EP1207539A1 - Glazing covered ferrite core electrode terminal of a surface mounting inductor - Google Patents
Glazing covered ferrite core electrode terminal of a surface mounting inductor Download PDFInfo
- Publication number
- EP1207539A1 EP1207539A1 EP00125175A EP00125175A EP1207539A1 EP 1207539 A1 EP1207539 A1 EP 1207539A1 EP 00125175 A EP00125175 A EP 00125175A EP 00125175 A EP00125175 A EP 00125175A EP 1207539 A1 EP1207539 A1 EP 1207539A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- ferrite core
- layer
- electrode terminal
- core electrode
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Definitions
- the present invention relates to a ferrite core electrode terminal. More particularly, the present invention relates to a ferrite core electrode terminal of a surface mounting inductor.
- a conventional ferrite core electrode terminal is coated by a silver paste. Since the surface of the ferrite core electrode terminal has a plurality of gas spacings, some gas spacings will remain between the ferrite core electrode terminal and the silver paste. The silver paste will release from the ferrite core electrode terminal under high temperatures. Furthermore, the surface of the silver paste will be uneven so that a further soldering result will be poor.
- Object of the present invention is to provide a ferrite core electrode terminal in which the silver paste is firmly bonded to the surface and will not release from the ferrite core electrode terminal even at high temperatures.
- a ferrite core electrode terminal which has a glazing covered layer between a silver paste layer and a ferrite core so that an electroplating solution will not enter the surface of the ferrite core.
- a preferred embodiment of the glazing covered ferrite core electrode terminal according to the invention has a glazing covered layer, a silver paste layer, a nickel paste layer, a solder plated layer, and a solder paste layer to reinforce a ferrite core.
- a glazing covered ferrite core electrode terminal comprises a ferrite core 1, a glazing covered layer 2 coated on a surface of the ferrite core 1, a silver paste layer 3 disposed on the glazing covered layer 2, a nickel plated layer 4 disposed on the silver paste layer 3, a solder plated layer 5 disposed on the nickel plated layer 4, and a solder paste layer 6 disposed on the solder plated layer 5.
- the glazing covered ferrite core electrode terminal is processed by an infrared reflow method.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A glazing covered ferrite core electrode terminal has a ferrite
core (1), a glazing covered layer (2) coated on a surface
of the ferrite core (1), a silver paste layer (3) disposed on
the glazing covered layer (2), a nickel plated layer (4) disposed
on the silver paste layer (3), a solder plated layer (5)
disposed on the nickel plated layer (4), and a solder paste
layer (6) disposed on the solder plated layer (5).
Description
- The present invention relates to a ferrite core electrode terminal. More particularly, the present invention relates to a ferrite core electrode terminal of a surface mounting inductor.
- A conventional ferrite core electrode terminal is coated by a silver paste. Since the surface of the ferrite core electrode terminal has a plurality of gas spacings, some gas spacings will remain between the ferrite core electrode terminal and the silver paste. The silver paste will release from the ferrite core electrode terminal under high temperatures. Furthermore, the surface of the silver paste will be uneven so that a further soldering result will be poor.
- Object of the present invention is to provide a ferrite core electrode terminal in which the silver paste is firmly bonded to the surface and will not release from the ferrite core electrode terminal even at high temperatures.
- The problem is solved by a ferrite core electrode terminal according to
claim 1 which has a glazing covered layer between a silver paste layer and a ferrite core so that an electroplating solution will not enter the surface of the ferrite core. A preferred embodiment of the glazing covered ferrite core electrode terminal according to the invention has a glazing covered layer, a silver paste layer, a nickel paste layer, a solder plated layer, and a solder paste layer to reinforce a ferrite core. - A preferred embodiment of the present invention will now be described in detail as illustrated in the accompanying drawing in which:
- FIG. 1 is a schematic view illustrating a ferrite core of a preferred embodiment coated by a glazing covered layer; and FIG. 2 is a sectional assembly view of a glazing covered ferrite core electrode terminal of a preferred embodiment in accordance with the present invention.
-
- Referring to FIGS. 1 to 3, a glazing covered ferrite core electrode terminal comprises a
ferrite core 1, a glazing coveredlayer 2 coated on a surface of theferrite core 1, asilver paste layer 3 disposed on the glazing coveredlayer 2, a nickel platedlayer 4 disposed on thesilver paste layer 3, a solder platedlayer 5 disposed on the nickel platedlayer 4, and asolder paste layer 6 disposed on the solder platedlayer 5. - The glazing covered ferrite core electrode terminal is processed by an infrared reflow method.
Claims (2)
- A glazing covered ferrite core electrode terminal comprising a ferrite core (1) and a silver paste layer (2),
characterized in that
a glazing covered layer (2) is coated on the surface of the ferrite core (1) and the silver paste layer (3) is disposed on the glazing covered layer (2). - A glazing covered ferrite core electrode terminal according to claim 1,
characterized in that
a nickel plated layer (4) is disposed on the silver paste layer (3),
a solder plated layer (5) is disposed on the nickel plated layer (4), and
a solder paste layer (6) is disposed on the solder plated layer (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00125175A EP1207539A1 (en) | 2000-11-18 | 2000-11-18 | Glazing covered ferrite core electrode terminal of a surface mounting inductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00125175A EP1207539A1 (en) | 2000-11-18 | 2000-11-18 | Glazing covered ferrite core electrode terminal of a surface mounting inductor |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1207539A1 true EP1207539A1 (en) | 2002-05-22 |
Family
ID=8170414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00125175A Ceased EP1207539A1 (en) | 2000-11-18 | 2000-11-18 | Glazing covered ferrite core electrode terminal of a surface mounting inductor |
Country Status (1)
Country | Link |
---|---|
EP (1) | EP1207539A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140138155A1 (en) * | 2011-05-03 | 2014-05-22 | Pilkington Group Limited | Glazing with a soldered connector |
CN107225336A (en) * | 2017-07-18 | 2017-10-03 | 中国工程物理研究院流体物理研究所 | A kind of welding method of ferrite and metal |
US9975207B2 (en) | 2011-02-04 | 2018-05-22 | Antaya Technologies Corporation | Lead-free solder composition |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4930865A (en) * | 1972-07-20 | 1974-03-19 | ||
JPS6117475A (en) * | 1984-07-05 | 1986-01-25 | 旭化成株式会社 | Method of directly bonding metal member to ceramic member |
JPH07201603A (en) * | 1993-12-28 | 1995-08-04 | Koa Corp | Electrode structure for electronic device and its formation |
JPH09115772A (en) * | 1995-10-19 | 1997-05-02 | Mitsubishi Materials Corp | External electrode for chip electronic component |
JPH11340053A (en) * | 1998-05-29 | 1999-12-10 | Taiyo Yuden Co Ltd | Surface mounted coil part |
US6027008A (en) * | 1997-05-14 | 2000-02-22 | Murata Manufacturing Co., Ltd. | Electronic device having electric wires and method of producing same |
-
2000
- 2000-11-18 EP EP00125175A patent/EP1207539A1/en not_active Ceased
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4930865A (en) * | 1972-07-20 | 1974-03-19 | ||
JPS6117475A (en) * | 1984-07-05 | 1986-01-25 | 旭化成株式会社 | Method of directly bonding metal member to ceramic member |
JPH07201603A (en) * | 1993-12-28 | 1995-08-04 | Koa Corp | Electrode structure for electronic device and its formation |
JPH09115772A (en) * | 1995-10-19 | 1997-05-02 | Mitsubishi Materials Corp | External electrode for chip electronic component |
US6027008A (en) * | 1997-05-14 | 2000-02-22 | Murata Manufacturing Co., Ltd. | Electronic device having electric wires and method of producing same |
JPH11340053A (en) * | 1998-05-29 | 1999-12-10 | Taiyo Yuden Co Ltd | Surface mounted coil part |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 11 26 December 1995 (1995-12-26) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 09 30 September 1997 (1997-09-30) * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9975207B2 (en) | 2011-02-04 | 2018-05-22 | Antaya Technologies Corporation | Lead-free solder composition |
US20140138155A1 (en) * | 2011-05-03 | 2014-05-22 | Pilkington Group Limited | Glazing with a soldered connector |
US9595768B2 (en) * | 2011-05-03 | 2017-03-14 | Pilkington Group Limited | Glazing with a soldered connector |
CN107225336A (en) * | 2017-07-18 | 2017-10-03 | 中国工程物理研究院流体物理研究所 | A kind of welding method of ferrite and metal |
CN107225336B (en) * | 2017-07-18 | 2019-07-30 | 中国工程物理研究院流体物理研究所 | A kind of welding method of ferrite and metal |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
17P | Request for examination filed |
Effective date: 20021022 |
|
AKX | Designation fees paid |
Designated state(s): DE ES FR GB IE |
|
17Q | First examination report despatched |
Effective date: 20061030 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
18R | Application refused |
Effective date: 20070402 |