EP1122977B1 - Microphone - Google Patents
Microphone Download PDFInfo
- Publication number
- EP1122977B1 EP1122977B1 EP01100976A EP01100976A EP1122977B1 EP 1122977 B1 EP1122977 B1 EP 1122977B1 EP 01100976 A EP01100976 A EP 01100976A EP 01100976 A EP01100976 A EP 01100976A EP 1122977 B1 EP1122977 B1 EP 1122977B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- microphone
- board
- capsule
- microphone capsule
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002775 capsule Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000003475 lamination Methods 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000012528 membrane Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 241000881711 Acipenser sturio Species 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 210000003625 skull Anatomy 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
Definitions
- the invention relates to a microphone module with the features specified in the preamble of claim 1.
- a structure-borne sound microphone for installation in a helmet (motorcycle, fire brigade, etc.) is known, in which a flat body can be fastened to the inside of the helmet by means of a hook and loop fastener and the microphone in one on the opposite side of the helmet Body located rubber bellows is arranged so that it is pressed when placing the helmet against the head and receives the guided when speaking to the skull ceiling structure-borne sound.
- the flat body further includes a printed circuit board with a microphone amplifier.
- a digital hearing aid in which the microphone amplifier is surrounded within the hearing aid housing by its own shield in which an A / D converter is provided so that the complete analog input part of the hearing against electromagnetic Interference is shielded.
- the microphone capsule is directly assembled with a preamplifier, so that the weak microphone signals are impaired as little as possible by interspersed interference, which deteriorate the intelligibility.
- the preamplifier is implemented on a circuit board to which the microphone capsule is attached via a rubber mount, and to shield the amplifier shielding hoods are placed on both sides of the board, which both the components on the one hand, as well as shield the printed traces on the other side against interference from the environment.
- the invention has for its object to further improve such a microphone module in terms of its shielding against interference with the ability to maintain the directional characteristics of the microphone, if not to improve.
- the invention provides for a half-shell or trough, the edges of which are soldered all around with the platinum cladding, so that a connection which is absolutely impermeable to interference is obtained.
- the on the back side metallized microphone capsule can be easily fit into this tub, with its metal housing forms a continuous contact with the shielding well, which is intensified by the insertion of the module into a housing by pressure from the outside.
- the back metallization of the microphone capsule can also be easily soldered to the metal lamination of the board, which on the one hand the microphone attached to the board and on the other hand, a good shielding between the microphone capsule and board is achieved.
- openings are formed in the rear wall of the microphone capsule, via which the sound pressure on the membrane rear side in the sense of the desired directional characteristic can be influenced. If you look at the edge of the board where it is connected (soldered) to the microphone capsule the locations where the capsule openings are, corresponding recesses, then the directivity of the microphone capsule is not affected, but can be even better.
- the microphone capsule is attached obliquely to the board in an expedient embodiment of the invention, so that therefore forms the longitudinal axis of the microphone capsule at an angle with the board surface. An angle of 22 ° has proven to be particularly favorable here.
- FIG. 1 shows a microphone capsule 2 which sits at the end of an amplifier board 4. Furthermore, one recognizes a shielding trough 6 which is drawn as a phantom and which encloses the lower side of the circuit board 4 with the components 8 and the lower half of the microphone capsule 2.
- a connecting cable 10 leads from the board to a downstream circuit, not shown here, in which the microphone signals are processed.
- the board 4 On the surface facing up in the figures, the board 4 is provided with a continuous metal lamination 12, which is not used here as usual for the formation of the tracks, which extend in the present case on the opposite component side. Rather, the lamination, which usually consists of copper, forms a closed surface which shields the electrical circuit of the amplifier board upwards. The shielding down through the shielding trough 6, which encloses the device 8 and the conductors extending therebetween.
- the microphone capsule 2 is metallized on its rear half side also in the form of a shield 14, which is shown crosshatched in the figures as well as the copper lining 12.
- the orientation of the microphone capsule 2 relative to the circuit board 4 is such that on the side edge of the board on which the microphone capsule 2 is applied, the two laminations 12 and 14 can be soldered together, whereby on the one hand the microphone capsule is attached to the board and on the other hand the shield continues through the Platinenkaschleiter 12 in the Mikrofonkapselkaschtechnik 14.
- the microphone capsule 2 sits slightly obliquely on the board 4, which is related in a manner yet to be explained with the directional characteristic of the microphone.
- the shielding trough 6 is closed on the right side in FIG. 1 by an end plate 16, which may be soldered to the trough 6, for example.
- On the opposite side of the microphone capsule 2 is fitted in the tub 6 so that their rounding down exactly matches the round cross-section of the tub and a continuous contact of the metallic capsule housing with the sheet metal tub is made with contact. If the illustrated module is used after completion in an existing example of plastic material housing, then this presses from the outside against the line of contact between the shield and microphone capsule edge, so that here no soldering with the housing capsule is necessary, which is also due to the heat occurring during soldering of the housing capsule would cause damage to the microphone membrane.
- solder joint between the metal lamination 12 of the board 4 and the metallized shield 14 of the microphone capsule 2 is shown in FIG. 1 as a solder seam 18, while the solder joints of the board edges with the shielding trough 6 are referred to as solder seams 20.
- solder seams 20 The solder joint between the metal lamination 12 of the board 4 and the metallized shield 14 of the microphone capsule 2 is shown in FIG. 1 as a solder seam 18, while the solder joints of the board edges with the shielding trough 6 are referred to as solder seams 20.
- the invention provides two corresponding with these openings 22, for example, semicircular recesses 24 on the soldering with the microphone capsule 2 edge of the amplifier board 4, through which a connection of the openings 22 is made with the environment, so that the directional characteristic of the microphone even when connected amplifier board 2 and shielding pan 6 is maintained, or even can be improved.
- the microphone capsule 2 is attached obliquely to the board, the central axis of the microphone capsule 2 with the plane of the board 4 in the special case forms an angle of 22 °.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
Die Erfindung betrifft ein Mikrofonmodul mit den im Oberbegriff des Anspruchs 1 angegebenen Merkmalen.The invention relates to a microphone module with the features specified in the preamble of claim 1.
Aus der DE 43 10 793 A1 ist ein Körperschallmikrofon zum Einbauen in einen Helm (Motorrad, Feuerwehr etc.) bekannt, bei welchem ein flacher Grundkörper mittels eines Klettverschlusses an der Innenseite des Helms befestigt werden kann und das Mikrofon in einem auf der gegenüberliegenden Seite des Grundkörpers befindlichen Gummibalg angeordnet ist, so daß es beim Aufsetzen des Helmes gegen den Kopf gedrückt wird und den beim Sprechen zur Schädeldecke geleiteten Körperschall aufnimmt. Der flache Grundkörper enthält ferner eine Leiterplatte mit einem Mikrofonverstärker.From DE 43 10 793 A1 a structure-borne sound microphone for installation in a helmet (motorcycle, fire brigade, etc.) is known, in which a flat body can be fastened to the inside of the helmet by means of a hook and loop fastener and the microphone in one on the opposite side of the helmet Body located rubber bellows is arranged so that it is pressed when placing the helmet against the head and receives the guided when speaking to the skull ceiling structure-borne sound. The flat body further includes a printed circuit board with a microphone amplifier.
Ferner ist aus der DE 195 45 760 C1 ein digitales Hörgerät bekannt, bei welchem der Mikrofonverstärker innerhalb des Hörgerätegehäuses von einer eigenen Abschirmung umgeben ist, in der auch ein A/D-Wandler vorgesehen ist, so daß der komplette analoge Eingangsteil des Hörgerätes gegen elektromagnetische Einstreuungen abgeschirmt ist.Furthermore, from DE 195 45 760 C1, a digital hearing aid is known in which the microphone amplifier is surrounded within the hearing aid housing by its own shield in which an A / D converter is provided so that the complete analog input part of the hearing against electromagnetic Interference is shielded.
Für verschiedene Anwendungszwecke, wie Freisprechanlagen bei Autotelefonen, Sprechfunksystemen, Personenrufanlagen etc. verwendet man Mikrofonmodule, bei denen die Mikrofonkapsel unmittelbar mit einem Vorverstärker zusammengebaut ist, damit die schwachen Mikrofonsignale möglichst wenig durch eingestreute Störungen beeinträchtigt werden, welche die Verständlichkeit verschlechtern. Der Vorverstärker ist auf einer Schaltungsplatine realisiert, an der die Mikrofonkapsel über eine Gummihalterung befestigt ist, und zur Abschirmung des Verstärkers werden beiderseits auf die Platine Abschirmhauben aufgesetzt, welche sowohl die Bauelemente auf der einen Seite wie auch die gedruckten Leiterbahnen auf der anderen Seite gegen Störungen aus der Umgebung abschirmen.For various applications, such as hands-free systems for car telephones, radio systems, paging etc. used microphone modules, in which the microphone capsule is directly assembled with a preamplifier, so that the weak microphone signals are impaired as little as possible by interspersed interference, which deteriorate the intelligibility. The preamplifier is implemented on a circuit board to which the microphone capsule is attached via a rubber mount, and to shield the amplifier shielding hoods are placed on both sides of the board, which both the components on the one hand, as well as shield the printed traces on the other side against interference from the environment.
Der Erfindung liegt die Aufgabe zugrunde, ein solches Mikrofonmodul hinsichtlich seiner Abschirmung gegen Störeinstreuungen weiter zu verbessern mit der Möglichkeit, die Richtcharakteristik des Mikrofons beizubehalten, wenn nicht zu verbessern.The invention has for its object to further improve such a microphone module in terms of its shielding against interference with the ability to maintain the directional characteristics of the microphone, if not to improve.
Diese Aufgabe wird durch die im Anspruch 1 angegebenen Merkmale gelöst. Weiterbildungen der Erfindung sind in den Unteransprüchen gekennzeichnet.This object is achieved by the features specified in claim 1. Further developments of the invention are characterized in the subclaims.
Durch die Ausnutzung der Platinenkaschierung als Abschirmung anstatt zur Ausbildung der Leiterbahnen erübrigt sich eine eigene Abschirmung der Kaschierungsseite der Platine, so daß nur die Bestückungsseite, auf der auch die Verbindungsleiter vorgesehen sind, abgeschirmt zu werden braucht. Die Erfindung sieht hierzu eine Halbschale oder Wanne vor, deren Ränder mit der Platinenkaschierung rundum verlötet werden, so daß man eine gegen Störeinstreuungen absolut dichte Verbindung erhält. Die auf der Rückseite halbseitig metallisierte Mikrofonkapsel läßt sich ohne weiteres in diese Wanne einpassen, wobei ihr Metallgehäuse einen durchgehenden Kontakt mit der Abschirmwanne bildet, der beim Einsetzen des Moduls in ein Gehäuse durch Druck von außen noch intensiviert wird. Die rückseitige Metallisierung der Mikrofonkapsel läßt sich ebenfalls einfach mit der Metallkaschierung der Platine verlöten, womit einerseits das Mikrofon an der Platine befestigt und andererseits auch hier eine gute Abschirmung zwischen Mikrofonkapsel und Platine erreicht wird.By exploiting the Platinenkaschierung as a shield instead of the formation of the interconnects, a separate shield the Kaschierungsseite the board is unnecessary, so that only the component side, on which the connection conductors are provided, needs to be shielded. For this purpose, the invention provides for a half-shell or trough, the edges of which are soldered all around with the platinum cladding, so that a connection which is absolutely impermeable to interference is obtained. The on the back side metallized microphone capsule can be easily fit into this tub, with its metal housing forms a continuous contact with the shielding well, which is intensified by the insertion of the module into a housing by pressure from the outside. The back metallization of the microphone capsule can also be easily soldered to the metal lamination of the board, which on the one hand the microphone attached to the board and on the other hand, a good shielding between the microphone capsule and board is achieved.
Zur Erzielung einer bestimmten Richtwirkung, die bei derartigen Mikrofonen erforderlich ist, sind in der Rückwand der Mikrofonkapsel Öffnungen ausgebildet, über welche der Schalldruck auf der Membranrückseite im Sinne der gewünschten Richtcharakteristik beeinflußt werden kann. Sieht man am Rand der Platine, an dem diese mit der Mikrofonkapsel verbunden (verlötet) ist, an den Stellen, wo sich die Kapselöffnungen befinden, entsprechende Ausnehmungen vor, dann wird die Richtwirkung der Mikrofonkapsel nicht beeinträchtigt, sondern läßt sich sogar noch verbessern. Im Sinne der gewünschten Richtwirkung wird in zweckmäßiger Ausgestaltung der Erfindung die Mikrofonkapsel schräg an der Platine befestigt, so daß also die Längsachse der Mikrofonkapsel einen Winkel mit der Platinenfläche bildet. Ein Winkel von 22° hat sich hier als besonders günstig erwiesen.To achieve a certain directional effect, which is required in such microphones, openings are formed in the rear wall of the microphone capsule, via which the sound pressure on the membrane rear side in the sense of the desired directional characteristic can be influenced. If you look at the edge of the board where it is connected (soldered) to the microphone capsule the locations where the capsule openings are, corresponding recesses, then the directivity of the microphone capsule is not affected, but can be even better. In terms of the desired directivity, the microphone capsule is attached obliquely to the board in an expedient embodiment of the invention, so that therefore forms the longitudinal axis of the microphone capsule at an angle with the board surface. An angle of 22 ° has proven to be particularly favorable here.
Die Erfindung sei im folgenden anhand eines in den beiliegenden Zeichnungen veranschaulichten Ausführungsbeispiels näher erläutert. Es zeigen:
- Fig. 1
- eine schematische perspektivische Ansicht des erfindungsgemäßen Mikrofonmoduls; und
- Fig. 2
- eine Schnittansicht längs der Linie II-II durch das Mikrofonmodul nach Fig. 1.
- Fig. 1
- a schematic perspective view of the microphone module according to the invention; and
- Fig. 2
- a sectional view taken along the line II-II through the microphone module of FIG. 1st
Figur 1 zeigt eine Mikrofonkapsel 2, die am Ende einer Verstärkerplatine 4 sitzt. Ferner erkennt man eine als Phantom gezeichnete Abschirmwanne 6, welche die untere Seite der Platine 4 mit den Bauelementen 8 und die untere Hälfte der Mikrofonkapsel 2 umschließt. Ein Anschlußkabel 10 führt von der Platine zu einer nachgeordneten, hier nicht dargestellten Schaltung, in welcher die Mikrofonsignale verarbeitet werden.FIG. 1 shows a
Auf der in den Figuren nach oben weisenden Fläche ist die Platine 4 mit einer durchgängigen Metallkaschierung 12 versehen, welche hier nicht wie üblich zur Ausbildung der Leiterbahnen benutzt wird, die im vorliegenden Falle auf der gegenüberliegenden Bestückungsseite verlaufen. Vielmehr bildet die Kaschierung, die gewöhnlich aus Kupfer besteht, eine geschlossene Fläche, welche die elektrische Schaltung der Verstärkerplatine nach oben abschirmt. Die Abschirmung nach unten erfolgt durch die Abschirmwanne 6, welche die Bauelement 8 und die dazwischen verlaufenden Leiter umschließt.On the surface facing up in the figures, the
Die Mikrofonkapsel 2 ist auf ihrer Rückseite halbseitig ebenfalls in Form einer Abschirmung 14 metallisiert, die in den Figuren ebenso wie die Kupferkaschierung 12 kreuzschraffiert dargestellt ist. Die Orientierung der Mikrofonkapsel 2 gegenüber der Platine 4 erfolgt so, daß an der Seitenkante der Platine, an welcher die Mikrofonkapsel 2 anliegt, die beiden Kaschierungen 12 und 14 miteinander verlötet werden können, womit einerseits die Mikrofonkapsel an der Platine befestigt wird und andererseits die Abschirmung durch die Platinenkaschierung 12 sich in der Mikrofonkapselkaschierung 14 fortsetzt. Wie die Figuren zeigen, sitzt die Mikrofonkapsel 2 etwas schräg an der Platine 4, was in noch zu erläuternder Weise mit der Richtcharakteristik des Mikrofons zusammenhängt.The
Die Abschirmwanne 6 ist auf der in Fig. 1 rechten Seite durch eine Endplatte 16 verschlossen, die beispielsweise mit der Wanne 6 verlötet sein kann. Auf der gegenüberliegenden Seite ist die Mikrofonkapsel 2 in die Wanne 6 so eingepaßt, daß ihre Rundung unten genau mit dem runden Querschnitt der Wanne übereinstimmt und eine durchgehende Berührung des metallischen Kapselgehäuses mit der Blechwanne unter Kontaktgabe erfolgt. Wenn der dargestellte Modul nach Fertigstellung in ein beispielsweise aus Plastikmaterial bestehendes Gehäuse eingesetzt wird, dann drückt dieses von außen gegen die Berührungslinie zwischen Abschirmwanne und Mikrofonkapselkante, so daß hier keine Verlötung mit der Gehäusekapsel notwendig ist, was auch wegen der beim Löten erfolgenden Erwärmung der Gehäusekapsel zu Beschädigungen der Mikrofonmembran führen würde.The
Die Lötverbindung zwischen der Metallkaschierung 12 der Platine 4 und der metallisierten Abschirmung 14 der Mikrofonkapsel 2 ist in Fig. 1 als Lötnaht 18 dargestellt, während die Lötverbindungen der Platinenränder mit der Abschirmwanne 6 als Lötnähte 20 bezeichnet sind. Durch diese Lötnähte sowie die Berührung des unteren Randes der Mikrofonkapsel mit der Abschirmwanne 6 erfolgt in Verbindung mit der Abschirmung 14 auf der Mikrofonrückseite und deren Metallkapsel, an welche sich unten wiederum die Abschirmwanne 6 anschließt, eine störeinstreudichte Abschirmung der Verstärkerschaltung auf der Platine, so daß auch schwache Mikrofonsignale störungsfrei an die nachfolgende Schaltung weitergegeben werden.The solder joint between the
Auf der Rückseite der Mikrofonkapsel befinden sich zwei Schalldrucköffnungen 22, die einen gezielten Ausgleich des Schalldrucks bei den Membranbewegungen erlauben, so daß sich eine z.B. nierenförmige Richtcharakteristik ergibt. Die Erfindung sieht zwei mit diesen Öffnungen 22 korrespondierende, beispielsweise halbkreisförmige Ausnehmungen 24 an der mit der Mikrofonkapsel 2 verlötenden Kante der Verstärkerplatine 4 vor, durch welche eine Verbindung der Öffnungen 22 mit der Umgebung hergestellt wird, so daß die Richtcharakteristik des Mikrofons auch bei angesetzter Verstärkerplatine 2 und Abschirmwanne 6 erhalten bleibt, bzw. sogar noch verbessert werden kann. Zur Erzielung dieser Richtcharakteristik ist außerdem die Mikrofonkapsel 2 schräg an die Platine angesetzt, wobei die Mittelachse der Mikrofonkapsel 2 mit der Ebene der Platine 4 im speziellen Fall einen Winkel von 22° bildet.On the back of the microphone capsule are two
Claims (5)
- A microphone module with a microphone capsule, a circuit board containing a preamplifier to the one side edge of which said microphone capsule is fastened and with a shielding for the circuit board,
characterized in that said circuit board (4) contains components (8) and their connecting lines on one side only whilst the other side thereof is provided with a continuous metal lamination (12) and that said shielding is configured to be a trough made from a shielding plate that is closed on one side at least and is arranged on top of the component mounting side of the board (4), that the opposite trough side is closed by said microphone capsule (2) and that the shielding trough (6) is soldered at its edge to the lamination (12) of the board (4) so as to be impervious to interference (solder seams 18, 20). - The microphone module as set forth in claim 1,
characterized in that the trough (6) has a cross section that is curved to conform to the shape of the microphone capsule (2) for said microphone capsule to fit therein with its metal capsule coming into contact at one end of said trough and that said trough is closed at its other end with an end plate (16) the edges of which are curved accordingly. - The microphone module as set forth in claim 2,
characterized in that the round microphone capsule (2) is laminated on half of its back side with a metal shielding (14) and is attached to an edge of the board (4) along which the metal laminations (12, 14) of said board and said microphone capsule are soldered together. - The microphone module as set forth in any one of the afore mentioned claims, characterized in that the microphone capsule (2) is disposed at an oblique angle with respect to the board (4) with its central axis being inclined with respect to the plane thereof.
- The microphone module as set forth in any one of the afore mentioned claims, characterized in that the microphone capsule (2) comprises on its back side sound pressure ports (22) determining the directional effect and that recesses (24) corresponding to said sound pressure ports (22) are configured on the connecting edge of the board (4) to said microphone capsule (2).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10004408 | 2000-02-02 | ||
| DE10004408A DE10004408C1 (en) | 2000-02-02 | 2000-02-02 | Microphone module, e.g. for hands-free car telephone or other radio transceiver, has screening shell enclosing microphone capsule and pre-amplifier components |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP1122977A2 EP1122977A2 (en) | 2001-08-08 |
| EP1122977A3 EP1122977A3 (en) | 2005-05-11 |
| EP1122977B1 true EP1122977B1 (en) | 2006-11-22 |
Family
ID=7629487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01100976A Expired - Lifetime EP1122977B1 (en) | 2000-02-02 | 2001-01-17 | Microphone |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6643380B2 (en) |
| EP (1) | EP1122977B1 (en) |
| AT (1) | ATE346474T1 (en) |
| DE (2) | DE10004408C1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4310234B2 (en) * | 2004-05-18 | 2009-08-05 | 株式会社オーディオテクニカ | Condenser microphone |
| JP4393297B2 (en) * | 2004-07-14 | 2010-01-06 | 株式会社オーディオテクニカ | Condenser microphone |
| US7270010B2 (en) * | 2004-08-27 | 2007-09-18 | Ashcroft-Nagano, Inc. | System and method for pressure measurement |
| JP4452584B2 (en) * | 2004-08-31 | 2010-04-21 | 株式会社オーディオテクニカ | Condenser microphone |
| US7660428B2 (en) * | 2004-10-25 | 2010-02-09 | Polycom, Inc. | Ceiling microphone assembly |
| JP4471818B2 (en) * | 2004-11-17 | 2010-06-02 | 株式会社オーディオテクニカ | Boundary microphone |
| JP4724410B2 (en) * | 2004-11-19 | 2011-07-13 | 株式会社オーディオテクニカ | Condenser microphone |
| JP5639845B2 (en) * | 2010-10-25 | 2014-12-10 | 株式会社オーディオテクニカ | Boundary microphone |
| CN102333253A (en) * | 2011-07-26 | 2012-01-25 | 歌尔声学股份有限公司 | Microphone and test method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4399703A (en) * | 1980-10-16 | 1983-08-23 | Dymax Corporation | Ultrasonic transducer and integral drive circuit therefor |
| CH664057A5 (en) * | 1984-02-27 | 1988-01-29 | Phonak Ag | HOERGERAET. |
| DE4310793A1 (en) * | 1993-04-02 | 1994-10-06 | Ceotronics Gmbh Elektronische | Structure-borne noise microphone for protective helmets or the like |
| DE4343702C1 (en) * | 1993-12-21 | 1995-03-09 | Siemens Audiologische Technik | Hearing aid worn on the head |
| JPH09107192A (en) * | 1995-10-09 | 1997-04-22 | Kitagawa Ind Co Ltd | Printed board and printed board serving also as case and portable communication appliance |
| DE19545760C1 (en) * | 1995-12-07 | 1997-02-20 | Siemens Audiologische Technik | Digital hearing aid |
| US5740261A (en) * | 1996-11-21 | 1998-04-14 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
| US6157546A (en) * | 1999-03-26 | 2000-12-05 | Ericsson Inc. | Shielding apparatus for electronic devices |
-
2000
- 2000-02-02 DE DE10004408A patent/DE10004408C1/en not_active Expired - Fee Related
-
2001
- 2001-01-17 DE DE50111474T patent/DE50111474D1/en not_active Expired - Lifetime
- 2001-01-17 EP EP01100976A patent/EP1122977B1/en not_active Expired - Lifetime
- 2001-01-17 AT AT01100976T patent/ATE346474T1/en not_active IP Right Cessation
- 2001-01-31 US US09/773,166 patent/US6643380B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1122977A2 (en) | 2001-08-08 |
| ATE346474T1 (en) | 2006-12-15 |
| EP1122977A3 (en) | 2005-05-11 |
| DE10004408C1 (en) | 2001-06-21 |
| DE50111474D1 (en) | 2007-01-04 |
| US6643380B2 (en) | 2003-11-04 |
| US20010012374A1 (en) | 2001-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0660641B1 (en) | Hearing aid to be worn on the head | |
| DE102012220096B4 (en) | Outside noise introductory earphone | |
| DE102011004760B4 (en) | Electronic device for a vehicle | |
| DE69434881T2 (en) | Shielding for a radiotelephone | |
| DE10084137B4 (en) | Shielding container with tapered wall ends for surface mounting, and radiotelephones in which it is installed | |
| DE102007055385B4 (en) | Shielding device for a hearing aid | |
| EP1122977B1 (en) | Microphone | |
| CH664057A5 (en) | HOERGERAET. | |
| DE112019003955T5 (en) | INTEGRATED SUB-ASSEMBLY FOR A PORTABLE AUDIO DEVICE | |
| DE60028460T2 (en) | EMC-compliant shield cap for a printed circuit board | |
| CH648713A5 (en) | SMALL HOUSE APPLIANCE. | |
| EP0491072A1 (en) | Hearing aid | |
| EP0719017A2 (en) | Handset for telephone and radiotelephone systems | |
| DE69505930T2 (en) | Shielding device and assembly method | |
| DE10159113A1 (en) | Circuit boards arrangement esp. multi-layer circuit boards, includes connecting devices for enabling fixture of circuit boards to one another in given position | |
| DE2558881A1 (en) | CONDENSER MICROPHONE | |
| EP0310840A1 (en) | Hearing aid housing | |
| DE102006026753B3 (en) | Super miniature dual battery contact module for e.g. headphone, has plastic frame that is fastened at contact springs and comprises guiding pins or guiding borehole for fixing module on printed circuit board | |
| DE8708894U1 (en) | Hearing aid with a conductor foil | |
| DE29612557U1 (en) | Shielding device against electromagnetic radiation | |
| DE69012493T2 (en) | Filter connector with lockable installation frame. | |
| DE69601330T2 (en) | Plug connector with solder pin for better solderability in through holes of printed circuit boards | |
| DE112018000569T5 (en) | Interconnects | |
| DE4116016C1 (en) | Handset for telephone appts. - has housing halves supporting leads and contact surfaces | |
| DE10032306B4 (en) | Motorized control and circuit board housing used therein |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: 7H 04R 1/08 B Ipc: 7H 04R 1/02 A Ipc: 7H 05K 9/00 B Ipc: 7H 04R 1/34 B |
|
| 17P | Request for examination filed |
Effective date: 20051012 |
|
| AKX | Designation fees paid |
Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 9/00 20060101ALI20060119BHEP Ipc: H04R 1/02 20060101AFI20060119BHEP |
|
| GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
| GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20061122 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20061122 Ref country code: IE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20061122 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20061122 |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: GERMAN |
|
| REF | Corresponds to: |
Ref document number: 50111474 Country of ref document: DE Date of ref document: 20070104 Kind code of ref document: P |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070131 Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070131 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070131 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20070222 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20070222 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20070305 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20070423 |
|
| NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
| GBV | Gb: ep patent (uk) treated as always having been void in accordance with gb section 77(7)/1977 [no translation filed] |
Effective date: 20061122 |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: FD4D |
|
| EN | Fr: translation not filed | ||
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| 26N | No opposition filed |
Effective date: 20070823 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20061122 |
|
| BERE | Be: lapsed |
Owner name: PARAGON AG Effective date: 20070131 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070131 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20070713 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20070223 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070117 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20061122 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20061122 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070117 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20061122 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20190322 Year of fee payment: 19 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 50111474 Country of ref document: DE |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20200801 |