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EP1708278A3 - Optical device module, lens holding device, and method for manufacturing optical device module - Google Patents

Optical device module, lens holding device, and method for manufacturing optical device module Download PDF

Info

Publication number
EP1708278A3
EP1708278A3 EP20060251585 EP06251585A EP1708278A3 EP 1708278 A3 EP1708278 A3 EP 1708278A3 EP 20060251585 EP20060251585 EP 20060251585 EP 06251585 A EP06251585 A EP 06251585A EP 1708278 A3 EP1708278 A3 EP 1708278A3
Authority
EP
European Patent Office
Prior art keywords
optical device
device module
solid
image sensor
state image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20060251585
Other languages
German (de)
French (fr)
Other versions
EP1708278A2 (en
Inventor
Hiroaki Tsukamoto
Nobuhito Hirosumi
Takashi Yasudome
Kazuo Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of EP1708278A2 publication Critical patent/EP1708278A2/en
Publication of EP1708278A3 publication Critical patent/EP1708278A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

A solid-state image sensor 2, a transparent cover 6, a DSP 8, a wiring board 7 and the like are sealed in a sealing portion 14 by molding of a synthetic resin, and fixed to an imaging unit 1. At this time, a portion of the transparent cover 6 is exposed from the sealing portion 14. The optical path fixing device 20 and the imaging unit 1 sealed by the sealing portion 14 are fixedly combined by engagement of hook engaging portions 28 and hook portions 16, in a state where the lower end surface of a lens barrel 22 comes into contact with the exposed portion. As the result, positioning accuracy of a lens 21 with respect to a pixel area of the solid-state image sensor 2 dose not deteriorate even if a substrate on which the solid-state image sensor 2 is arranged is deflected or distorted.
EP20060251585 2005-03-29 2006-03-24 Optical device module, lens holding device, and method for manufacturing optical device module Withdrawn EP1708278A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005095573A JP4233535B2 (en) 2005-03-29 2005-03-29 Optical device module, optical path delimiter, and optical device module manufacturing method

Publications (2)

Publication Number Publication Date
EP1708278A2 EP1708278A2 (en) 2006-10-04
EP1708278A3 true EP1708278A3 (en) 2008-04-23

Family

ID=36677069

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20060251585 Withdrawn EP1708278A3 (en) 2005-03-29 2006-03-24 Optical device module, lens holding device, and method for manufacturing optical device module

Country Status (6)

Country Link
US (1) US7733408B2 (en)
EP (1) EP1708278A3 (en)
JP (1) JP4233535B2 (en)
KR (1) KR100779119B1 (en)
CN (1) CN100521738C (en)
TW (1) TWI307966B (en)

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JP4324623B2 (en) * 2007-04-27 2009-09-02 シャープ株式会社 Solid-state imaging device and electronic apparatus including the same
JP4340698B2 (en) 2007-04-27 2009-10-07 シャープ株式会社 Optical unit, solid-state imaging device including the same, and electronic apparatus
CN100561280C (en) * 2007-05-30 2009-11-18 鸿富锦精密工业（深圳）有限公司 Camera module and manufacturing method thereof
CN101359081B (en) * 2007-08-03 2010-09-29 鸿富锦精密工业（深圳）有限公司 Camera module
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US8269883B2 (en) * 2008-01-10 2012-09-18 Sharp Kabushiki Kaisha Solid image capture device and electronic device incorporating same
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JP5017168B2 (en) * 2008-04-25 2012-09-05 日立オートモティブシステムズ株式会社 Camera device
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JP4694602B2 (en) 2008-09-02 2011-06-08 シャープ株式会社 Solid-state imaging device and electronic apparatus including the same
JP2010088088A (en) * 2008-10-03 2010-04-15 Fujifilm Corp Camera module
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US8830389B2 (en) 2010-02-12 2014-09-09 Ability Enterprise Co., Ltd. Image detecting module and lens module
CN102314050B (en) * 2010-06-29 2015-02-04 鸿富锦精密工业（深圳）有限公司 Image pickup module and assembling method thereof
TWM403662U (en) * 2010-07-02 2011-05-11 Pixart Imaging Inc Sensing device and its image sensing module
US20120281113A1 (en) * 2011-05-06 2012-11-08 Raytheon Company USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIP
KR101224790B1 (en) * 2011-06-14 2013-01-21 삼성전기주식회사 Image Photographing Device
JP5261548B2 (en) 2011-07-29 2013-08-14 シャープ株式会社 The camera module
JP2013118230A (en) * 2011-12-01 2013-06-13 Canon Inc Solid-state imaging device
CN107770462B (en) * 2011-12-28 2020-09-22 株式会社尼康 Imaging element and imaging device
CN103185927B (en) * 2011-12-29 2016-03-02 鸿富锦精密工业（深圳）有限公司 Optical fiber transmission module
US8981511B2 (en) * 2012-02-29 2015-03-17 Semiconductor Components Industries, Llc Multi-chip package for imaging systems
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JP5998962B2 (en) * 2013-01-31 2016-09-28 三菱電機株式会社 Semiconductor optical device
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WO2015038064A2 (en) 2013-09-10 2015-03-19 Heptagon Micro Optics Pte. Ltd. Compact opto-electronic modules and fabrication methods for such modules
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US10009523B2 (en) * 2015-05-11 2018-06-26 Samsung Electro-Mechanics Co., Ltd. Electronic module and method of manufacturing the same
KR102472566B1 (en) * 2015-12-01 2022-12-01 삼성전자주식회사 Semiconductor package
KR20170073796A (en) * 2015-12-18 2017-06-29 삼성전자주식회사 Semiconductor package and Method of manufacturing package
US20170256576A1 (en) * 2016-03-02 2017-09-07 Semiconductor Components Industries, Llc High reliability housing for a semiconductor package
US20180315894A1 (en) * 2017-04-26 2018-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
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CN108196416A (en) * 2018-02-27 2018-06-22 广东欧珀移动通信有限公司 Laser projection module, depth camera and electronic device
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Also Published As

Publication number Publication date
TW200640024A (en) 2006-11-16
JP4233535B2 (en) 2009-03-04
US20060221225A1 (en) 2006-10-05
TWI307966B (en) 2009-03-21
CN1842136A (en) 2006-10-04
US7733408B2 (en) 2010-06-08
EP1708278A2 (en) 2006-10-04
CN100521738C (en) 2009-07-29
KR20060105517A (en) 2006-10-11
KR100779119B1 (en) 2007-11-23
JP2006279533A (en) 2006-10-12

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