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EP1414065A3 - Configuration of power devices enabeling the mechatronic integration of power devices - Google Patents

Configuration of power devices enabeling the mechatronic integration of power devices Download PDF

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Publication number
EP1414065A3
EP1414065A3 EP03022929A EP03022929A EP1414065A3 EP 1414065 A3 EP1414065 A3 EP 1414065A3 EP 03022929 A EP03022929 A EP 03022929A EP 03022929 A EP03022929 A EP 03022929A EP 1414065 A3 EP1414065 A3 EP 1414065A3
Authority
EP
European Patent Office
Prior art keywords
power devices
power
enabeling
configuration
mechatronic integration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03022929A
Other languages
German (de)
French (fr)
Other versions
EP1414065A2 (en
Inventor
Ralf-Michael Franke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP1414065A2 publication Critical patent/EP1414065A2/en
Publication of EP1414065A3 publication Critical patent/EP1414065A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Conversion In General (AREA)

Abstract

Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen, die für die mechatronische Integration verschiedener Leistungsbauelemente in die Applikation geeignet ist, mit einer Mehrzahl von Leistungsbauelementen, insbesondere IGBTs und/oder Leistungsdioden, einer Leiterplatte, auf der die Leistungsbauelemente gehäusefrei angeordnet sind, mindestens einem Kühlkörper zur Wärmeabführung von den Leistungsbauelementen und einem mit dem Kühlkörper verbundenen Druckmontagerahmen, der die auf der Leiterplatte angeordneten Leistungsbauelemente in Wärmeleitkontakt mit dem Kühlkörper hält.

Figure imgaf001
Power component assembly for mechatronic integration of power devices, which is suitable for the mechatronic integration of various power components in the application, with a plurality of power devices, in particular IGBTs and / or power diodes, a circuit board on which the power components are arranged without a housing, at least one heat sink for heat dissipation of the power devices and a pressure mounting frame connected to the heat sink, which holds the arranged on the circuit board power components in Wärmeleitkontakt with the heat sink.
Figure imgaf001
EP03022929A 2002-10-22 2003-10-09 Configuration of power devices enabeling the mechatronic integration of power devices Withdrawn EP1414065A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10249205 2002-10-22
DE10249205A DE10249205B3 (en) 2002-10-22 2002-10-22 Power component arrangement for the mechatronic integration of power components

Publications (2)

Publication Number Publication Date
EP1414065A2 EP1414065A2 (en) 2004-04-28
EP1414065A3 true EP1414065A3 (en) 2006-05-24

Family

ID=32049545

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03022929A Withdrawn EP1414065A3 (en) 2002-10-22 2003-10-09 Configuration of power devices enabeling the mechatronic integration of power devices

Country Status (3)

Country Link
US (1) US6867972B2 (en)
EP (1) EP1414065A3 (en)
DE (1) DE10249205B3 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881077B2 (en) * 2002-07-22 2005-04-19 Siemens Vdo Automotive Corporation Automotive control module housing
US20050213299A1 (en) * 2004-03-29 2005-09-29 Hardt Thomas T Memory package
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
DE102005022226B4 (en) * 2005-05-10 2008-05-15 RUNGE, André Cooling arrangement for arranged in a housing electronic components
DE102006052620B4 (en) * 2006-11-08 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Circuit arrangement with a power module that is combined with a printed circuit board.
DE102008014653A1 (en) 2008-03-17 2009-09-24 Robert Bosch Gmbh Device with semiconductor component and manufacturing method
US7778033B2 (en) * 2008-10-30 2010-08-17 Astec International Limited Thermally conductive covers for electric circuit assemblies
CN105814978B (en) * 2014-01-08 2018-06-22 恩菲斯能源公司 Double insulation radiator
KR101836969B1 (en) 2016-07-06 2018-03-09 현대오트론 주식회사 Electronic control unit having heat conductive medium fiiling module and method for manufacturing the same
SG11202104077RA (en) * 2019-01-31 2021-05-28 Yamaichi Electronics Co Ltd Socket for inspection

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3995310A (en) * 1974-12-23 1976-11-30 General Electric Company Semiconductor assembly including mounting plate with recessed periphery
DE8427885U1 (en) * 1984-09-21 1985-01-03 Siemens AG, 1000 Berlin und 8000 München Device for fastening a heat sink on several integrated modules arranged next to one another
US5280409A (en) * 1992-10-09 1994-01-18 Sun Microsystems, Inc. Heat sink and cover for tab integrated circuits
DE4410029A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Spring-loaded heat sink arrangement for a plurality of integrated circuits on a substrate
EP0654822A1 (en) * 1993-11-19 1995-05-24 BULL HN INFORMATION SYSTEMS ITALIA S.p.A. Heat sink assembly for integrated circuit
DE4407810A1 (en) * 1994-03-09 1995-09-21 Semikron Elektronik Gmbh Switching arrangement allowing larger packing density
US6055158A (en) * 1999-03-16 2000-04-25 Framatome Connectors Interlock, Inc. Electronic component heat sink assembly
JP2000277542A (en) * 1999-03-25 2000-10-06 Sanyo Electric Co Ltd Semiconductor device
US6188576B1 (en) * 1999-05-13 2001-02-13 Intel Corporation Protective cover and packaging for multi-chip memory modules
US20020149055A1 (en) * 2001-04-11 2002-10-17 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including insulating substrate formed of single-crystal silicon chip
EP1316999A1 (en) * 2001-11-28 2003-06-04 Continental ISAD Electronic Systems GmbH & Co. oHG Method and device of contacting power electronic devices

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19600619A1 (en) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Control unit consisting of at least two housing parts
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
DE19832710A1 (en) * 1998-07-14 2000-01-27 Siemens Ag Electro-optical assembly for data transmission
US6396127B1 (en) * 1998-09-25 2002-05-28 International Rectifier Corporation Semiconductor package
DE10002362A1 (en) * 2000-01-20 2001-08-02 Infineon Technologies Ag Semiconducting component enables heat to be easily conducted away - has diode with two connections connected to two carrier arrangement connecting parts via current and heat conducting connecting parts
US6459582B1 (en) * 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
TW511885U (en) * 2002-01-30 2002-11-21 Hon Hai Prec Ind Co Ltd Assembly of heat dissipation apparatus
US20040042178A1 (en) * 2002-09-03 2004-03-04 Vadim Gektin Heat spreader with surface cavity

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3995310A (en) * 1974-12-23 1976-11-30 General Electric Company Semiconductor assembly including mounting plate with recessed periphery
DE8427885U1 (en) * 1984-09-21 1985-01-03 Siemens AG, 1000 Berlin und 8000 München Device for fastening a heat sink on several integrated modules arranged next to one another
US5280409A (en) * 1992-10-09 1994-01-18 Sun Microsystems, Inc. Heat sink and cover for tab integrated circuits
DE4410029A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Spring-loaded heat sink arrangement for a plurality of integrated circuits on a substrate
EP0654822A1 (en) * 1993-11-19 1995-05-24 BULL HN INFORMATION SYSTEMS ITALIA S.p.A. Heat sink assembly for integrated circuit
DE4407810A1 (en) * 1994-03-09 1995-09-21 Semikron Elektronik Gmbh Switching arrangement allowing larger packing density
US6055158A (en) * 1999-03-16 2000-04-25 Framatome Connectors Interlock, Inc. Electronic component heat sink assembly
JP2000277542A (en) * 1999-03-25 2000-10-06 Sanyo Electric Co Ltd Semiconductor device
US6188576B1 (en) * 1999-05-13 2001-02-13 Intel Corporation Protective cover and packaging for multi-chip memory modules
US20020149055A1 (en) * 2001-04-11 2002-10-17 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including insulating substrate formed of single-crystal silicon chip
EP1316999A1 (en) * 2001-11-28 2003-06-04 Continental ISAD Electronic Systems GmbH & Co. oHG Method and device of contacting power electronic devices

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"COOLING ENHANCEMENT OF INTEL 386/486 BY CLIP-ON HEAT SINK", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 33, no. 2, 1 July 1990 (1990-07-01), pages 218 - 219, XP000123594, ISSN: 0018-8689 *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05) *

Also Published As

Publication number Publication date
US6867972B2 (en) 2005-03-15
EP1414065A2 (en) 2004-04-28
DE10249205B3 (en) 2004-08-05
US20040075985A1 (en) 2004-04-22

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