EP1865094B1 - Apparatus for electrochemical deposition on surfaces and electrochemical system - Google Patents

Abstract

The position of the return roller (5) between two adjacent contact rollers (2) can be varied. This varies the returned length of substrate between the two contact rollers. Variation is carried out in accordance with extension of the starter layer to be coated. Return roller position is varied by an electrical- or mechanical actuator. The electrolyte (3) is replenished from an anode basket (11) filled with metal bodies. The basket is height-adjustable in the electroplating bath (4). The contact rollers carry the substrate through the electroplating bath. Each has a speed-controlled drive with timing belt transmission. The contact rollers are ground to a barrel-profile, to retain the substrate in a central position during transport. The return roller has an airturn, i.e. a non-contacting pneumatic levitation device. The electroplating bath includes an overflow. On the side of the contact rollers which first touches the substrate leaving the bath, a wiper (8) is provided. On the opposite side there is a scraper (10) removing adherent electrolyte from the roller. Slip rings on both sides of the contact rollers supply electrical current. A potential divider, or segmented contact rollers with suitable voltage supply, ensure uniform voltage distribution. The return roller is carried in glass ball bearings. Spacer units intervene between the contact roller bearing housings and the bath sidewalls. A flap in the bath permits anode basket replacement. Outside the bath, there is an electrolyte replenishment system. The substrate is supplied from a feeder and is taken up on leaving. The electroplating unit (1) has a preliminary electrolyte bath ahead of it. Between two or more electroplating baths, an instrument measures the starter layer thickness and/or variation in its resistance. Individual electroplating units can be taken off line from the electroplating system, to carry out maintenance work. A cleaning and/or inerting module is included.

Description

The present invention relates to a device for the electrodeposition of an electrically conductive layer on a carrier, to which a starter layer suitable for electroplating is arranged at least in regions, with a galvanic bath in which an electrolyte for the deposition of conductive material is provided, with at least two contacting rollers. which are arranged outside the electroplating bath and which can be switched as cathodes and / or anodes, and with at least one deflection roller, which is interposed between the contacting rollers.

Devices for the electrodeposition of an electrically conductive layer on a carrier are generally known.

Such galvanizing or electroplating systems are often used for the production of conductor structures or full-surface conductor layers. For example, antenna coils, printed circuit boards, smart card modules or heating foils for use in the automotive industry, for example, for heating exterior mirrors or rear windows or ribbon cables and the like are manufactured with such devices.

In one application example, for this purpose, a metal cylinder connected continuously as a cathode is at least partially immersed in an electrolyte bath and set in rotation. In the electrolyte bath is an anode assembly. At the slowly rotating cathode, a metal layer is deposited, which is laminated outside of the electrolyte on a film by the metal foil is peeled off from the cathode. After the metal layer has been laminated, a resist is applied, which is then photolithographically exposed. A subsequent etching step etches away those regions of the full-area metal layer that are not needed for a conductor patterning. After removal of the remaining on the patterned metal layer Ätzreistlackes the desired conductor pattern is completed.

This method, on the one hand, has the disadvantage that only low throughput rates can be achieved and high material costs and disposal costs are generated due to the use of toxic and expensive chemicals and unused raw materials due to the subtractive process. On the other hand, the thickness of the metal layer is limited by the necessary further processing due to otherwise possible cracking in the layer to a minimum thickness of 17 microns. However, since a layer thickness of approximately 2 .mu.m, for example, is desirable in the high-frequency range, the method described above can not be used for such an application.

Another disadvantage is that must be done at regular intervals anodic or mechanical cleaning of the cylindrical cathode, which the production and Throughput times further reduced. In addition, only one side of a metal layer can be deposited on the carrier substrate.

Another method is disclosed in the publication DE 102 347 05 described in which the material to be plated is contacted directly in the active electroplating bath by a circulating, for continuous cleaning alternately cathodic / anodic collector roller. However, the collector roller required for this purpose is very expensive to manufacture and very large, since individual conductive areas must be separated from one another by insulating areas.

The size and cost of the contacting rollers allows only a small number of devices connected in series and therefore limits the possible production speed.

A complete cleaning is not possible in the Umpolphase the segments. Therefore, discontinuously with a cleaning fleece must be repeatedly cleaned, which interrupts the production, which can lead to longer processing times and contamination of the electrolyte.

A patent application filed on behalf of the Applicant has not yet published a contacting unit which can be switched as a cathode and / or anode and is surrounded by an insulating housing. In the insulating housing, an opening is formed to provide contact between the contacting unit and the substrate to be coated. The contacting of the carrier material takes place within a galvanic bath in the region of the opening. The remaining part of the contacting unit is largely shielded from the electrolyte in the electroplating bath by means of the insulating housing, so that deposition of the anode material in this area should be largely prevented. Since the contacting rollers in this arrangement continuously with the electrolyte in Despite small gaps in the region of the opening in the housing, deposits of electrolyte on the contacting rollers are the result. This can adversely affect a uniform coating of the substrate to be coated, for example by the formation of grooves in the printed conductors or by uneven deposition of the metal ions , Due to this problem, a stable process management can not be guaranteed, especially over a longer period.

The Applicant has therefore changed the arrangement or process management to the effect that the housing of the contacting rollers were pressurized with compressed air to allow only a minimal electrolyte entry into the housing or to blow out electrolyte.

Furthermore, the opening in the housing was reduced, with the result that the housing was now more susceptible to wear due to contamination, as well as that with the polyethylene rollers used a secure contacting of the carrier material could no longer be guaranteed.

The polyethylene counterpressure rollers provided in the original design were replaced by foam rubber rollers which, due to their deformability, further sealed the open contact nip against electrolyte. Nevertheless, even small hard impurities (copper flakes) led after some time to grooves on the tracks, when the necessary material web tension was applied.

The contacting rollers were therefore arranged so that the web followed a certain arc run to ensure a safer contact even at low web tension can.

An umpolung of a contacting roller, which was then turned out of the way during the running process, extended the time until the complete Cleaning the system.

With all these design improvements, the process could be maintained for a long time, but then all contacting rollers had to be reversed and mechanically cleaned over a web-like cleaning fleece for a long time.

Although a stable process control was achieved, but there was still the danger that formed by permanently formed in the contact zones solid impurities (copper particles) grooves on the tracks or on the contacting rollers deposited copper on the housings and it so uncontrolled zone-wise Aufkupfern came. Then the process had to be stopped unplanned.

The invention is therefore based on the object to provide a device for the electrodeposition of an electrically conductive layer to a carrier, which allows a reliable, fast and simple and cost-effective production of an electrically conductive layer on a support with the smoothest possible surface.

This object is achieved with the features of claims 1 and 16. Advantageous embodiments will be apparent from the dependent claims.

In the device according to the invention for the electro-deposition of an electrically conductive layer, the position of the deflection roller located therein between two outside of the electroplating symmetrically arranged contacting rollers is variable such that on the change of position of the guide roller a distance traveled by the carrier material distance between two contact points of two adjacent Contact rollers is formed, corresponds to the expansion of the starter layer to be coated.

By varying the position of the deflection roller ensures that the areas to be coated of the carrier between the contacting rollers can be almost constantly supplied with electric current and at the same time supplying electrical power contacting units can be arranged outside the electroplating and thus no or only a small Experience contact with the electrolyte. The deflection rollers direct the material web according to their geometric design in the electrolyte bath. The starter layer to be coated is applied to the contacting rollers with a voltage between 0.5 and 5 V depending on the desired and achievable coating thickness.

A particularly stable and easily controllable process results when the change in the position of the deflection rollers in the device takes place electrically and / or mechanically via an actuator. Thus, the position of the deflection rollers can also be adapted to possibly different expansions in the longitudinal or conveying direction of the areas to be coated on the support during the ongoing process.

The electrolyte can be supplied via anode baskets filled with metal bodies, which are arranged in particular vertically adjustable in the electroplating bath in order to be variable in accordance with the geometrical design of the carrier and thus the change in the position of the deflecting rollers.

The movement of the carrier through the electroplating can be done by means of contacting rollers themselves, which are each driven, for example, with a speed-controlled drive unit, in particular via gears and / or a toothed belt. Other drive systems known in the art are also conceivable. The traction adjustment of the material webs can be ensured by a speed-controlled drive unit in the device, wherein a superimposed setpoint sequence control is provided between individual devices in order to set web tension between the Coating modules to change the web speed of the entire system can.

It is advantageous if the motor gear units driving the contact rollers are arranged on the individual devices such that they remain connected to the latter during a possible disassembly of a device, for example for maintenance purposes, or are so easy to separate that no additional assembly or disassembly steps are required ,

The contacting rollers can be formed in one embodiment of the present invention by a positive cambered ground roller which holds the carrier in the central position. In order to ensure that the carrier is steered centrally through the device, additionally or instead a path control system may be provided.

In order to ensure a gentle transport of, for example, scratch and / or zugempfindlichem material, in one embodiment of the present invention, the pulleys are designed as Airturn, that is, as a pressurizable with compressed air provided with Ausblasbohrungen, fixed pipe, wherein by the at the Ausblasbohrungen exiting air a non-contact deflection of the support is made possible around the tube.

In one exemplary embodiment, an overflow or a weir, in particular in the form of oblong hole bores, is formed in the electroplating bath in order to keep the level of the electrolyte bath constant during pumped-in inflowing electrolyte during the electroplating process.

In order to be able to protect the contacting rollers from electrolyte possibly entrained by the carrier, in one exemplary embodiment, on one side of the contacting roller, at which the carrier emerging from the electroplating bath first comes into contact, Scraper provided. In addition, the contacting rollers can be protected from below by plastic carriers against exposure to electrolyte fluid. If the contacting rollers are completely above the electrolyte level, the web is guided over at least one deflection roller around the contacting roller to the lowest vertex (6 o'clock position), and then first immersed in the electrolyte.

In the event that impurities nevertheless deposit on the contacting roller, a scraper is provided for scraping off the electrolyte material deposited on the contacting roller in a further exemplary embodiment, on one side of the contacting rollers, in particular on the carrier entering the electroplating bath , When a metal scraper is used, the scraper abrasion can then be conducted into the electrolyte or anode baskets and dissolve again there.

To return possibly entrained electrolyte in the galvanizing, a gutter may be formed below the contacting roller, which directs the electrolyte in a collecting trough or in the electroplating bath.

The voltage supply to the contacting rollers can be done on both sides with slip rings. For a homogeneous distribution of the voltage and to prevent a voltage drop across the contacting roller width, which could lead to different Ankupfern on the carrier, especially with larger machine width, a voltage distributor may be provided on the contacting rollers. This can be installed, for example, in the arranged below the contacting roller plastic carrier.

Important is a precise leveling of the device, since the level of the electrolyte must be only a few millimeters below the edge of the plastic carrier. Only by the smallest possible distance of the electrolyte level to the contact roller can a maximum time of the power supply are held for the copper-plating on the carrier layer and can be coated in the direction very short objects.

Since the deflection roller is partly completely immersed in the electrolyte, it is expedient to store the deflection roller in bearings suitable for galvanizing, such as glass ball bearings. The contacting rollers, however, are stored outside the electrolyte and can therefore be provided with conventional bearings.

In order to prevent these storage come into contact with electrolyte, for example, should leaks at the shaft passages should occur, in one embodiment, in the bearing housings distance units provided to the side walls of the electroplating bath, can drip in the entrained electrolyte, before he in the field of Bearing the contacting rollers can penetrate. This has the advantage that very low-cost standard bearings can be used. On the other hand disassembly is possible in a very simple way due to the better accessibility.

In a further embodiment of the present invention, at least one closure flap is provided in the wall of the electroplating bath, which allows a particularly simple insertion or repositioning of the anode baskets below the contacting rollers.

Furthermore, an additional ion accumulation of the electrolyte can be provided outside of the electroplating bath, so that the anode baskets can be made smaller, as a result of which the dimensions of the device and thus of the entire system can be considerably reduced. The anode baskets may be filled with copper balls, for example. However, any other material suitable for electroplating may be inserted into the anode baskets.

An electroplating system according to the invention consists of at least one device for electrodeposition of an electrically conductive layer and of a feed device, for example in the form of a material web unwinding unit, via which the carrier is fed and at least one pick-up device, for example in the form of a material web rewind, which subsequently picks up the carrier.

In one embodiment, the electroplating system of the device is preceded by an electrolyte pre-bath. This serves for a first metallization of the conductive layer printed on the carriers, without providing an electric current supply in the electrolyte bath. The starter layer printed, for example, with iron carbonyl color or another suitable material metallizes about 1-2 μm during the passage through the defined electrolyte bath. As a result, the sensitive printing ink consisting of poorly adhering spherical pigments is covered with a thin metal layer, so that the mechanical abrasion of the particles or pigments in the first subsequent processes is avoided or at least reduced.

In order to be able to control the progress of the metal deposition, at least one measuring unit, for example for the thickness measurement and / or resistance measurement of the structures to be produced, can be arranged between every two devices in the system. Of course, it is also possible to provide other measuring devices suitable for process control and control, for example for determining the surface roughness or the like in this area.

The devices are connected in series in one embodiment of the electroplating system, wherein the devices can be removed individually from the system for maintenance, repair or retrofitting work simply from the electroplating system, without requiring the carrier removed or the coating process must be stopped. It only need the pulleys in the Be moved area of the devices to be removed upwards, so that the carrier rests only on the side of the guide rollers arranged guide rollers and the actual coating process can be continued continuously. The devices can be arranged, for example, in frame structures such that they can be pulled out laterally for maintenance. In order to be able to operate the system continuously despite possible maintenance work, additional devices may be provided in one exemplary embodiment according to the invention.

If a device is to be reused after the maintenance, it is simply pushed back into its old position in the system and the pulleys are moved back into the position adapted to the web length. Thus, the devices can be used without the web being re-introduced or the coating process having to be interrupted.

In a further embodiment, a cleaning and / or inerting module is further provided in the electroplating system, which includes a bath with distilled water for purification and / or a citric acid-containing inerting.

The number of devices in a plating system depends on the desired web speed and the necessary degree of coppering. Thus, degrees of coppering between 1 .mu.m and 100 .mu.m, preferably 5 .mu.m to 40 .mu.m, more preferably 3 microns to 20 microns may be desired. To achieve a degree of coupling, depending on the conveying speed of the carrier, for example, 30 to 40 devices may be required. These can either be arranged side by side or else one above the other, for example in four columns with ten modules each. Due to the flexible possibility of arranging the devices, the machine can be adapted relatively flexibly to the space available for production, despite the large number of devices.

The arrangement of the contacting rollers should preferably always be symmetrical. As a result, even very short structures can be uniformly coated. If the distance between the electrolyte level and the contact point of the carrier with the contacting roller is too large, the level of the electroplating bath can be raised, for example, by increasing the overflow. However, this leads to a reduced production speed, since a stronger wetting of the contacting rollers with electrolyte can be the result, whereby there is a risk that the contacting rollers are added more quickly to the material present in the electrolyte.

It may be expedient for longer extensions of the starter layer, for example, to provide in each case two or even more deflection rollers between the contacting rollers in order to ensure the most homogeneous possible transport of the carrier.

With the electroplating system according to the invention, it is possible to metallize material webs printed on one side as well as on both sides, for example by targeted punching of the material webs, as a result of which the material side which does not touch the contacting roll can also be reached by the corresponding through-contacting. Especially in this case, it is expedient to pass the material web through an electrolyte pre-bath before the actual electroplating process, in order to achieve a first metallization, which makes it possible for the structures not directly in contact with the contacting rolls to be on the side of the side facing away from the contacting rolls Carrier is applied accordingly with a voltage. The material web is guided in the through-contacted structure with the printed side stronger to the contacting rollers directed through the device.

The particular web-shaped carrier used must be wet-strength and sufficiently resistant to tension. The material of the carrier is preferably made of plastic such as PP, PET, PU, acrylate or similar. The use of nonwovens or wet-strength paper is also possible thanks to a special material guide.

With regard to further advantageous embodiments and modifications of the invention, reference is made to the dependent claims and the following description of an embodiment with reference to the accompanying drawings.

Figur 1

eine schematische Darstellung einer erfindungsgemäßen Vorrichtung;

Figur 2

einen Querschnitt durch ein Modul eines erfindungsgemäßen Galvanisierungssystems; und

Figur 3

einen erfindungsgemäßen Träger mit einer aufgedruckten Starterschicht in Form einer Antennenstruktur.

In the drawing shows:

FIG. 1

a schematic representation of a device according to the invention;

FIG. 2

a cross section through a module of a Galvanisierungssystems invention; and

FIG. 3

a carrier according to the invention with a printed starter layer in the form of an antenna structure.

The FIG. 1 shows three inventive devices 1 for depositing a conductive layer with four contacting rollers 2, which are arranged laterally outside of three each filled with an electrolyte 3 electroplating baths 4 symmetrically.

Between two contacting rollers 2, a guide roller 5 is arranged in each case, which is height-adjustable via a servo motor, not shown. A carrier 6 to be contacted and coated is in the form of an endless foil and is formed as indicated by arrows in FIG FIG. 1 characterized by the contacting rollers 2 and guide rollers 5 guided by the individual devices 1. As a result of the set position of the deflecting rollers 5, the carrier 6 thereby passes through the electrolyte 3 in the electroplating baths 4. The carrier 6 is partially provided with a so-called starter layer 7, for example made of nonconductive material Iron carbonyl particles printed (see also FIG. 3 ), which forms, for example, an antenna structure. Only when the starter layer 7 is acted upon by a current from the contacting roller 2, the particles of the starter layer 7 on the carrier 6 become conductive.

In order to be able to protect the contacting rollers 2 from electrolyte 3 entrained optionally by the carrier 6, scrapers 8 are provided on one side of the contacting rollers 2, at which the carrier 6 emerging from the electroplating bath 4 first comes to rest. In addition, the contacting rollers 2 can be protected from below by plastic carrier 9 against exposure to electrolyte 3.

In the event that unintentionally deposit anode material or impurities on the contacting rollers 2, a scraper 10 for scraping off the contacting rollers 2 is located on one side of the contacting rollers 2, at which the carrier 6 entering the electroplating bath 4 comes to rest deposited anode material provided. The abrasion of the scraper 10 is passed into anode baskets 11 and then dissolved again.

To return possibly entrained electrolyte 3 in the galvanization, a non-illustrated gutter below the contacting rollers 2 is formed, which directs the electrolyte 3 in a collecting tray or in the electroplating 4.

The FIG. 2 shows a cross section through a galvanization module 12, which includes 16 devices 1. In this module 12, the guide rollers 5 are fixed to a frame construction 13. By moving the frame structure 13, it is possible to adjust the deflection rollers 5 synchronously in height and thus to set the distance that the carrier 6 is guided by the galvanic baths 4 and to adapt it optimally to the expansions of the starter layer 7 on the carrier 6. About knurled screws 14, it is possible, the positions of the guide rollers 5 to each other Fine adjustment to undergo. Guide rollers, which are not shown in more detail, ensure that the method is as uniform as possible in the vertical direction and prevent tilting of the deflection rollers 5 or the frame construction 13.

An electroplating system according to the invention is composed of 30 to 40 such plating modules 12, which can be arranged both one behind the other and one above the other and thus can be set up to the available space available.

For coating the starter layer 7 on the carrier 6 with a conductive material, the carrier 6 is first passed from a material processing unit via a punching unit, not shown, for the purpose of selective punching of the carrier 6 for coating the carrier 6 on both sides in an electrolyte bath. In the electrolyte prebath, the starter layer 7 printed on the support 6, which is formed for example by a printed iron carbonyl color, is metallized in the defined electrolyte bath to about 1 to 2 μm. As a result of this metallization, the sensitive, often poorly adhering, starter layer 7 consisting of spherical iron carbonyl pigments is secured against mechanical abrasion of the iron particles in the first subsequent processes. Subsequently, the carrier 6 of a series of series-connected modules 12 according to the FIG. 2 fed.

If the contacting rollers 2 are acted upon cathodically by a power supply, not shown, the surface of the carrier 12 passing through the modules 12 is charged such that anode material located in the electrolyte 3 attaches to the starter layer 7 of the carrier 6, so that a conductive, highly homogeneous Copper layer on the starter layer 7 of the carrier 6 attaches. At the same time, further metal ions pass from the anode baskets into the electrolyte 3. About an unillustrated additional Supply module, the concentration of metal ions contained in the electrolyte 3 can be controlled.

In the case that the carrier 6 is printed on two sides, it is passed through the modules 12 with the printed side on the contacting rollers 2. The guide rollers 5 guide the carrier 6 through the electrolyte in the electroplating bath 4. The now conductive starter layer 7 takes on the contacting rollers 2 to the voltage. The DC voltage is applied negatively from about 0.5 to 5V depending on the desired and possible metallization thickness. In this case, currents flow to over 50 A per device unit 1. The carrier 6 is then immersed in the example enriched with copper ions electrolyte 3 and there are correspondingly more located in the electrolyte solution ions to the already aufkupferten layer on. Due to the targeted punching of the carrier 6, the carrier side facing away from the contacting roller 2 can be metallized on a carrier 6 printed on both sides.

Since the arrangement of the contacting rollers 2 is always symmetrical, even very short printed objects / starting layers 7 can be uniformly coated. The small web length between the contacting rollers 2 allows for longer extensions of the starter layers 7 in the longitudinal or conveying direction a constant application of an electrical DC voltage. It may be expedient for longer extensions of the starter layer 7, for example, to provide in each case two deflection rollers 5 between the contacting rollers 2 in order to ensure the most homogeneous possible transport of the carrier 6. For shorter objects, the current flow may be briefly interrupted. By adjusting the position of the guide rollers 5 between two contacting rollers 2, an adjustment of the web length of the starter layer 7 on the support 6 in the electrolyte 3 is possible. By changing the position of the guide rollers 5 between two contacting rollers 2, a distance to be traveled by the carrier 6 in the electroplating bath 4, which is formed between two contact points of two adjacent contacting rollers 2, to the Extension of the coated starter layer 7 can be adjusted. By extension, the dimensions of the starter layer 7 are meant in this application, in particular in the longitudinal direction or the conveying direction of the material web 6 to be conveyed.

During the promotion of the carrier 6, the carrier 6 is guided strongly supported. As a result, even very thin or against web tension sensitive material can be processed. In one embodiment, not shown, a cleaning and inerting module is interposed in the system. This consists of a bath of distilled water for purification and a citric acid-containing inerting bath.

Finally, the support 6, which has already been coated with the necessary layer thickness, is fed to a material web winding unit via a drying unit (not shown with the finished structures).

The FIG. 3 shows a carrier 6 according to the invention, which is provided with a starter layer 7 in the form of an antenna. The carrier 6 is provided for generating copper layers 14 on both the top and on the bottom with slots 15 which form a so-called via during printing of the carrier with a starter layer 7. Above the starter layer 7, a galvanically deposited copper layer 14 is formed in each case.

Claims (20)

1. An apparatus (1) for galvanically depositing an electrically conductive layer onto a carrier (6) on which at least partially a starter layer (7) is disposed suitable for electroplating comprising an electroplating bath (4) in which an electrolyte (3) for depositing conductive material is provided, with at least two contact rollers (2) which are disposed outside of the electroplating bath (4), and which can be connected as cathodes and/or anodes, and at least one deflection roller (5) which is positioned between the contact rollers (2),
   characterised in that
   the position of the deflection roller (5) between two contact rollers (2) is changeable such that by changing the position of the deflection roller (5) a distance to be covered by the carrier (6) and which is formed between two contact points of two adjacent contact rollers (2) corresponds to an extension of the starter layer (7) to be coated.
2. The apparatus (1) according to Claim 1, characterised in that the position of the deflection roller (5) is changed electrically and/or mechanically by means of an actuator.
3. The apparatus (1) according to Claim 1 or 2, characterised in that the electrolyte (3) is supplied by means of anode baskets (11) filled with metal elements which are disposed in the electroplating bath (4) in particular such as to be height adjustable.
4. The apparatus (1) according to any of the preceding claims, characterised in that the carrier (6) is conveyed through the electroplating bath (4) by means of the contact rollers (2) which can respectively be driven by a speed-regulated drive unit, in particular by means of a toothed belt.
5. The apparatus (1) according to any of the preceding claims, characterised in that the contact rollers (2) are polished with a positive curve, by means of which they hold the carrier (6) in the central position when being conveyed.
6. The apparatus (1) according to any of the preceding claims, characterised in that the deflection roller (5) is provided with an Airturn.
7. The apparatus (1) according to any of the preceding claims, characterised in that an overflow is formed in the electroplating bath (4).
8. The apparatus (1) according to any of the preceding claims, characterised in that on one side of the contact rollers, in particular at which the carrier passing out of the electroplating bath (4) first comes to rest, a wiper (8) is provided.
9. The apparatus (1) according to any of the preceding claims, characterised in that on one side of the contact rollers (2), in particular at which the carrier passing into the electroplating bath (4) last comes to rest, a scraper (10) is provided for scraping away the electrolyte (3) deposited on the contact rollers (2).
10. The apparatus (1) according to any of the preceding claims, characterised in that the voltage is supplied to both sides of the contact rollers (2) by means of collector rings.
11. The apparatus (1) according to any of the preceding claims, characterised in that for homogeneous distribution of the voltage a voltage distributor or segmented contact rollers with a corresponding power supply are provided.
12. The apparatus (1) according to any of the preceding claims, characterised in that the deflection roller (5) is mounted with glass ball bearings.
13. The apparatus (1) according to any of the preceding claims, characterised in that spacer units are provided between the bearing housings of the bearings of the contact rollers (2) and the side walls of the electroplating bath (4).
14. The apparatus (1) according to any of the preceding claims, characterised in that a flap is formed in the electroplating bath (4) by means of which the anode baskets (11) can be changed.
15. The apparatus (1) according to any of the preceding claims, characterised in that external electrolyte enrichment is provided outside of the electroplating bath (4).
16. An electroplating system with at least one apparatus (1) according to any of Claims 1 to 15, with at least one conveyance apparatus which conveys the carrier (6), and at least one receiving apparatus which receives the carrier (6).
17. The electroplating system according to Claim 16, characterised in that a preliminary electrolyte bath is connected upstream of the at least one apparatus (1).
18. The electroplating system according to either of Claims 16 or 17, characterised in that at least one measuring unit for measuring the thickness and/or the resistance of the layer thicknesses of the starter layer (7) is disposed between at least two apparatuses (1).
19. The electroplating system according to any of Claims 16 to 18, characterised in that the apparatuses (1) can be individually removed from the electroplating system for maintenance work.
20. The electroplating system according to any of Claims 16 to 19, characterised in that it has a cleansing and/or an inertisation module.

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