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EP1810226A1 - Device comprising a non-detachable electronic module - Google Patents

Device comprising a non-detachable electronic module

Info

Publication number
EP1810226A1
EP1810226A1 EP05808175A EP05808175A EP1810226A1 EP 1810226 A1 EP1810226 A1 EP 1810226A1 EP 05808175 A EP05808175 A EP 05808175A EP 05808175 A EP05808175 A EP 05808175A EP 1810226 A1 EP1810226 A1 EP 1810226A1
Authority
EP
European Patent Office
Prior art keywords
metallization
chip
film
module
primer layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05808175A
Other languages
German (de)
French (fr)
Inventor
Stéphane OTTOBON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales DIS France SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Publication of EP1810226A1 publication Critical patent/EP1810226A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/30—Payment architectures, schemes or protocols characterised by the use of specific devices or networks
    • G06Q20/34—Payment architectures, schemes or protocols characterised by the use of specific devices or networks using cards, e.g. integrated circuit [IC] cards or magnetic cards
    • G06Q20/341—Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/0806—Details of the card
    • G07F7/0813—Specific details related to card security
    • G07F7/082—Features insuring the integrity of the data on or in the card
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/10—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means together with a coded signal, e.g. in the form of personal identification information, like personal identification number [PIN] or biometric data
    • G07F7/1008—Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system

Definitions

  • This invention relates to a device comprising an electronic module that can not be dismantled from a support without destroying it and the associated module.
  • an electronic device comprising a module stuck on a support body by means of an adhesive; the module comprises a support film having a first metallization on an upper face and on a lower face an integrated circuit chip connected to the first metallization through the film.
  • Disassembly of the micromodule is already made impossible without destruction of it by other techniques such as structural bonding or also by mechanical inking of the chip in a resin secured to the cavity bottom of a plastic card body.
  • the chip remains glued to the bottom of the cavity being disconnected from the contact pads and disengaged from the dielectric support film.
  • the object of the invention is to propose a device comprising an electronic module on a support and which is provided with an effective anti-tear function regardless of the nature of the support.
  • the subject of the invention is an electronic device of the above type which is distinguished in that it comprises a separation primer layer placed between the lower face of the film and the chip and in that the layer adheres more to the adhesive layer than to the film.
  • the invention also relates to two types of electronic modules comprising a support film having a first metallization on an upper face and on a lower face an integrated circuit chip connected to the first metallization through the film.
  • the first is distinguished by including a nonmetallic primer layer disposed between the underside and the chip.
  • the second is distinguished in that the separating primer layer disposed between the lower face and the chip has a peel strength of between about 1 and 5 N / cm whether it is metallic or not.
  • the invention is applicable to printed circuits.
  • the invention has the advantage of not modifying current methods for inserting modules into a card body. Especially in a double-sided version with contact and contactless function. It suffices to choose particular adhesion forces of the different constituents.
  • the invention is described in connection with examples illustrated in the following figures:
  • FIG. 1 illustrates a device of the invention according to a first embodiment, the chip being mounted face-up;
  • Figure 2 illustrates the behavior of the device of Figure 1 during a tearing of the module;
  • FIG. 3 illustrates a device of the invention according to a second embodiment, the chip being mounted on the rear face;
  • FIG. 4 illustrates the behavior of the device of FIG. 3 during a pullout of the module;
  • the electronic device 1 of the invention is in the form of a smart card.
  • the card conventionally comprises an electronic module or micromodule 2 fixed on a card body 3, in particular in a cavity 4 formed in the body.
  • the attachment uses an adhesive 5 in particular in the form of a layer or film of thermo-fuse or thermo-adhesive type commonly called "hotmelt" with possibly a thermosetting phase preventing further melting or softening and delamination under heat.
  • a layer may be envisaged for glue, for example, streaks, glue beads, glue points for example cyanoacrylate type.
  • glue layer will be used to designate any means and form of gluing.
  • the adhesive is preferably attached to the module especially when it is still in the form of tape. The module is then cut to the desired format extracted from the ribbon and then embedded in the cavity of the card body.
  • the adhesive is preferably selected to withstand the bending / twisting forces imposed by the current smart card standard, in this case ISO 7816.
  • the adhesive provides peel strength in general of from about 10 to 30 N / cm.
  • the peel test consists, for example, of gluing a strip of 1 cm wide and then of pulling it (with an angle of 90 ° for example) and recording the force in Newton (N) necessary to delaminate the strip.
  • the module 2 meanwhile comprises a dielectric support film 6 in particular polyimide or composite glass / epoxy or PET or PEN, having an upper and lower face (in the direction of the figure). On its upper face is fixed a first metallization 7 while an integrated circuit chip 8 is fixed by bonding on its underside.
  • the metallization 7, in particular copper, is constituted in the example by electrical contact pads, intended to be read by an external reader.
  • the chip is connected to the first metallization through the film. These ranges can be obtained by lamination of a copper layer on the dielectric then chemical etching. Any metallic pattern may be made according to various techniques known to those skilled in the art, for example by mechanical cutting or by chemical etching or even by screen printing conductive material.
  • the metallization 7 may also be a communication interface in the form of an antenna.
  • the device comprises a separation primer layer 9 (or interposition element) disposed between the lower face 10 of the dielectric and the chip 8.
  • the separation layer 9 in the example is a second metallization carried out especially as the first metallization (by lamination, the lower metallization may also be a metal layer deposited by electrochemistry) but with a different pattern and a particular adhesion.
  • the module is then called a "double-sided".
  • the primer layer and the adhesives involved are chosen so that the release primer layer adheres more to the adhesive layer than to the film.
  • the layer separation primer For correct operation of the invention, it is recommended to have at least a significant difference in the adhesion forces of the layer separation primer relative to the adhesive layer and the dielectric film, for example at least of the order of 1 to 2 N / cm.
  • the separation primer layer has a dielectric adhesion of less than 8 N / cm).
  • This value of 8 N / cm 2 is generally used for the adhesion of a metallization on a dielectric.
  • the chip 8 rests at least in part on this separation layer.
  • the chip is fixed front face on this separation layer so that its electrical pads 11 (commonly called "bumps") are connected (flip chip connection method).
  • the chip is possible to use an adhesive 13 that becomes conductive depending on the pressure, or non-conductive glue or anisotropic conductive glue, for example.
  • the separation primer layer also has an adhesion to the embedding adhesive greater than or equal to 10 N / cm 2.
  • an adhesive and / or inking means of the separating layer are used in the adhesive so that the adhesive force or the reverse peel force is between 10 and 30 N / cm. It may be greater than 30 N / cm.
  • the module comprises metallized vias 12 passing through the dielectric and providing the connection between the contact pads and the metal separation layer.
  • tearing of the module exerted by a force F causes delamination of the dielectric with respect to the separation which remains stuck in the cavity with the chip.
  • the metallized vias 12 are sectioned and the module becomes unusable.
  • another device comprises a chip 8 fixed by its rear face (opposite to the connection pads) by an adhesive 18 to the second metallization 14.
  • the chip is directly connected to the contact pads by means of conductive wires 15 which pass through the dielectric at perforations 16 to access the contact pads.
  • the chip preferably comprises a coating 17, in particular of resin, intended to protect the chip and the electrical connections.
  • the metallization may represent electrical tracks intended to connect the chip to an antenna, in particular via conductive vias traversing the body. The antenna can be inserted into laminated sheets constituting the body.
  • the antenna may also be constituted by the spiral-shaped separation primer layer.
  • the module constitutes a module with two contact and contactless communication interfaces.
  • tearing of the module initiated in the same manner as above causes delamination of the dielectric 6 with respect to the separation layer 14 which remains stuck in the cavity with the chip.
  • the connections 15 with the first metallization are cut and make the module unusable in its contact function.
  • the module may comprise a separation primer layer that is non-metallic or electrically insulating.
  • the layer can be replaced by an element interposition having a particular pattern, for example a spiral, grids etc.
  • the separation layer may comprise a surface state in particular following an abrasive or acid or plasma treatment or polishing to vary the adhesion of its faces and improve the effectiveness of the anti-tearing function.
  • the dosage of different adhesions is within the reach of those skilled in the art.
  • the release layer may include mechanical inking means in the adhesive to improve mechanical anchorage adhesion and increase the adhesion gap with the dielectric.
  • a metallization in the form of double-sided copper or interposing element must have dimensions such as a part thereof or vis-à-vis the embedding adhesive so as to be in the mass adhesive solidly to the card body.
  • the surface of the separation primer layer may be equivalent to that of the module.
  • the delamination phenomenon can only be obtained if there is a particular design of the micromodule as regards the adhesion (or mechanical catch) between the interposing element and the dielectric and the specific properties of the adhesive used during embedding in relation to the surface and material of the card body.
  • the control of the adhesive power of the double-sided copper or the interposing element on the dielectric can be done by choice of the adhesive material and its adhering power or by subsequent alteration of its adhesion, for example, embrittlement of the adhesive interface by setting temperature.
  • the control of adhesive power can also be carried out using a dielectric easy to delaminate by nature (because it has a difficult adhesion) such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate group of polyesters but higher temperature resistance than PET) It has been found that the delamination of the separation primer layer is all the easier as the dielectric is more flexible than the separation primer layer (for example a copper separation primer layer). is characterized by a Young's modulus less than about 100,000 MPa and a polyester dielectric with a Young's modulus of the order of 10OOMpa)
  • the principle of the invention can be extended to the delamination of any element interposing the chip glued to a support or insulating substrate; this may be of course the case of a copper on a plate of a single or multilayer printed circuit.
  • the printed circuit may similarly comprise a primer layer separation between a chip or any component and a metallization.
  • the printed circuit which comprises a metallization on a dielectric plate and at least one electrical / electronic component connected to this metallization, also comprises the separation primer layer placed between the component and the dielectric plate.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Security & Cryptography (AREA)
  • Business, Economics & Management (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Strategic Management (AREA)
  • Accounting & Taxation (AREA)
  • General Business, Economics & Management (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to an electronic device comprising a module which is affixed to a support body by means of a layer of adhesive. According to the invention, the module comprises a support film having a first metallisation on an upper face and a printed circuit chip on a lower face, said chip being connected to the first metallisation through the film. The invention is characterised in that the device comprises a primer separation layer (9, 14) which is disposed between the lower face (10) and the chip (8).The invention is also characterised in that the primer separation layer adheres more to the adhesive layer than the film. The invention also relates to the associated modules.

Description

DISPOSITIF A MODULE ELECTRONIQUE INDEMONTABLE DEVICE HAVING AN ELECTRONIC MODULE
Cette invention concerne un dispositif comprenant un module électronique indémontable d'un support sans destruction de celui-ci et le module associé.This invention relates to a device comprising an electronic module that can not be dismantled from a support without destroying it and the associated module.
En particulier, elle concerne un dispositif électronique comprenant un module collé sur un corps support par l'intermédiaire d'un adhésif; le module comporte un film support ayant une première métallisation sur une face supérieure et sur une face inférieure une puce de circuit intégré reliée à la première métallisation à travers le film.In particular, it relates to an electronic device comprising a module stuck on a support body by means of an adhesive; the module comprises a support film having a first metallization on an upper face and on a lower face an integrated circuit chip connected to the first metallization through the film.
Elle trouve application notamment dans les cartes à puce nécessitant de la sécurité au niveau du démontage du micromodule du corps de carte, que ce soit pour des utilisations bancaires, Identité ou autres.It finds application in particular in smart cards requiring security in the disassembly of the micromodule of the card body, whether for banking, identity or other uses.
Dans un contexte international de grande croissance de la sécurité et de l'authentification ainsi que de l'identité les fabricants de cartes à puces se doivent de proposer à leurs clients des cartes à puces où il n'est pas possible d'arracher le micromodule de sa carte sans le dégrader ou le détruire.In an international context of great growth in security and authentication as well as identity smart card manufacturers must offer their customers smart cards where it is not possible to tear the micromodule of his map without degrading or destroying it.
Le démontage du micromodule est déjà rendu impossible sans destruction de celui-ci par d'autres techniques telles que le collage structural ou également par encrage mécanique de la puce dans une résine solidaire du fond de cavité d'un corps de carte en plastique. Ainsi, lors d'un arrachage du module, la puce reste collée au fond de la cavité en étant déconnectée des plages de contact et désolidarisée du film support diélectrique.Disassembly of the micromodule is already made impossible without destruction of it by other techniques such as structural bonding or also by mechanical inking of the chip in a resin secured to the cavity bottom of a plastic card body. Thus, during a pulling of the module, the chip remains glued to the bottom of the cavity being disconnected from the contact pads and disengaged from the dielectric support film.
Le collage structural performant n'est possible qu'avec un nombre restreint de matériau comme le PVC. Il n'existe pas de collage efficace pour certain matériau polymère en particulier, le PET qui est particulièrement adapté aux cartes à longue durée de vie telles que les cartes mettant en oeuvre une application Identité.High-performance structural bonding is only possible with a limited number of materials such as PVC. There is no effective bonding for some particular polymeric material, PET which is particularly suitable for long-life cards such as cards implementing an Identity application.
L'invention a pour objectif de proposer un dispositif comportant un module électronique sur un support et qui soit doté d'une fonction anti- arrachement efficace indépendamment de la nature du supportThe object of the invention is to propose a device comprising an electronic module on a support and which is provided with an effective anti-tear function regardless of the nature of the support.
A cet effet, l'invention a pour objet un dispositif électronique du type ci-dessus qui se distingue en ce qu'il comprend une couche d'amorce de séparation disposée entre la face inférieure du film et la puce et en ce que la couche adhère plus à la couche adhésive d'encartage qu'au film.For this purpose, the subject of the invention is an electronic device of the above type which is distinguished in that it comprises a separation primer layer placed between the lower face of the film and the chip and in that the layer adheres more to the adhesive layer than to the film.
L'invention a pour objet également deux types de modules électroniques comportant un film support ayant une première métallisation sur une face supérieure et sur une face inférieure une puce de circuit intégré reliée à la première métallisation à travers le film. Le premier se distingue en ce qu'il comprend une couche d'amorce de séparation non métallique disposée entre la face inférieure et la puce.The invention also relates to two types of electronic modules comprising a support film having a first metallization on an upper face and on a lower face an integrated circuit chip connected to the first metallization through the film. The first is distinguished by including a nonmetallic primer layer disposed between the underside and the chip.
Le second se distingue en ce que la couche d'amorce de séparation disposée entre la face inférieure et la puce présente une résistance au pelage comprise entre environ 1 et 5 N/cm qu'elle soit métallique ou non.The second is distinguished in that the separating primer layer disposed between the lower face and the chip has a peel strength of between about 1 and 5 N / cm whether it is metallic or not.
L'invention est applicable aux circuits imprimés.The invention is applicable to printed circuits.
L'invention a l'avantage de ne pas modifier les procédés actuels d'encartage de module dans un corps de carte. En particulier dans une version double face à fonction contact et sans contact. Il suffit de choisir des forces d'adhésion particulières des différents constituants. L'invention est décrite en relation avec des exemples illustrés sur les figures suivantes:The invention has the advantage of not modifying current methods for inserting modules into a card body. Especially in a double-sided version with contact and contactless function. It suffices to choose particular adhesion forces of the different constituents. The invention is described in connection with examples illustrated in the following figures:
La figure 1 illustre un dispositif de l'invention selon un premier mode de réalisation, la puce étant montée face avant; La figure 2 illustre le comportement du dispositif de la figure 1 au cours d'un arrachage du module;FIG. 1 illustrates a device of the invention according to a first embodiment, the chip being mounted face-up; Figure 2 illustrates the behavior of the device of Figure 1 during a tearing of the module;
La figure 3 illustre un dispositif de l'invention selon un second mode de réalisation, la puce étant montée face arrière; La figure 4 illustre le comportement du dispositif de la figure 3 au cours d'un arrachage du module;FIG. 3 illustrates a device of the invention according to a second embodiment, the chip being mounted on the rear face; FIG. 4 illustrates the behavior of the device of FIG. 3 during a pullout of the module;
A la figure 1 , le dispositif électronique 1 de l'invention, se présente sous forme de carte à puce. La carte comprend de manière classique un module ou micromodule électronique 2 fixé sur un corps de carte 3, en particulier dans une cavité 4 ménagée dans le corps. La fixation utilise un adhésif 5 notamment sous forme de couche ou film de type thermo-fusible ou thermo-adhésif communément appelé "hotmelt" avec éventuellement une phase thermodurcissable empêchant une nouvelle fusion ou ramollissement et décollement sous la chaleur. Une autre forme qu'une couche peut être éventuellement envisagée pour la colle par exemple, stries, cordons de colle, points de colle par exemple de type cyanoacrylate. Par simplification on utilisera l'expression "couche de colle" pour désigner tout moyen et forme de collage. L'adhésif est de préférence fixée sur le module notamment lorsqu'il est encore sous forme de ruban. Le module est ensuite découpé au format voulu extrait du ruban puis encarté dans la cavité du corps de carte.In FIG. 1, the electronic device 1 of the invention is in the form of a smart card. The card conventionally comprises an electronic module or micromodule 2 fixed on a card body 3, in particular in a cavity 4 formed in the body. The attachment uses an adhesive 5 in particular in the form of a layer or film of thermo-fuse or thermo-adhesive type commonly called "hotmelt" with possibly a thermosetting phase preventing further melting or softening and delamination under heat. Another form that a layer may be envisaged for glue, for example, streaks, glue beads, glue points for example cyanoacrylate type. For simplicity, the term "glue layer" will be used to designate any means and form of gluing. The adhesive is preferably attached to the module especially when it is still in the form of tape. The module is then cut to the desired format extracted from the ribbon and then embedded in the cavity of the card body.
L'adhésif est choisi de préférence de manière à résister aux efforts de flexion/torsion imposée par la norme des cartes à puce en vigueur, en l'occurrence ISO 7816. L'adhésif confère une résistance au pelage en général comprise entre environ 10 à 30 N/cm. L'essai de pelage consiste par exemple à coller une bande de 1 cm de large et ensuite de tirer dessus (avec un angle de 90° par exemple) et d'enregistrer la force en Newton (N) nécessaire à délaminer la bande. Le module 2 quant à lui, comporte un film support diélectrique 6 notamment en polyimide ou composite verre/époxy ou PET ou PEN, comportant une face supérieure et inférieure (dans le sens de la figure). Sur sa face supérieure est fixée une première métallisation 7 tandis qu'une puce de circuit intégré 8 est fixée par collage sur sa face inférieure.The adhesive is preferably selected to withstand the bending / twisting forces imposed by the current smart card standard, in this case ISO 7816. The adhesive provides peel strength in general of from about 10 to 30 N / cm. The peel test consists, for example, of gluing a strip of 1 cm wide and then of pulling it (with an angle of 90 ° for example) and recording the force in Newton (N) necessary to delaminate the strip. The module 2 meanwhile comprises a dielectric support film 6 in particular polyimide or composite glass / epoxy or PET or PEN, having an upper and lower face (in the direction of the figure). On its upper face is fixed a first metallization 7 while an integrated circuit chip 8 is fixed by bonding on its underside.
La métallisation 7, en cuivre notamment, est constituée dans l'exemple par des plages de contact électrique, destinées à être lu par un lecteur externe. La puce est reliée à la première métallisation à travers le film. Ces plages peuvent être obtenues par lamination d'une couche de cuivre sur le diélectrique puis gravage chimique. Un motif quelconque métallique peut être réalisé selon différentes techniques connues de l'homme de l'art, par exemple par découpage mécanique ou par gravure chimique voire même par sérigraphie de matière conductrice. La métallisation 7 peut être également une interface de communication sous forme d'antenne.The metallization 7, in particular copper, is constituted in the example by electrical contact pads, intended to be read by an external reader. The chip is connected to the first metallization through the film. These ranges can be obtained by lamination of a copper layer on the dielectric then chemical etching. Any metallic pattern may be made according to various techniques known to those skilled in the art, for example by mechanical cutting or by chemical etching or even by screen printing conductive material. The metallization 7 may also be a communication interface in the form of an antenna.
Selon l'invention, le dispositif comprend une couche d'amorce de séparation 9 (ou élément d'interposition) disposée entre la face inférieure 10 du diélectrique et la puce 8. La couche de séparation 9 dans l'exemple est une seconde métallisation réalisée notamment comme la première métallisation (par lamination, la métallisation inférieure peut aussi être une couche métallique déposée par électrochimie) mais avec un motif différent et une adhésion particulière. Le module est alors appelé un "double face". La couche d'amorce et les adhésifs impliqués sont choisis de manière à ce que la couche d'amorce de séparation adhère plus à la couche adhésive d'encartage qu'au film.According to the invention, the device comprises a separation primer layer 9 (or interposition element) disposed between the lower face 10 of the dielectric and the chip 8. The separation layer 9 in the example is a second metallization carried out especially as the first metallization (by lamination, the lower metallization may also be a metal layer deposited by electrochemistry) but with a different pattern and a particular adhesion. The module is then called a "double-sided". The primer layer and the adhesives involved are chosen so that the release primer layer adheres more to the adhesive layer than to the film.
Pour un fonctionnement correct de l'invention, il est préconisé d'avoir au moins un écart significatif des forces d'adhésion de la couche d'amorce de séparation relativement à la couche adhésive d'encartage et au film diélectrique, par exemple au moins de l'ordre de 1 à 2 N/cm.For correct operation of the invention, it is recommended to have at least a significant difference in the adhesion forces of the layer separation primer relative to the adhesive layer and the dielectric film, for example at least of the order of 1 to 2 N / cm.
Selon une caractéristique, la couche d'amorce de séparation présente une adhésion au diélectrique inférieure à 8 N/cm). Cette valeur de 8 N/cm2 est en général utilisée pour l'adhésion d'une métallisation sur un diélectrique. Dans l'exemple, on préfère avoir une adhésion de la couche de séparation au diélectrique comprise entre 3 et 5 N/cm); ce qui permet un bon compromis entre la capacité à amorcer la séparation eu égard le pouvoir d'adhésion de l'adhésif d'encartage utilisé et une bonne tenue mécanique du module par rapport à des efforts de flexion / torsion de son support et autres tests normalisés.According to one characteristic, the separation primer layer has a dielectric adhesion of less than 8 N / cm). This value of 8 N / cm 2 is generally used for the adhesion of a metallization on a dielectric. In the example, it is preferred to have an adhesion of the separation layer to the dielectric of between 3 and 5 N / cm); which allows a good compromise between the ability to initiate the separation with regard to the adhesion of the embedding adhesive used and a good mechanical strength of the module relative to the bending / torsion of its support and other tests standardized.
La puce 8 repose au moins en partie sur cette couche de séparation. Dans l'exemple, la puce est fixée face avant sur cette couche de séparation de manière que ses plots électriques 11 (communément appelés "bumps") y soient connectés (procédé de connexion par flip chip). Pour la fixation, on peut utiliser un adhésif 13 devenant conducteur en fonction de la pression ou colle non-conductrice ou colle conductrice anisotropique par exemple.The chip 8 rests at least in part on this separation layer. In the example, the chip is fixed front face on this separation layer so that its electrical pads 11 (commonly called "bumps") are connected (flip chip connection method). For fixing, it is possible to use an adhesive 13 that becomes conductive depending on the pressure, or non-conductive glue or anisotropic conductive glue, for example.
D'autre part, la couche d'amorce de séparation présente également une adhésion à l'adhésif d'encartage 5 supérieure ou égale à 10 N/cm;.On the other hand, the separation primer layer also has an adhesion to the embedding adhesive greater than or equal to 10 N / cm 2.
De préférence, on utilise un adhésif et/ou des moyens d'encrage de la couche de séparation dans l'adhésif de manière que la force d'adhésion ou inversement de pelage soit comprise entre 10 et 30 N/cm. Elle peut être supérieure à 30 N/cm.Preferably, an adhesive and / or inking means of the separating layer are used in the adhesive so that the adhesive force or the reverse peel force is between 10 and 30 N / cm. It may be greater than 30 N / cm.
Le module comporte des vias métallisés 12 traversant le diélectrique et assurant la connexion entre les plages de contact et la couche de séparation métallique.The module comprises metallized vias 12 passing through the dielectric and providing the connection between the contact pads and the metal separation layer.
A la figure 2, un arrachement du module exercé par une force F provoque une délamination du diélectrique par rapport à la couche de séparation qui reste collée dans la cavité avec la puce. Les vias métallisés 12 sont sectionnés et le module devient inutilisable.In FIG. 2, tearing of the module exerted by a force F causes delamination of the dielectric with respect to the separation which remains stuck in the cavity with the chip. The metallized vias 12 are sectioned and the module becomes unusable.
A la figure 3, un autre dispositif l' comprend une puce 8 fixée par sa face arrière (opposée aux plots de connexion) par un adhésif 18 à la seconde métallisation 14. La puce est directement connectée aux plages de contact à l'aide de fils conducteurs 15 qui traversent le diélectrique au niveau de perforations 16 pour accéder aux plages de contact. La puce comporte de préférence un enrobage 17 notamment en résine, destiné à protéger la puce et les connexions électriques. La métallisation peut représenter des pistes électriques destinées à connecter la puce à une antenne notamment par des vias conducteurs traversant le corps. L'antenne peut être insérée dans des feuilles laminées constituant le corps.In FIG. 3, another device comprises a chip 8 fixed by its rear face (opposite to the connection pads) by an adhesive 18 to the second metallization 14. The chip is directly connected to the contact pads by means of conductive wires 15 which pass through the dielectric at perforations 16 to access the contact pads. The chip preferably comprises a coating 17, in particular of resin, intended to protect the chip and the electrical connections. The metallization may represent electrical tracks intended to connect the chip to an antenna, in particular via conductive vias traversing the body. The antenna can be inserted into laminated sheets constituting the body.
L'antenne peut être également constituée par la couche d'amorce de séparation en forme de spirale. Dans ce cas, le module constitue un module à deux interfaces de communication contact et sans contact.The antenna may also be constituted by the spiral-shaped separation primer layer. In this case, the module constitutes a module with two contact and contactless communication interfaces.
A la figure 4, un arrachement du module initié de la même manière que précédemment provoque une délamination du diélectrique 6 par rapport à la couche de séparation 14 qui reste collée dans la cavité avec la puce. Les connexions 15 avec la première métallisation sont sectionnées et rendent le module inutilisable dans sa fonction à contact.In FIG. 4, tearing of the module initiated in the same manner as above causes delamination of the dielectric 6 with respect to the separation layer 14 which remains stuck in the cavity with the chip. The connections 15 with the first metallization are cut and make the module unusable in its contact function.
Par contre, une fonction éventuelle sans contact dans le cas carte à deux interfaces peut fonctionner encore. Le module n'est plus transposable dans une autre cavité de corps de carte à des fins de fraude.On the other hand, a possible non-contact function in the two-interface card case can still work. The module is no longer transposable into another card body cavity for fraud purposes.
D'une manière générale, le module peut comporter une couche d'amorce de séparation qui soit non métallique ou isolante électriquement. La couche peut être remplacée par un élément d'interposition ayant un motif particulier, par exemple une spirale, des quadrillages etc.In general, the module may comprise a separation primer layer that is non-metallic or electrically insulating. The layer can be replaced by an element interposition having a particular pattern, for example a spiral, grids etc.
La couche de séparation peut comprendre un état de surface notamment suite à un traitement abrasif ou acide ou plasma ou un polissage pour faire varier l'adhésion de ses faces et améliorer l'efficacité de la fonction anti-arrachement. Le dosage des différentes adhérences est à la portée de l'homme de l'art.The separation layer may comprise a surface state in particular following an abrasive or acid or plasma treatment or polishing to vary the adhesion of its faces and improve the effectiveness of the anti-tearing function. The dosage of different adhesions is within the reach of those skilled in the art.
La couche de séparation peut comprendre des moyens d'encrage mécaniques dans l'adhésif pour améliorer l'adhésion par ancrage mécanique et augmenter l'écart d'adhérence avec le diélectrique.The release layer may include mechanical inking means in the adhesive to improve mechanical anchorage adhesion and increase the adhesion gap with the dielectric.
Une métallisation sous forme de cuivre double face ou d'élément d'interposition doit avoir des dimensions telles qu'une partie de celui-ci soit en vis-à-vis de l'adhésif d'encartage de façon à être pris dans la masse adhésive solidairement au corps de carte. La surface de la couche d'amorce de séparation peut être équivalente à celle du module.A metallization in the form of double-sided copper or interposing element must have dimensions such as a part thereof or vis-à-vis the embedding adhesive so as to be in the mass adhesive solidly to the card body. The surface of the separation primer layer may be equivalent to that of the module.
Elle peut notamment s'étendre jusqu'au bord du module.It can in particular extend to the edge of the module.
Le phénomène de délamination ne peut être obtenu que s'il existe une conception particulière du micromodule en ce qui concerne l'adhésion (ou accroche mécanique) entre l'élément d'interposition et le diélectrique et des propriétés spécifiques de l'adhésif utilisé lors de l'encartage par rapport à la surface et au matériau du corps de carte.The delamination phenomenon can only be obtained if there is a particular design of the micromodule as regards the adhesion (or mechanical catch) between the interposing element and the dielectric and the specific properties of the adhesive used during embedding in relation to the surface and material of the card body.
C'est bien la conjugaison de tous ces paramètres dans des plages d'adhésion bien ciblées qui permettent la destruction du système lors d'une tentative de démontage.It is the combination of all these parameters in well-targeted membership ranges that allow the destruction of the system during an attempt to dismantle.
Le contrôle du pouvoir adhésif du cuivre double face ou de l'élément d'interposition sur le diélectrique peut être fait par choix du matériau adhésif et de son pouvoir adhérent ou par altération ultérieure de son adhésion, par exemple, fragilisation de l'interface adhésive par mise en température. Le contrôle du pouvoir adhésif peut également s'effectuer par utilisation d'un diélectrique facile à délaminer par nature (du fait qu'il présente une adhésion difficile) comme par exemple le PET (Polyéthylène Téréphtalate) ou PEN (Polyéthylène Naphtalate du groupe des polyesters mais plus haute résistance en température que le PET) II a été constaté que la délamination de la couche d'amorce de séparation est d'autant plus facile que le diélectrique est plus souple que la couche d'amorce de séparation (par exemple une couche d'amorce de séparation en cuivre est caractérisée par un module d'Young inférieur à environ 100000 Mpa et un diélectrique en polyester a un module d'Young de l'ordre de 10OOMpa)The control of the adhesive power of the double-sided copper or the interposing element on the dielectric can be done by choice of the adhesive material and its adhering power or by subsequent alteration of its adhesion, for example, embrittlement of the adhesive interface by setting temperature. The control of adhesive power can also be carried out using a dielectric easy to delaminate by nature (because it has a difficult adhesion) such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate group of polyesters but higher temperature resistance than PET) It has been found that the delamination of the separation primer layer is all the easier as the dielectric is more flexible than the separation primer layer (for example a copper separation primer layer). is characterized by a Young's modulus less than about 100,000 MPa and a polyester dielectric with a Young's modulus of the order of 10OOMpa)
Le principe de l'invention peut être étendu à la délamination de tout élément interposant la puce collée à un support ou substrat isolant; ce peut être bien sur le cas d'un cuivre sur une plaque d'un circuit imprimé mono ou multicouches. Le circuit imprimé peut comporter de la même manière une couche d'amorce de séparation entre une puce ou un composant quelconque et une métallisation. A cet effet, le circuit imprimé qui comprend une métallisation sur une plaque diélectrique et au moins un composant électrique/électronique relié à cette métallisation, comprend également la couche d'amorce de séparation placée entre le composant et la plaque diélectrique. The principle of the invention can be extended to the delamination of any element interposing the chip glued to a support or insulating substrate; this may be of course the case of a copper on a plate of a single or multilayer printed circuit. The printed circuit may similarly comprise a primer layer separation between a chip or any component and a metallization. For this purpose, the printed circuit which comprises a metallization on a dielectric plate and at least one electrical / electronic component connected to this metallization, also comprises the separation primer layer placed between the component and the dielectric plate.

Claims

REVENDICATIONS
1. Dispositif électronique comprenant un module collé sur un corps support par l'intermédiaire d'une couche adhésive d'encartage, ledit module comportant un film support ayant une première métallisation sur une face supérieure et sur une face inférieure une puce de circuit intégré reliée à la première métallisation à travers le film, caractérisé en ce qu'il comprend une couche d'amorce de séparation (9, 14) disposée entre la face inférieure (10) et la puce (8) et en ce que la couche adhère plus à la couche adhésive d'encartage (5) qu'au film.An electronic device comprising a module adhered to a support body by means of an adhesive insertion layer, said module comprising a support film having a first metallization on an upper face and on a lower face a connected integrated circuit chip. at the first metallization through the film, characterized in that it comprises a separating primer layer (9, 14) disposed between the lower face (10) and the chip (8) and in that the layer adheres more to the adhesive layer (5) than to the film.
2. Dispositif selon la revendication 1 , caractérisé en ce que la couche d'amorce de séparation présente une force d'adhésion au diélectrique inférieure à 8 N/cm.. 2. Device according to claim 1, characterized in that the separation primer layer has a dielectric adhesion strength of less than 8 N / cm.
3. Dispositif selon l'une des revendications 1 ou 2, caractérisé en ce que la couche d'amorce de séparation (9, 14) présente une force d'adhésion au diélectrique comprise entre 3 et 5 N/cm.3. Device according to one of claims 1 or 2, characterized in that the separating primer layer (9, 14) has a dielectric adhesion strength of between 3 and 5 N / cm.
4. Dispositif selon l'une quelconque des revendications précédentes, caractérisé en ce que la couche d'amorce de séparation présente une adhésion à l'adhésif (5) supérieure à 10 N/cm.4. Device according to any one of the preceding claims, characterized in that the separating primer layer has adhesion to the adhesive (5) greater than 10 N / cm.
5. Dispositif selon l'une quelconque des revendications précédentes, caractérisé en ce que la couche d'amorce de séparation constitue une seconde métallisation du film.5. Device according to any one of the preceding claims, characterized in that the separating primer layer constitutes a second metallization of the film.
6. Dispositif selon la revendication précédente, caractérisé en ce que la puce est également connectée à la seconde métallisation.6. Device according to the preceding claim, characterized in that the chip is also connected to the second metallization.
7. Dispositif selon la revendication 6, caractérisé en ce que la seconde métallisation présente un motif d'antenne spiralée.7. Device according to claim 6, characterized in that the second metallization has a spiral antenna pattern.
8. Module électronique comportant un film support ayant une première métallisation sur une face supérieure et sur une face inférieure une puce de circuit intégré reliée à la première métallisation à travers le film, caractérisé en ce qu'il comprend une couche d'amorce de séparation non métallique disposée entre la face inférieure (10) et la puce (8).An electronic module comprising a support film having a first metallization on an upper face and a lower face an integrated circuit chip connected to the first metallization through the film, characterized in that it comprises a non-metallic separation primer layer disposed between the lower face (10) and the chip (8).
9. Module électronique comportant un film support ayant une première métallisation sur une face supérieure et sur une face inférieure une puce de circuit intégré reliée à la première métallisation à travers le film, caractérisé en ce qu'il comprend une couche d'amorce de séparation (9, 14) disposée entre la face inférieure (10) et la puce (8) présentant une résistance au pelage comprise entre environ 1 et 5 N/cm. 9. Electronic module comprising a support film having a first metallization on an upper face and on a lower face an integrated circuit chip connected to the first metallization through the film, characterized in that it comprises a separation primer layer (9, 14) disposed between the lower face (10) and the chip (8) having a peel strength of between about 1 and 5 N / cm.
10. Module selon la revendication 9, caractérisé en ce que la couche d'amorce de séparation constitue une seconde métallisation du film.10. Module according to claim 9, characterized in that the separating primer layer constitutes a second metallization of the film.
11. Module selon la revendication 10, caractérisé en ce que la puce est également connectée à la seconde métallisation cette dernière présentant un motif d'antenne spiralée.11. Module according to claim 10, characterized in that the chip is also connected to the second metallization the latter having a spiral antenna pattern.
12. Circuit imprimé comprenant une métallisation sur une plaque diélectrique et au moins un composant électrique/électronique relié à cette métallisation, caractérisé en ce qu'il comprend une couche d'amorce de séparation placée entre le composant et la plaque diélectrique. 12. Printed circuit comprising a metallization on a dielectric plate and at least one electrical / electronic component connected to this metallization, characterized in that it comprises a separating primer layer placed between the component and the dielectric plate.
EP05808175A 2004-11-03 2005-10-20 Device comprising a non-detachable electronic module Withdrawn EP1810226A1 (en)

Applications Claiming Priority (2)

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FR0452507A FR2877463B1 (en) 2004-11-03 2004-11-03 DEVICE HAVING AN ELECTRONIC MODULE
PCT/EP2005/055435 WO2006048380A1 (en) 2004-11-03 2005-10-20 Device comprising a non-detachable electronic module

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EP (1) EP1810226A1 (en)
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KR20140084801A (en) * 2012-12-27 2014-07-07 삼성전기주식회사 Printed circuit board and method of manufacturing the same
CN106847785A (en) * 2017-03-15 2017-06-13 深圳市骄冠科技实业有限公司 A kind of radio frequency chip connection sheet assembly and its preparation technology

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US6193163B1 (en) * 1998-08-31 2001-02-27 The Standard Register Company Smart card with replaceable chip
FR2792091B1 (en) * 1999-04-12 2001-08-17 Schlumberger Systems & Service SECURE ELECTRONIC MEMORY CARD
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FR2877463A1 (en) 2006-05-05

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