EP1677368A3 - Piezoelectric devices with conductive perovskite layers - Google Patents
Piezoelectric devices with conductive perovskite layers Download PDFInfo
- Publication number
- EP1677368A3 EP1677368A3 EP20050028010 EP05028010A EP1677368A3 EP 1677368 A3 EP1677368 A3 EP 1677368A3 EP 20050028010 EP20050028010 EP 20050028010 EP 05028010 A EP05028010 A EP 05028010A EP 1677368 A3 EP1677368 A3 EP 1677368A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- piezoelectric
- piezoelectric devices
- conductive layer
- conductive perovskite
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052746 lanthanum Inorganic materials 0.000 abstract 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004380988A JP4431891B2 (en) | 2004-12-28 | 2004-12-28 | Piezoelectric element, piezoelectric actuator, piezoelectric pump, ink jet recording head, ink jet printer, surface acoustic wave element, thin film piezoelectric resonator, frequency filter, oscillator, electronic circuit, and electronic equipment |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1677368A2 EP1677368A2 (en) | 2006-07-05 |
EP1677368A3 true EP1677368A3 (en) | 2007-07-11 |
EP1677368B1 EP1677368B1 (en) | 2011-06-22 |
Family
ID=36051493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20050028010 Not-in-force EP1677368B1 (en) | 2004-12-28 | 2005-12-21 | Piezoelectric devices with conductive perovskite layers |
Country Status (5)
Country | Link |
---|---|
US (1) | US7622850B2 (en) |
EP (1) | EP1677368B1 (en) |
JP (1) | JP4431891B2 (en) |
KR (1) | KR100682432B1 (en) |
CN (1) | CN100511744C (en) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100844432B1 (en) * | 2006-07-05 | 2008-07-08 | 한국과학기술연구원 | Fluid Control Valve Using Piezo Actuator |
KR101238360B1 (en) * | 2006-08-16 | 2013-03-04 | 삼성전자주식회사 | Resonator and the method thereof |
JP2009255531A (en) * | 2008-03-28 | 2009-11-05 | Seiko Epson Corp | Liquid ejecting head, liquid ejecting apparatus and actuator |
WO2009128245A1 (en) * | 2008-04-17 | 2009-10-22 | 株式会社村田製作所 | Stacked piezoelectric element and piezoelectric pump |
US9035253B2 (en) | 2008-06-27 | 2015-05-19 | Panasonic Intellectual Property Managment Co., Ltd. | Infrared sensor element |
EP2306539A4 (en) * | 2008-06-27 | 2013-06-12 | Panasonic Corp | PIEZOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING THE SAME |
US8030823B2 (en) * | 2009-01-26 | 2011-10-04 | Resonance Semiconductor Corporation | Protected resonator |
US9735338B2 (en) | 2009-01-26 | 2017-08-15 | Cymatics Laboratories Corp. | Protected resonator |
US8164234B2 (en) * | 2009-02-26 | 2012-04-24 | Fujifilm Corporation | Sputtered piezoelectric material |
WO2010122707A1 (en) * | 2009-04-20 | 2010-10-28 | パナソニック株式会社 | Piezoelectric thin film and manufacturing method therefor, inkjet head, method for forming images using an inkjet head, angular velocity sensor, method for measuring angular velocity using an angular velocity sensor, piezoelectric element, and method for generating electricity using piezoelectric elements |
JP5305027B2 (en) * | 2009-07-16 | 2013-10-02 | セイコーエプソン株式会社 | Liquid ejecting head, liquid ejecting apparatus, and piezoelectric element |
JP2011088369A (en) * | 2009-10-23 | 2011-05-06 | Seiko Epson Corp | Liquid ejection head, liquid ejection device and piezoelectric element |
JP2011103327A (en) * | 2009-11-10 | 2011-05-26 | Seiko Epson Corp | Piezoelectric element, piezoelectric actuator, liquid injection head, and liquid injection device |
JP2011142280A (en) * | 2010-01-09 | 2011-07-21 | Seiko Epson Corp | Actuator apparatus, method of manufacturing the same, method of manufacturing liquid injection head, and method of manufacturing liquid injection equipment |
US9761785B2 (en) | 2011-10-17 | 2017-09-12 | The United States Of America As Represented By The Secretary Of The Army | Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing |
US8866367B2 (en) | 2011-10-17 | 2014-10-21 | The United States Of America As Represented By The Secretary Of The Army | Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making |
CN102583497A (en) * | 2011-11-23 | 2012-07-18 | 陕西科技大学 | Method adopting sol-gel to prepare high-temperature superconductivity parent-phase material, i.e. La2CuO4 powder |
JP5998531B2 (en) * | 2012-03-09 | 2016-09-28 | 株式会社リコー | Electro-mechanical transducer, droplet discharge head, and droplet discharge device |
JP5998537B2 (en) * | 2012-03-12 | 2016-09-28 | 株式会社リコー | Electro-mechanical conversion element, droplet discharge head, and droplet discharge apparatus |
JP5998543B2 (en) * | 2012-03-13 | 2016-09-28 | 株式会社リコー | Electro-mechanical conversion element, droplet discharge head, and droplet discharge apparatus |
US20130320813A1 (en) * | 2012-06-04 | 2013-12-05 | Tdk Corporation | Dielectric device |
US8994251B2 (en) * | 2012-08-03 | 2015-03-31 | Tdk Corporation | Piezoelectric device having first and second non-metal electroconductive intermediate films |
JP6376690B2 (en) * | 2014-08-28 | 2018-08-22 | 東芝テック株式会社 | Droplet ejecting apparatus and image forming apparatus |
JP6575743B2 (en) * | 2015-01-30 | 2019-09-18 | セイコーエプソン株式会社 | Method of driving liquid jet head, piezoelectric element, and liquid jet head |
KR102576924B1 (en) | 2016-03-09 | 2023-09-11 | (주)와이솔 | SAW Resonator having negative profile Metal Structure and the Manufacturing Method thefeof |
TWI717498B (en) * | 2016-06-21 | 2021-02-01 | 日商前進材料科技股份有限公司 | Membrane structure and manufacturing method thereof |
US10272692B2 (en) * | 2016-09-13 | 2019-04-30 | Toshiba Tec Kabushiki Kaisha | Liquid circulation device, liquid ejection apparatus, and liquid ejection method |
JP6790776B2 (en) * | 2016-12-07 | 2020-11-25 | Tdk株式会社 | Piezoelectric thin film laminates, piezoelectric thin film substrates, piezoelectric thin film elements, piezoelectric actuators, piezoelectric sensors, head assemblies, head stack assemblies, hard disk drives, printer heads, and inkjet printer devices. |
CN107443919A (en) * | 2017-09-19 | 2017-12-08 | 吉林大学 | A kind of printer ink supply system with pressurization piezoelectric pump |
JP7167337B2 (en) * | 2019-06-12 | 2022-11-08 | 富士フイルム株式会社 | Piezoelectric element and method for manufacturing piezoelectric element |
CN113966552A (en) * | 2019-06-12 | 2022-01-21 | 富士胶片株式会社 | Piezoelectric element |
US11581870B2 (en) * | 2019-09-27 | 2023-02-14 | Skyworks Solutions, Inc. | Stacked acoustic wave resonator package with laser-drilled VIAS |
JP7237032B2 (en) * | 2020-02-17 | 2023-03-10 | 富士フイルム株式会社 | Substrate with piezoelectric film, piezoelectric element and vibration power generation element |
CN116134186A (en) | 2020-07-28 | 2023-05-16 | 富士胶片株式会社 | Substrate with piezoelectric film and piezoelectric element |
JP7575335B2 (en) | 2021-04-05 | 2024-10-29 | 株式会社アルバック | Method for forming piezoelectric film and piezoelectric device |
WO2022250016A1 (en) * | 2021-05-27 | 2022-12-01 | 株式会社村田製作所 | Elastic wave device |
JP7636302B2 (en) * | 2021-08-31 | 2025-02-26 | 富士フイルム株式会社 | Piezoelectric laminate and piezoelectric element |
JP7617824B2 (en) * | 2021-08-31 | 2025-01-20 | 富士フイルム株式会社 | Piezoelectric laminate and piezoelectric element |
CN115567027B (en) * | 2022-11-03 | 2023-07-07 | 常州承芯半导体有限公司 | Transducer, surface acoustic wave resonator, method of forming the same, and filter |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5270298A (en) * | 1992-03-05 | 1993-12-14 | Bell Communications Research, Inc. | Cubic metal oxide thin film epitaxially grown on silicon |
WO2002009160A2 (en) * | 2000-07-24 | 2002-01-31 | Motorola, Inc. | Piezoelectric structures for acoustic wave devices and manufacturing processes |
WO2003098714A1 (en) * | 2002-05-15 | 2003-11-27 | Seiko Epson Corporation | Piezoelectric actuator and liquid jet head |
US20040043520A1 (en) * | 2002-08-29 | 2004-03-04 | Fujitsu Limited | Device having capacitor and its manufacture |
EP1396877A2 (en) * | 2002-09-05 | 2004-03-10 | Seiko Epson Corporation | Substrate for electronic devices, manufacturing method therefor, and electronic device |
Family Cites Families (16)
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JPH07187614A (en) | 1987-04-08 | 1995-07-25 | Hitachi Ltd | Method for producing superconducting oxide and superconductor device |
US5096882A (en) | 1987-04-08 | 1992-03-17 | Hitachi, Ltd. | Process for controlling oxygen content of superconductive oxide, superconductive device and process for production thereof |
JP3684059B2 (en) | 1998-01-07 | 2005-08-17 | 株式会社東芝 | Semiconductor device |
JP4051654B2 (en) | 2000-02-08 | 2008-02-27 | セイコーエプソン株式会社 | Piezoelectric element, ink jet recording head, manufacturing method thereof, and ink jet printer |
JP2003298134A (en) * | 2002-01-31 | 2003-10-17 | Toyota Motor Corp | Multilayer piezoelectric actuator |
US7083270B2 (en) * | 2002-06-20 | 2006-08-01 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus |
JP2004066600A (en) | 2002-08-05 | 2004-03-04 | Seiko Epson Corp | Liquid ejecting head and liquid ejecting apparatus |
JP2004179642A (en) | 2002-11-11 | 2004-06-24 | Seiko Epson Corp | Piezoelectric device, liquid ejection head, ferroelectric device, electronic apparatus, and manufacturing method thereof |
US7268472B2 (en) | 2002-11-11 | 2007-09-11 | Seiko Epson Corporation | Piezoelectric device, liquid jetting head, ferroelectric device, electronic device and methods for manufacturing these devices |
JP4521751B2 (en) * | 2003-03-26 | 2010-08-11 | 国立大学法人東京工業大学 | Lead zirconate titanate-based film, dielectric element, and method for manufacturing dielectric film |
JP4058018B2 (en) * | 2003-12-16 | 2008-03-05 | 松下電器産業株式会社 | Piezoelectric element and method for manufacturing the same, ink jet head including the piezoelectric element, ink jet recording apparatus, and angular velocity sensor |
JP2005302933A (en) * | 2004-04-09 | 2005-10-27 | Seiko Epson Corp | Piezoelectric element, piezoelectric actuator, ink jet recording head, ink jet printer, surface acoustic wave element, frequency filter, oscillator, electronic circuit, thin film piezoelectric resonator, and electronic device |
JP4344942B2 (en) * | 2004-12-28 | 2009-10-14 | セイコーエプソン株式会社 | Inkjet recording head and piezoelectric actuator |
US7696549B2 (en) * | 2005-08-04 | 2010-04-13 | University Of Maryland | Bismuth ferrite films and devices grown on silicon |
US20070029592A1 (en) * | 2005-08-04 | 2007-02-08 | Ramamoorthy Ramesh | Oriented bismuth ferrite films grown on silicon and devices formed thereby |
US8119022B2 (en) * | 2005-11-04 | 2012-02-21 | Ceracomp Co., Ltd. | Piezoelectric single crystal and method of production of same, piezoelectric element, and dielectric element |
-
2004
- 2004-12-28 JP JP2004380988A patent/JP4431891B2/en not_active Expired - Fee Related
-
2005
- 2005-12-15 US US11/304,937 patent/US7622850B2/en active Active
- 2005-12-21 EP EP20050028010 patent/EP1677368B1/en not_active Not-in-force
- 2005-12-23 CN CNB200510134075XA patent/CN100511744C/en not_active Expired - Fee Related
- 2005-12-27 KR KR20050130155A patent/KR100682432B1/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5270298A (en) * | 1992-03-05 | 1993-12-14 | Bell Communications Research, Inc. | Cubic metal oxide thin film epitaxially grown on silicon |
WO2002009160A2 (en) * | 2000-07-24 | 2002-01-31 | Motorola, Inc. | Piezoelectric structures for acoustic wave devices and manufacturing processes |
WO2003098714A1 (en) * | 2002-05-15 | 2003-11-27 | Seiko Epson Corporation | Piezoelectric actuator and liquid jet head |
EP1505663A1 (en) * | 2002-05-15 | 2005-02-09 | Seiko Epson Corporation | Piezoelectric actuator and liquid jet head |
US20040043520A1 (en) * | 2002-08-29 | 2004-03-04 | Fujitsu Limited | Device having capacitor and its manufacture |
EP1396877A2 (en) * | 2002-09-05 | 2004-03-10 | Seiko Epson Corporation | Substrate for electronic devices, manufacturing method therefor, and electronic device |
Non-Patent Citations (1)
Title |
---|
ZHANG Q Q ET AL: "High performance piezoelectric films for high frequency MEMS ultrasonic transducers", 2004 IEEE ULTRASONICS SYMPOSIUM, 23-27 AUGUST 2004, MONTREAL, CANADA, vol. 3, August 2004 (2004-08-01), pages 1954 - 1957, XP010784375, ISBN: 0-7803-8412-1 * |
Also Published As
Publication number | Publication date |
---|---|
US7622850B2 (en) | 2009-11-24 |
CN1805164A (en) | 2006-07-19 |
KR100682432B1 (en) | 2007-02-15 |
CN100511744C (en) | 2009-07-08 |
JP4431891B2 (en) | 2010-03-17 |
KR20060076694A (en) | 2006-07-04 |
EP1677368B1 (en) | 2011-06-22 |
JP2006186258A (en) | 2006-07-13 |
US20060139414A1 (en) | 2006-06-29 |
EP1677368A2 (en) | 2006-07-05 |
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