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EP1414060A2 - System for the detection of substrates arranged one above the other with a determined distance - Google Patents

System for the detection of substrates arranged one above the other with a determined distance Download PDF

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Publication number
EP1414060A2
EP1414060A2 EP03024416A EP03024416A EP1414060A2 EP 1414060 A2 EP1414060 A2 EP 1414060A2 EP 03024416 A EP03024416 A EP 03024416A EP 03024416 A EP03024416 A EP 03024416A EP 1414060 A2 EP1414060 A2 EP 1414060A2
Authority
EP
European Patent Office
Prior art keywords
opening
transmitting
sensor head
vertical drive
wall element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03024416A
Other languages
German (de)
French (fr)
Other versions
EP1414060A3 (en
Inventor
Ulysses Gilchrist
Louise S. Barriss
Hagen Raue
Berndt Lahne
Manfred Heinze
Joachim König
Klaus Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brooks Automation Germany GmbH
Original Assignee
Brooks PRI Automation Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks PRI Automation Germany GmbH filed Critical Brooks PRI Automation Germany GmbH
Publication of EP1414060A2 publication Critical patent/EP1414060A2/en
Publication of EP1414060A3 publication Critical patent/EP1414060A3/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Definitions

  • the invention relates to a device for the detection of substrates arranged one above the other at a certain distance at an opening of a wall element with a closure for the opening, which can be adjusted in at least two different directions relative to the wall element by means of a drive positioned below the opening and with a transmitting and receiving device for transmitting and receiving a horizontally directed measuring beam.
  • a presence and occupancy control a so-called mapping
  • the handling system can work more effectively and avoid idle routines.
  • Known detection devices work as fixed optical systems or as movable systems based on light barriers.
  • a known fixed optical system according to US Pat. No. 6,147,356 is constructed in such a way that at least two linearly extended rows of light sources are arranged parallel to a set of planes specified by the container compartments and substrates and lie in one area parallel to the edge regions to be detected.
  • a lens is arranged between the parallel rows of light sources, with which a large number of container compartments are simultaneously imaged onto a sensor array, from which at least portions of an edge region of the substrate that is transversely extended can be read out so that any irregularity present in the edge region is always present when it is imaged on the sensor array is smaller than the read-out portions of the edge area.
  • the transmitting and receiving device consists of a vertical drive attached to the wall element and a sensor head which can be adjusted between a lower and an upper position by the vertical drive is rotatably mounted on the vertical drive for pivoting into the opening.
  • the device according to the invention allows greater flexibility of the measuring processes for position detection, since these are not connected to a movement sequence of another functional unit, such as, for. B. the closure when opening and closing the opening in the wall element or a handling system, which serves to remove and return the substrates, but is not part of the device according to the invention.
  • the movement sequence of the transmitting and receiving device in no way interferes with the other movement sequences, since the vertical drive is attached to the wall element below the opening and outside the movement range of the closure.
  • the vertical drive carries the sensor head on a swivel head with a horizontally directed swivel axis, which is attached to a vertically extendable arm.
  • the pivot axis can run through a hollow shaft on which the sensor head is placed and which can be rotated between two end position positions.
  • a special embodiment of the invention provides that the sensor head is designed as a fork light barrier, in which a transmitter is attached to a first fork end for transmitting a measurement beam directed along the measuring beam path to the other fork end, and a beam deflection device is attached to the other fork end is provided, from which an optical fiber coupled to it is guided outside the measuring beam path by means of optics in a light-tight manner to a receiver at the first fork end.
  • This design on the one hand enables the transmitter and receiver to form a unit and the free end of the fork is not burdened by a receiver, and on the other hand prevents interference from stray and external light.
  • the measurement object that is passed between the two fork ends during the vertical movement of the sensor head is picked up in a radiographic method with the receiver and evaluated in a control and evaluation electronics that is connected to the receiver.
  • the vertical drive is constructed as a motor-spindle combination, which has an encoder for recognizing the vertical positions and which is connected to the control and evaluation electronics of the transmitting and receiving device, the measurement signals received from the receiver must be assigned to the determined positions.
  • the adjacent arrangement of the transmitter and receiver at the same fork end, the beam return of the measuring beam via the optical fiber and its light-tight coupling to the receiver ensure that the measured value is independent of the material properties. It is ensured that only the emitted measurement beam, which is not held back by the measurement object in the measurement beam path, reaches the receiver. External light influences caused by lighting, reflections and reflections on the existing surfaces and may have an interference effect on the measurement signal are excluded with the present sensor head, in contrast to the known measuring devices.
  • the sensor head is characterized by a very small installation space and a very low weight due to the beam guidance via the optical fiber, as a result of which vibration effects during lifting and swiveling are considerably reduced.
  • the rotatable mounting of the fork light barrier on the vertical drive can advantageously be designed such that the horizontally directed pivot axis runs parallel and at a distance from the measuring beam path, so that the fork ends pass through the opening in the wall element when pivoted about the pivot axis. In this way, a compact device with a measuring beam path that can be brought up to the substrates to be detected is realized.
  • a laser is used as the transmitter with a bright measuring beam and a small opening angle, which can be precisely adapted to the thickness of the substrates.
  • the transmitting and receiving device is provided with its own control and evaluation electronics, which is connected to a bus system of a central logic control.
  • the transmitting and receiving device which is particularly suitable due to its constructive design, Subsequent installation in existing loading and unloading stations can thus be formed into a component of a modular system of functional units, in which each functional unit is equipped with its own control and evaluation electronics, which is connected to the central logic control via the bus system.
  • the control and evaluation electronics of the transmitting and receiving device and that of the other functional units, such as. B. the lock can be easily separated from the bus system. It is also possible to add further functional units or to exchange them, whereby the immediate functionality is guaranteed in any case.
  • the sensor head of the transmitting and receiving device can also be designed as a reflex measuring device, in which the transmitter and receiver are arranged adjacent to one another on the sensor head.
  • the measuring beam emitted by the transmitter instead of in the transmission method, is recorded with the receiver after its reflection on the substrate to be detected.
  • an opening 4 serving for loading and unloading a container 3 equipped with semiconductor wafers 2 as substrates is incorporated into a frame-shaped wall element 1.
  • a closure 6 in the open position is attached to a height-adjustable arm 7 against the wall element 1, for which in a housing part 8 both for height adjustment and for adjusting the arm 7 against the wall element 1 drive means, e.g. B. are provided in the form of lifting cylinders.
  • the arm 7 can also be pivoted in the lower region about a horizontal axis.
  • the closure 6 carries a container door 9 already removed from the side of the container 3 to be opened during the opening process.
  • a vertical drive 10 of a transmitting and receiving device 11 is attached, which is in a position between a lower and an upper position adjustable arm 12 carries a sensor head 13. 1, the sensor head 13 is in the lower position P serving as the rest position and in FIG. 2 in a working position lying between the lower and the upper position, in which the sensor head 13 is 90 ° from the rest position. Swivel defined to the semiconductor wafer 2 and protrudes into the opening 4.
  • a housing part 14 Structurally coupled to the vertical drive 10 is a housing part 14 in which the control and evaluation electronics required for the transmitting and receiving device 11 are accommodated, which are connected in a manner not shown to a bus system of a central logic control.
  • FIG. 3 illustrates the vertical drive 10, which contains a DC servo drive motor 15 provided with an encoder with a high positioning accuracy of less than 100 ⁇ m, which drives a precision spindle 16 via a toothed belt drive ,
  • the toothed belt is tensioned by an eccentric motor rotation.
  • the vertically extendable arm 12 made of highly rigid material is forcibly coupled via a precision linear guide 17 carries the sensor head 13 designed as a forked light barrier on an angled swivel head 18.
  • the pivot head 18 contains a hollow shaft 19 shown in FIG. 4, on which the sensor head 13 is placed for pivoting between the positions of the rest position and the working position.
  • the positions differing by 90 ° are ensured by an end position stop 20 and an electrically set holding torque of a DC drive motor 21 provided for driving the hollow shaft 19 and are approached via a speed profile.
  • (Hall) sensors are provided on a printed circuit board 22 for the sensor connection on a closing plate 23.
  • the sensor head 13 shown in FIGS. 5 and 6 is designed as a weight-minimized curved fork 24, in which a transmitter 26 in the form of a laser for emitting a measuring beam is attached to a first fork end 25, which serves as a transmitting and receiving part a first deflecting mirror 27 is directed along a measuring beam path MM to the other fork end 28.
  • a second deflecting mirror 29 incorporated into the structure of the fork 24 at the other fork end 28 couples the measuring beam via a converging lens 30 into an optical fiber 31 which, outside of the measuring beam path MM in the fork 24, is light-tight to a receiver 32 on the outside by means of an optics hidden here first fork end 25 is guided.
  • the laser transmitter 26 ensures an optimal focus at the edge of the semiconductor wafer 2 and thus a sufficient resolution of the thickness of the semiconductor wafer 2.
  • a parallel bore 33 is provided adjacent to the measuring beam path MM, which results in a pivot axis SS for the sensor head 13, so that when pivoting about the pivot axis SS the fork ends 25 and 28 through the Pass opening 4 in wall element 1.
  • the working with the device according to the invention takes place in a way that prevents the functions of opening, access of a handling device and further sensor elements defined by SEMI standards from being impeded.
  • the sensor head 13 is moved to the upper position above the highest possible position of a semiconductor wafer 2, the transmitter 26 and the receiver 32 are switched on and the light barrier operation is tested. Then will the sensor head 13 with the vertical drive 10 is moved past all possible semiconductor wafers 2 and without a stop, the vertical coordinates of the light barrier interruptions to register the presence and the position of the semiconductor wafers 2 are registered in the container 3. The vertical movement downwards is preferred, since vibration effects are reduced. While the presence of a semiconductor wafer 2 results from a measurement beam interruption, the vertical position is determined from the measurement results (position) taken by the encoder on the vertical drive 10 at the time of the beam interruption and the beam release. In contrast to fixed optical systems, the resulting position values can be processed immediately and can be transferred to a handling system, for example.
  • the thickness of the semiconductor wafers 2 is within defined limits, it can also be determined from the determined differences between two measured values whether there is a double occupancy of a subject or an inclined position of a semiconductor wafer 2.
  • the determined data are fed to the control and evaluation electronics, evaluated there and displayed as saved results on a monitor, not shown.
  • the sensor head 13 is moved into the lowest possible swivel-back position, there it is pivoted back through 90 ° about the swivel axis SS and thus swiveled out of the opening 4 and then lowered into the parking position P.
  • the advantage of the device according to the invention is also shown in the fact that an intermediate position lying at the upper edge of the opening 4 can be assumed, from which intermediate diameters are also possible, if necessary. Alternating movement sequences are also possible to optimize the time sequences.
  • the sensor is then swiveled into a lower position, moves to a lower start position and determines the measured values while moving to an upper end position. In this upper end position, the sensor arch is pivoted back and positioned in a rest position above the opening. The subsequent measurement is then carried out in the reverse order. The idle movements can be reduced by this process.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The equipment includes a transceiver (11) for transmitting and receiving a horizontally directed measurement beam. The transceiver consists of a vertical drive (10) that is attached to a wall element and a sensor head that can be shifted between a lower and an upper position by the vertical drive. The sensor can be turned in the opening (4) of the wall element.

Description

Die Erfindung bezieht sich auf eine Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten an einer Öffnung eines Wandelementes mit einem Verschluss für die Öffnung, der durch einen unterhalb der Öffnung positionierten Antrieb in wenigsten zwei unterschiedlichen Richtungen relativ zu dem Wandelement verstellbar ist und mit einer Sendeund Empfangseinrichtung zum Aussenden und Empfangen eines horizontal gerichteten Messstrahls.The invention relates to a device for the detection of substrates arranged one above the other at a certain distance at an opening of a wall element with a closure for the opening, which can be adjusted in at least two different directions relative to the wall element by means of a drive positioned below the opening and with a transmitting and receiving device for transmitting and receiving a horizontally directed measuring beam.

Bei der Bearbeitung von Substraten, wie Halbleiterwafer, Flachschirmanzeigen oder Masken werden diese in der Regel einzeln in Fächern eines Behälters untergebracht, um sie mit automatischen Ausrüstungen handhaben zu können. Auf Grund der großen Anzahl von technologischen Schritten macht es sich wegen des damit verbundenen hohen Kostenaufwandes erforderlich, Schäden, die durch Fehler bei der Handhabung der Substrate entstehen können und zu deren Unbrauchbarkeit führen, zu vermeiden bzw. auf ein Minimum zu beschränken.When processing substrates such as semiconductor wafers, flat screen displays or masks, these are usually accommodated individually in compartments of a container in order to be able to handle them with automatic equipment. Due to the large number of technological steps, it is necessary, due to the high cost involved, to avoid or to minimize to a minimum any damage which may result from errors in the handling of the substrates and lead to their uselessness.

Aus diesem Grund wird vor der Entnahme der Substrate aus dem Behälter üblicherweise eine Anwesenheits- und Belegungskontrolle, ein sogenanntes Mapping durchgeführt, das dem Erkennen insbesondere von leeren Behälterfächern, der Doppelbelegung eines Behälterfaches oder Schräglagen der Substrate über zwei oder mehr Behälterfächer dient. Außerdem kann das Handhabungssystem durch genaue Kenntnis der tatsächlichen Positionen der Substrate effektiver arbeiten und Leerlaufroutinen vermeiden.
Bekannte Nachweiseinrichtungen arbeiten als feststehende optische Systeme oder als bewegliche Systeme auf Lichtschrankenbasis.For this reason, a presence and occupancy control, a so-called mapping, is usually carried out before the substrates are removed from the container, which is used to identify empty container compartments in particular, double occupancy of a container compartment or inclined positions of the substrates over two or more container compartments. In addition, by knowing the actual positions of the substrates accurately, the handling system can work more effectively and avoid idle routines.
Known detection devices work as fixed optical systems or as movable systems based on light barriers.

Ein bekanntes feststehendes optisches System nach der US 6 147 356 ist derart aufgebaut, dass mindestens zwei linear ausgedehnte Lichtquellenreihen parallel zu einer von den Behälterfächern und Substraten vorgegebenen Ebenenschar angeordnet sind und in einer Fläche parallel zu den zu detektierenden Kantenbereichen liegen. Zwischen den parallel angebrachten Lichtquellenreihen ist ein Objektiv angeordnet, mit dem eine Vielzahl von Behälterfächern gleichzeitig auf ein Sensorarray abgebildet wird, aus dem mindestens Anteile eines transversal soweit ausgedehnten Kantenbereiches des Substrates auslesbar sind, dass eine im Kantenbereich vorhandene Unregelmäßigkeit bei ihrer Abbildung auf das Sensorarray stets kleiner als die ausgelesenen Anteile des Kantenbereiches ist.
Zwar gestattet diese Lösung den Nachweis der Substrate unabhängig von deren Ausrichtung und von Unstetigkeiten in deren Randbereich, doch bleibt der allgemeine Nachteil feststehender optischer Systeme erhalten, dass eine ausreichende Reflektivität im Randbereich grundsätzlich vorhanden sein muss.A known fixed optical system according to US Pat. No. 6,147,356 is constructed in such a way that at least two linearly extended rows of light sources are arranged parallel to a set of planes specified by the container compartments and substrates and lie in one area parallel to the edge regions to be detected. A lens is arranged between the parallel rows of light sources, with which a large number of container compartments are simultaneously imaged onto a sensor array, from which at least portions of an edge region of the substrate that is transversely extended can be read out so that any irregularity present in the edge region is always present when it is imaged on the sensor array is smaller than the read-out portions of the edge area.
Although this solution allows the detection of the substrates regardless of their orientation and of discontinuities in their edge area, the general disadvantage of fixed optical systems remains that sufficient reflectivity must always be present in the edge area.

Diesen Nachteil können die auf Lichtschrankenbasis arbeitenden Sensorsysteme beheben, wie z. B. eine Einrichtung gemäß der US 6 188 323 B1, bei der das Sensorsystem mit einer für die Be- und Entladeöffnung vorgesehenen Tür verbunden ist. Das Sensorsystem, bei dem Sender und Empfänger gegenüberliegend und einander zugewandt angeordnet, an umklappbaren Hebeln befestigt sind, detektiert die Anwesenheit der Substrate im Behälter während des Absenkens der Tür. Dazu klappen die Hebel zu Beginn des Öffnungsvorganges in Richtung der Substrate aus und nach Beendigung des Öffnungs- und Messvorganges wieder ein. Zur Positionserkennung wird die Vertikalstellung des Türantriebes benutzt.This disadvantage can be remedied by the sensor systems working on the basis of light barriers, e.g. B. a device according to US Pat. No. 6,188,323 B1, in which the sensor system is connected to a door provided for the loading and unloading opening. The sensor system, in which the transmitter and receiver are arranged opposite and facing each other and attached to foldable levers, detects the presence of the substrates in the container while the door is being lowered. For this purpose, the levers fold out in the direction of the substrates at the beginning of the opening process and after the opening and Measuring process again. The vertical position of the door operator is used for position detection.

Durch die Anbindung des Erkennungsprozesses an den Bewegungsablauf der Tür werden zwar zusätzliche Verfahrensschritte vermieden, doch resultiert daraus wiederum eine Unflexibilität des Systems, da zwischenzeitliche Messungen ausgeschlossen sind bzw. zunächst den Schließvorgang der Tür erfordern. Außerdem ist die Lösung mit einem erhöhten Risiko der Partikelgenerierung verbunden, da Antriebselemente in Wafernähe gebracht werden und die großflächige Tür zu Verwirbelungen bei deren Bewegung führen kann.By linking the recognition process to the movement of the door, additional procedural steps are avoided, but this in turn results in an inflexibility of the system, since measurements in the meantime are excluded or first require the door to be closed. In addition, the solution is associated with an increased risk of particle generation, since drive elements are brought close to the wafer and the large-area door can cause turbulence when moving.

Mit der Handhabungseinrichtung verbundene Sensorsysteme haben ebenfalls den Nachteil, weniger flexibel zu sein.Sensor systems connected to the handling device also have the disadvantage of being less flexible.

Ausgehend hiervon ist es Aufgabe der Erfindung, die Nachweiseinrichtung derart auszubilden, dass die Lageerfassung der Substrate hinsichtlich des Messablaufes und der angewendeten Messmethode flexibler ausgeführt werden kann und eine definierte Heranführung eines Sensorsystems an das zu detektierende Halbleitersubstrat in eine sichere Messposition bei einem verringerten Risiko einer Partikelgenerierung gewährleistet ist.Proceeding from this, it is an object of the invention to design the detection device in such a way that the position detection of the substrates can be carried out more flexibly with regard to the measurement sequence and the measurement method used, and a defined approach of a sensor system to the semiconductor substrate to be detected in a safe measurement position with a reduced risk of particle generation is guaranteed.

Diese Aufgabe wird bei einer Einrichtung der eingangs genannten Art dadurch gelöst, dass die Sende- und Empfangseinrichtung aus einem, an dem Wandelement befestigten Vertikalantrieb und einem, zwischen einer unteren und einer oberen Position durch den Vertikalantrieb verstellbaren Sensorkopf besteht, der zum Einschwenken in die Öffnung an dem Vertikalantrieb drehbar gelagert ist.This object is achieved in a device of the type mentioned above in that the transmitting and receiving device consists of a vertical drive attached to the wall element and a sensor head which can be adjusted between a lower and an upper position by the vertical drive is rotatably mounted on the vertical drive for pivoting into the opening.

Die erfindungsgemäße Einrichtung gestattet eine höhere Flexibilität der Messabläufe zur Lageerfassung, da diese nicht mit einem Bewegungsablauf einer anderen Funktionseinheit verbunden sind, wie z. B. des Verschlusses beim Öffnen und Schließen der Öffnung in dem Wandelement oder eines Handhabungssystems, welches zur Entnahme und Rückführung der Substrate dient, jedoch nicht Bestandteil der erfindungsgemäßen Einrichtung ist.The device according to the invention allows greater flexibility of the measuring processes for position detection, since these are not connected to a movement sequence of another functional unit, such as, for. B. the closure when opening and closing the opening in the wall element or a handling system, which serves to remove and return the substrates, but is not part of the device according to the invention.

Außerdem wirkt sich der Bewegungsablauf der Sende- und Empfangseinrichtung in keiner Weise störend auf die anderen Bewegungsabläufe aus, da der Vertikalantrieb unterhalb der Öffnung und außerhalb des Bewegungsbereiches des Verschlusses an dem Wandelement befestigt ist.In addition, the movement sequence of the transmitting and receiving device in no way interferes with the other movement sequences, since the vertical drive is attached to the wall element below the opening and outside the movement range of the closure.

Der definierten Heranführung an die zu detektierenden Substrate dient auch eine vorteilhafte Ausgestaltung, bei der der Vertikalantrieb den Sensorkopf an einem Schwenkkopf mit horizontal gerichteter Schwenkachse trägt, der an einem vertikal ausfahrbaren Arm befestigt ist. Hierbei kann die Schwenkachse durch eine Hohlwelle verlaufen, auf der der Sensorkopf aufgesetzt ist und die zwischen zwei Endlagenpositionen verdrehbar ist.The defined approach to the substrates to be detected is also used in an advantageous embodiment in which the vertical drive carries the sensor head on a swivel head with a horizontally directed swivel axis, which is attached to a vertically extendable arm. Here, the pivot axis can run through a hollow shaft on which the sensor head is placed and which can be rotated between two end position positions.

Eine besondere Ausgestaltung der Erfindung sieht vor, dass der Sensorkopf als Gabellichtschranke ausgebildet ist, bei der an einem ersten Gabelende ein Sender zum Aussenden eines entlang eines Messstrahlenganges auf das andere Gabelende gerichteten Messstrahls angebracht und an dem anderen Gabelende eine Strahlumlenkeinrichtung vorgesehen ist, von der aus eine daran angekoppelte Lichtleitfaser außerhalb des Messstrahlenganges mittels einer Optik lichtdicht an einen Empfänger an dem ersten Gabelende geführt ist. Durch diese Gestaltung wird einerseits ermöglicht, dass Sender und Empfänger eine Einheit bilden und das freie Ende der Gabel nicht durch einen Empfänger belastet wird und das andererseits eine Beeinflussung durch Streu- und Fremdlicht ausgeschlossen wird.A special embodiment of the invention provides that the sensor head is designed as a fork light barrier, in which a transmitter is attached to a first fork end for transmitting a measurement beam directed along the measuring beam path to the other fork end, and a beam deflection device is attached to the other fork end is provided, from which an optical fiber coupled to it is guided outside the measuring beam path by means of optics in a light-tight manner to a receiver at the first fork end. This design on the one hand enables the transmitter and receiver to form a unit and the free end of the fork is not burdened by a receiver, and on the other hand prevents interference from stray and external light.

Hierbei wird das bei der Vertikalbewegung des Sensorkopfes zwischen den beiden Gabelenden hindurchgeführte Messobjekt im Durchstrahlverfahren mit dem Empfänger aufgenommen und in einer Ansteuer- und Auswerteelektronik, die an den Empfänger angeschlossenen ist, ausgewertet.In this case, the measurement object that is passed between the two fork ends during the vertical movement of the sensor head is picked up in a radiographic method with the receiver and evaluated in a control and evaluation electronics that is connected to the receiver.

Da der Vertikalantrieb als Motor-Spindel-Kombination aufgebaut ist, die zum Erkennen der vertikalen Positionen einen Encoder aufweist, der mit der Ansteuerund Auswerteelektronik der Sende- und Empfangseinrichtung verbunden ist, sind die aus dem Empfänger erhaltenen Messsignale den ermittelten Positionen zuzuordnen.Since the vertical drive is constructed as a motor-spindle combination, which has an encoder for recognizing the vertical positions and which is connected to the control and evaluation electronics of the transmitting and receiving device, the measurement signals received from the receiver must be assigned to the determined positions.

Die benachbarte Anordnung von Sender und Empfänger am selben Gabelende, die Strahlrückführung des Messstrahls über die Lichtleitfaser und deren lichtdichte Ankopplung an den Empfänger gewährleistet eine von Materialeigenschaften unabhängige Messwerterfassung. Es wird sichergestellt, dass nur der ausgesendete Messstrahl, der im Messstrahlengang von dem Messobjekt nicht zurückgehalten wird, auf den Empfänger gelangt. Fremdlichteinflüsse, die durch Beleuchtung, Spiegelungen und Reflexionen an den vorhandenen Oberflächen entstehen und einen Störeinfluss auf das Messsignal haben können, werden mit dem vorliegenden Sensorkopf, im Gegensatz zu den bekannten Messeinrichtungen, ausgeschlossen.The adjacent arrangement of the transmitter and receiver at the same fork end, the beam return of the measuring beam via the optical fiber and its light-tight coupling to the receiver ensure that the measured value is independent of the material properties. It is ensured that only the emitted measurement beam, which is not held back by the measurement object in the measurement beam path, reaches the receiver. External light influences caused by lighting, reflections and reflections on the existing surfaces and may have an interference effect on the measurement signal are excluded with the present sensor head, in contrast to the known measuring devices.

Außerdem zeichnet sich der Sensorkopf infolge der Strahlführung über die Lichtleitfaser durch einen sehr kleinen Bauraum und ein sehr geringes Gewicht aus, wodurch Schwingeffekte beim Heben und Schwenken erheblich reduziert sind.In addition, the sensor head is characterized by a very small installation space and a very low weight due to the beam guidance via the optical fiber, as a result of which vibration effects during lifting and swiveling are considerably reduced.

Die drehbare Lagerung der Gabellichtschranke an dem Vertikalantrieb kann vorteilhaft derart ausgebildet sein, dass die horizontal gerichtete Schwenkachse parallel und beabstandet zum Messstrahlengang verläuft, so dass die Gabelenden bei einer Schwenkung um die Schwenkachse durch die Öffnung in dem Wandelement hindurchtreten. Auf diese Weise wird eine kompakte Einrichtung mit einem an die nachzuweisenden Substrate heranführbaren Messstrahlengang realisiert.The rotatable mounting of the fork light barrier on the vertical drive can advantageously be designed such that the horizontally directed pivot axis runs parallel and at a distance from the measuring beam path, so that the fork ends pass through the opening in the wall element when pivoted about the pivot axis. In this way, a compact device with a measuring beam path that can be brought up to the substrates to be detected is realized.

Besonders vorteilhaft wirkt es sich aus, wenn als Sender ein Laser mit einem lichtstarken Messstrahl und kleinem Öffnungswinkel dient, der präzise an die Dicke der Substrate angepasst werden kann.It is particularly advantageous if a laser is used as the transmitter with a bright measuring beam and a small opening angle, which can be precisely adapted to the thickness of the substrates.

Eine vorteilhafte Weiterbildung der Erfindung besteht darin, dass die Sende- und Empfangseinrichtung mit einer eigenen Ansteuer- und Auswerteelektronik versehen ist, die an ein Bussystem einer zentralen Logiksteuerung angeschlossen ist.An advantageous development of the invention is that the transmitting and receiving device is provided with its own control and evaluation electronics, which is connected to a bus system of a central logic control.

Die Sende- und Empfangseinrichtung, die durch ihre konstruktive Gestaltung besonders dazu geeignet ist, nachträglich in bestehende Be- und Entladestationen eingebaut zu werden, kann dadurch zu einem Bestandteil eines modularen Systems von Funktionseinheiten ausgebildet werden, bei denen jede Funktionseinheit mit einer eigenen Ansteuer- und Auswerteelektronik ausgestattet ist, die über das Bussystem an die zentrale Logiksteuerung angeschlossen ist. Die Ansteuer- und Auswerteelektronik der Sende- und Empfangseinrichtung sowie die der anderen Funktionseinheiten, wie z. B. des Verschlusses, können in einfacher Weise von dem Bussystem getrennt werden. Ebenso ist es möglich, weitere Funktionseinheiten hinzuzufügen oder einen Austausch vorzunehmen, wobei in jedem Fall die sofortige Funktionsfähigkeit gewährleistet ist.The transmitting and receiving device, which is particularly suitable due to its constructive design, Subsequent installation in existing loading and unloading stations can thus be formed into a component of a modular system of functional units, in which each functional unit is equipped with its own control and evaluation electronics, which is connected to the central logic control via the bus system. The control and evaluation electronics of the transmitting and receiving device and that of the other functional units, such as. B. the lock can be easily separated from the bus system. It is also possible to add further functional units or to exchange them, whereby the immediate functionality is guaranteed in any case.

Schließlich kann der Sensorkopf der Sende- und Empfangseinrichtung in einer weiteren, alternativen Ausgestaltung auch als Reflexmesseinrichtung ausgeführt sein, bei der Sender und Empfänger am Sensorkopf benachbart zueinander angeordnet sind. Der von dem Sender ausgesendete Messstrahl wird, anstatt im Durchstrahlverfahren, nach dessen Reflexion an dem nachzuweisenden Substrat mit dem Empfänger aufgenommen.Finally, in a further alternative embodiment, the sensor head of the transmitting and receiving device can also be designed as a reflex measuring device, in which the transmitter and receiver are arranged adjacent to one another on the sensor head. The measuring beam emitted by the transmitter, instead of in the transmission method, is recorded with the receiver after its reflection on the substrate to be detected.

Die Erfindung soll nachstehend anhand der schematischen Zeichnung näher erläutert werden. Es zeigen:

Fig. 1
eine Einrichtung zur Detektion von übereinander angeordneten Substraten mit einer in Parkposition befindlichen Sende- und Empfangseinrichtung
Fig. 2
die Einrichtung gemäß Fig. 1, bei der sich die Sende- und Empfangseinrichtung in einer Arbeitsposition befindet
Fig. 3
die Sende- und Empfangseinrichtung
Fig. 4
einen Schwenkkopf zur Verstellung des Sensorkopfes von einer Ruheposition in eine Arbeitsposition
Fig. 5
einen für die Sende- und Empfangseinrichtung vorgesehenen Sensorkopf in einer ersten Ansicht mit geöffnetem Sende- und Empfangsteil
Fig. 6
den Sensorkopf in einer zweiten Ansicht
The invention will be explained below with reference to the schematic drawing. Show it:
Fig. 1
a device for the detection of superimposed substrates with a transmitting and receiving device in the park position
Fig. 2
the device according to FIG. 1, in which the transmitting and receiving device is in a working position
Fig. 3
the transmitting and receiving device
Fig. 4
a swivel head for adjusting the sensor head from a rest position to a working position
Fig. 5
a sensor head provided for the transmitting and receiving device in a first view with the transmitting and receiving part open
Fig. 6
the sensor head in a second view

Bei der in Fig. 1 dargestellten Einrichtung ist in ein rahmenförmiges Wandelement 1 eine zum Be- und Entladen eines mit Halbleiterwafern 2 als Substrate bestückten Behälters 3 dienende Öffnung 4 eingearbeitet. Für die Positionierung des Behälters 3 an der Öffnung 4 wird dieser auf einer Plattform 5 abgestellt, so dass seine zu öffnende Seite mit der Öffnung 4 fluchtet. Ein in Offenstellung befindlicher Verschluss 6 ist an einem höhen- und gegen das Wandelement 1 verstellbaren Arm 7 befestigt, für den in einem Gehäuseteil 8 sowohl zur Höhenverstellung als auch zur Verstellung des Armes 7 gegen das Wandelement 1 Antriebsmittel, z. B. in Form von Hubzylindern vorgesehen sind. Zur Verstellung gegen das Wandelement 1 ist der Arm 7 außerdem im unteren Bereich um eine horizontale Achse schwenkbar. Der Verschluss 6 trägt eine bereits beim Öffnungsvorgang von der zu öffnenden Seite des Behälters 3 abgenommene Behältertür 9.In the device shown in FIG. 1, an opening 4 serving for loading and unloading a container 3 equipped with semiconductor wafers 2 as substrates is incorporated into a frame-shaped wall element 1. For positioning the container 3 at the opening 4, it is placed on a platform 5 so that its side to be opened is aligned with the opening 4. A closure 6 in the open position is attached to a height-adjustable arm 7 against the wall element 1, for which in a housing part 8 both for height adjustment and for adjusting the arm 7 against the wall element 1 drive means, e.g. B. are provided in the form of lifting cylinders. For adjustment against the wall element 1, the arm 7 can also be pivoted in the lower region about a horizontal axis. The closure 6 carries a container door 9 already removed from the side of the container 3 to be opened during the opening process.

Unterhalb der Öffnung 4, seitlich benachbart zu dem Gehäuseteil 8 und den darin enthaltenen Antriebsmitteln für den Verschluss 6 und außerhalb des Bewegungsbereiches des Verschlusses 6 ist ein Vertikalantrieb 10 einer Sende- und Empfangseinrichtung 11 befestigt, der an einem, zwischen einer unteren und einer oberen Position verstellbaren Arm 12 einen Sensorkopf 13 trägt. In der Darstellung gemäß Fig. 1 befindet sich der Sensorkopf 13 in der als Ruhestellung dienenden unteren Position P und in Fig. 2 in einer zwischen der unteren und der oberen Position liegenden Arbeitsstellung, bei der der Sensorkopf 13 gegenüber der Ruhestellung durch eine 90°-Schwenkung definiert an die Halbleiterwafer 2 herangeführt ist und in die Öffnung 4 hineinragt.Beneath the opening 4, laterally adjacent to the housing part 8 and the drive means contained therein for the closure 6 and outside the range of movement of the closure 6, a vertical drive 10 of a transmitting and receiving device 11 is attached, which is in a position between a lower and an upper position adjustable arm 12 carries a sensor head 13. 1, the sensor head 13 is in the lower position P serving as the rest position and in FIG. 2 in a working position lying between the lower and the upper position, in which the sensor head 13 is 90 ° from the rest position. Swivel defined to the semiconductor wafer 2 and protrudes into the opening 4.

An den Vertikalantrieb 10 baulich angekoppelt ist ein Gehäuseteil 14, in dem die für die Sende- und Empfangseinrichtung 11 erforderliche Ansteuer- und Auswerteelektronik untergebracht ist, welche in nicht dargestellter Weise an ein Bussystem einer zentralen Logiksteuerung angeschlossen ist.Structurally coupled to the vertical drive 10 is a housing part 14 in which the control and evaluation electronics required for the transmitting and receiving device 11 are accommodated, which are connected in a manner not shown to a bus system of a central logic control.

Die detaillierte Darstellung der Sende- und Empfangseinrichtung 11 gemäß Fig. 3 verdeutlicht den Vertikalantrieb 10, der einen, mit einem Encoder versehenen DC-Servo-Antriebsmotor 15 mit einer hohen Positionierungsgenauigkeit von weniger als 100 µm enthält, der über einen Zahnriementrieb eine Präzisionsspindel 16 antreibt. Das Spannen des Zahnriemens erfolgt durch eine exzentrische Motordrehung. An der Präzisionsspindel 16 ist über eine Präzisionslinearführung 17 der vertikal ausfahrbare Arm 12 aus hochsteifem Material zwangsfrei angekoppelt, der den als Gabellichtschranke ausgebildeten Sensorkopf 13 an einem abgewinkelten Schwenkkopf 18 trägt.3 illustrates the vertical drive 10, which contains a DC servo drive motor 15 provided with an encoder with a high positioning accuracy of less than 100 μm, which drives a precision spindle 16 via a toothed belt drive , The toothed belt is tensioned by an eccentric motor rotation. On the precision spindle 16, the vertically extendable arm 12 made of highly rigid material is forcibly coupled via a precision linear guide 17 carries the sensor head 13 designed as a forked light barrier on an angled swivel head 18.

Der Schwenkkopf 18 enthält eine in Fig. 4 dargestellte Hohlwelle 19, auf der der Sensorkopf 13 zum Verschwenken zwischen den Stellungen der Ruheposition und der Arbeitsposition aufgesetzt ist. Die sich um 90° unterscheidenden Stellungen sind durch einen Endlagenanschlag 20 und ein elektrisch eingestelltes Haltemoment eines zum Antrieb der Hohlwelle 19 vorgesehenen DC-Antriebsmotors 21 gewährleistet und werden über ein Geschwindigkeitsprofil angefahren.
Zur Erkennung des Endlagenanschlages 20 sind (Hall-) Sensoren auf einer Leiterplatte 22 für die Sensorzuschaltung an einer Schließplatte 23 vorgesehen.The pivot head 18 contains a hollow shaft 19 shown in FIG. 4, on which the sensor head 13 is placed for pivoting between the positions of the rest position and the working position. The positions differing by 90 ° are ensured by an end position stop 20 and an electrically set holding torque of a DC drive motor 21 provided for driving the hollow shaft 19 and are approached via a speed profile.
To detect the end position stop 20, (Hall) sensors are provided on a printed circuit board 22 for the sensor connection on a closing plate 23.

Der in den Figuren 5 und 6 dargestellte Sensorkopf 13 ist als gewichtsminimierte bogenförmige Gabel 24 ausgebildet, bei der an einem, als Sende- und Empfangsteil dienenden ersten Gabelende 25 ein Sender 26 in Form eines Lasers zum Aussenden eines Messstrahls angebracht ist, der zur Bauraumminimierung über einen ersten Umlenkspiegel 27 entlang eines Messstrahlenganges M-M auf das andere Gabelende 28 gerichtet ist. Ein an dem anderen Gabelende 28 in die Struktur der Gabel 24 eingearbeiteter zweiter Umlenkspiegel 29 koppelt den Messstrahl über eine Sammellinse 30 in eine Lichtleitfaser 31 ein, die außerhalb des Messstrahlenganges M-M in der Gabel 24 mittels einer hier verdeckten Optik lichtdicht an einen Empfänger 32 an dem ersten Gabelende 25 geführt ist. Der Lasersender 26 gewährleistet einen optimalen Fokus am Rand des Halbleiterwafers 2 und damit eine ausreichende Auflösung der Dicke des Halbleiterwafers 2.The sensor head 13 shown in FIGS. 5 and 6 is designed as a weight-minimized curved fork 24, in which a transmitter 26 in the form of a laser for emitting a measuring beam is attached to a first fork end 25, which serves as a transmitting and receiving part a first deflecting mirror 27 is directed along a measuring beam path MM to the other fork end 28. A second deflecting mirror 29 incorporated into the structure of the fork 24 at the other fork end 28 couples the measuring beam via a converging lens 30 into an optical fiber 31 which, outside of the measuring beam path MM in the fork 24, is light-tight to a receiver 32 on the outside by means of an optics hidden here first fork end 25 is guided. The laser transmitter 26 ensures an optimal focus at the edge of the semiconductor wafer 2 and thus a sufficient resolution of the thickness of the semiconductor wafer 2.

Zum Aufsetzen des Sensorkopfes 13 auf die Hohlwelle 20 ist eine zum Messstrahlengang M-M mit Abstand benachbarte, parallel gerichtete Bohrung 33 vorgesehen, wodurch für den Sensorkopf 13 eine Schwenkachse S-S resultiert, so dass bei einer Schwenkung um die Schwenkachse S-S die Gabelenden 25 und 28 durch die Öffnung 4 in dem Wandelement 1 hindurchtreten.
Die Arbeitsweise mit der erfindungsgemäßen Einrichtung erfolgt in einer Weise, bei der eine Behinderung der Funktionen des Öffnens, eines Zugriffs einer Handhabungseinrichtung sowie weiterer, durch SEMI-Standards festgelegter Sensorelemente ausgeschlossen ist.To place the sensor head 13 on the hollow shaft 20, a parallel bore 33 is provided adjacent to the measuring beam path MM, which results in a pivot axis SS for the sensor head 13, so that when pivoting about the pivot axis SS the fork ends 25 and 28 through the Pass opening 4 in wall element 1.
The working with the device according to the invention takes place in a way that prevents the functions of opening, access of a handling device and further sensor elements defined by SEMI standards from being impeded.

Nachdem der Öffnungsvorgang für die Öffnung 4 in dem Wandelement 1 abgeschlossen ist (Fig. 1 und 2), wofür der Verschluss 6 zuvor unter Mitnahme der Behältertür 9 eine erste, von dem Wandelement 1 weggerichtete Bewegung und anschließend eine zweite vertikale Bewegung nach unten ausgeführt hat, wird der Sensorkopf 13 aus der Parkposition P, mit dem Vertikalantrieb 10 soweit nach oben gefahren, dass die Gabelenden 25 und 28 durch Schwenken des Sensorkopfes 13 um die Schwenkachse S-S durch die Öffnung 4 hindurch definiert an die zu detektierenden Halbleiterwafer 2 in eine Arbeitsposition herangebracht werden können. Das Einschwenken geschieht in einer möglichst unteren Position, so dass das Partikel-Kontaminationsrisiko minimiert wird.After the opening process for the opening 4 in the wall element 1 has been completed (FIGS. 1 and 2), for which the closure 6 has previously carried out a first movement away from the wall element 1 and then a second vertical movement downward, taking the container door 9 with it , The sensor head 13 is moved from the parking position P, with the vertical drive 10 upwards, so that the fork ends 25 and 28 are brought into a working position by the pivoting of the sensor head 13 about the pivot axis SS through the opening 4 to the semiconductor wafer 2 to be detected can be. The pivoting takes place in a position that is as low as possible, so that the risk of particle contamination is minimized.

Danach wird der Sensorkopf 13 in die obere Position oberhalb der höchstmöglichen Position eines Halbleiterwafers 2 gefahren, der Sender 26 und der Empfänger 32 werden eingeschaltet und der Lichtschrankenbetrieb wird getestet. Anschließend wird der Sensorkopf 13 mit dem Vertikalantrieb 10 an allen möglichen Halbleiterwafern 2 vorbei nach unten gefahren und ohne Zwischenstop werden die Vertikalkoordinaten der Lichtschranken-Unterbrechungen zum Nachweis des Vorhandenseins und der Position der Halbleiterwafer 2 in dem Behälter 3 registriert. Die Vertikalbewegung nach unten ist bevorzugt, da hierbei Schwingungseffekte reduziert sind. Während sich das Vorhandensein eines Halbleiterwafers 2 aus einer Messstrahlunterbrechung ergibt, bestimmt sich die vertikale Position aus den über den Encoder am Vertikalantrieb 10 abgenommenen Messergebnissen (Position) zum Zeitpunkt der Strahlunterbrechung und der Strahlfreigabe. Die sich ergebenden Positionswerte sind im Unterschied zu feststehenden optischen Systemen sofort weiterverarbeitbar und können z.B. an ein Handhabungssystem übergeben werden.Then the sensor head 13 is moved to the upper position above the highest possible position of a semiconductor wafer 2, the transmitter 26 and the receiver 32 are switched on and the light barrier operation is tested. Then will the sensor head 13 with the vertical drive 10 is moved past all possible semiconductor wafers 2 and without a stop, the vertical coordinates of the light barrier interruptions to register the presence and the position of the semiconductor wafers 2 are registered in the container 3. The vertical movement downwards is preferred, since vibration effects are reduced. While the presence of a semiconductor wafer 2 results from a measurement beam interruption, the vertical position is determined from the measurement results (position) taken by the encoder on the vertical drive 10 at the time of the beam interruption and the beam release. In contrast to fixed optical systems, the resulting position values can be processed immediately and can be transferred to a handling system, for example.

Da die Dicke der Halbleiterwafer 2 in definierten Grenzen liegt, lässt sich aus den ermittelten Differenzen zweier Messwerte auch bestimmen, ob eine Doppelbelegung eines Faches oder eine Schräglage eines Halbleiterwafers 2 vorliegt.
Die ermittelten Daten werden der Ansteuer- und Auswerteelektronik zugeführt, dort ausgewertet und als gespeicherte Ergebnisse an einem nichtdargestellten Monitor zur Anzeige gebracht.Since the thickness of the semiconductor wafers 2 is within defined limits, it can also be determined from the determined differences between two measured values whether there is a double occupancy of a subject or an inclined position of a semiconductor wafer 2.
The determined data are fed to the control and evaluation electronics, evaluated there and displayed as saved results on a monitor, not shown.

Nachdem der Messvorgang abgeschlossen ist, wird der Sensorkopf 13 in die tiefstmögliche Rückschwenkposition gefahren, dort um 90° um die Schwenkachse S-S zurückund damit aus der Öffnung 4 geschwenkt und anschließend in die Parkposition P abgesenkt.'After the measuring process is complete, the sensor head 13 is moved into the lowest possible swivel-back position, there it is pivoted back through 90 ° about the swivel axis SS and thus swiveled out of the opening 4 and then lowered into the parking position P. '

Der Vorteil der erfindungsgemäßen Einrichtung zeigt sich auch darin, dass eine am oberen Rand der Öffnung 4 liegende Zwischenposition eingenommen werden kann, von der aus auch Zwischendurchmessungen, soweit erforderlich, möglich sind.
Zur Optimierung der zeitlichen Abläufe sind auch alternierende Bewegungsabläufe möglich. Der Sensor wird dann in einer unteren Position eingeschwenkt, fährt eine untere Startposition an und ermittelt die Messwerte während der Bewegung zu einer oberen Endposition. In dieser oberen Endposition wird der Sensorbogen zurückgeschwenkt und in einer Ruheposition oberhalb der Öffnung positioniert. Die anschließende Messung erfolgt dann in umgekehrter Reihenfolge. Durch diesen Ablauf können die Leerlaufbewegungen reduziert werden.The advantage of the device according to the invention is also shown in the fact that an intermediate position lying at the upper edge of the opening 4 can be assumed, from which intermediate diameters are also possible, if necessary.
Alternating movement sequences are also possible to optimize the time sequences. The sensor is then swiveled into a lower position, moves to a lower start position and determines the measured values while moving to an upper end position. In this upper end position, the sensor arch is pivoted back and positioned in a rest position above the opening. The subsequent measurement is then carried out in the reverse order. The idle movements can be reduced by this process.

Claims (10)

Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten an einer Öffnung eines Wandelementes mit einem Verschluss für die Öffnung, der durch einen unterhalb der Öffnung positionierten Antrieb in wenigsten zwei unterschiedlichen Richtungen relativ zu dem Wandelement verstellbar ist und mit einer Sende- und Empfangseinrichtung zum Aussenden und Empfangen eines horizontal gerichteten Messstrahls, dadurch gekennzeichnet, dass die Sende- und Empfangseinrichtung (11) aus einem, an dem Wandelement (1) befestigten Vertikalantrieb (10) und einem, zwischen einer unteren und einer oberen Position durch den Vertikalantrieb (10) verstellbaren Sensorkopf (13) besteht, der zum Einschwenken in die Öffnung (4) an dem Vertikalantrieb (10) drehbar gelagert ist.Device for the detection of substrates arranged one above the other at a certain distance at an opening of a wall element with a closure for the opening, which can be adjusted in at least two different directions relative to the wall element by a drive positioned below the opening and with a transmitting and receiving device for Transmitting and receiving a horizontally directed measuring beam, characterized in that the transmitting and receiving device (11) consists of a vertical drive (10) attached to the wall element (1) and a vertical drive (10) between a lower and an upper position. adjustable sensor head (13) which is rotatably mounted on the vertical drive (10) for pivoting into the opening (4). Einrichtung nach Anspruch 1, dadurch gekennzeichnet, dass der Vertikalantrieb (10) unterhalb der Öffnung (4) und außerhalb des Bewegungsbereiches des Verschlusses (6) an dem Wandelement (1) befestigt ist.Device according to claim 1, characterized in that the vertical drive (10) below the opening (4) and outside the range of movement of the closure (6) is attached to the wall element (1). Einrichtung nach Anspruch 2, dadurch gekennzeichnet, dass der Vertikalantrieb (10) den Sensorkopf (13) an einem Schwenkkopf (18) mit horizontal gerichteter Schwenkachse (S-S) trägt, der an einem vertikal ausfahrbaren Arm (12) befestigt ist.Device according to claim 2, characterized in that the vertical drive (10) carries the sensor head (13) on a swivel head (18) with a horizontally directed swivel axis (SS) which is attached to a vertically extendable arm (12). Einrichtung nach Anspruch 3, dadurch gekennzeichnet, dass die Schwenkachse (S-S) durch eine Hohlwelle (19) verläuft, auf der der Sensorkopf (13) aufgesetzt ist und die zwischen zwei Endlagenpositionen verdrehbar ist.Device according to claim 3, characterized in that the pivot axis (SS) runs through a hollow shaft (19) on which the sensor head (13) is placed and which can be rotated between two end positions. Einrichtung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass der Sensorkopf (13) als Gabellichtschranke ausgebildet ist, bei der an einem ersten Gabelende (25) ein Sender (26) zum Aussenden eines entlang eines Messstrahlenganges (M-M) auf das andere Gabelende (28) gerichteten Messstrahls angebracht und an dem anderen Gabelende (28) eine Strahlumlenkeinrichtung vorgesehen ist, von der aus eine daran angekoppelte Lichtleitfaser (31) außerhalb des Messstrahlenganges (M-M) mittels einer Optik lichtdicht an einen Empfänger (32) an dem ersten Gabelende (25) geführt ist.Device according to one of claims 1 to 4, characterized in that the sensor head (13) is designed as a fork light barrier, in which at a first fork end (25) a transmitter (26) for transmitting a along a measuring beam path (MM) to the other fork end (28) directed measuring beam and at the other fork end (28) a beam deflection device is provided, from which an optical fiber (31) coupled to it outside the measuring beam path (MM) by means of optics light-tight to a receiver (32) at the first fork end ( 25) is performed. Einrichtung nach Anspruch 5, dadurch gekennzeichnet, dass die Gabellichtschranke um eine horizontal gerichtete Schwenkachse (S-S) drehbar gelagert ist, die parallel und beabstandet zum Messstrahlengang (MM) verläuft, so dass die Gabelenden (25, 28) bei einer Schwenkung um die Schwenkachse (S-S) durch die Öffnung (4) in dem Wandelement (1) hindurchtreten.Device according to claim 5, characterized in that the fork light barrier is rotatably mounted about a horizontally directed pivot axis (SS) which runs parallel and at a distance from the measuring beam path (MM), so that the fork ends (25, 28) when pivoted about the pivot axis ( SS) pass through the opening (4) in the wall element (1). Einrichtung nach Anspruch 6, dadurch gekennzeichnet, dass der Sender (26) als Laser ausgebildet ist.Device according to claim 6, characterized in that the transmitter (26) is designed as a laser. Einrichtung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Sende- und Empfangseinrichtung (11) mit einer eigenen Ansteuerund Auswerteelektronik versehen ist, die an ein Bussystem einer zentralen Logiksteuerung angeschlossen ist.Device according to one of claims 1 to 7, characterized in that the transmitting and receiving device (11) is provided with its own control and evaluation electronics, which is connected to a bus system of a central logic control. Einrichtung nach Anspruch 8, dadurch gekennzeichnet, dass der Vertikalantrieb (10) als Motor-Spindel-Kombination aufgebaut ist, die zum Erkennen der vertikalen Positionen einen Encoder aufweist, der mit der Ansteuer- und Auswerteelektronik der Sende- und Empfangseinrichtung (11) verbunden ist, wodurch die aus dem Empfänger (32) erhaltenen Messsignale den ermittelten vertikalen Positionen zuzuordnen sind.Device according to claim 8, characterized in that the vertical drive (10) as a motor-spindle combination is constructed, which has an encoder for recognizing the vertical positions, which is connected to the control and evaluation electronics of the transmitting and receiving device (11), as a result of which the measurement signals obtained from the receiver (32) can be assigned to the determined vertical positions. Einrichtung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass der Sensorkopf als Reflexmesseinrichtung ausgebildet ist, bei der Sender und Empfänger am Sensorkopf benachbart zueinander angeordnet sind.Device according to one of claims 1 to 4, characterized in that the sensor head is designed as a reflex measuring device in which the transmitter and receiver are arranged adjacent to one another on the sensor head.
EP03024416A 2002-10-25 2003-10-23 System for the detection of substrates arranged one above the other with a determined distance Withdrawn EP1414060A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10250353 2002-10-25
DE10250353A DE10250353B4 (en) 2002-10-25 2002-10-25 Device for detecting substrates arranged one above the other at a certain distance

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EP1414060A2 true EP1414060A2 (en) 2004-04-28
EP1414060A3 EP1414060A3 (en) 2006-05-24

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US20040188641A1 (en) 2004-09-30
DE10250353A1 (en) 2004-05-19
US7109509B2 (en) 2006-09-19
DE10250353B4 (en) 2008-04-30
EP1414060A3 (en) 2006-05-24

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