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EP2010500B1 - Arrangement for contacting power semiconductors to a cooling surface - Google Patents

Arrangement for contacting power semiconductors to a cooling surface Download PDF

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Publication number
EP2010500B1
EP2010500B1 EP07727781A EP07727781A EP2010500B1 EP 2010500 B1 EP2010500 B1 EP 2010500B1 EP 07727781 A EP07727781 A EP 07727781A EP 07727781 A EP07727781 A EP 07727781A EP 2010500 B1 EP2010500 B1 EP 2010500B1
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EP
European Patent Office
Prior art keywords
spring element
cooling surface
housing
arrangement according
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP07727781A
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German (de)
French (fr)
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EP2010500A1 (en
Inventor
Matthias Maschke
Hartmut Schneeweiss
Anja Ulmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebm Papst Mulfingen GmbH and Co KG
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Ebm Papst Mulfingen GmbH and Co KG
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Publication of EP2010500A1 publication Critical patent/EP2010500A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61P—SPECIFIC THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS
    • A61P35/00—Antineoplastic agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an arrangement for contacting at least one electronic component mounted in a housing with connecting wires, in particular a power semiconductor, on a cooling surface and a spring element fastened in the housing with at least one spring arm which presses the component against the cooling surface in a contact position of the spring element ,
  • the prior art further includes holding devices, which essentially comprise a U- or L-shaped spring clip which is (clipped ”) over ade Economicswandung and simultaneously over the component and in this way the pressing force between the contact surfaces of the heat sink and ensures the component.
  • the present invention is based on the object to provide an arrangement of the type described above, which exerts no shear forces in the direction or opposite direction of the connecting wires for the electrical components with simple installation.
  • the above-mentioned object is achieved in that the housing wall in the adjoining the side wall acting as a cooling surface side walls perpendicular to the bottom to running embedded pairs of grooves, each consisting of an insertion groove and a locking groove, wherein the Einhegenuten are deart .
  • the locking grooves allow a convenient automatic engagement of the spring element in a predefined position. A complex alignment of the spring element is eliminated.
  • the spring element is displaceable from the first mounting position by a force perpendicular to the cooling surface in the pressing position, so that in this second assembly step no thrust force acts in the longitudinal direction of the connecting wires, instead, the spring element from the first mounting position by acting purely perpendicular to the cooling surface forces fixed in the pressure position.
  • the spring element consists of mutually parallel spring arms, which are perpendicularly attached to a support member which connects the two lateral projections of the spring element with each other
  • the Fig. 1 and 2 show an inventive spring element 2 as provided for installation in an electronics housing 4 of an electric motor.
  • the spring element 2 consists of a support member 8, at the upper edge present z. B. six spring arms 10 are formed and the side has two angled lugs 12 a, 12 b.
  • the lugs 12a, 12b are formed at their upper and lower edges with folded at right angles inwardly tabs 13 to prevent buckling of the lugs 12a, 12b.
  • the support member has approximately right angle folded narrow portions 14a, 14b, the bottom portion 14a facing the side where the spring arms 10 are and the top portion 14b faces in the opposite direction.
  • the upper section 14b continues at equidistant intervals ( Fig.
  • the spring arms 10 At its lower end, the spring arms 10 have a convex outwardly curved contact portion 16 which in Anyakposition of the spring element 2 against the Components 24 presses.
  • a convex outwardly curved contact portion 16 Below the center of the support member 8, opposite the contact portions 16, parallel to the top and bottom edges of the support member 8 is a curved towards the front, semicircular stiffening bead 18, which prevents bending of the spring element 2.
  • the Fig. 3 to 7 show a possible use variant of the spring element 2 according to the invention in an electronics housing 4 of an electric motor 6.
  • the electronics housing 4 On a rotor housing 7 of the electric motor 6, the electronics housing 4 is placed, which receives a printed circuit board 20 with electronic components 22 and other electrical connecting elements ( Fig. 3 ).
  • the electronics housing 4 consists essentially of a peripheral wall, which is formed by a flat side wall 26, which acts as a cooling surface, adjoining side walls 32, 33 and one of the planar side wall 26 opposite wall 34.
  • brackets 36 are formed with holes 37 for attachment of the housing.
  • the electronics housing 4 can be closed with a housing cover, not shown, which engages in a circumferential groove 38 on the end face of the side walls 26, 32, 33 and 34.
  • the housing cover is attached to holding projections 40, the holes 41, attached.
  • On the bottom of the electronics housing 4 sits a electronic components 22, 24 supporting circuit board 20.
  • Power semiconductors 24 are soldered to the circuit board 20 that they can be arranged in the interior of the electronics housing 4 on a flat side wall 26 of the electronics housing 4. Between the power semiconductor 24 and the planar side wall 26, a heat conductive electrical insulating layer 28 is inserted to allow and improve heat transfer to the side wall 26 provided with cooling fins 30.
  • the upper pair of tabs 13 has an additional task: If the * spring element 2 is inserted into the electronics housing 4, but not yet locked, a housing cover can not be mounted, as then molded on the housing cover pin on the upper tabs 13th rest and would prevent closure of the lid. If the proper locking of the spring element 2 is performed, the pin of the lid can engage in the vacant space and the lid can be put on. This has a check whether a proper assembly of the spring element 2 has been performed.
  • the insertion position is in Fig. 4 shown. A detailed view of the position of the spring element in this insertion position shows Fig. 6 , It can be seen that the projection 12a is fixed by placing its end portion in the insertion groove 44a. In the insertion process, the spring arms 10 are not yet in contact with the power semiconductors 24, thus exerting no shear forces on the component 24 and its solder joint. It an air gap 45 remains between the spring arms 10 and the power semiconductors 24.
  • the latching groove pair 46a, 46b adjoins directly to the insertion grooves 44a, 44b and is recessed in the same way but at a smaller distance from the flat side wall 26.
  • the transition region 48a, 48b between the insertion groove 44a (44b) and the latching groove 46a (46b) is formed in such a way that its resistance can be overcome by a force F acting on the spring element 2 perpendicular to the cooling surface ( Fig. 4 ).
  • the elastic lateral projections 12a, 12b are briefly compressed during the advancing movement in the direction of the power semiconductor 24 by the transition regions 48a, 48b before they rest in the latching grooves 46a, 46b in the pressure position ( Fig. 5 ).
  • FIG. 7 A detailed view of the position of the spring element 2 on the side wall 32 in the pressure position shows Fig. 7 , The end portion of the projection 12a fixed with its vertically extending edge, which is now embedded in the locking groove 46a, the spring element 2.
  • this pressure position now press the spring arms 10 on the power semiconductor 24, which thereby against the heat-conducting insulating layer 28 and thus against as Cooling surface 27 formed side wall 26 are pressed. This ensures safe heat dissipation without the use of other fasteners, such as screws or clamps.
  • the component 24 and the solder joint are not loaded by shear forces.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Organic Chemistry (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An arrangement for contact-connecting at least one electronic component mounted in a housing with connection wires to a cooling surface and a spring element that can be fixed in the housing and has at least one spring arm which presses the component against the cooling surface in a contact-pressure position of the spring element is presented. The arrangement is characterized in that the spring element can be inserted into the housing without touching the component, and the housing is provided with retaining means for the spring element adapted in a manner so that no shear forces are produced in the longitudinal direction of the connection wires when the spring element is mounted.

Description

Die vorliegende Erfindung betrifft eine Anordnung zur Kontaktierung von mindestens einem in einem Gehäuse mit Anschlussdrähten montiertem elektronischen Bauelement, insbesondere einem Leistungshalbleiter, an einer Kühlfläche und einem im Gehäuse befestigbaren Federelement mit mindestens einem Federarm, der in einer Andruckposition des Federelements das Bauelement gegen die Kühlfläche drückt.The present invention relates to an arrangement for contacting at least one electronic component mounted in a housing with connecting wires, in particular a power semiconductor, on a cooling surface and a spring element fastened in the housing with at least one spring arm which presses the component against the cooling surface in a contact position of the spring element ,

Um die Kühlung von Leistungshalbleitern zu gewährleisten, werden diese in wärmeleitenden Kontakt zu einem Kühlkörper gesetzt. Dies wird in kostengünstigen Ausführungen meist mit Federn realisiert, die das Halbleiterbauelement an den Kühlkörper pressen.To ensure the cooling of power semiconductors, they are placed in heat-conducting contact with a heat sink. This is usually realized in inexpensive versions with springs that press the semiconductor device to the heat sink.

Eine solche Anordnung ist in der deutschen Gebrauchsmusterschrift G 92 13 671.0 beschrieben. Durch die Vormontage eines Haltefederelements in einem Gehäuseteil werden bei anschließendem Zusammensetzen der Gehäuseteile die zu kühlenden Bauelemente durch Federzungen der Haltefeder gegen eine Innenwand des Kühlkörpers gedrückt.Such an arrangement is in the German utility model G 92 13 671.0 described. By pre-assembly of a retaining spring element in a housing part, the components to be cooled are pressed by spring tongues of the retaining spring against an inner wall of the heat sink in subsequent assembly of the housing parts.

In ähnlicher Weise zeigen die US-Patentschrift 5,274,193 , die deutsche Offenlegungsschrift 36 12 862 A1 , die deutsche Patentschrift 195 43 260 C2 und die deutsche Gebrauchsmusterschrift DE 200 14 739 U1 Federelement, die zwischen Leistungshalbleitern und Gehäuse verklemmt werden. Unterschiedlich ist jeweils die Abstützung bzw. die Befestigung der Federelemente an dem Gehäuse. So kann beispielsweise das Federelement selbst durch Ausnehmungen und Stege des Gehäuses gehalten werden oder mittels zusätzlicher Befestigungselemente wie Schrauben oder Klemmschienen gehalten werden.Similarly, the show U.S. Patent 5,274,193 , the German publication 36 12 862 A1 , the German patent 195 43 260 C2 and the German Utility Model DE 200 14 739 U1 Spring element, which are jammed between power semiconductors and housing. The support or attachment of the spring elements to the housing is different in each case. For example, the spring element itself can be held by recesses and webs of the housing or held by means of additional fasteners such as screws or clamping rails.

Dem Stand der Technik gehören weiterhin Haltevorrichtungen an, die im Wesentlichen einen U- oder L-förmigen Federbügel aufweisen, der über eine Kühlkörperwandung und gleichzeitig über das Bauelement gesteckt ("geclipt") wird und auf diese Weise die Andruckkraft zwischen den Anlageflächen des Kühlkörpers und des Bauelements sicherstellt.The prior art further includes holding devices, which essentially comprise a U- or L-shaped spring clip which is (clipped ") over a Kühlkörperwandung and simultaneously over the component and in this way the pressing force between the contact surfaces of the heat sink and ensures the component.

Bei allen Vorrichtungen ohne zusätzliche Befestigungselemente, aus dem deutschen Gebrauchsmuster G 92 13 671.0 bekannt, tritt das Problem auf, dass das Bauteil und die Lötstelle durch Schubspannungen belastet werden. Dies kann zu einer Schädigung des Bauteils oder der Lötverbindung führen. Die Schubspannungen entstehen durch Kräfte, die beim Zusammenbau der Vorrichtung in einer Ebene parallel zur Kohlanlagefläche der Bauelemente bzw. des Kühlkörpers auf das Bauelement einwirken.In all devices without additional fasteners, known from German Utility Model G 92 13 671.0, the problem arises that the component and the solder joint are loaded by shear stresses. This can lead to damage to the component or the solder joint. The shear stresses are caused by forces acting on the component in a plane parallel to the Kohlanlagefläche of the components or the heat sink during assembly of the device.

In dem im US-Patent 5,274,193 offenbarten Gegenstand wirkt zwar keine Schubkraft auf die Bauelemente, die Fixierung der Haltefeder und das Erzeugen der Haltekraft des Federelements muss aber durch eine zusätzliche Klemmschiene bewerkstelligt werden.In the im U.S. Patent 5,274,193 Although disclosed object does not have a pushing force on the components, the fixation of the retaining spring and the generation of the holding force of the spring element but must be accomplished by an additional clamping rail.

Aus der US 5,909,358 ist eine gattungsgemäße Anordnung bekannt. Bei dieser bekannten Anordnung muss das Federelement beim Übergang in die Andruckposition eine Art Schwenkbewegung durchführen und zudem erfolgt die Montage des Federelements senkrecht zur Kühlfläche, so dass ein relativ großer Platzbedarf vor der Kühlfläche für das Einführen des Federelements erforderlich istFrom the US 5,909,358 is a generic arrangement known. In this known arrangement, the spring element must perform a kind of pivoting movement in the transition to the pressure position and also the assembly of the spring element is perpendicular to the cooling surface, so that a relatively large space requirement in front of the cooling surface for the insertion of the spring element is required

Eine entsprechende Montage erfolgt auch bei dem Federelement, wie es aus der DE 103 17182 A1 bekannt ist.An appropriate assembly is also at the spring element, as it is from the DE 103 17182 A1 is known.

Auch das aus der FR 2780456 bekannte Federelement wird senkrecht zur Kühlfläche montiert, so dass auch hier der vor der Kühlfläche erforderliche freie Montageraum vorhanden sein muss, um eine ordnungsgemäße Montage vornehmen zu können.Also from the FR 2780456 known spring element is mounted perpendicular to the cooling surface, so that here also the required before the cooling surface free mounting space must be present in order to make a proper installation can.

Der vorliegenden Erfindung liegt die Aufgabe zu Grunde, eine Anordnung der eingangs beschriebenen Art zu schaffen, die bei einfacher Montage keine Schubkräfte in Richtung oder Gegenrichtung der Anschlussdrähte für die elektrischen Bauelemente ausübt.The present invention is based on the object to provide an arrangement of the type described above, which exerts no shear forces in the direction or opposite direction of the connecting wires for the electrical components with simple installation.

Eine Anordnung gemäß dem Oberbegriff des Patentanspruchs 1 ist aus US 5,909,358 bekannt.An arrangement according to the preamble of claim 1 is made US 5,909,358 known.

Erfindungsgemäß wird die oben erwähnte Aufgabe dadurch erreicht, dass die Gehäusewandung in den an die als Kühlfläche wirkende seitlichen Wand angrenzenden Seitenwänden senkrecht nach unten auf den Boden zu verlaufende eingelassene Nutenpaare aufweist, die jeweils aus einer Einfügenut und einer Rastnut bestehen, wobei die Einfügenuten deart sind, dass das Federelement in axialer Richtung der Einfügenuten gegenüber dem Leistungshalbleiter berührungsfrei parallel zur Kühlfläche in einer Einfügeposition mittels seitlich an einem Trägerelement des Federelements abgewinkelter elastischer Ansätze einschiebbar ist, und die Rastnuten mit den Einfügenuten über derart angeformte Übergangsbereiche verbunden sind, dass das in der Einfügeposition befindliche Federelement mittels der Ansätze durch eine senkrecht zur Kühlfläche wirkenden Kraft in die Rastnuten in die Andruckposition rastend verschiebbar ist und die Rastnuten derart ausgebildet sind, dass das Federelement in der Andruckposition halten.According to the invention, the above-mentioned object is achieved in that the housing wall in the adjoining the side wall acting as a cooling surface side walls perpendicular to the bottom to running embedded pairs of grooves, each consisting of an insertion groove and a locking groove, wherein the Einfügenuten are deart . that the spring element in the axial direction of the insertion grooves against the power semiconductor contactlessly parallel to the cooling surface in an insertion position by means of laterally on a support member of the spring element angled elastic lugs is inserted, and the locking grooves are connected to the insertion grooves on such molded transition areas that the located in the insertion position Spring element by means of the lugs by a force acting perpendicular to the cooling surface in the locking grooves in the pressing position is latching displaced and the locking grooves are formed such that the spring element hold in the pressure position.

Die Rastnuten ermöglichen ein zweckmäßiges automatisches Einrasten des Federelements in vordefinierter Position. Eine aufwändige Ausrichtung des Federelements entfällt.The locking grooves allow a convenient automatic engagement of the spring element in a predefined position. A complex alignment of the spring element is eliminated.

Das Federelement ist von der ersten Montageposition durch eine Kraftwirkung senkrecht zur Kühlfläche in die Andruckposition verschiebbar, so dass bei diesem zweiten Montageschritt keine Schubkraft in Längsrichtung der Anschlussdrähte wirkt, statt dessen wird das Federelement aus der ersten Montageposition heraus durch rein senkrecht auf die Kühlfläche wirkende Kräfte in der Andruckposition fixiert.The spring element is displaceable from the first mounting position by a force perpendicular to the cooling surface in the pressing position, so that in this second assembly step no thrust force acts in the longitudinal direction of the connecting wires, instead, the spring element from the first mounting position by acting purely perpendicular to the cooling surface forces fixed in the pressure position.

In weiterer vorteilhafter Ausgestaltung besteht das Federelement aus parallel zueinander verlaufenden Federarmen, die senkrecht an einem Trägerelement befestigt sind, das die beiden seitlichen Ansätze des Federelements miteinander verbindet Diese Ausführung erlaubt es auf Grund der Steifigkeit hohe Anpresskräfte aufzubringen, wobei vorteilhafterweise nur ein Federelement für alle gleichförmig angeordneten Halbleiterbauelemente erforderlich ist.In a further advantageous embodiment, the spring element consists of mutually parallel spring arms, which are perpendicularly attached to a support member which connects the two lateral projections of the spring element with each other This embodiment allows due to the rigidity of applying high contact forces, advantageously only one spring element for all uniform arranged semiconductor devices is required.

Weitere zweckmäßige Ausgestaltungsmerkmale werden an Hand eines bevorzugten, in den Zeichnungen veranschaulichten Ausführungsbeispiels genau erläutert. Dabei zeigen:

Fig. 1
eine Vorderansicht eines erfindungsgemäßen Federelements,
Fig. 2
eine rückwärtige Ansicht des erfindungsgemäßen Federelements,
Fig. 3
das Federelement vor dem Einsatz in ein Elektronikgehäuse,
Fig. 4
das Federelement in einer ersten Montageposition,
Fig. 5
das Federelement in eingerasteter Andruckposition,
Fig. 6
Detailansicht des Federelements in der ersten Montageposition,
Fig. 7
Detailansicht des Federelements in eingerasteter Andruckposition.
Further expedient design features are explained in detail with reference to a preferred, illustrated in the drawings embodiment. Showing:
Fig. 1
a front view of a spring element according to the invention,
Fig. 2
a rear view of the spring element according to the invention,
Fig. 3
the spring element before use in an electronics housing,
Fig. 4
the spring element in a first mounting position,
Fig. 5
the spring element in latched pressure position,
Fig. 6
Detail view of the spring element in the first mounting position,
Fig. 7
Detail view of the spring element in latched pressure position.

Die Fig. 1 und 2 zeigen ein erfindungsgemäßes Federelement 2 wie es zum Einbau in ein Elektronikgehäuse 4 eines Elektromotors vorgesehen ist. Das Federelement 2 besteht aus einem Trägerelement 8, an dessen oberer Kante vorliegend z. B. sechs Federarme 10 angeformt sind und das seitlich zwei abgewinkelte Ansätze 12a, 12b aufweist. Die Ansätze 12a, 12b sind an ihrer oberen und unteren Kante mit rechtwinklig nach innen umgefalzten Laschen 13 ausgebildet, um ein Einknicken der Ansätze 12a, 12b zu verhindern. An der Ober- und Unterkante besitzt das Trägerelement ebenfalls etwa rechtwinklig umgefalzte schmale Abschnitte 14a, 14b, wobei der untere Abschnitt 14a zu der Seite weist, an der sich die Federarme 10 befinden und der obere Abschnitt 14b in die entgegengesetzte Richtung weist. Der obere Abschnitt 14b setzt sich in äquidistanten Abständen fort (Fig. 2) und bildet über die Oberkante des Trägerelements 8 nach unten in Richtung auf den Abschnitt 14 a gebogen die parallel zueinander verlaufenden Federarme 10. An ihrem unteren Ende besitzen die Federarme 10 einen nach außen konvex gekrümmten Kontaktbereich 16, der in Andruckposition des Federelements 2 gegen die Bauelemente 24 drückt. Unterhalb der Mitte des Trägerelements 8, gegenüberliegend der Kontaktbereiche 16, verläuft parallel zur Ober- und Unterkante des Trägerelements 8 eine zur Vorderseite hin gewölbte, halbkreisförmige Versteifungssicke 18, die ein Durchbiegen des Federelements 2 verhindert.The Fig. 1 and 2 show an inventive spring element 2 as provided for installation in an electronics housing 4 of an electric motor. The spring element 2 consists of a support member 8, at the upper edge present z. B. six spring arms 10 are formed and the side has two angled lugs 12 a, 12 b. The lugs 12a, 12b are formed at their upper and lower edges with folded at right angles inwardly tabs 13 to prevent buckling of the lugs 12a, 12b. Also, at the top and bottom edges, the support member has approximately right angle folded narrow portions 14a, 14b, the bottom portion 14a facing the side where the spring arms 10 are and the top portion 14b faces in the opposite direction. The upper section 14b continues at equidistant intervals ( Fig. 2 At its lower end, the spring arms 10 have a convex outwardly curved contact portion 16 which in Andruckposition of the spring element 2 against the Components 24 presses. Below the center of the support member 8, opposite the contact portions 16, parallel to the top and bottom edges of the support member 8 is a curved towards the front, semicircular stiffening bead 18, which prevents bending of the spring element 2.

Die Fig. 3 bis 7 zeigen eine mögliche Verwendungsvariante des erfindungsgemäßen Federelementes 2 in einem Elektronikgehäuse 4 eines Elektromotors 6. Auf ein Rotorgehäuse 7 des Elektromotors 6 ist das Elektronikgehäuse 4 aufgesetzt, das eine Leiterplatte 20 mit elektronischen Bauelementen 22 sowie weitere elektrische Verbindungselemente aufnimmt (Fig. 3). Das Elektronikgehäuse 4 besteht im Wesentlichen aus einer Umfangswandung, die von einer ebenen seitlichen Wand 26, die als Kühlfläche wirkt, daran angrenzenden Seitenwänden 32, 33 und einer der ebenen seitlichen Wand 26 gegenüberliegenden Wand 34 gebildet wird. An den Seitenwänden 32, 33 sowie an der gegenüberliegenden Wand 34 sind Halterungen 36 mit Bohrungen 37 zur Befestigung des Gehäuses angeformt. Das Elektronikgehäuse 4 kann mit einem nicht dargestellten Gehäusedeckel verschlossen werden, der in eine umlaufende Nut 38 an der Stirnseite der Seitenwände 26, 32, 33 und 34 eingreift. Der Gehäusedeckel ist an Haltevorsprüngen 40, die Bohrungen 41 aufweisen, befestigt. Auf dem Boden des Elektronikgehäuses 4 sitzt eine die elektronischen Bauelemente 22, 24 tragende Leiterplatte 20. Dabei sind Leistungshalbleiter 24 so auf der Leiterplatte 20 eingelötet, dass sie im Innern des Elektronikgehäuses 4 an einer ebenen seitlichen Wand 26 des Elektronikgehäuses 4 angeordnet werden können. Zwischen dem Leistungshalbleiter 24 und der ebenen Seitenwand 26 ist eine wärmeleitende elektrische Isolierschicht 28 eingefügt, um einen Wärmetransport zu der mit Kühlrippen 30 versehenen Seitenwand 26 zu ermöglichen und zu verbessern.The Fig. 3 to 7 show a possible use variant of the spring element 2 according to the invention in an electronics housing 4 of an electric motor 6. On a rotor housing 7 of the electric motor 6, the electronics housing 4 is placed, which receives a printed circuit board 20 with electronic components 22 and other electrical connecting elements ( Fig. 3 ). The electronics housing 4 consists essentially of a peripheral wall, which is formed by a flat side wall 26, which acts as a cooling surface, adjoining side walls 32, 33 and one of the planar side wall 26 opposite wall 34. To the Side walls 32, 33 and on the opposite wall 34 brackets 36 are formed with holes 37 for attachment of the housing. The electronics housing 4 can be closed with a housing cover, not shown, which engages in a circumferential groove 38 on the end face of the side walls 26, 32, 33 and 34. The housing cover is attached to holding projections 40, the holes 41, attached. On the bottom of the electronics housing 4 sits a electronic components 22, 24 supporting circuit board 20. Power semiconductors 24 are soldered to the circuit board 20 that they can be arranged in the interior of the electronics housing 4 on a flat side wall 26 of the electronics housing 4. Between the power semiconductor 24 and the planar side wall 26, a heat conductive electrical insulating layer 28 is inserted to allow and improve heat transfer to the side wall 26 provided with cooling fins 30.

In die an die ebene Seitenwand 26 angrenzenden Seitenwände 32 und 33 sind senkrecht nach unten verlaufende Nutpaare eingelassen, die die Funktion als Einfügenuten 44a, 44b und als Rastnuten 46a, 46b erfüllen. Die zwei Einfügenuten 44a, 44b befinden sich beiseitig der ebenen Seitenwand 26 in jeweils gleichem Abstand von dieser einander gegenüber in den Seitenwänden 32, 33. In diese Einfügenuten 44a, 44b wird das Federelement 2 axial entsprechend der Pfeilrichtung R in Fig. 3 eingeschoben und nimmt eine erste Montageposition (Einfügeposition) ein. Die an der Oberseite angebrachten Laschen 13 können dabei als Angriffsflächen für die per Hand aufgebrachten Einschubkräfte dienen. Neben dieser Funktion als Montagehilfe besitzt das obere Laschenpaar 13 noch eine zusätzliche Aufgabe: Wenn das *Federelement 2 in das Elektronikgehäuse 4 eingesetzt, aber noch nicht verrastet ist, lässt sich ein Gehäusedeckel nicht montieren, da am Gehäusedeckel angespritzte Zapfen dann auf den oberen Laschen 13 aufliegen und ein Schließen des Deckels verhindern würden. Ist die ordnungsgemäße Verrastung des Federelementes 2 durchgeführt, kann der Zapfen des Deckels in den frei gewordenen Raum eingreifen und der Deckel lässt sich aufsetzen. Man hat hierdurch eine Kontrolle, ob eine ordnungsgemäße Montage des Federelementes 2 durchgeführt wurde. Die Einfügeposition ist in Fig. 4 dargestellt. Eine Detailansicht der Lage des Federelements in dieser Einfügeposition zeigt Fig. 6. Man erkennt, dass der Ansatz 12a durch Anlage seines Endbereichs in der Einfügenut 44a fixiert ist. Bei dem Einschubvorgang kommen die Federarme 10 noch nicht mit den Leistungshalbleitern 24 in Berührung, üben somit keinerlei Schubkräfte auf das Bauteil 24 und dessen Lötstelle aus. Es verbleibt ein Luftspalt 45 zwischen den Federarmen 10 und den Leistungshalbleitern 24.In the adjacent to the flat side wall 26 side walls 32 and 33 are vertically inwardly extending groove pairs inserted, which fulfill the function as Einfügenuten 44a, 44b and as latching grooves 46a, 46b. The two Einsteckuten 44a, 44b are located on both sides of the planar side wall 26 in the same distance from each other in the side walls 32, 33th In these Einfügenuten 44a, 44b, the spring element 2 is axially corresponding to the direction of arrow R in Fig. 3 inserted and assumes a first mounting position (insertion position). The attached to the top tabs 13 can serve as attack surfaces for the manually applied insertion forces. In addition to this function as a mounting aid, the upper pair of tabs 13 has an additional task: If the * spring element 2 is inserted into the electronics housing 4, but not yet locked, a housing cover can not be mounted, as then molded on the housing cover pin on the upper tabs 13th rest and would prevent closure of the lid. If the proper locking of the spring element 2 is performed, the pin of the lid can engage in the vacant space and the lid can be put on. This has a check whether a proper assembly of the spring element 2 has been performed. The insertion position is in Fig. 4 shown. A detailed view of the position of the spring element in this insertion position shows Fig. 6 , It can be seen that the projection 12a is fixed by placing its end portion in the insertion groove 44a. In the insertion process, the spring arms 10 are not yet in contact with the power semiconductors 24, thus exerting no shear forces on the component 24 and its solder joint. It an air gap 45 remains between the spring arms 10 and the power semiconductors 24.

Das Rastnutpaar 46a, 46b schließt sich unmittelbar an die Einfügenuten 44a, 44b an und ist in gleicher Weise, aber mit geringerem Abstand zur ebenen Seitenwand 26 eingelassen. Der Übergangsbereich 48a, 48b zwischen Einfügenut 44a (44b) und Rastnut 46a (46b) ist derart ausgeformt, dass dessen Widerstand durch eine Krafteinwirkung F auf das Federelement 2 senkrecht zur Kühlfläche überwunden werden kann (Fig. 4). Dabei werden die elastischen seitlichen Ansätze 12a, 12b kurzzeitig bei der Vorschubbewegung in Richtung des Leistungshalbleiters 24 durch die Übergangsbereiche 48a, 48b zusammengedrückt, bevor sie in den Rastnuten 46a, 46b in der Andruckposition anliegen (Fig. 5).The latching groove pair 46a, 46b adjoins directly to the insertion grooves 44a, 44b and is recessed in the same way but at a smaller distance from the flat side wall 26. The transition region 48a, 48b between the insertion groove 44a (44b) and the latching groove 46a (46b) is formed in such a way that its resistance can be overcome by a force F acting on the spring element 2 perpendicular to the cooling surface ( Fig. 4 ). In this case, the elastic lateral projections 12a, 12b are briefly compressed during the advancing movement in the direction of the power semiconductor 24 by the transition regions 48a, 48b before they rest in the latching grooves 46a, 46b in the pressure position ( Fig. 5 ).

Eine Detailansicht der Lage des Federelements 2 an der Seitenwand 32 in Andruckposition zeigt Fig. 7. Der Endbereich des Ansatzes 12a fixiert mit seiner senkrecht verlaufenden Kante, die jetzt in die Rastnut 46a eingebettet ist, das Federelement 2. In dieser Andruckposition drücken nun die Federarme 10 auf die Leistungshalbleiter 24, die dadurch gegen die wärmeleitende Isolierschicht 28 und damit gegen die als Kühlfläche 27 ausgebildete Seitenwand 26 gepresst werden. Dadurch wird ohne Verwendung weiterer Verbindungselemente, wie Schrauben oder Klemmen, eine sichere Wärmeableitung gewährleistet. Das Bauteil 24 und die Lötstelle werden nicht durch Schubkräfte belastet.A detailed view of the position of the spring element 2 on the side wall 32 in the pressure position shows Fig. 7 , The end portion of the projection 12a fixed with its vertically extending edge, which is now embedded in the locking groove 46a, the spring element 2. In this pressure position now press the spring arms 10 on the power semiconductor 24, which thereby against the heat-conducting insulating layer 28 and thus against as Cooling surface 27 formed side wall 26 are pressed. This ensures safe heat dissipation without the use of other fasteners, such as screws or clamps. The component 24 and the solder joint are not loaded by shear forces.

Die Erfindung ist nicht auf die dargestellten und beschriebenen Ausführungsbeispiele beschränkt, sondern umfaßt auch alle im Sinne der Erfindung gleichwirkenden Ausführungen.The invention is not limited to the illustrated and described embodiments, but also includes all the same in the context of the invention embodiments.

Claims (8)

  1. An arrangement for the contacting of at least one electronic component (24), in particular a power semiconductor (24), against a cooling surface (26), consisting of a housing (4), on whose cooling surface (26) there is mounted the electronic component (24) by means of connecting wires, and a spring member (2), securable in the housing (4), with at least one spring arm (10) which, in a pressure position of the spring element (2), presses the component (24) against the cooling surface (26), and the spring element (2) is insertable into the housing (4) without touching the component (24) and the housing (4) is provided with holding means (46a, 46b) for the spring element (2) in such a manner that upon mounting of the spring element (2) there is no occurrence of transverse forces in the longitudinal direction of the connecting wires, characterised in that the housing wall has let-in groove pairs, running perpendicularly downwards toward the base, in the side walls (32, 33) adjoining the lateral wall (26) acting as a cooling surface, which groove pairs each consist of an insertion groove (44a, 44b) and a locking groove (46a, 46b), wherein the insertion grooves (44a, 44b) are such that the spring element (2) can, by means of resilient extensions (12a, 12b) laterally bent at an angle on a bearer element of the spring element, in an insertion position be inserted in the axial direction (R) of the insertion grooves, in a contact-free manner with respect to the power semiconductor (24), parallel to the cooling surface (26), and the locking grooves (46a, 46b) are connected to the insertion grooves (44a, 44b) via transition regions (48a, 48b) formed in such a manner that the spring element (2) located in the insertion position is, through a force (F) acting perpendicular to the cooling surface (26), displaceable in a locking manner into the locking grooves (46a, 46b) into the pressure position by means of the extensions (12a, 12b), and the locking grooves (46a, 46b) are such that they hold the spring element (2) in the pressure position.
  2. An arrangement according to claim 1, characterised in that a plurality of springs arms (10) are secured, so as to run parallel to one another, to the edge, remote from the printed circuit board in the mounted state, of the bearer element (8).
  3. An arrangement according to one of claims 1 to 2, characterised in that the bearer element (8) has a stiffening depression (18) running between both lateral extensions (12a, 12b).
  4. An arrangement according to any one of claims 1 to 3, characterised in that the bearer element (8) has, on its long sides, portions (14a, 14b) which are folded over at a right angle.
  5. An arrangement according to any one of claims 1 to 4, characterised in that the lateral extensions (12a, 12b) of the spring element (2) have flaps (13) formed thereon at a right angle.
  6. An arrangement according to any one of claims 1 to 5, characterised in that one spring element (2) presses against a plurality of components (24) arranged in a row and with the same orientation.
  7. An arrangement according to any one of claims 1 to 6, characterised in that the lateral wall (26) in the form of a cooling surface (26) has a plane-parallel contact surface directed into the housing interior and is provided with cooling ribs (30)at its exterior.
  8. An arrangement according to any one of claims 1 to 6, characterised in that a heat-conducting insulating layer (28) is fitted between the cooling surface (26) and the component (24).
EP07727781A 2006-04-20 2007-04-04 Arrangement for contacting power semiconductors to a cooling surface Active EP2010500B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006018716A DE102006018716A1 (en) 2006-04-20 2006-04-20 Arrangement for contacting power semiconductors on a cooling surface
PCT/EP2007/053310 WO2007122084A1 (en) 2006-04-20 2007-04-04 Layout of power semiconductor contacts on a cooling surface

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EP2010500A1 EP2010500A1 (en) 2009-01-07
EP2010500B1 true EP2010500B1 (en) 2011-06-08

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EP (1) EP2010500B1 (en)
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AT (1) ATE512461T1 (en)
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WO (1) WO2007122084A1 (en)

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US8905063B2 (en) 2011-12-15 2014-12-09 Honeywell International Inc. Gas valve with fuel rate monitor
US8947242B2 (en) 2011-12-15 2015-02-03 Honeywell International Inc. Gas valve with valve leakage test
US9074770B2 (en) 2011-12-15 2015-07-07 Honeywell International Inc. Gas valve with electronic valve proving system
US8899264B2 (en) 2011-12-15 2014-12-02 Honeywell International Inc. Gas valve with electronic proof of closure system
US10851993B2 (en) 2011-12-15 2020-12-01 Honeywell International Inc. Gas valve with overpressure diagnostics
US8839815B2 (en) 2011-12-15 2014-09-23 Honeywell International Inc. Gas valve with electronic cycle counter
US9995486B2 (en) 2011-12-15 2018-06-12 Honeywell International Inc. Gas valve with high/low gas pressure detection
US9234661B2 (en) 2012-09-15 2016-01-12 Honeywell International Inc. Burner control system
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US10564062B2 (en) 2016-10-19 2020-02-18 Honeywell International Inc. Human-machine interface for gas valve
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Also Published As

Publication number Publication date
ATE512461T1 (en) 2011-06-15
US20090239424A1 (en) 2009-09-24
CN101421246B (en) 2011-07-06
EP2010500A1 (en) 2009-01-07
WO2007122084A1 (en) 2007-11-01
CN101421246A (en) 2009-04-29
DE102006018716A1 (en) 2007-10-25
US7845994B2 (en) 2010-12-07

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