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EP1677368A3 - Piezoelectric devices with conductive perovskite layers - Google Patents

Piezoelectric devices with conductive perovskite layers Download PDF

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Publication number
EP1677368A3
EP1677368A3 EP20050028010 EP05028010A EP1677368A3 EP 1677368 A3 EP1677368 A3 EP 1677368A3 EP 20050028010 EP20050028010 EP 20050028010 EP 05028010 A EP05028010 A EP 05028010A EP 1677368 A3 EP1677368 A3 EP 1677368A3
Authority
EP
European Patent Office
Prior art keywords
piezoelectric
piezoelectric devices
conductive layer
conductive perovskite
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20050028010
Other languages
German (de)
French (fr)
Other versions
EP1677368B1 (en
EP1677368A2 (en
Inventor
Setsuya Iwashita
Takeshi Kijima
Koji Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of EP1677368A2 publication Critical patent/EP1677368A2/en
Publication of EP1677368A3 publication Critical patent/EP1677368A3/en
Application granted granted Critical
Publication of EP1677368B1 publication Critical patent/EP1677368B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/0538Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14233Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • H03H9/02574Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/173Air-gaps
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/174Membranes
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/176Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/704Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877Conductive materials
    • H10N30/878Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Oscillators With Electromechanical Resonators (AREA)

Abstract

A piezoelectric device includes: a substrate (1); a first conductive layer (4) formed over the substrate, the first conductive layer including at least one buffer layer (41) formed of a (001) preferentially oriented lanthanum-based layered perovskite compound; a piezoelectric layer (5) formed over the first conductive layer and including a piezoelectric having a perovskite structure; and a second conductive layer (6) electrically connected with the piezoelectric layer.
EP20050028010 2004-12-28 2005-12-21 Piezoelectric devices with conductive perovskite layers Not-in-force EP1677368B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004380988A JP4431891B2 (en) 2004-12-28 2004-12-28 Piezoelectric element, piezoelectric actuator, piezoelectric pump, ink jet recording head, ink jet printer, surface acoustic wave element, thin film piezoelectric resonator, frequency filter, oscillator, electronic circuit, and electronic equipment

Publications (3)

Publication Number Publication Date
EP1677368A2 EP1677368A2 (en) 2006-07-05
EP1677368A3 true EP1677368A3 (en) 2007-07-11
EP1677368B1 EP1677368B1 (en) 2011-06-22

Family

ID=36051493

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20050028010 Not-in-force EP1677368B1 (en) 2004-12-28 2005-12-21 Piezoelectric devices with conductive perovskite layers

Country Status (5)

Country Link
US (1) US7622850B2 (en)
EP (1) EP1677368B1 (en)
JP (1) JP4431891B2 (en)
KR (1) KR100682432B1 (en)
CN (1) CN100511744C (en)

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WO2009128245A1 (en) * 2008-04-17 2009-10-22 株式会社村田製作所 Stacked piezoelectric element and piezoelectric pump
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US8030823B2 (en) * 2009-01-26 2011-10-04 Resonance Semiconductor Corporation Protected resonator
US9735338B2 (en) 2009-01-26 2017-08-15 Cymatics Laboratories Corp. Protected resonator
US8164234B2 (en) * 2009-02-26 2012-04-24 Fujifilm Corporation Sputtered piezoelectric material
WO2010122707A1 (en) * 2009-04-20 2010-10-28 パナソニック株式会社 Piezoelectric thin film and manufacturing method therefor, inkjet head, method for forming images using an inkjet head, angular velocity sensor, method for measuring angular velocity using an angular velocity sensor, piezoelectric element, and method for generating electricity using piezoelectric elements
JP5305027B2 (en) * 2009-07-16 2013-10-02 セイコーエプソン株式会社 Liquid ejecting head, liquid ejecting apparatus, and piezoelectric element
JP2011088369A (en) * 2009-10-23 2011-05-06 Seiko Epson Corp Liquid ejection head, liquid ejection device and piezoelectric element
JP2011103327A (en) * 2009-11-10 2011-05-26 Seiko Epson Corp Piezoelectric element, piezoelectric actuator, liquid injection head, and liquid injection device
JP2011142280A (en) * 2010-01-09 2011-07-21 Seiko Epson Corp Actuator apparatus, method of manufacturing the same, method of manufacturing liquid injection head, and method of manufacturing liquid injection equipment
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JP5998531B2 (en) * 2012-03-09 2016-09-28 株式会社リコー Electro-mechanical transducer, droplet discharge head, and droplet discharge device
JP5998537B2 (en) * 2012-03-12 2016-09-28 株式会社リコー Electro-mechanical conversion element, droplet discharge head, and droplet discharge apparatus
JP5998543B2 (en) * 2012-03-13 2016-09-28 株式会社リコー Electro-mechanical conversion element, droplet discharge head, and droplet discharge apparatus
US20130320813A1 (en) * 2012-06-04 2013-12-05 Tdk Corporation Dielectric device
US8994251B2 (en) * 2012-08-03 2015-03-31 Tdk Corporation Piezoelectric device having first and second non-metal electroconductive intermediate films
JP6376690B2 (en) * 2014-08-28 2018-08-22 東芝テック株式会社 Droplet ejecting apparatus and image forming apparatus
JP6575743B2 (en) * 2015-01-30 2019-09-18 セイコーエプソン株式会社 Method of driving liquid jet head, piezoelectric element, and liquid jet head
KR102576924B1 (en) 2016-03-09 2023-09-11 (주)와이솔 SAW Resonator having negative profile Metal Structure and the Manufacturing Method thefeof
TWI717498B (en) * 2016-06-21 2021-02-01 日商前進材料科技股份有限公司 Membrane structure and manufacturing method thereof
US10272692B2 (en) * 2016-09-13 2019-04-30 Toshiba Tec Kabushiki Kaisha Liquid circulation device, liquid ejection apparatus, and liquid ejection method
JP6790776B2 (en) * 2016-12-07 2020-11-25 Tdk株式会社 Piezoelectric thin film laminates, piezoelectric thin film substrates, piezoelectric thin film elements, piezoelectric actuators, piezoelectric sensors, head assemblies, head stack assemblies, hard disk drives, printer heads, and inkjet printer devices.
CN107443919A (en) * 2017-09-19 2017-12-08 吉林大学 A kind of printer ink supply system with pressurization piezoelectric pump
JP7167337B2 (en) * 2019-06-12 2022-11-08 富士フイルム株式会社 Piezoelectric element and method for manufacturing piezoelectric element
CN113966552A (en) * 2019-06-12 2022-01-21 富士胶片株式会社 Piezoelectric element
US11581870B2 (en) * 2019-09-27 2023-02-14 Skyworks Solutions, Inc. Stacked acoustic wave resonator package with laser-drilled VIAS
JP7237032B2 (en) * 2020-02-17 2023-03-10 富士フイルム株式会社 Substrate with piezoelectric film, piezoelectric element and vibration power generation element
CN116134186A (en) 2020-07-28 2023-05-16 富士胶片株式会社 Substrate with piezoelectric film and piezoelectric element
JP7575335B2 (en) 2021-04-05 2024-10-29 株式会社アルバック Method for forming piezoelectric film and piezoelectric device
WO2022250016A1 (en) * 2021-05-27 2022-12-01 株式会社村田製作所 Elastic wave device
JP7636302B2 (en) * 2021-08-31 2025-02-26 富士フイルム株式会社 Piezoelectric laminate and piezoelectric element
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Also Published As

Publication number Publication date
US7622850B2 (en) 2009-11-24
CN1805164A (en) 2006-07-19
KR100682432B1 (en) 2007-02-15
CN100511744C (en) 2009-07-08
JP4431891B2 (en) 2010-03-17
KR20060076694A (en) 2006-07-04
EP1677368B1 (en) 2011-06-22
JP2006186258A (en) 2006-07-13
US20060139414A1 (en) 2006-06-29
EP1677368A2 (en) 2006-07-05

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