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EP1448336A4 - Method of laser milling using constant tool path algorithm - Google Patents

Method of laser milling using constant tool path algorithm

Info

Publication number
EP1448336A4
EP1448336A4 EP02782385A EP02782385A EP1448336A4 EP 1448336 A4 EP1448336 A4 EP 1448336A4 EP 02782385 A EP02782385 A EP 02782385A EP 02782385 A EP02782385 A EP 02782385A EP 1448336 A4 EP1448336 A4 EP 1448336A4
Authority
EP
European Patent Office
Prior art keywords
tool path
path algorithm
laser milling
constant tool
constant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02782385A
Other languages
German (de)
French (fr)
Other versions
EP1448336A1 (en
Inventor
Chen-Hsiung Cheng
Xinbing Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/266,934 external-priority patent/US6897405B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP1448336A1 publication Critical patent/EP1448336A1/en
Publication of EP1448336A4 publication Critical patent/EP1448336A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Numerical Control (AREA)
EP02782385A 2001-11-30 2002-11-27 Method of laser milling using constant tool path algorithm Withdrawn EP1448336A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US266934 1994-06-27
US33474601P 2001-11-30 2001-11-30
US334746P 2001-11-30
US10/266,934 US6897405B2 (en) 2001-11-30 2002-10-08 Method of laser milling using constant tool path algorithm
PCT/US2002/037962 WO2003047805A1 (en) 2001-11-30 2002-11-27 Method of laser milling using constant tool path algorithm

Publications (2)

Publication Number Publication Date
EP1448336A1 EP1448336A1 (en) 2004-08-25
EP1448336A4 true EP1448336A4 (en) 2006-03-15

Family

ID=26952122

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02782385A Withdrawn EP1448336A4 (en) 2001-11-30 2002-11-27 Method of laser milling using constant tool path algorithm

Country Status (4)

Country Link
EP (1) EP1448336A4 (en)
JP (1) JP4455884B2 (en)
CN (1) CN1295052C (en)
AU (1) AU2002348254A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
EP1993781A4 (en) 2006-02-03 2016-11-09 Semiconductor Energy Lab Co Ltd METHOD FOR MANUFACTURING MEMORY ELEMENT, LASER IRRADIATION APPARATUS, AND LASER IRRADIATION METHOD
JP5178022B2 (en) * 2006-02-03 2013-04-10 株式会社半導体エネルギー研究所 Method for manufacturing memory element
US8580700B2 (en) 2006-02-17 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7532378B2 (en) 2006-02-21 2009-05-12 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, method of laser irradiation, and method for manufacturing semiconductor device
JP4833773B2 (en) * 2006-08-31 2011-12-07 本田技研工業株式会社 Micro drilling method
JP5122833B2 (en) * 2007-02-20 2013-01-16 ファナック株式会社 Laser processing method and laser processing apparatus
US8481887B2 (en) * 2007-05-03 2013-07-09 Electro Scientific Industries, Inc. Method for machining tapered micro holes
EP2163339B1 (en) * 2008-09-11 2016-11-02 Bystronic Laser AG Laser cutting assembly for cutting a work piece with a laser beam with a variable cutting speed
CN101811229B (en) * 2009-02-19 2013-12-25 株式会社日立高科技 Laser processing method, laser processing apparatus and method for manufacturing solar panel
US9289858B2 (en) * 2011-12-20 2016-03-22 Electro Scientific Industries, Inc. Drilling holes with minimal taper in cured silicone
DE102012111771B4 (en) * 2012-12-04 2020-12-03 Ewag Ag Method for machining a workpiece using a laser machining device for manufacturing a cutting tool
CN104439716A (en) * 2014-11-17 2015-03-25 深圳锜宏伟科技有限公司 Laser processing system and laser processing method
CN104985329B (en) * 2015-06-16 2016-09-21 沈阳飞机工业（集团）有限公司 Hyperbolicity solid milling part laser incising type processing method
CN111136389A (en) * 2020-01-22 2020-05-12 苏州德龙激光股份有限公司 Device and method for cutting pi screen plate by laser imaging method
CN113427137A (en) * 2020-03-06 2021-09-24 大族激光科技产业集团股份有限公司 Hole machining method
CN111822887B (en) * 2020-07-14 2022-04-26 深圳中科光子科技有限公司 Processing system and method for laser drilling thick glass
EP4275906B1 (en) 2021-01-05 2025-03-05 Konica Minolta, Inc. Inkjet head nozzle plate, manufacturing method therefor, inkjet head, and inkjet recording device
CN117733358B (en) * 2024-01-04 2024-07-23 江苏富乐华半导体科技股份有限公司 Reworking method for engraving two-dimensional codes on copper-clad plate
CN118060708B (en) * 2024-04-22 2024-08-27 深圳市圭华智能科技有限公司 Battery laser processing equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1425340A (en) * 1972-08-25 1976-02-18 Europ Rotogravure Ass Method of engraving a printing member by means of a beam of energy
US4718418A (en) * 1983-11-17 1988-01-12 Lri L.P. Apparatus for ophthalmological surgery
EP0308512A1 (en) * 1987-02-24 1989-03-29 Nippon Steel Corporation Apparatus for dull finish of roll with pulse laser
US5237148A (en) * 1990-10-04 1993-08-17 Brother Kogyo Kabushiki Device for manufacturing a nozzle and its manufacturing method
US5798927A (en) * 1995-03-20 1998-08-25 Electro Scientific Industries, Inc. Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system
US6231566B1 (en) * 1998-08-12 2001-05-15 Katana Research, Inc. Method for scanning a pulsed laser beam for surface ablation

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DE2829851A1 (en) * 1978-07-07 1980-01-24 Precitec Gmbh ARRANGEMENT FOR MEASURING THE DISTANCE BETWEEN A METAL WORKPIECE AND A MACHINING TOOL
US4270421A (en) * 1979-03-22 1981-06-02 The United States Of America As Represented By The United States Department Of Energy Apparatus for correcting precision errors in slide straightness in machine tools
US4754208A (en) * 1986-11-17 1988-06-28 Nippon Kokan Kabushiki Kaisha Circular path control apparatus and method for multi-axis servomechanisms
JPH11281814A (en) * 1998-03-30 1999-10-15 Sekisui Chem Co Ltd Manufacture of color filter

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1425340A (en) * 1972-08-25 1976-02-18 Europ Rotogravure Ass Method of engraving a printing member by means of a beam of energy
US4718418A (en) * 1983-11-17 1988-01-12 Lri L.P. Apparatus for ophthalmological surgery
EP0308512A1 (en) * 1987-02-24 1989-03-29 Nippon Steel Corporation Apparatus for dull finish of roll with pulse laser
US5237148A (en) * 1990-10-04 1993-08-17 Brother Kogyo Kabushiki Device for manufacturing a nozzle and its manufacturing method
US5798927A (en) * 1995-03-20 1998-08-25 Electro Scientific Industries, Inc. Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system
US6231566B1 (en) * 1998-08-12 2001-05-15 Katana Research, Inc. Method for scanning a pulsed laser beam for surface ablation

Non-Patent Citations (1)

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Title
See also references of WO03047805A1 *

Also Published As

Publication number Publication date
CN1295052C (en) 2007-01-17
JP2005511312A (en) 2005-04-28
CN1596172A (en) 2005-03-16
EP1448336A1 (en) 2004-08-25
JP4455884B2 (en) 2010-04-21
AU2002348254A1 (en) 2003-06-17

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Inventor name: LIU, XINBING

Inventor name: CHENG, CHEN-HSIUNG

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