EP1042765B1 - Methode de fabrication d'un dispositif electrique - Google Patents
Methode de fabrication d'un dispositif electrique Download PDFInfo
- Publication number
- EP1042765B1 EP1042765B1 EP98962060A EP98962060A EP1042765B1 EP 1042765 B1 EP1042765 B1 EP 1042765B1 EP 98962060 A EP98962060 A EP 98962060A EP 98962060 A EP98962060 A EP 98962060A EP 1042765 B1 EP1042765 B1 EP 1042765B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- temperature
- conductive
- conductive polymer
- polymer composition
- resistive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000203 mixture Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 31
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 23
- 239000011888 foil Substances 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000004132 cross linking Methods 0.000 claims abstract description 6
- 239000011231 conductive filler Substances 0.000 claims description 9
- -1 polyethylene Polymers 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920002313 fluoropolymer Polymers 0.000 claims description 2
- 239000004811 fluoropolymer Substances 0.000 claims description 2
- 229920001038 ethylene copolymer Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000007669 thermal treatment Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 5
- 229920001903 high density polyethylene Polymers 0.000 description 5
- 239000004700 high-density polyethylene Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-OUBTZVSYSA-N Cobalt-60 Chemical compound [60Co] GUTLYIVDDKVIGB-OUBTZVSYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012733 comparative method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- CGPRUXZTHGTMKW-UHFFFAOYSA-N ethene;ethyl prop-2-enoate Chemical compound C=C.CCOC(=O)C=C CGPRUXZTHGTMKW-UHFFFAOYSA-N 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/30—Apparatus or processes specially adapted for manufacturing resistors adapted for baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
Definitions
- EP-A- 0730282 discloses a PTC element comprising a conductive sheet of a crystalline polyolefin matrix, and a conductive filler, having provided on both sides thereof an electrode of a metallic foil.
- this invention provides a method of making an electrical device which comprises
- the invention also provides a method for making a battery assembly which comprises the steps of
- the particulate conductive filler which is dispersed in the polymeric component may be any suitable material, including carbon black, graphite, metal, metal oxide, conductive coated glass or ceramic beads, particulate conductive polymer, or a combination of these.
- the filler may be in the form of powder, beads, flakes, fibers, or any other suitable shape.
- the quantity of conductive filler needed is based on the required resistivity of the composition and the resistivity of the conductive filler itself. For many compositions the conductive filler comprises 10 to 60% by volume, preferably 20 to 55% by volume, and for low resistivity compositions used for low resistance circuit protection devices, especially 25 to 50% by volume of the total volume of the composition.
- the conductive polymer composition may comprise additional components, such as antioxidants, inert fillers, nonconductive fillers, radiation crosslinking agents (often referred to as prorads or crosslinking enhancers, e.g. triallyl isocyanurate), stabilizers, dispersing agents, coupling agents, acid scavengers (e.g. CaCO 3 ), or other components. These components generally comprise at most 20% by volume of the total composition. Dispersion of the conductive filler and other components into the polymeric component may be achieved by any suitable means of mixing, e.g. melt-processing or solvent-mixing.
- the mixed composition can be melt-shaped by any suitable method, e.g.
- the composition used in the resistive element exhibits positive temperature coefficient (PTC) behavior, i.e. it shows a sharp increase in resistivity with temperature over a relatively small temperature range.
- PTC positive temperature coefficient
- the term "PTC” is used to mean a composition or device which has an R 14 value of at least 2.5 and/or an R 100 value of at least 10, and it is preferred that the composition or device should have an R 30 value of at least 6, where R 14 is the ratio of the resistivities at the end and the beginning of a 14°C range, R 100 is the ratio of the resistivities at the end and the beginning of a 100°C range, and R 30 is the ratio of the resistivities at the end and the beginning of a 30°C range.
- the compositions used in devices of the invention show increases in resistivity which are much greater than those minimum values.
- first and second laminar electrodes which are attached to the first face and the second face, respectively, of the resistive element.
- the conductive polymer composition be extruded or otherwise formed into a sheet onto which the electrodes may be attached to form a laminate, i.e. the conductive polymer is sandwiched between the foils.
- Both first and second electrodes comprise a conductive material, and are preferably metal in the form of a foil, e.g. nickel, copper, brass, stainless steel, or an alloy of one or more of these metals, although one or both of the electrodes may comprise a conductive paint or graphite layer.
- a tie layer e.g. a conductive adhesive, may be used to attach the electrode to the resistive element.
- the first and second electrodes comprise an electrodeposited metal foil, e.g. nickel, copper, or nickel-coated copper.
- an electrodeposited metal foil e.g. nickel, copper, or nickel-coated copper.
- Appropriate electrodes are disclosed in U.S. Patents Nos. 4,689,475 (Matthiesen) and 4,800,253 (Kleiner et al), and in International Publication No. WO95/34081 (Raychem Corporation, published December 14, 1995).
- the device may also comprise an insulating layer, which provides electrical and environmental protection to the device.
- the insulating layer generally covers some or all of the metal foil electrodes and any exposed surfaces of the resistive element.
- Suitable insulating materials include polymers such as polyamide, polybutylene terephthalate, a polyester, polyethylene, polyvinylidene fluoride, liquid crystalline polymers, or an epoxy resin.
- the device in a cutting step, is cut from a laminate comprising the conductive polymer composition positioned between two metal foils.
- cutting is used to include any method of isolating or separating the resistive element of the device from the laminate, e.g. dicing, punching, shearing, cutting, etching and/or breaking as described in International Publication No. WO95/34084 (published December 14, 1995).
- the device is then subjected to a thermal treatment step.
- the thermal treatment step comprises at least one excursion from a first temperature T 1 to a second temperature T 2 .
- the thermal treatment step includes a return to the first temperature after exposure to the second temperature, thus creating a cycle from T 1 to T 2 to T 1 .
- the first temperature is at most (T m - 100)°C, preferably at most (T m - 120)°C, particularly at most (T m - 150)°C, where T m is the melting point of the polymeric component, as measured by the peak of the endotherm of a differential scanning calorimeter.
- T m is defined as the temperature of the highest temperature peak.
- the second temperature is at most (T m - 25)°C, preferably at most (T m - 35)°C, particularly at most (T m - 50)°C.
- T 1 is often at a temperature below room temperature, i.e. less than 20°C.
- the device is exposed to at least two thermal cycles, preferably at least three thermal cycles. For some applications, the device may be exposed to many more thermal cycles, e.g. six thermal cycles.
- the device is held at both the first and the second temperatures for sufficient time to ensure that the entire device reaches the designated temperature.
- the time period during which the device is held may be the same or different at T 1 and T 2 , but is generally at least 1 minute, preferably at least 3 minutes, more preferably at least 5 minutes, particularly at least 10 minutes, more particularly at least 15 minutes, especially at least 30 minutes, e.g. 60 minutes, as measured from the time the device reaches the designated temperature.
- Any suitable heat source may be used during the thermal treatment step, e.g. an oven (particularly a programmable oven) or other environmental chamber, or a heat lamp.
- the rate of temperature increase from T 1 to T 2 may be any convenient rate, e.g. 2 to 30°C/minute.
- the rate from T 1 to T 2 may the same as or different from the rate from T 2 to T 1 .
- the conductive polymer composition is crosslinked.
- Crosslinking can be accomplished by chemical means or by irradiation, e.g. using an electron beam or a Co 60 ⁇ irradiation source.
- the level of crosslinking depends on the required application for the composition, but is generally less than the equivalent of 200 Mrads, and is preferably substantially less, i.e. from 1 to 20 Mrads, preferably from 1 to 15 Mrads, particularly from 2 to 10 Mrads for low voltage (i.e. less than 60 volts) applications.
- Useful circuit protection devices for applications of less than 30 volts can be made by irradiating the device to at least 2 Mrads but at most 10 Mrads.
- first and second conductive leads are attached to first and second electrodes, respectively.
- the conductive leads allow easy connection of the electrodes to the source of electrical power, e.g. a battery or a power source, or into the circuit, and can be used to control the thermal output of the device.
- the conductive leads which often are supplied as part of a lead frame for ease in manufacture, are preferably attached to the electrodes by means of an intermediate layer, e.g. solder or a conductive adhesive.
- This lead attachment step preferably occurs after the cutting step and before the thermal treatment step.
- Other assembly processes e.g. application of the electrically insulating layer such as an epoxy resin or other polymer, are preferably conducted during an assembly step, which includes the lead attachment step and occurs after the cutting step and before the thermal treatment step.
- devices in which the conductive polymer has a low resistivity i.e. less than 100 ohm-cm, preferably less than 20 ohm-cm, particularly less than 10 ohm-cm, more particularly less than 5 ohm-cm, especially less than 2 ohm-cm, e.g. less than 1 ohm-cm, can be prepared.
- the device generally has a resistance at 20°C of less than 1 ohm, preferably less than 0.5 ohms, particularly less than 0.25 ohms, e.g. 0.050 to 0.150 ohms.
- Devices made by the method according to the invention are particularly suitable for use in a battery assembly, in which the device is preferably attached to the first or second terminal of a battery.
- the attachment may be directly between the battery and the first or second electrode, or between the battery and the first conductive lead which is attached to the first electrode, or the second conductive lead which is attached to the second electrode.
- the device is physically and electrically attached to a button terminal.
- the device may be attached to either the negative or the positive terminal of the battery.
- Batteries suitable for use include nickel-cadmium, nickel-metal hydride, alkaline, or lithium batteries. Often the battery assembly comprises two or more batteries. Such a battery assembly is shown in International Publications Nos. WO97/06538 (K.K. Raychem, published February 20, 1997) and WO98/20567 (Raychem Corporation, published May 14, 1998).
- FIG. 1 shows in cross-section electrical device 1 comprising PTC component 3, first conductive lead 15, second conductive lead 18, and insulating material 23.
- PTC component 3 comprises first electrode 11, second electrode 13 and resistive element 9 composed of a conductive polymer sandwiched therebetween.
- resistive element 9 composed of a conductive polymer sandwiched therebetween.
- both electrodes opposing each other form first surface 43 and second surface 41.
- PTC component 3 comprises surfaces 41 and 43, outer periphery 5 and inner periphery 7 and is in the form of a disk with an opening 27 in the center.
- the inner periphery 7 defines the opening 27.
- Figure 4 shows a top view of second conductive lead 18, which comprises first part 19 and second part 21.
- First part 19 is attached to second electrode 13 and covers at least part of the surface of second electrode 13.
- Second part 21 extends away from outer periphery 5 and can be bent, if necessary, to make electrical contact to a second battery or other electrical component.
- First and second conductive leads 15,18 can be made from any suitable material, e.g. nickel, stainless steel, copper, or an alloy such as brass or bronze. For ease of manufacture second lead 18 is often part of a lead frame.
- Figure 5 shows a top view of device 1 which as been encapsulated by electrically insulating layer 23.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Noodles (AREA)
Claims (9)
- Méthode pour fabriquer un dispositif électrique (1) qui comprend(A) un élément résistif (9) qui est composé d'une composition de polymère conducteur qui présente un comportement CTP et qui comprend(1) un composant polymérique ayant une cristallinité d'au moins 20% et un point de fusion Tm, et(2) dispersé dans le composant polymérique, un bourrage conducteur particulaire; et(B) deux électrodes (11, 13) qui (i) sont attachées à l'élément résistif (9), (ii) comprennent des feuilles de métal, et (iii) peuvent être connectées à une source d'énergie électrique,la méthode comprenant les étapes(a) de découper un dispositif (1) à partir d'un laminé comprenant la composition de polymère conducteur positionnée entre deux feuilles de métal;(b) d'exposer le dispositif (1) après l'étape de découpage à au moins un passage thermique allant d'une première température qui est au plus (Tm - 100)°C à une seconde température qui est au plus (Tm - 25)°C; et
caractérisée en ce que la méthode comprend en outre(c) réticuler la composition de polymère conducteur après l'augmentation thermique. - Méthode selon la revendication 1, qui comprend l'attachement d'au moins un fil conducteur (15) à une des électrodes en feuille de métal après l'étape (a) et avant l'étape (b).
- Méthode selon la revendication 1 ou 2, dans laquelle le dispositif (1) a été réticulé à l'étape (c) à l'équivalent de 1 à 20 Mrads.
- Méthode selon l'une quelconque des revendications précédentes, dans laquelle le composant polymérique comprend du polyéthylène, un copolymère d'éthylène, ou un fluoropolymère.
- Méthode selon l'une quelconque des revendications précédentes, dans laquelle à l'étape (b) le dispositif (1) est exposé à au moins un cycle thermique allant de la première température à la seconde température et revenant à la première température.
- Méthode selon l'une quelconque des revendications précédentes, dans laquelle à l'étape (b) la première température T1 est inférieure à 23°C.
- Méthode selon la revendication 1, dans laquelle(1) l'élément résistif (9) (i) a une épaisseur d'au plus 0,51 mm et (ii) est réticulé à l'équivalent d'au moins 2 Mrads, et(2) à l'étape (b), le dispositif (1) est exposé à au moins un cycle thermique allant d'une première température qui est au plus (Tm - 100)°C à une seconde température qui est au plus (Tm - 25)°C et revenant à la première température après l'étape de découpage.
- Méthode selon la revendication 7, dans laquelle à l'étape (b) le dispositif (1) est exposé à au moins trois cycles thermiques.
- Méthode pour fabriquer un assemblage de batterie comprenant les étapes; et(1) de fournir une batterie qui comprend des premières et secondes bornes; et(2) de produire un dispositif (1) selon la revendication 1 et(a) attacher un premier fil conducteur (15) à la première électrode (11) dudit dispositif (1), et(b) attacher un second fil conducteur (18) à la seconde électrode (13) dudit dispositif (1);(3) de placer ledit dispositif (1) en contact avec la première borne de la batterie de telle sorte que le premier fil conducteur (15) est en contact physique et électrique avec cette borne.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US99070797A | 1997-12-15 | 1997-12-15 | |
US990707 | 1997-12-15 | ||
PCT/US1998/026328 WO1999031677A1 (fr) | 1997-12-15 | 1998-12-10 | Dispositif electrique |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1042765A1 EP1042765A1 (fr) | 2000-10-11 |
EP1042765B1 true EP1042765B1 (fr) | 2007-05-09 |
Family
ID=25536456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98962060A Expired - Lifetime EP1042765B1 (fr) | 1997-12-15 | 1998-12-10 | Methode de fabrication d'un dispositif electrique |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1042765B1 (fr) |
JP (1) | JP4459438B2 (fr) |
CN (1) | CN1155011C (fr) |
AT (1) | ATE362185T1 (fr) |
DE (1) | DE69837771T2 (fr) |
TW (1) | TW408343B (fr) |
WO (1) | WO1999031677A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2004114331A1 (ja) | 2003-06-23 | 2006-08-03 | タイコ エレクトロニクス レイケム株式会社 | Ptcサーミスタ、および回路の保護方法 |
CN100479072C (zh) * | 2005-08-05 | 2009-04-15 | 聚鼎科技股份有限公司 | 过电流保护元件 |
CN100472674C (zh) * | 2005-08-19 | 2009-03-25 | 聚鼎科技股份有限公司 | 过电流保护元件 |
JP5274019B2 (ja) * | 2005-12-09 | 2013-08-28 | タイコエレクトロニクスジャパン合同会社 | Ptcデバイスの製造方法 |
CN101026029B (zh) * | 2006-02-17 | 2010-05-12 | 聚鼎科技股份有限公司 | 过电流保护元件 |
WO2017220747A1 (fr) * | 2016-06-22 | 2017-12-28 | Thüringisches Institut für Textil- und Kunststoff-Forschung e.V. | Corps moulé électriquement conducteur à coefficient de température positif |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR920003015B1 (ko) * | 1988-06-01 | 1992-04-13 | 마쯔시다덴기산교 가부시기가이샤 | 자체온도 제어발열체 조성물 |
JPH04167501A (ja) * | 1990-10-31 | 1992-06-15 | Daito Tsushinki Kk | Ptc素子 |
JPH0521207A (ja) * | 1991-07-12 | 1993-01-29 | Daito Tsushinki Kk | Ptc素子 |
TW298653B (fr) * | 1995-02-28 | 1997-02-21 | Yunichica Kk | |
KR19990036224A (ko) * | 1995-08-07 | 1999-05-25 | 준 이시오까 | Ptc 소자 및 그것을 이용한 전지 조립체 |
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1998
- 1998-12-10 DE DE69837771T patent/DE69837771T2/de not_active Expired - Fee Related
- 1998-12-10 JP JP2000539488A patent/JP4459438B2/ja not_active Expired - Fee Related
- 1998-12-10 WO PCT/US1998/026328 patent/WO1999031677A1/fr active IP Right Grant
- 1998-12-10 CN CNB988119862A patent/CN1155011C/zh not_active Expired - Fee Related
- 1998-12-10 EP EP98962060A patent/EP1042765B1/fr not_active Expired - Lifetime
- 1998-12-10 AT AT98962060T patent/ATE362185T1/de not_active IP Right Cessation
- 1998-12-15 TW TW087120821A patent/TW408343B/zh not_active IP Right Cessation
Non-Patent Citations (1)
Title |
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None * |
Also Published As
Publication number | Publication date |
---|---|
DE69837771D1 (de) | 2007-06-21 |
ATE362185T1 (de) | 2007-06-15 |
WO1999031677A1 (fr) | 1999-06-24 |
DE69837771T2 (de) | 2008-01-17 |
JP2002509348A (ja) | 2002-03-26 |
CN1155011C (zh) | 2004-06-23 |
TW408343B (en) | 2000-10-11 |
CN1283304A (zh) | 2001-02-07 |
JP4459438B2 (ja) | 2010-04-28 |
EP1042765A1 (fr) | 2000-10-11 |
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