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EP0817317A3 - Sensing element lead wire connecting structure - Google Patents

Sensing element lead wire connecting structure Download PDF

Info

Publication number
EP0817317A3
EP0817317A3 EP97108310A EP97108310A EP0817317A3 EP 0817317 A3 EP0817317 A3 EP 0817317A3 EP 97108310 A EP97108310 A EP 97108310A EP 97108310 A EP97108310 A EP 97108310A EP 0817317 A3 EP0817317 A3 EP 0817317A3
Authority
EP
European Patent Office
Prior art keywords
sensing element
terminal portions
fixing portion
back surfaces
connecting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97108310A
Other languages
German (de)
French (fr)
Other versions
EP0817317B1 (en
EP0817317A2 (en
Inventor
Junko Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of EP0817317A2 publication Critical patent/EP0817317A2/en
Publication of EP0817317A3 publication Critical patent/EP0817317A3/en
Application granted granted Critical
Publication of EP0817317B1 publication Critical patent/EP0817317B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
    • G01G19/08—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for incorporation in vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/12—Measuring force or stress, in general by measuring variations in the magnetic properties of materials resulting from the application of stress
    • G01L1/127—Measuring force or stress, in general by measuring variations in the magnetic properties of materials resulting from the application of stress by using inductive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A sensing element lead wire connecting structure which is able to carry out stably an operation to connect conductors forming the coil of a sensing element for load measurement with lead wires for external connection. In the sensing element lead wire connecting structure, the two terminal portions of a flexible circuit board, which are respectively situated near to the two ends of the flexible circuit board folded up substantially in the longitudinal direction middle portion thereof with the back surface thereof facing a plate-shaped member, are respectively mounted on the front and back surfaces of one fixing portion of the plate-shaped member of a sensing element, two engaging pins provided on and projected from the front and back surfaces of the fixing portion are respectively engaged into engaging holes formed in the respective terminal portions to thereby fix the terminal portions of the flexible circuit board to the front and back surfaces of the fixing portion in such a manner that the terminal portions are mounted on the front and back surfaces of the fixing portion, and, in this state, the four end portions of two magnet wires and the end portions of lead wires corresponding to the magnet wires are soldered by twos to two conductive patterns formed in the respective front surface side portions of the two terminal portions, thereby achieving electrical connection between the conductive patterns and lead wires.
EP97108310A 1996-05-29 1997-05-22 Sensing element lead wire connecting structure Expired - Lifetime EP0817317B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP135114/96 1996-05-29
JP13511496A JP3204367B2 (en) 1996-05-29 1996-05-29 Lead wire connection structure of sensing element

Publications (3)

Publication Number Publication Date
EP0817317A2 EP0817317A2 (en) 1998-01-07
EP0817317A3 true EP0817317A3 (en) 1999-04-14
EP0817317B1 EP0817317B1 (en) 2006-02-08

Family

ID=15144167

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97108310A Expired - Lifetime EP0817317B1 (en) 1996-05-29 1997-05-22 Sensing element lead wire connecting structure

Country Status (5)

Country Link
US (1) US5894409A (en)
EP (1) EP0817317B1 (en)
JP (1) JP3204367B2 (en)
KR (1) KR100210960B1 (en)
DE (1) DE69735219T2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6629631B2 (en) * 2001-06-04 2003-10-07 Sony Corporation Solder iron pressure monitor and method of using same in manufacturing a cathode ray tube
US7439449B1 (en) 2002-02-14 2008-10-21 Finisar Corporation Flexible circuit for establishing electrical connectivity with optical subassembly
US7446261B2 (en) * 2001-09-06 2008-11-04 Finisar Corporation Flexible circuit boards with tooling cutouts for optoelectronic modules
US7526207B2 (en) * 2002-10-18 2009-04-28 Finisar Corporation Flexible circuit design for improved laser bias connections to optical subassemblies
US7189929B2 (en) * 2004-01-16 2007-03-13 Hewlett-Packard Development Company, L.P. Flexible circuit with cover layer
US7425135B2 (en) * 2004-04-30 2008-09-16 Finisar Corporation Flex circuit assembly
US7311240B2 (en) 2004-04-30 2007-12-25 Finisar Corporation Electrical circuits with button plated contacts and assembly methods
US7275937B2 (en) 2004-04-30 2007-10-02 Finisar Corporation Optoelectronic module with components mounted on a flexible circuit
US7629537B2 (en) * 2004-07-09 2009-12-08 Finisar Corporation Single layer flex circuit
KR100820170B1 (en) * 2006-08-30 2008-04-10 한국전자통신연구원 Stacking method of flexible substrate
US7477521B2 (en) * 2007-05-15 2009-01-13 Acterna Llc Isolating stress on a printed circuit board
CN103972264A (en) * 2013-01-25 2014-08-06 财团法人工业技术研究院 Flexible electronic device
EP2789998B1 (en) * 2013-04-08 2015-06-10 Bayern Engineering GmbH & Co. KG Transport rail system with weighing means
US10488278B2 (en) * 2015-09-24 2019-11-26 Methode Electronics Malta Ltd. Planar magnetoelastic force sensor
JP6650265B2 (en) * 2015-12-28 2020-02-19 太洋電機産業株式会社 Soldering iron
US11014417B2 (en) * 2018-02-27 2021-05-25 Methode Electronics, Inc. Towing systems and methods using magnetic field sensing
GB201817357D0 (en) * 2018-10-25 2018-12-12 Strip Tinning Ltd Flexible connector
WO2024150278A1 (en) * 2023-01-10 2024-07-18 Smc株式会社 Sensor module and sensor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086576A (en) * 1974-11-27 1978-04-25 C. L. Instruments Limited Axle load monitoring systems
DE4407066A1 (en) * 1993-03-04 1994-09-22 Yazaki Corp Sensor element for a vehicle load measuring device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3593217A (en) * 1967-10-27 1971-07-13 Texas Instruments Inc Subminiature tunable circuits in modular form and method for making same
AU534244B2 (en) * 1979-04-19 1984-01-12 Tokyo Electric Co. Ltd. Load cell
DE3208315A1 (en) * 1982-03-08 1983-09-15 Robert Bosch Gmbh, 7000 Stuttgart MULTI-AXLE TRACTOR
US4677538A (en) * 1986-07-02 1987-06-30 Zenith Electronics Corporation Sweep transformer with terminating PC board
JP2526320Y2 (en) * 1991-01-29 1997-02-19 矢崎総業株式会社 Load weighing device
KR100191261B1 (en) * 1994-07-04 1999-06-15 구보 미츠오 Load cell unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086576A (en) * 1974-11-27 1978-04-25 C. L. Instruments Limited Axle load monitoring systems
DE4407066A1 (en) * 1993-03-04 1994-09-22 Yazaki Corp Sensor element for a vehicle load measuring device

Also Published As

Publication number Publication date
EP0817317B1 (en) 2006-02-08
DE69735219T2 (en) 2006-07-27
EP0817317A2 (en) 1998-01-07
JP3204367B2 (en) 2001-09-04
JPH09318423A (en) 1997-12-12
KR100210960B1 (en) 1999-07-15
DE69735219D1 (en) 2006-04-20
US5894409A (en) 1999-04-13
KR970075857A (en) 1997-12-10

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