EP1252554A1 - Nonlinear image distortion correction in printed circuit board manufacturing - Google Patents
Nonlinear image distortion correction in printed circuit board manufacturingInfo
- Publication number
- EP1252554A1 EP1252554A1 EP00969787A EP00969787A EP1252554A1 EP 1252554 A1 EP1252554 A1 EP 1252554A1 EP 00969787 A EP00969787 A EP 00969787A EP 00969787 A EP00969787 A EP 00969787A EP 1252554 A1 EP1252554 A1 EP 1252554A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- pattern
- image data
- conductive material
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012937 correction Methods 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 239000004020 conductor Substances 0.000 claims abstract description 196
- 238000000034 method Methods 0.000 claims abstract description 116
- 230000008569 process Effects 0.000 claims abstract description 78
- 238000003384 imaging method Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 18
- 239000010410 layer Substances 0.000 description 373
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
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- 238000003475 lamination Methods 0.000 description 10
- 238000004080 punching Methods 0.000 description 10
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- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
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- 238000012993 chemical processing Methods 0.000 description 1
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- 238000002508 contact lithography Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Definitions
- Post-etch punching of inner layers offered the following advantages as compared to pre-exposure methods:
- the tooling pattern is punched in the inner layer after etching. All material movement resulting from artwork instability, etching, black oxidizing, etc. is compensated for by offset and global scale.
- linear scaling error may be characterized by a single correction factor per axis for a given type of layer
- non-linear scaling errors require a more complex correction scheme.
- second order non-linearity which requires two correction factors through higher degrees of non-linearity, which require a number of correction factors equal to the degree of non-linearity to the most complex case where the required correction factor is as complex as the image file itself.
- An actual conductor pattern (produced from an initial map or stored image data, and produced by a defined process on defined apparatus) on at least one inner layer (artificially termed "a first inner layer,” even though it does not have to be the first layer) is scanned by an image scanner to produce a scanned map or scanned image data.
- the information from the scanned image of the first inner layer includes either the entire pattern of the conductor pattern, substantially all areas of the conductor pattern which contain conductor sites, or a segmented (discontinuous) pattern identifying the location of all conductor sites in the first inner layer, or a preselected portion of conductor sites.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IL2000/000667 WO2002033492A1 (en) | 1999-07-06 | 2000-10-19 | Nonlinear image distortion correction in printed circuit board manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1252554A1 true EP1252554A1 (en) | 2002-10-30 |
Family
ID=11043004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP00969787A Withdrawn EP1252554A1 (en) | 2000-10-19 | 2000-10-19 | Nonlinear image distortion correction in printed circuit board manufacturing |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1252554A1 (zh) |
| JP (1) | JP4791681B2 (zh) |
| KR (1) | KR20020074163A (zh) |
| CN (1) | CN1434932A (zh) |
| AU (1) | AU2000279433A1 (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901119A (zh) * | 2018-06-22 | 2018-11-27 | 广州兴森快捷电路科技有限公司 | 用于测量激光钻机孔位精度的治具及方法 |
| CN116362957A (zh) * | 2021-12-27 | 2023-06-30 | 广州镭晨智能装备科技有限公司 | Pcb板卡图像对齐的方法、装置、介质和电子设备 |
| CN117141037A (zh) * | 2023-10-30 | 2023-12-01 | 山西昌鸿电力器材有限公司 | 一种电力金具加工工艺 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100526035B1 (ko) * | 2003-05-07 | 2005-11-08 | 홍성국 | 메탈 마스크 검사 장치 및 그의 검사 방법 |
| EP1804278A4 (en) * | 2004-09-14 | 2011-03-02 | Nikon Corp | CORRECTION METHOD AND EXPOSURE DEVICE |
| US7368207B2 (en) * | 2006-03-31 | 2008-05-06 | Eastman Kodak Company | Dynamic compensation system for maskless lithography |
| EP2539773B1 (en) * | 2010-02-26 | 2014-04-16 | Micronic Mydata AB | Method and apparatus for performing pattern alignment |
| CN111694226B (zh) * | 2020-05-25 | 2022-05-17 | 合肥芯碁微电子装备股份有限公司 | 水平度测量方法和直接式成像设备 |
| KR102385554B1 (ko) * | 2020-06-16 | 2022-04-13 | 재단법인 아산사회복지재단 | 나노구조체 기반의 표면증강라만 기판 및 그 제조 방법 |
| CN114485409A (zh) * | 2022-04-18 | 2022-05-13 | 深圳市元硕自动化科技有限公司 | 原料板质量检测方法、装置、设备及可读存储介质 |
| CN119967731B (zh) * | 2025-04-10 | 2025-07-15 | 惠州威尔高电子有限公司 | 基于防偏定位的厚铜电源板压合控制方法及系统 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3291176B2 (ja) * | 1995-05-15 | 2002-06-10 | 松下電工株式会社 | 回路パターンの検査方法および検査装置 |
-
2000
- 2000-10-19 JP JP2002536614A patent/JP4791681B2/ja not_active Expired - Fee Related
- 2000-10-19 KR KR1020027007439A patent/KR20020074163A/ko not_active Withdrawn
- 2000-10-19 CN CN00819083A patent/CN1434932A/zh active Pending
- 2000-10-19 EP EP00969787A patent/EP1252554A1/en not_active Withdrawn
- 2000-10-19 AU AU2000279433A patent/AU2000279433A1/en not_active Abandoned
Non-Patent Citations (1)
| Title |
|---|
| See references of WO0233492A1 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901119A (zh) * | 2018-06-22 | 2018-11-27 | 广州兴森快捷电路科技有限公司 | 用于测量激光钻机孔位精度的治具及方法 |
| CN116362957A (zh) * | 2021-12-27 | 2023-06-30 | 广州镭晨智能装备科技有限公司 | Pcb板卡图像对齐的方法、装置、介质和电子设备 |
| CN116362957B (zh) * | 2021-12-27 | 2024-05-14 | 广州镭晨智能装备科技有限公司 | Pcb板卡图像对齐的方法、装置、介质和电子设备 |
| CN117141037A (zh) * | 2023-10-30 | 2023-12-01 | 山西昌鸿电力器材有限公司 | 一种电力金具加工工艺 |
| CN117141037B (zh) * | 2023-10-30 | 2024-02-02 | 山西昌鸿电力器材有限公司 | 一种电力金具加工工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1434932A (zh) | 2003-08-06 |
| KR20020074163A (ko) | 2002-09-28 |
| JP4791681B2 (ja) | 2011-10-12 |
| JP2004512678A (ja) | 2004-04-22 |
| AU2000279433A1 (en) | 2002-04-29 |
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Legal Events
| Date | Code | Title | Description |
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| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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| AK | Designated contracting states |
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| 17P | Request for examination filed |
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| STAA | Information on the status of an ep patent application or granted ep patent |
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| 18D | Application deemed to be withdrawn |
Effective date: 20060501 |