives which are selected from antioxidants and / or further organic brighteners.
Bevorzugte organische Glanzbildner sind hierbei Morpholin, 2-Morpholinethansulfonsäure, Hexamethylentetramin, 3-(4-Morpholino)-1,2-propandiol, 1,4-Diazabicyclo-[2.2.2]-octan, 1-Benzyl-3-carbamoyl-pyridiniumchlorid, 1-(2'-Chloro-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(2'-Fluoro-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(2'-Methoxy-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(2'-Carboxy-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(2'-Carbamoyl-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(3'-Chloro-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(3'-Fluoro-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(3'-Methoxy-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(3'-Carboxy-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(3'-Carbamoyl-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(4'-Chloro-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(4'-Fluoro-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(4'-Methoxybenzyl)-3-carbamoyl-pyridinium-chlorid, 1-(4'-Carboxy-benzyl)-3-carbamoyl-pyridinium-chlorid, 1-(4'-Carbamoyl-benzyl)-3-carbamoyl-pyridinium-chlorid, (1'-Methyl-naphthyl)-3-carbamoyl-pyridinium-chlorid, 1-(1'methyl-naphthyl)-3-carbamoyl-pyridinium-bromid, 1-(1'-Methyl-naphthyl)-3-carbamoyl-pyridinium-fluorid, 1,1'-(Xylenyl)-3,3'-bis-carbamoyl-bis-pyridinium-dibromid, 1,1',1"-(Mesitylenyl)-3,3',3"-tris-carbamoyl-tri-pyridinium-trichlorid, sowie die korrespondierenden Bromide, Fluoride, Iodide und Pseudohalogenide (z.B. Triflate, Tosylate) der oben aufgeführten Verbindungen sowie quatemisierte N,N-Bis-[dialkylamino-alkyl]-harnstoffe, wobei benzylierte Derivate besonders geeignet sind.Preferred organic brighteners here are morpholine, 2-morpholineethanesulfonic acid, hexamethylenetetramine, 3- (4-morpholino) -1,2-propanediol, 1,4-diazabicyclo [2.2.2] octane, 1-benzyl-3-carbamoyl-pyridinium chloride , 1- (2'-Chloro-benzyl) -3-carbamoyl-pyridinium chloride, 1- (2'-fluoro-benzyl) -3-carbamoyl-pyridinium chloride, 1- (2'-methoxy-benzyl) - 3-carbamoyl-pyridinium chloride, 1- (2'-carboxy-benzyl) -3-carbamoyl-pyridinium chloride, 1- (2'-carbamoyl-benzyl) -3-carbamoyl-pyridinium chloride, 1- (3 'Chloro-benzyl) -3-carbamoyl-pyridinium chloride, 1- (3'-fluoro-benzyl) -3-carbamoyl-pyridinium chloride, 1- (3'-methoxy-benzyl) -3-carbamoyl-pyridinium chloride, 1- (3'-carboxy-benzyl) -3-carbamoyl-pyridinium chloride, 1- (3'-carbamoyl-benzyl) -3-carbamoyl-pyridinium chloride, 1- (4'-chlorobenzyl ) -3-carbamoyl-pyridinium chloride, 1- (4'-fluoro-benzyl) -3-carbamoyl-pyridinium chloride, 1- (4'-methoxybenzyl) -3-carbamoyl-pyridinium chloride, 1- (4 '-carboxy-benzyl) -3-carbamoyl pyridinium chloride, 1- (4'-carbamoyl-benzyl) -3-carbamoyl-pyridinium chloride, (1'-methyl-naphthyl) -3-carbamoyl-pyridinium chloride, 1- (1'-methyl-naphthyl) -3-carbamoyl pyridinium bromide, 1- (1'-methyl-naphthyl) -3-carbamoyl-pyridinium-fluoride, 1,1 '- (xylenyl) -3,3'-bis-carbamoyl-bis-pyridinium-dibromide, 1,1 ', 1 "- (Mesitylenyl) -3,3', 3" -tris-carbamoyl-tri-pyridinium-trichloride, and the corresponding bromides, fluorides, iodides and pseudohalides (eg triflates, tosylates) of the compounds listed above and quaternized N , N-bis [dialkylamino-alkyl] -ureas, with benzylated derivatives being particularly suitable.
Die erfindungsgemäßen Additive können mit N-Methylpyrrolidon alleine oder als Gemisch mehrerer unterschiedlicher Glanzbildnersysteme der oben genannten Vertreter in einer Konzentration von 0,0001 bis 20 g/l und besonders bevorzugt von 0,001 bis 1 g/l eingesetzt werden.The additives according to the invention can be used with N-methylpyrrolidone alone or as a mixture of a plurality of different brightener systems of the abovementioned representatives in a concentration of 0.0001 to 20 g / l and more preferably of 0.001 to 1 g / l.
Die Zinn-Ionenquelle und die Quelle für ein weiteres Legierungselement können Pyrophosphate sein. Insoweit sind die Zinn-Ionenquelle und die Quelle für ein weiteres Legierungselement auch Pyrophosphat-Quellen im Sinne der vorgenannten Komponente (iv) des erfindungsgemäßen Elektrolytbads.The tin ion source and the source of another alloying element may be pyrophosphates. In that regard, the tin ion source and the source of another alloying element are also pyrophosphate sources within the meaning of the aforementioned component (iv) of the electrolytic bath according to the invention.
In einem solchen Fall beträgt die Pyrophosphatkonzentration der Quelle für ein weiteres Legierungselement 0,5 bis 50 g/l und vorzugsweise 1 bis 5 g/l. Beispielsweise kann das erfindungsgemäße Bad Kupferpyrophosphat in einer Menge von 0,5 bis 50 g/l, vorzugsweise 1 bis 5 g/l oder Zinkpyrophosphat in diesen Mengen enthalten.In such a case, the pyrophosphate concentration of the source for another alloying element is 0.5 to 50 g / l, and preferably 1 to 5 g / l. For example, the bath according to the invention may contain copper pyrophosphate in an amount of 0.5 to 50 g / l, preferably 1 to 5 g / l or zinc pyrophosphate in these amounts.
Wenn als Zinn-Ionenquelle Zinnpyrophosphat in dem erfindungsgemäßen Elektrolytbad eingesetzt wird, beträgt die Konzentration im Allgemeinen 0,5 bis 100 g/l, wobei Konzentrationen von 10 bis 40 g/l besonders bevorzugt sind.When tin pyrophosphate is used as the tin ion source in the electrolytic bath of the present invention, the concentration is generally 0.5 to 100 g / l, with concentrations of 10 to 40 g / l being particularly preferred.
Neben den oben erwähnten Zinn- und Metallpyrophosphaten können auch anderweitige wasserlösliche Zinn- und Metallsalze, wie z.B. Zinnsulfat, Zinnmethansulfonat, Kupfersulfat, Kupfermethansulfonat, oder die entsprechenden Zinksalze eingesetzt werden, die durch Zusatz geeigneter Alkalimetallpyrophosphate innerhalb des Elektrolyten in die entsprechenden Pyrophosphate umkomplexiert werden können. Dabei sollte das Konzentrationsverhältnis Pyrophosphat zu Zinn/Metall bei 3 bis 80, besonders bevorzugt bei 5 bis 50 liegen.In addition to the above-mentioned tin and metal pyrophosphates, other water-soluble tin and metal salts, such as tin sulfate, tin methanesulfonate, copper sulfate, copper methanesulfonate, or the corresponding Zinc salts are used, which can be umkomplexiert by the addition of suitable alkali metal pyrophosphates within the electrolyte into the corresponding pyrophosphates. The concentration ratio of pyrophosphate to tin / metal should be 3 to 80, more preferably 5 to 50.
Pyrophosphat-Quellen gemäß Komponente (iv) sind besonders bevorzugt die Natrium-, Kalium- und Ammoniumpyrophosphate in Konzentrationen von 50 bis 500 g/l, besonders bevorzugt von 100 bis 400 g/l.Pyrophosphate sources according to component (iv) are particularly preferably the sodium, potassium and ammonium pyrophosphates in concentrations of 50 to 500 g / l, more preferably from 100 to 400 g / l.
Die vorgenannten Antioxidationsmittel beinhalten hydroxylierte aromatische Verbindungen wie z.B. Catechol, Resorcin, Brenzkatechin, Hydrochinon, Pyrogallol, α- oder β-Naphthol, Phloroglucin und zuckerbasierte Systeme wie z.B. Ascorbinsäure, Sorbitol in Konzentrationen von 0,1 bis 1 g/l.The aforementioned antioxidants include hydroxylated aromatic compounds, e.g. Catechol, resorcinol, pyrocatechol, hydroquinone, pyrogallol, α- or β-naphthol, phloroglucin and sugar-based systems such as e.g. Ascorbic acid, sorbitol in concentrations of 0.1 to 1 g / l.
Als organische Sulfonsäuren können sowohl Mono- als auch Polyalkylsulfonsäuren wie z.B. Methansulfonsäure, Methandisulfonsäure, Ethansulfonsäure, Propansulfonsäure, 2-Propansulfonsäure, Butansulfonsäure, 2-Butansulfonsäure, Pentansulfonsäure, Hexansulfonsäure, Decansulfonsäure, Dodecansulfonsäure sowie deren Salze und deren hydroxylierte Derivate eingesetzt werden. Besonders bevorzugt ist die Verwendung von Methansulfonsäure in einer Konzentration von 0,01 bis 1 g/l.As organic sulfonic acids, both mono- and polyalkylsulfonic acids, e.g. Methanesulfonic acid, methanedisulfonic acid, ethanesulfonic acid, propanesulfonic acid, 2-propanesulfonic acid, butanesulfonic acid, 2-butanesulfonic acid, pentanesulfonic acid, hexanesulfonic acid, decanesulfonic acid, dodecanesulfonic acid and salts thereof and their hydroxylated derivatives are used. Particularly preferred is the use of methanesulfonic acid in a concentration of 0.01 to 1 g / l.
Die erfindungsgemäßen Bäder weisen einen pH-Wert von 3 bis 9, besonders bevorzugt 6 bis 8 auf.The baths according to the invention have a pH of 3 to 9, more preferably 6 to 8.
Überraschend und unerwarteter Weise konnte gefunden werden, dass durch Zusatz von N-Methylpyrrolidon eine signifikante Verbesserung der abgeschiedenen Schichten hinsichtlich Glanz und Porenfreiheit erreicht werden kann, vorzugsweise in einer Konzentration von 0,1 bis 50 g/l, besonders bevorzugt 0,1 bis 4 g/l.Surprisingly and unexpectedly it could be found that by adding N-methylpyrrolidone a significant improvement in the deposited layers can be achieved with regard to gloss and freedom from pores, preferably in a concentration of 0.1 to 50 g / l, more preferably 0.1 to 4 g / l.
Die erfindungsgemäßen Bäder können mit gebräuchlichen Verfahren hergestellt werden, beispielsweise durch Zugabe der spezifischen Mengen der vorstehend beschriebenen Komponenten zu Wasser. Die Menge der Basen-, Säure- und Pufferkomponenten, wie z.B. Natriumpyrophosphat, Methansulfonsäure und/oder Borsäure, sollte vorzugsweise so gewählt werden, dass das Bad den pH-Bereich von mindestens 6 bis 8 zu erreicht.The baths according to the invention can be prepared by conventional methods, for example by adding the specific amounts of the above-described components to water. The amount of bases, acids and acids Buffer components such as sodium pyrophosphate, methanesulfonic acid and / or boric acid should preferably be chosen so that the bath reaches the pH range of at least 6 to 8.
Die erfindungsgemäßen Bäder scheiden eine blanke, ebene und duktile Kupfer-Zinn-Legierungsschicht bei jeder gebräuchlichen Temperatur von etwa 15 bis 50°C, vorzugsweise 20°C bis 40°C, besonders bevorzugt 25°C bis 30°C, ab. Bei diesen Temperaturen sind die erfindungsgemäßen Bäder stabil und über einen weiten Stromdichtebereich von 0,01 bis 2 A/dm2, besonders bevorzugt 0,25 bis 0,75 A/dm2, wirkungsvoll.The baths according to the invention deposit a bright, even and ductile copper-tin alloy layer at any customary temperature of about 15 to 50 ° C, preferably 20 ° C to 40 ° C, more preferably 25 ° C to 30 ° C from. At these temperatures, the baths according to the invention are stable and effective over a wide current density range of 0.01 to 2 A / dm 2 , more preferably 0.25 to 0.75 A / dm 2 .
Die erfindungsgemäßen Bäder können auf eine kontinuierliche oder intermittierende Weise betrieben werden, und von Zeit zu Zeit wird man die Komponenten des Bades ergänzen müssen. Die Komponenten des Bades können einzeln oder in Kombination zugesetzt werden. Ferner können sie über einen weiten Bereich variiert werden, abhängig vom Verbrauch und vorliegenden Konzentration der Einzelkomponenten.The baths of the invention may be operated in a continuous or intermittent manner, and from time to time the components of the bath will have to be supplemented. The components of the bath may be added singly or in combination. Furthermore, they can be varied over a wide range, depending on the consumption and present concentration of the individual components.
Ein Vorteil der erfindungsgemäßen Bäder im Vergleich zum Elektrolyten der
Die erfindungsgemäßen wässrigen Bäder können im allgemeinen für alle Arten von Substraten verwendet werden, auf welchen Zinn-Legierungen abgeschieden werden können. Beispiele zweckdienlicher Substrate schließen Kupfer-Zink-Legierungen, mit chemisch Kupfer oder chemisch Nickel beschichtete ABS-Kunststoffoberflächen, Weichstahl, Edelstahl, Federstahl, Chromstahl, Chrom-Molybdänstahl, Kupfer und Zinn ein.The aqueous baths according to the invention can generally be used for all types of substrates on which tin alloys can be deposited. Examples of useful substrates include copper-zinc alloys, chemically copper or chemically nickel-coated ABS plastic surfaces, mild steel, stainless steel, spring steel, chrome steel, chromium-molybdenum steel, copper and tin.
Ein weiterer Gegenstand ist daher ein Verfahren zur galvanischen Abscheidung von Kupfer-Zinn-Legierungen auf üblichen Substraten, wobei das erfindungsgemäße Bad verwendet wird. Dabei wird das zu beschichtende Substrat in das Elektrolytbad eingebracht.Another object is therefore a process for the electrodeposition of copper-tin alloys on conventional substrates, wherein the inventive Bath is used. In this case, the substrate to be coated is introduced into the electrolyte bath.
Vorzugsweise erfolgt bei dem erfindungsgemäßen Verfahren die Abscheidung der Überzüge bei einer Stromdichte von 0,25 bis 0,75 A/dm2 sowie bei einer Temperatur von 15 bis 50°C, vorzugsweise 25 bis 30°C.Preferably, in the inventive method, the deposition of the coatings at a current density of 0.25 to 0.75 A / dm 2 and at a temperature of 15 to 50 ° C, preferably 25 to 30 ° C.
Das erfindungsgemäße Verfahren kann bei der Anwendung für Massenteile beispielsweise als Trommelgalvanisierverfahren und zur Abscheidung auf größeren Werkstücken als Gestellgalvanisierverfahren durchgeführt werden. Dabei werden Anoden verwendet, die löslich sein können, wie beispielsweise Kupferanoden, Zinnanoden oder geeignete Kupfer-Zinn-Legierungsanoden, die gleichzeitig als Kupfer und/oder Zinn-Ionen-Quelle dienen, damit das auf der Kathode abgeschiedenen Kupfer und/oder Zinn durch Auflösen von Kupfer und/oder Zinn an der Anode substituiert wird.The method according to the invention can be carried out in the application for mass parts, for example as a drum electroplating method and for depositing on larger workpieces as a rack electroplating method. In this case, anodes are used which may be soluble, such as copper anodes, tin anodes or suitable copper-tin alloy anodes, which also serve as copper and / or tin ion source, so that deposited on the cathode copper and / or tin by dissolution is substituted by copper and / or tin at the anode.
Andererseits können auch unlösliche Anoden (z.B. platinierte Titanmischoxid-Anoden) eingesetzt werden, wobei die dem Elektrolyten entzogenen Kupfer-und Zinn-Ionen auf andere Weise wieder zugesetzt werden müssen, z.B. durch Zusatz der entsprechenden löslichen Metallsalze. Wie bei der galvanischen Abscheidung möglich, kann auch das erfindungsgemäße Verfahren unter Stickstoff- oder Argoneinblasung, mit Warenbewegung oder ohne Bewegung, betrieben werden, ohne dass sich hierfür irgendwelche Nachteile für die erhaltenen Überzüge ergeben. Zur Vermeidung bzw. Reduzierung von Oxidationen der zugesetzten Additive bzw. der Zinn(II)-Ionen kann mit der Trennung der Elektrodenräume oder mit der Verwendung von Membrananoden gearbeitet werden, wodurch eine erhebliche Stabilisierung des Elektrolyten erreicht werden kann.On the other hand, insoluble anodes (e.g., platinum-mixed titanium mixed oxide anodes) can also be used, and the copper and tin ions withdrawn from the electrolyte must be re-added in some other way, e.g. by addition of the corresponding soluble metal salts. As in the case of galvanic deposition, it is also possible to operate the process according to the invention under nitrogen or argon injection, with goods movement or without movement, without resulting in any disadvantages for the coatings obtained. To avoid or reduce oxidations of the added additives or the tin (II) ions can be used with the separation of the electrode spaces or with the use of membrane anodes, whereby a significant stabilization of the electrolyte can be achieved.
Als Stromquelle dienen handelsübliche Gleichstromrichter oder Pulsgleichrichter.The current source used are commercial DC converters or pulse rectifiers.
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Es wird ein Elektrolyt mit folgender Zusammensetzung verwendet:
Claims (22)
- An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces, comprising(i) a tin ion source and a source for another alloy element, characterised in that it further contains(ii) N-methyl pyrrolidone.
- The aqueous cyanide-free electrolyte bath according to claim 1, further comprising an acid (iii) and/or a pyrophosphate source (iv).
- The aqueous cyanide-free electrolyte bath according to claim 2, wherein the acid is orthoposphoric acid, sulfuric acid or methanesulfonic acid.
- The aqueous cyanide-free electrolyte bath according to claim 1, wherein the tin ion source is tin pyrophosphate.
- The aqueous cyanide-free electrolyte bath according to claim 4, containing tin pyrophosphate in an amount of 0.5 to 100 g/l.
- The aqueous cyanide-free electrolyte bath according to claim 1, wherein the source for another alloy element is copper pyrophosphate.
- The aqueous cyanide-free electrolyte bath according to claim 5 or 6, containing tin pyrophosphate in an amount of 10 to 40 g/l and copper pyrophosphate in an amount of 1 to 5 g/l.
- The aqueous cyanide-free electrolyte bath according to claim 2, wherein the pyrophosphate source is selected from the group consisting of sodium, potassium and ammonium pyrophosphates.
- Aqueous cyanide-free electrolyte bath according to claim 8, containing the pyrophosphates in a concentration of 50 to 500 g/l.
- The aqueous cyanide-free electrolyte bath according to claim 2, wherein the concentration ratio of pyrophosphate to tin/alloy element is 3 to 80.
- The aqueous cyanide-free electrolyte bath according to claim 1, containing N-methyl pyrrolidone in a concentration of 0.1 to 50 g/l.
- The aqueous cyanide-free electrolyte bath according to claim 11, containing N-methyl pyrrolidone in a concentration of 0:1 to 4 g/l.
- The aqueous cyanide-free electrolyte bath according to claim 1 having a pH value of 3 to 9.
- The aqueous cyanide-free electrolyte bath according to claim 1, further comprising an antioxidant and/or a further organic gloss agent.
- The aqueous cyanide-free electrolyte bath according to claim 14, wherein the further organic gloss agent is selected from the group consisting of morpholine, 2-morpholine ethanesulfonic acid, hexamethylenetetramine, 3-(4-morpholino)-1,2-propanediol, 1,4-diazabicyclo-[2.2.2]-octane, 1-benzyl-3-carbamoyl-pyridinium chloride, 1-(2'-chloro-benzyl)-3-carbamoylpyridinium chloride, 1-(2'-fluoro-benzyl)-3-carbamoyl-pyridinium chloride, 1-(2'-methoxy-benzyl)-3-carbamoyl-pyridinium chloride, 1-(2'-carboxybenzyl)-3-carbamoyl-pyridinium chloride, 1-(2'-carbamoyl-benzyl)-3-carbamoyl-pyridinium chloride, 1-(3'-chloro-benzyl)-3-carbarnoyl-pyridinium chloride, 1-(3'-fluoro-benzyl)-3-carbamoyl-pyridinium chloride, 1-(3'-methoxy-benzyl)-3-carbamoyl-pyridinium chloride, 1-(3'-carboxy-benzyl)-3-carbamoyl-pyridinium chloride, 1-(3'-carbamoyl-benzyl)-3-carbamoylpyridinium chloride, 1-(4'-chloro-benzyl)-3-carbamoyl-pyridinium chloride, 1-(4'-fluoro-benzyl)-3-carbamoyl-pyridinium chloride, 1-(4'-methoxybenzyl)-3-carbamoyl-pyridinium chloride, 1-(4'-carbamoyl-benzyl)-3-carbamoyl-pyridinium chloride, (1'-methyl-naphthyl)-3-carbamoylpyridinium chloride, 1-(1'methyl-naphthyl)-3-carbamoyl-pyridinium bromide, 1,1'-(xylenyl)-3,3'-bis-carbamoyl-bis-pyridinium dibromide, 1,1',1"-(mesitylenyl)-3,3',3"-tris-carbamoyl-tri-pyridinium trichloride as well as the corresponding bromides, fluorides, iodides and pseudo halogenides of the aforementioned compounds and quaternised N,N-bis-[dialkylamino-alkyl] ureas.
- A process for electroplating of glossy and even tin alloy coatings, comprising introducing a substrate to be coated into an aqueous cyanide-free electrolyte bath according to claims 1 to 15 and plating the tin alloy coating on the substrate.
- The process according to claim 16, wherein the bath is operated at a current density of 0.01 to 2 A/dm2.
- The process according to claim 17, wherein the bath is operated at a current density of 0.25 to 0.75 A/dm2.
- The process according to claim 16, wherein the bath is operated at a temperature of 15 to 50°C.
- The process according to claim 19, wherein the bath is operated at a temperature of 25 to 30°C.
- The process according to claim 16 to 20, wherein the coatings on a conductive substrate are plated using a frame electroplating method.
- The process according to claims 16 to 21, wherein membrane anodes are used as the anodes.
Priority Applications (14)
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EP08003786A EP2103717B1 (en) | 2008-02-29 | 2008-02-29 | Pyrophosphate-based bath for depositing tin alloy layers |
DE502008000573T DE502008000573D1 (en) | 2008-02-29 | 2008-02-29 | Pyrophosphate-based bath for the deposition of tin alloy layers |
AT08003786T ATE465283T1 (en) | 2008-02-29 | 2008-02-29 | PYROPHOSPHATE-BASED BATH FOR DEPOSITION OF TIN ALLOY LAYERS |
ES08003786T ES2340973T3 (en) | 2008-02-29 | 2008-02-29 | PIROPHOSPHATE BASED BATHROOM FOR THE DEPOSITION OF TIN ALLOY LAYERS. |
PL08003786T PL2103717T3 (en) | 2008-02-29 | 2008-02-29 | Pyrophosphate-based bath for depositing tin alloy layers |
PT08003786T PT2103717E (en) | 2008-02-29 | 2008-02-29 | Pyrophosphate-based bath for depositing tin alloy layers |
PCT/EP2009/000802 WO2009109271A2 (en) | 2008-02-29 | 2009-02-05 | Pyrophosphate-based bath for plating on tin alloy layers |
CA2716115A CA2716115A1 (en) | 2008-02-29 | 2009-02-05 | Pyrophosphate-based bath for plating on tin alloy layers |
CN2009801015016A CN101918618B (en) | 2008-02-29 | 2009-02-05 | Pyrophosphate-Based Bath for Electroplating Tin Alloy Layers |
KR1020107018440A KR101540615B1 (en) | 2008-02-29 | 2009-02-05 | Pyrophosphate-based bath for plating on tin alloy layers |
BRPI0907497-0A BRPI0907497A2 (en) | 2008-02-29 | 2009-02-05 | Pyrophosphate based bath for coating of tin alloy layers |
US12/864,180 US8647491B2 (en) | 2008-02-29 | 2009-02-05 | Pyrophosphate-based bath for plating of tin alloy layers |
JP2010547984A JP5688841B2 (en) | 2008-02-29 | 2009-02-05 | Pyrophosphate bath for plating of tin alloy layers |
TW098104123A TWI439580B (en) | 2008-02-29 | 2009-02-10 | Pyrophosphate-based bath for plating of tin alloy layers |
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DE102011121799B4 (en) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell |
CN103849912A (en) * | 2012-11-29 | 2014-06-11 | 沈阳工业大学 | Electroplating technology of shining tin zinc nickel alloy |
CN103132113B (en) * | 2013-03-08 | 2015-08-12 | 大连理工大学 | A kind of weakly alkaline tin-based lead-free solder composite plating solution and its application |
EP2801640A1 (en) | 2013-05-08 | 2014-11-12 | ATOTECH Deutschland GmbH | Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy |
CN103668402B (en) * | 2013-10-08 | 2016-06-08 | 常州大学 | Preparation method of nano composite high-tin copper alloy electroplating material |
AR100422A1 (en) * | 2014-05-15 | 2016-10-05 | Nippon Steel & Sumitomo Metal Corp | SOLUTION FOR DEPOSITION FOR THREADED CONNECTION FOR A PIPE OR PIPE AND PRODUCTION METHOD OF THE THREADED CONNECTION FOR A PIPE OR PIPE |
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2008
- 2008-02-29 ES ES08003786T patent/ES2340973T3/en active Active
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Also Published As
Publication number | Publication date |
---|---|
CN101918618A (en) | 2010-12-15 |
US8647491B2 (en) | 2014-02-11 |
CA2716115A1 (en) | 2009-09-11 |
PT2103717E (en) | 2010-06-14 |
TWI439580B (en) | 2014-06-01 |
WO2009109271A2 (en) | 2009-09-11 |
BRPI0907497A2 (en) | 2015-07-14 |
ES2340973T3 (en) | 2010-06-11 |
KR20100120160A (en) | 2010-11-12 |
EP2103717A1 (en) | 2009-09-23 |
DE502008000573D1 (en) | 2010-06-02 |
KR101540615B1 (en) | 2015-07-30 |
TW200949021A (en) | 2009-12-01 |
JP2011513585A (en) | 2011-04-28 |
CN101918618B (en) | 2012-02-22 |
ATE465283T1 (en) | 2010-05-15 |
PL2103717T3 (en) | 2010-07-30 |
WO2009109271A3 (en) | 2010-02-25 |
JP5688841B2 (en) | 2015-03-25 |
US20100300890A1 (en) | 2010-12-02 |
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